ATSAM4S8CA-CU - ARM Cortex-M4 MCU 120MHz 512KB Flash | Microchip
N.º da peça: ATSAM4S8CA-CU ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.95 | $8,95 |
| 10 | $8.06 | $80,60 |
| 100 | $7.36 | $736,00 |
| 500 | $6.78 | $3.390,00 |
| 1.000 | $6.18 | $6.180,00 |
ATSAM4S8CA-CU Visão geral
A microcontroller (MCU) is an integrated circuit that combines a CPU core, program memory (Flash), data memory (SRAM), and a rich set of peripherals (timers, ADC, communication controllers, GPIO) on a single die. The ARM Cortex-M4 is a 32-bit RISC core designed for embedded deterministic processing with DSP extensions and a single-cycle hardware multiplier. MCUs sit at the bottom of the compute hierarchy alongside microprocessors, FPGAs, and DSPs, but unlike an MPU the MCU boots and runs Flash-resident firmware without external memory in most configurations.
Key features of the ATSAM4S8CA-CU include a maximum clock of 120 MHz, 512 KB Flash organised as 512K x 8, 128 KB SRAM, a 16-bit External Bus Interface (EBI) supporting SDRAM and SRAM, USB 2.0 Full-Speed with on-chip transceiver, CAN 2.0A/B controller, multiple USART/UART/SPI/TWI channels, a 12-bit ADC, and a 32-bit hardware floating-point unit when DSP instructions are enabled. Power consumption is specified at 200 uA/MHz in dynamic mode at low frequency, around 30 mA at 100 MHz active, and 3 uA in back-up mode with RTC running at 1.8 V.
Typical applications include industrial control panels, smart metering, point-of-sale terminals, motor control, USB peripherals, CAN-connected sensors, and home appliances. The SAM4S family is pin-to-pin compatible with SAM3S, SAM4N, SAM3N, and SAM7S devices (64- and 100-pin versions), giving designers an upgrade path within the Atmel/Microchip ARM portfolio without re-laying the PCB. Compared with SAM3S parts (which use Cortex-M3), the SAM4S gains the Cortex-M4 DSP extensions and FPU, useful for sensor-fusion and audio processing.
When laying out a board for the 100-pin TFBGA, allocate a 4-layer PCB with a continuous ground plane below the BGA and at least 4 vias in the central thermal/exposed pad to limit the junction temperature at high active current. Provide a 1 uF + 100 nF decoupling pair within 2 mm of every VDD/VSS pin pair, and route the 12 MHz external crystal traces symmetrically with a guard ring to ground to avoid Hibernation-mode crystal-startup failures.
This page synthesizes distributor pricing from DigiKey and Mouser, Microchip's official SAM4S datasheet (document 60001419B family), drop-in alternative MPNs sharing the same 100-pin TFBGA footprint, and PCB-level design notes that complement but do not replace the manufacturer datasheet.
Alternativas drop-in para ATSAM4S8CA-CU — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAM4S8CA-CU (mesmo formato e footprint) — diferindo em ADC, Package, Core Architecture, RoHS Status, USB.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAM4S16CA-CU
✅ Drop-In✓ Em estoque
$4.89 / unidade
Ver ficha técnica →ATSAM4S4CA-CU
✅ Drop-In✓ Em estoque
$3.45 / unidade
Ver ficha técnica →ATSAM4S8CA-AU
✅ Drop-In✓ Em estoque
$5.74 / unidade
Ver ficha técnica →ATSAM4S8CA-CU Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M4 |
| Core Width | 32-bit |
| Maximum Clock Speed | 120 MHz |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 128 KB |
| Instruction Cache | 2 KB |
| DSP Extensions | Yes (single-cycle MAC, hardware multiply) |
| Memory Protection Unit (MPU) | Yes |
| Instruction Set | Thumb-2, ARM Cortex-M4 |
| Supply Voltage (Vcc/Vdd) | 1.62 V to 3.6 V |
| Temperatura de operação | -40 C to +85 C (Industrial) |
| Encapsulamento | 100-pin TFBGA (9x9 mm) |
| External Bus Interface (EBI) | 16-bit (SDRAM/SRAM/NAND/NOR) |
| USB | USB 2.0 Full-Speed, on-chip transceiver |
| CAN | CAN 2.0A/B |
| ADC | 12-bit |
| Active Current | Approx. 30 mA at 100 MHz (per datasheet) |
| Back-up Mode Current (RTC, 1.8 V) | 3 uA |
| Pin-to-Pin Compatibility | SAM4S, SAM4N, SAM3S, SAM3N, SAM7S (64-/100-pin) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant (per Heisener listing) |
Guia de Configuração de Pinos do ATSAM4S8CA-CU 100-pin tfbga (9x9 mm)
Configuração de pinos para ATSAM4S8CA-CU (pacote 100-pin tfbga (9x9 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para ATSAM4S8CA-CU.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
ATSAM4S8CA-CU é adequado para 6 aplicaçãos: Industrial Control and HMI Panels, USB Peripherals and HID Devices, Automotive CAN Sensor Nodes, Smart Energy and Metering, Point-of-Sale Terminals and Secure Readers, Motor Control and BLDC Drives.
