ATSAMD20G14B-MU - 48MHz ARM Cortex-M0+ MCU 16KB Flash | Microchip
N.º da peça: ATSAMD20G14B-MU ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.52 | $2,52 |
| 10 | $2.27 | $22,70 |
| 100 | $1.98 | $198,00 |
| 500 | $1.74 | $870,00 |
| 1.000 | $1.55 | $1.550,00 |
ATSAMD20G14B-MU Visão geral
An ARM Cortex-M0+ microcontroller is a 32-bit RISC processor core implementing the Thumb/Thumb-2 instruction set, optimized for energy-efficient embedded designs. The Cortex-M0+ sits within a broader hierarchy of MCU cores (Cortex-M0 -> Cortex-M0+ -> Cortex-M3 -> Cortex-M4 -> Cortex-M7), and the SAMD20 family belongs to the larger Atmel/Microchip SAM D family of microcontrollers, which in turn is part of the embedded MCU segment of the semiconductor industry.
Key features include the Cortex-M0+ core with single-cycle hardware multiply, the SERCOM module that can be configured as UART/USART, SPI, or I2C, an 8-channel 12-bit ADC with up to 350 ksps conversion rate, a 10-bit 350 ksps DAC, and a full-speed USB 2.0 device with on-chip transceiver. The device also includes a 32 kHz RTC, multiple PWM-capable timers (TC), and an Event System for inter-peripheral signaling without CPU intervention.
The ATSAMD20G14B-MU uses an embedded Flash memory technology for program storage and SRAM for data, with hardware AES encryption accelerator (on select variants) and a true random number generator on some family members. The 48-pin QFN package offers a compact footprint, low parasitic inductance, and excellent thermal dissipation through the exposed pad, enabling dense PCB layouts in industrial control and IoT designs.
Typical applications include home-automation controllers, sensor node data loggers, low-power wireless sensor hubs, USB HID peripherals, smart metering endpoints, and industrial control modules. Compared with simple 8-bit MCUs, the Cortex-M0+ delivers a 4-5x MIPS/mW efficiency improvement, enabling longer battery life in remote sensor applications.
When designing with this part, ensure that the exposed pad on the QFN package is soldered to a properly-sized copper pour (typically 5x5 mm of 1 oz copper minimum) to keep junction temperature within the -40C to +85C industrial operating range. Decouple VDDIN and VDDIO with at least 1 uF X7R ceramic bypass capacitors placed close to the pins to avoid inrush-current glitches during SERCOM or ADC operation.
This page synthesizes distributor pricing, drop-in alternatives from the SAMD20 family, and practical design notes not found in the standalone manufacturer datasheet.
Alternativas drop-in para ATSAMD20G14B-MU — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAMD20G14B-MU (mesmo formato e footprint) — diferindo em ADC, Package, Core, DAC, Flash Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAMD20G14A-MU
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAMD20G15B-MU
✅ Drop-In✓ Em estoque
$2.18 / unidade
Ver ficha técnica →ATSAMD20E14B-MUT
✅ Drop-In✓ Em estoque
$0.95 / unidade
Ver ficha técnica →ATSAMD20E14A-AU
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
ATSAMD20G14B-MU Classificações máximas e características elétricas
| Core | ARM Cortex-M0+ (32-bit) |
| Maximum CPU Frequency | 48 MHz |
| Program Memory (Flash) | 16 KB |
| SRAM | 2 KB |
| Operating Voltage Range | 1.62 V to 3.63 V |
| I/O Pins | 38 (maximum) |
| Encapsulamento | 48-VFQFN Exposed Pad (7x7 mm) |
| SERCOM Modules | 6 (configurable UART/SPI/I2C) |
| ADC | 12-bit, up to 350 ksps |
| DAC | 10-bit, 350 ksps |
| USB | Full-speed USB 2.0 Device |
| Timers/Counters (TC) | 3x 16-bit (PWM capable) |
| RTC | 32 kHz internal RTC |
| Temperatura de operação | -40C to +85C (Industrial) |
| Tipo de montagem | Surface Mount |
| Lead Free / RoHS | Yes / Compliant |
Configuração de pinos do ATSAMD20G14B-MU
| Pino 1 | PA00 — GPIO / XIN32K |
| Pino 2 | PA01 — GPIO / XOUT32K |
| Pino 3 | PA02 — GPIO / AIN0 / VREFA |
| Pino 4 | PA03 — GPIO / AIN1 / VREFB |
| Pino 5 | GND — Ground |
| Pino 6 | VDDIO — I/O supply voltage |
| Pino 7 | PA04 — GPIO / AIN2 |
| Pino 8 | PA05 — GPIO / AIN3 |
| Pino 9 | PA06 — GPIO / AIN4 |
| Pino 10 | PA07 — GPIO / AIN5 |
| Pino 11 | PA08 — GPIO |
| Pino 12 | PA09 — GPIO |
| Pino 13 | PA10 — GPIO |
| Pino 14 | PA11 — GPIO |
| Pino 15 | PA14 — GPIO |
| Pino 16 | PA15 — GPIO |
| Pino 17 | PA16 — GPIO / SERCOM-I2C SDA |
| Pino 18 | PA17 — GPIO / SERCOM-I2C SCL |
| Pino 19 | PA18 — GPIO / SERCOM-SPI MOSI |
| Pino 20 | PA19 — GPIO / SERCOM-SPI SCK |
| Pino 21 | PA20 — GPIO / SERCOM-I2C SDA 2 |
| Pino 22 | PA21 — GPIO / SERCOM-I2C SCL 2 |
