ATSAM3U4EA-CU - 96MHz Cortex-M3 MCU 256KB Flash LFBGA-144 | Microchip
N.º da peça: ATSAM3U4EA-CU ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $18.92 | $18,92 |
| 10 | $17.05 | $170,50 |
| 100 | $15.18 | $1.518,00 |
| 500 | $13.62 | $6.810,00 |
| 1.000 | $12.05 | $12.050,00 |
ATSAM3U4EA-CU Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, volatile memory (SRAM), non-volatile program memory (Flash), and a configurable set of peripherals on one die. The ARM Cortex-M3 is a 32-bit RISC core designed by ARM Holdings and widely licensed across the embedded industry; it implements the Thumb-2 instruction set, offers deterministic interrupt latency, and includes an optional Memory Protection Unit (MPU) for separating kernel and user tasks. The SAM3U family sits in the Cortex-M3 hierarchy as a general-purpose, peripheral-rich derivative, ranking above Cortex-M0 parts in performance and below Cortex-M4 in DSP capability.
Key features include 256 Kbytes of 128-bit-wide Flash with a memory accelerator and dual-bank organization, 52 Kbytes of SRAM, a 96 MHz maximum CPU clock, an integrated High-Speed USB 2.0 Device port, a 4-bit SDIO/SD/MMC Host interface, and a multi-layer AHB bus matrix. The device also offers up to 96 GPIO lines, a 12-bit ADC, multiple timers, USART, SPI, TWI, and an External Bus Interface supporting SRAM, NOR Flash, and NAND Flash memories.
Technically, the SAM3U uses a Harvard bus architecture with a multi-layer AHB matrix that allows simultaneous CPU and DMA accesses across SRAM, Flash, and peripherals without contention. The integrated USB 2.0 High-Speed transceiver eliminates the need for an external PHY and supports up to 480 Mbps, while the 128-bit Flash bus enables zero-wait-state execution at full CPU speed from on-chip memory.
Typical applications include USB peripherals such as industrial data loggers and instrumentation, smart-card readers, SD card readers, industrial control panels, and Human-Machine Interfaces (HMIs) where high data throughput, USB connectivity, and ample on-chip memory matter. The LFBGA-144 package and 1.8V/3.3V dual-voltage operation make it suitable for portable and battery-aware designs.
When designing with this MCU, ensure the PCB layout provides a continuous ground plane beneath the BGA and adequate via stitching for thermal dissipation. Decoupling capacitors (100 nF plus 4.7 µF bulk) should be placed within a few millimeters of each supply pin to maintain signal integrity at the 96 MHz core frequency.
This page synthesizes distributor pricing, cross-vendor drop-in alternatives, and practical design notes not found on a single manufacturer datasheet, giving component engineers a single decision-ready reference for the ATSAM3U4EA-CU.
Alternativas drop-in para ATSAM3U4EA-CU — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAM3U4EA-CU (mesmo formato e footprint) — diferindo em Package, Core Architecture, SRAM, Flash Memory, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAM3U2EA-CU
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAM3U1EA-CU
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAM3U4CA-CU
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →ATSAM3U4EA-AU
✅ Drop-In✓ Em estoque
$7.18 / unidade
Ver ficha técnica →ATSAM3U4EA-CU Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M3 (32-bit RISC) |
| Maximum CPU Clock | 96 MHz |
| Instruction Set | Thumb-2 |
| Program Memory | 256 KB Flash (dual-bank, 128-bit wide access) |
| SRAM | 52 KB |
| Operating Voltage | 1.8 V / 3.3 V |
| Encapsulamento | 144-ball LFBGA (10x10 mm) |
| USB | High-Speed USB 2.0 Device (480 Mbps, integrated transceiver) |
| Memory Card Interface | High-Speed MCI (SDIO/SD/MMC) |
| External Bus Interface | Yes (EBI - SRAM, NOR, NAND) |
| Memory Protection Unit | Yes (MPU) |
| GPIOs | Up to 96 |
| ADC | 12-bit |
| Tipo de montagem | Surface Mount (BGA) |
| Temperatura de operação | -40°C to +85°C |
Guia de Configuração de Pinos do ATSAM3U4EA-CU 144-ball lfbga (10x10 mm)
Configuração de pinos para ATSAM3U4EA-CU (pacote 144-ball lfbga (10x10 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para ATSAM3U4EA-CU.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
ATSAM3U4EA-CU é adequado para 6 aplicaçãos: Industrial USB Data Acquisition, Smart Card and SD Card Reader, Human-Machine Interface (HMI) Panels, Portable Test and Measurement Instrumentation, Automotive Telematics and Diagnostics (Non-Safety), USB-Connected IoT Edge Gateways.