Industrial Control and HMI Panels
The ATSAM4S8CA-CU's Cortex-M4 core at 120 MHz, 512 KB Flash, and 128 KB SRAM give an industrial HMI panel enough headroom to drive a TFT LCD over the External Bus Interface, render graphics, and run a real-time control loop concurrently. The 12-bit ADC and multiple USART/SPI/TWI channels let one MCU scan sensors, drive motor pre-drivers, and talk to a capacitive-touch bridge IC, replacing two or three discrete parts in a traditional PLC. The 1.62 V to 3.6 V supply range accepts a 24 V industrial rail after a small buck converter, and the -40C to +85C industrial temperature grade covers factory-floor thermal stress. Active current near 30 mA at 100 MHz stays within the budget of a 1 W isolated DC bus without heatsinking.
Recomendado
USB Peripherals and HID Devices
The ATSAM4S8CA-CU integrates a USB 2.0 Full-Speed device controller with an on-chip transceiver, so designers can build HID peripherals, custom instruments, and data-acquisition dongles without an external PHY. The 120 MHz Cortex-M4 with DSP instructions can perform on-the-fly signal conditioning (filtering, RMS, FFT) on the streaming endpoint data while the dedicated USB controller manages the protocol stack via DMA, offloading the CPU. The 128 KB SRAM buffers USB bursts during high-speed sampling. Back-up current at 3 uA with RTC lets bus-powered USB devices meet suspend-current requirements. Microchip's ASF USB stack provides ready-to-build HID, CDC, and vendor-class example projects for SAM4S.
Recomendado
Automotive CAN Sensor Nodes
The ATSAM4S8CA-CU's hardware CAN 2.0A/B controller and 512 KB Flash are well matched to automotive body and chassis sensor nodes that aggregate switch, temperature, and pressure data on a 500 kbps CAN bus. The Cortex-M4 with FPU executes calibration math, PID loops, and CANopen/CAN-FD-style filtering fast enough to publish ten 16-bit channels at 1 kHz. The industrial temperature grade covers cabin and engine-bay installations; for under-hood deployments Microchip offers the ATSAM4S8CA-AU drop-in variant qualified to +105C. The 1.62 V to 3.6 V supply is compatible with 12 V automotive rails after a 5 V LDO and supports cranking-profile transients down to 5 V.
Recomendado
Smart Energy and Metering
Smart electricity, water, and gas meters use the ATSAM4S8CA-CU's DSP instructions and Cortex-M4 single-cycle MAC to compute metrology (RMS voltage/current, harmonic analysis, energy accumulation) at low CPU load. The 512 KB Flash holds the metrology library, communication stack (DLMS/COSEM, M-Bus, or wireless M-Bus), and an OTA bootloader, while the 128 KB SRAM buffers measurement windows before compression. The RTC with 3 uA back-up mode keeps real-time billing accurate across power outages, and the 1.62 V to 3.6 V supply range supports both 3.6 V lithium primary cells and 3.3 V regulated supplies. Optional LCD segment driver output simplifies metered HMIs without an external display controller.
Recomendado
Point-of-Sale Terminals and Secure Readers
POS terminals need a fast deterministic MCU to handle card readers, encryption, keypad scan, and printer control; the ATSAM4S8CA-CU delivers 120 MHz of Cortex-M4 performance with hardware AES acceleration available in some family members, suitable for EMV/PIN-pad cryptographic flows. The 16-bit External Bus Interface pairs with external SDRAM to support a small graphical UI or printer buffer without bus contention. The on-chip USB Full-Speed controller connects to a host PC while a second USART drives the EMV contact reader, and a TWI port interfaces to a secure element (SE) for key storage. Industrial temperature grade supports outdoor kiosk use, and RoHS compliance keeps the build green.
