ATSAM3S2AA-MUR - Cortex-M3 MCU 64MHz 128KB Flash | Microchip
N.º da peça: ATSAM3S2AA-MUR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.11 | $5,11 |
| 10 | $4.68 | $46,80 |
| 100 | $4.21 | $421,00 |
| 500 | $3.85 | $1.925,00 |
| 1.000 | $3.49 | $3.490,00 |
ATSAM3S2AA-MUR Visão geral
A microcontroller (MCU) is a single-chip embedded processor that integrates a CPU core, program memory, data memory, and peripherals such as timers, serial interfaces, and analog functions. Within the embedded systems hierarchy, the SAM3S sits in the medium-range general-purpose class of 32-bit MCUs, positioned above 8-bit devices like the PIC16 family and below high-performance Cortex-M4/M7 parts. The ARM Cortex-M3 architecture provides deterministic interrupt handling via the Nested Vectored Interrupt Controller (NVIC) and efficient Thumb-2 instruction execution.
Key features include 64 MHz core performance, 128KB of on-chip Flash for program storage, low-power operation across the industrial temperature range, and a peripheral set that Microchip describes as offering the best ratio of reduced power consumption, processing power, and peripherals in its class. The PIOs support a parallel data capture mode that collects data from non-standard sources such as low-cost image sensors, with DMA transfers offloading the CPU.
The device integrates a Cortex-M3 core with configurable Flash and SRAM organization, and Microchip notes Flash is architected in dual banks on SAM3S family members, supporting ECC and flash-banking techniques. The exposed-pad QFN package provides low inductance power delivery and good thermal performance for compact industrial designs.
Typical applications include industrial control panels, consumer appliances, metering systems, and sensor-hub designs that benefit from the parallel capture interface and DMA-driven data flow.
When designing, ensure the 1.62V to 3.6V supply range is respected and decouple the VDDCORE and VDDIO domains per the manufacturer datasheet; the M suffix denotes tape-and-reel packaging for automated assembly.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas drop-in para ATSAM3S2AA-MUR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAM3S2AA-MUR (mesmo formato e footprint) — diferindo em Package, Core Processor, Flash Memory, Packaging, Peripherals.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAM3S2AA-MU
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.6 / unidade
Ver ficha técnica →ATSAM3S2BA-MU
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
ATSAM3S4AA-MUR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.85 / unidade
Ver ficha técnica →ATSAM3S1AA-MUR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
ATSAM3N2AA-MU
✅ Drop-In✓ Em estoque
$7.35 / unidade
Ver ficha técnica →ATSAM3S2AA-MUR Classificações máximas e características elétricas
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Frequência máxima de clock | 64 MHz |
| Flash Memory | 128KB (128K x 8) |
| Series | SAM3S |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Encapsulamento | 48-VFQFN (7x7 mm) Exposed Pad |
| Tipo de montagem | Surface Mount |
| Peripherals | DMA, PWM, parallel capture on PIOs |
| Temperatura de operação | -40C to +85C (Industrial) |
| Pin-to-Pin Compatibility | Compatible with SAM3N2A |
| Packaging | Tape & Reel (R suffix) |
| Status RoHS | Compliant (Green, per Mouser listing) |
Guia de Configuração de Pinos do ATSAM3S2AA-MUR 48-vfqfn (7x7 mm) exposed pad
Configuração de pinos para ATSAM3S2AA-MUR (pacote 48-vfqfn (7x7 mm) exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para ATSAM3S2AA-MUR.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
ATSAM3S2AA-MUR é adequado para 6 aplicaçãos: Industrial Control Panels, Metering and Smart Energy, Low-Cost Image Sensor Interfaces, Consumer Appliances, Sensor Hubs and Data Loggers, Portable and Battery-Powered Devices.
Industrial Control Panels
The ATSAM3S2AA-MUR fits industrial control and automation nodes where a 64 MHz Cortex-M3 with 128KB Flash handles real-time I/O scanning, PWM generation, and serial protocol bridging. Its 1.62V to 3.6V operation tolerates noisy industrial rails after regulation, and the industrial -40C to +85C grade covers unconditioned cabinets. DMA-driven peripherals keep the CPU free for control loops, while the exposed-pad QFN dissipates heat reliably. Placed on a 4-layer PCB with solid ground return, it delivers deterministic performance for PLC expansion modules, motor control user interfaces, and sensor aggregation points in factory equipment.
Recomendado
Metering and Smart Energy
Energy meters and sub-metering endpoints benefit from the ATSAM3S2AA-MUR's balance of low power and 32-bit math capability. The Cortex-M3 core at 64 MHz executes energy calculation algorithms faster than 8-bit alternatives, while Microchip positions the SAM3S as having the best ratio of power consumption to processing power in its class. 128KB Flash accommodates metrology firmware plus communication stacks, and the 1.62V to 3.6V range suits battery-backed or capacitor-backed power schemes. DMA handles periodic ADC sample streaming without CPU intervention, and the QFN package's small 7x7 mm footprint fits dense meter PCBs.
Recomendado
Low-Cost Image Sensor Interfaces
Microchip explicitly highlights the parallel data capture mode on the SAM3S PIOs, which collects data from external devices not compliant with standard memory read protocols, such as low-cost image sensors, with DMA transferring the data to memory offloading the CPU. The ATSAM3S2AA-MUR is therefore a strong host for barcode readers, simple camera modules, and scanner front ends. The 64 MHz core processes line data in real time while DMA streams frames into SRAM. Because the capture path avoids standard bus protocols, system cost stays low, and the exposed-pad QFN provides the signal integrity needed for parallel pixel buses.