Industrial USB Data Acquisition
The ATSAM3U4EA-CU's integrated High-Speed USB 2.0 Device port with embedded 480 Mbps transceiver, combined with 256 KB dual-bank Flash and 52 KB SRAM, makes it a strong match for industrial data acquisition peripherals. The 96 MHz Cortex-M3 core sustains sustained ADC-to-USB streaming at rates that 72 MHz parts cannot, while 52 KB of SRAM accommodates double-buffered sample pipelines without CPU stalling. Designers typically place the device between upstream 5 V VBUS and downstream sensor front-ends, using its 12-bit ADC and USART peripherals. Compared to an external ULPI PHY approach, the integrated transceiver eliminates 8-12 components on the BOM, simplifying the industrial EMC certification path.
Recomendado
Smart Card and SD Card Reader
The integrated High-Speed MCI (SDIO/SD/MMC) and External Bus Interface of the ATSAM3U4EA-CU support high-throughput card reader designs that stream SD card contents over USB. The 52 KB SRAM serves as a sector cache between the MCI controller and USB endpoint FIFOs, while 256 KB Flash hosts the FAT/exFAT stack and reader firmware. The Cortex-M3 at 96 MHz runs USB Mass Storage Class and SD transactions concurrently without throughput bottlenecks. This dual-peripheral integration is rare in the Cortex-M3 class and is the primary reason the SAM3U family is chosen over single-interface alternatives.
Recomendado
Human-Machine Interface (HMI) Panels
Industrial HMI panels benefit from the ATSAM3U4EA-CU's 96 MHz Cortex-M3 throughput, 256 KB Flash for graphical assets, 52 KB SRAM for frame buffers, and 96 GPIO lines for keypad scan and LCD parallel interfaces. The LFBGA-144 package's small 10x10 mm footprint suits compact panel enclosures, while the External Bus Interface can directly drive an LCD controller in 16-bit parallel mode. Compared to lower-end Cortex-M0 HMI solutions, the SAM3U4E eliminates the need for an external memory bus expander, reducing PCB area and BOM cost.
Recomendado
Portable Test and Measurement Instrumentation
Handheld oscilloscope probes, signal generators, and field meters benefit from the ATSAM3U4EA-CU's combination of USB device connectivity, 12-bit ADC at MSPS-class throughput, and 256 KB Flash for calibration constants and UI. The 1.8V/3.3V dual-voltage operation supports direct Li-ion battery monitoring, while 96 GPIOs accommodate multi-channel analog front-ends. Compared to discrete MCU+USB controller solutions, the integrated USB transceiver shortens the analog signal path, lowering noise pickup in sensitive measurement paths and improving EMC margin in portable instruments.
Recomendado
Automotive Telematics and Diagnostics (Non-Safety)
While not AEC-Q100 qualified, the ATSAM3U4EA-CU's industrial-grade temperature range and integrated USB make it useful for non-safety automotive telematics such as OBD-II dongles, fleet trackers, and service-bus diagnostics tools. The High-Speed USB 2.0 port supports host-side tethering for firmware updates, and the SDIO interface logs trip data to removable storage. Designers place the MCU between the 12V automotive rail and a wide-input DC-DC converter, with the SAM3U4E handling protocol parsing on the Cortex-M3 core at 96 MHz.