Recomendado
Motor Control and BLDC Drives
The ATSAM4S8CA-CU's Cortex-M4 DSP extensions and dedicated PWM timer counter channels make it suitable for sensorless BLDC, FOC, or stepper control loops in industrial drives. With 120 MHz of CPU bandwidth the firmware runs a 10 kHz FOC loop with quadrature encoder feedback while leaving CPU headroom for CANopen or Modbus communication. The 12-bit ADC with hardware triggering synchronises current sampling to the PWM edge, and the on-chip op-amp (where present) interfaces directly to shunt resistors. The 1.62 V to 3.6 V supply supports 3.3 V logic to gate drivers, while the industrial temperature grade covers harsh drive enclosures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAM4S8CA-CU — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAM4S16CA-CU | ATSAM4S4CA-CU | ATSAM4S8CA-AU | ATSAM4S8CA-CFUR | ATSAM4S8CA-CFN |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TFBGA (9x9) | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-TFBGA (9x9) - same | 100-LQFP (CFG) - different | 100-LQFP (CFG) - different |
| Flash | 512 KB | 1024 KB | 256 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 64 KB | 128 KB | 128 KB | 128 KB |
| Maximum Clock | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Temperature Grade | Industrial -40C to +85C | Industrial -40C to +85C | Industrial -40C to +85C | Automotive -40C to +105C | Industrial -40C to +85C | Industrial -40C to +85C |
| Core | ARM Cortex-M4 (DSP/FPU) | ARM Cortex-M4 (DSP/FPU) | ARM Cortex-M4 (DSP/FPU) | ARM Cortex-M4 (DSP/FPU) | ARM Cortex-M4 (DSP/FPU) | ARM Cortex-M4 (DSP/FPU) |
Principais diferenciais
- Cortex-M4 with hardware FPU and DSP instructions (vs ATSAM3S8CA-CU)
- 1 MB Flash upgrade option within same 100-TFBGA footprint (vs ATSAM4S4CA-CU)
- Automotive-grade variant available in same die (vs ATSAM4S8CA-AU)
- On-chip USB 2.0 Full-Speed transceiver (vs ATSAM4S4CA-CU)
Notas de projeto
Estimated: at 100 MHz active with a typical 30 mA active current at 3.3 V, the ATSAM4S8CA-CU dissipates roughly 100 mW into the TFBGA die. The 9x9 mm BGA spreads the heat through the central ball array; provide at least four stitched vias under the centre balls to a continuous ground plane on layer 2 to keep theta_JA in the datasheet's typical range. For back-up (RTC) mode the chip dissipates well under 10 uW and needs no special thermal treatment.
Place a 1 uF X7R ceramic + 100 nF X7R pair within 2 mm of every VDD/VSS ball pair to suppress switching noise from the Cortex-M4 load step. Use a 4-layer stack-up with a continuous ground plane directly under the BGA; the EBI data lines (D0-D15) must be length-matched within 50 mil and routed on an inner layer with reference to ground. Do not route the 12 MHz HSE crystal traces under the BGA and add a guard ring to ground to avoid Hibernation-mode start-up failures.
Do not assume the ATSAM4S8CA-CU is pin-compatible with the SAM4S8C LQFP variants without checking the specific die revision; the LQFP-100 (CFG) version is a different package footprint and requires different layout. Bootloader fuses are erased to factory defaults for SAM-BA; set GPNVM bits correctly before locking the Flash if you need a different boot source. Always consult the device errata sheet published on the Microchip product page for known silicon issues before locking the schematic.
When migrating from SAM3S designs, account for a slightly higher active current on SAM4S because of the DSP/FPU; size the 3.3 V LDO to at least 100 mA headroom and use a 10 uF bulk + 100 nF bypass at the VDD pin. For battery applications, use the on-chip 1.2 V regulator output to feed the core and disable the USB transceiver when unused to save 5-10 mA. The 3 uA RTC back-up mode requires VDDBU to remain above 1.62 V; a coin-cell or supercap holds time across main-power interruptions.
Informações de conformidade
RoHS/REACH compliance inferred from distributor listings (DigiKey, Mouser, Heisener). AEC-Q100 qualification available on the -AU drop-in variant, not on the base -CU part. Halogen-free status not explicitly listed in the verified web data.