Recomendado
Consumer Appliances
Appliance user interfaces, motorized enclosures, and control boards use the ATSAM3S2AA-MUR where a responsive 32-bit MCU drives touch buttons, displays, and actuators. The 64 MHz Cortex-M3 comfortably runs UI frameworks and housekeeping tasks simultaneously, and 128KB Flash holds localized menus plus communication firmware. Industrial temperature rating exceeds appliance chamber requirements, adding margin near heat sources. PWM outputs drive motors and backlighting, while DMA reduces CPU loading during sensor polling. The 48-QFN 7x7 mm package enables compact two-layer cost-sensitive boards, and tape-and-reel packaging suits high-volume SMT appliance production lines.
Recomendado
Sensor Hubs and Data Loggers
The ATSAM3S2AA-MUR serves as a sensor aggregation hub where multiple analog and digital sensors feed a central logging system. DMA channels move peripheral data to memory autonomously, the parallel capture mode accepts non-standard digital sensors, and the 64 MHz core timestamps and formats records for storage. The 1.62V to 3.6V supply range supports direct battery operation through a low-dropout regulator, extending battery life in unattended loggers. 128KB Flash reserves space for calibration tables and communication stacks, while the industrial grade and compact QFN package permit deployment in outdoor and embedded environments.
Recomendado
Portable and Battery-Powered Devices
Handheld instruments, portable readers, and wearable-adjacent devices leverage the SAM3S family's low-power design philosophy. The ATSAM3S2AA-MUR's 1.62V to 3.6V input tolerates a discharging lithium cell through an LDO, and low-power wait modes allow the 64 MHz core to sleep between events while DMA or peripherals maintain data flow. 128KB Flash supports protocol stacks for short-range connectivity bridges, and the 7x7 mm QFN keeps the PCB footprint small enough for ergonomic enclosures. Tape-and-reel delivery supports mid-volume production, and pin compatibility with the SAM3N2A gives a cost-down migration path as volumes grow.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAM3S2AA-MUR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAM3S2AA-MU | ATSAM3S2BA-MU | ATSAM3S4AA-MUR | ATSAM3S1AA-MUR | ATSAM3N2AA-MU |
|---|---|---|---|---|---|---|
| Package | 48-VFQFN (7x7 mm) EP | 48-VFQFN (7x7 mm) EP - same | 48-VFQFN (7x7 mm) EP - same | 48-VFQFN (7x7 mm) EP - same | 48-VFQFN (7x7 mm) EP - same | 48-VFQFN (7x7 mm) EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Clock | Cortex-M3 / 64 MHz | Cortex-M3 / 64 MHz | Cortex-M3 / 64 MHz | Cortex-M3 / 64 MHz | Cortex-M3 / 64 MHz | Cortex-M3 / 64 MHz |
| Flash Memory | 128KB | 128KB | 256KB | 256KB | 64KB | 128KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Pin-to-Pin Compatibility | Compatible with SAM3N2A | Identical die | Same family footprint | Same family footprint | Same family footprint | Pin-to-pin compatible with SAM3S2A per Microchip |
| Peripheral Set | SAM3S full set incl. parallel capture + DMA | Identical | Identical | Identical | Identical | Reduced (SAM3N set) |
| Packaging Format | Tape & Reel (R suffix) | Tray | Tray | Tape & Reel | Tape & Reel | Tray |
Principais diferenciais
- Parallel capture on PIOs with DMA (vs ATSAM3N2AA-MU)
- Flash flexibility within one footprint (vs ATSAM3S4AA-MUR)
- Cost-down path via smaller Flash (vs ATSAM3S1AA-MUR)
Notas de projeto
The ATSAM3S2AA-MUR accepts 1.62V to 3.6V across its supply domains, but the SAM3S family uses multiple supply pins (VDDIO, VDDCORE, VDDIN/regulator output per datasheet). Decouple each domain with 100 nF ceramic capacitors placed within 2 mm of the pins, plus bulk capacitance at the regulator. Power up all domains before releasing reset, and follow the datasheet power-up ramp requirements to avoid latch-up or corrupted Flash state. Estimated: at 64 MHz active operation, expect tens of mA; verify against the datasheet current-versus-frequency tables for your battery budget.
The 48-VFQFN exposed pad is the primary ground and thermal path - do not leave it unconnected. Solder the exposed pad to a grounded copper pour with an array of thermal vias (typically 3x3 or 4x4 via grid, filled or tented per your assembly house's capability) to reduce ground inductance and improve thermal relief. Include pin-1 dot alignment on your silkscreen for pick-and-place, and follow Microchip's QFN land-pattern recommendation for paste apertures on the center pad to prevent voiding and tombstoning.
When substituting with the pin-compatible ATSAM3N2AA-MU, remember the SAM3N family drops some SAM3S peripherals - review every peripheral initialization call before porting firmware. When migrating between Flash sizes (S1/S2/S4), linker scripts and Flash bank configuration must be updated since SRAM/Flash split points differ. Finally, the R suffix means tape-and-reel: reel quantities and dry-bake requirements (MSL) must be confirmed with the distributor before reflow, as moisture-saturated QFN packages can crack during reflow soldering.
Informações de conformidade
Mouser listing describes the part as QFN, Green, industrial temperature, MRL A. Formal REACH and conflict-minerals certificates should be requested from Microchip or the distributor.