Recomendado
USB-Connected IoT Edge Gateways
Edge gateways that aggregate sensor data over USB and forward it to a host PC or cloud uplink leverage the ATSAM3U4EA-CU's USB device port and Cortex-M3 processing. The 52 KB SRAM supports temporary buffering of sensor bursts before USB transmission, while the 256 KB Flash accommodates lightweight TLS or proprietary protocol stacks. The External Bus Interface allows expansion to NOR Flash for firmware images larger than 256 KB. Compared to bare Cortex-M0 IoT parts, the SAM3U4E provides the USB bandwidth and memory needed for multi-channel edge aggregation in a single chip.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAM3U4EA-CU — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAM3U2EA-CU | ATSAM3U1EA-CU | ATSAM3U4CA-CU |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 144-ball LFBGA (10x10) | 144-ball LFBGA (10x10) - same | 144-ball LFBGA (10x10) - same | 144-ball LFBGA (10x10) - same |
| Flash Memory | 256 KB | 128 KB | 64 KB | 256 KB |
| SRAM | 52 KB | 36 KB | 20 KB | 52 KB |
| Maximum CPU Clock | 96 MHz | 96 MHz | 96 MHz | 96 MHz |
| USB Interface | High-Speed USB 2.0 Device (integrated PHY) | High-Speed USB 2.0 Device (integrated PHY) | High-Speed USB 2.0 Device (integrated PHY) | High-Speed USB 2.0 Device (integrated PHY) |
| SDIO/SD/MMC Interface | Yes (High-Speed MCI) | Yes (High-Speed MCI) | Yes (High-Speed MCI) | Yes (High-Speed MCI) |
| External Bus Interface | Yes (SRAM, NOR, NAND) | Yes (SRAM, NOR, NAND) | Yes (SRAM, NOR, NAND) | Yes (SRAM, NOR, NAND) |
| Memory Protection Unit | Yes | Yes | Yes | Yes |
Principais diferenciais
- Integrated High-Speed USB 2.0 Device with embedded 480 Mbps transceiver (vs ATSAM3U1EA-CU)
- Dual-bank 256 KB Flash with in-application programming (vs ATSAM3U2EA-CU)
- 144-ball LFBGA packaging with 96 GPIO access (vs ATSAM3U4EA-AU (LQFP-144))
Notas de projeto
The 144-ball LFBGA package requires a continuous reference ground plane on layer 2 with via stitching at the BGA escape perimeter. Estimated: at 0.8 mm ball pitch, micro-via laser drilling (0.1 mm finished) with 0.4 mm capture pads and 0.2 mm antipad clearance is recommended for 4-layer stackup. Maintain a 50-ohm controlled impedance on USB differential pair (D+/D-) trace length matched within 150 mil for High-Speed USB compliance.
Place a 4.7 µF bulk tantalum or ceramic capacitor plus a 100 nF decoupling capacitor within 3 mm of each VDDCORE and VDDIO supply pin. The SAM3U's internal 1.8V regulator requires a minimum 10 µF bulk capacitor on its output pin per the datasheet. Estimated: peak core current at 96 MHz with all peripherals active can reach 50 mA; undersizing decoupling causes voltage droop and Cortex-M3 hard-fault events during USB bursts.
Do not assume the High-Speed USB embedded transceiver eliminates the need for ESD protection - place a USBLC6-2SC6 or equivalent TVS array on the D+/D- lines at the connector. Also verify the bootloader mode strap pins (BMS) at reset; floating BMS can cause the part to enter SAM-BA bootloader unintentionally after power-up, leading to firmware boot failures in production units.
Estimated: at full 96 MHz CPU load with USB and SDIO active, junction temperature rise is approximately 8-12 °C above ambient on a standard 4-layer 1 oz copper PCB. The LFBGA-144 package thermal pad must be soldered to a 6x6 mm minimum copper pour with thermal vias to the inner ground plane to stay within the -40°C to +85°C industrial operating range.
Informações de conformidade
RoHS and REACH compliance per Microchip product page. AEC-Q100 qualification is not specified for the ATSAM3U4EA-CU industrial variant; automotive designs should consult Microchip for the SAM3U4E automotive-grade option.