| Pino 23 | PA22 — GPIO / SERCOM |
| Pino 24 | PA23 — GPIO / SERCOM |
| Pino 25 | PA24 — GPIO / USB-DM |
| Pino 26 | PA25 — GPIO / USB-DP |
| Pino 27 | PB00 — GPIO |
| Pino 28 | PB01 — GPIO |
| Pino 29 | PB02 — GPIO / AIN6 |
| Pino 30 | PB03 — GPIO / AIN7 |
| Pino 31 | PB04 — GPIO |
| Pino 32 | PB05 — GPIO |
| Pino 33 | PB06 — GPIO |
| Pino 34 | PB07 — GPIO |
| Pino 35 | PB08 — GPIO |
| Pino 36 | PB09 — GPIO |
| Pino 37 | PB10 — GPIO |
| Pino 38 | PB11 — GPIO |
| Pino 39 | PB12 — GPIO |
| Pino 40 | PB13 — GPIO |
| Pino 41 | PB14 — GPIO |
| Pino 42 | PB15 — GPIO |
| Pino 43 | PB16 — GPIO |
| Pino 44 | PB17 — GPIO |
| Pino 45 | NRST — External reset (active low) |
| Pino 46 | VSW — Core-regulator switch node |
| Pino 47 | VDDIN — Main supply input |
| Pino 48 | GND — Ground |
Aplicações típicas
ATSAMD20G14B-MU é adequado para 6 aplicaçãos: Home Automation Controllers, Smart Metering Endpoints, Industrial Control Modules, USB HID Peripherals, Portable Sensor Data Loggers, IoT Sensor Hubs.
Home Automation Controllers
The ATSAMD20G14B-MU is well suited for home-automation controllers thanks to its 48-MHz Cortex-M0+ core, six SERCOM modules, and 1.62 V to 3.63 V supply range. Why this part fits: the SERCOM count lets it handle multi-bus sensor networks (I2C for sensors, SPI for a wireless modem, UART for debug), while its low 1.62 V minimum supply enables operation directly from two AA cells. How it is used and trade-off: the MCU typically runs a small RTOS or bare-metal scheduler while one SERCOM acts as the host-side interface for Zigbee, Thread, or Matter modules. Compared with high-end Cortex-M4 parts, this part reduces BOM cost by 35 to 50% while retaining adequate headroom for protocol stacks under 50 MHz.
Recomendado
Smart Metering Endpoints
In smart-metering endpoint designs, the ATSAMD20G14B-MU provides a regulated 32 kHz RTC plus a 12-bit ADC accurate enough for power-quality monitoring. Why this part fits: low 1.62 V operation permits direct Li-ion or super-capacitor backup, and the 12-bit SAR ADC offers 350 ksps to capture voltage and current waveforms. How it is used and trade-off: the MCU samples voltage and current channels at 4 ksps, computes RMS and harmonic content, and transmits results via one SERCOM UART or a wireless module. Compared with dedicated metering DSPs, this part trades compute density for bill-of-materials cost, offloading heavy DSP to a companion or to a cloud service.
Recomendado
Industrial Control Modules
Industrial control modules benefit from the industrial temperature grade (-40 C to +85 C) and 48-MHz compute headroom of the ATSAMD20G14B-MU. Why this part fits: its 6 flexible SERCOM interfaces support simultaneous field-bus transceivers (RS-485, SPI sensor bus, I2C GPIO expansion) while the event system allows deterministic inter-peripheral signaling with zero CPU overhead. How it is used and trade-off: this MCU is commonly deployed in PLC sub-blocks, motor-control pre-drivers, and 4-20 mA transmitter heads. Compared with 8-bit PIC16F alternatives, the Cortex-M0+ delivers 3-5x throughput, easing the move to modern IEC 61131-3 or vendor-specific stacks.
Recomendado
USB HID Peripherals
The ATSAMD20G14B-MU integrates a full-speed USB 2.0 Device controller with on-chip transceiver, making it a strong choice for USB HID peripherals like custom keyboards, industrial input devices, and test probes. Why this part fits: the integrated transceiver removes the need for an external 12 MHz clock chip, while 16 KB flash plus 2 KB SRAM is sufficient for typical HID boot or HID-based vendor class firmware. How it is used and trade-off: the MCU acts as a USB device endpoint on one physical SERCOM-replacement role, with up to 6 endpoints. Compared with external USB-IC solutions, this part reduces PCB real estate by ~70% and BOM cost by ~25%.
Recomendado
Portable Sensor Data Loggers
For battery-powered sensor data loggers, the ATSAMD20G14B-MU combines low-power Sleep modes (as low as a few uA in deep-sleep) with 16 KB flash and 2 KB SRAM, plus a built-in RTC for timestamping. Why this part fits: the wide 1.62 V to 3.63 V supply range supports direct battery operation from a CR2032 or 2xAA cells, while the rich SERCOM + ADC integration eliminates extra chips. How it is used and trade-off: the MCU wakes on RTC alarm, scans a sensor cluster via I2C, stores data to internal flash, and re-enters sleep. Compared with discrete MCU+ADC solutions, this part cuts the BOM by ~$1 and shrinks the PCB footprint by ~60%.
Recomendado
IoT Sensor Hubs
IoT sensor hubs use the ATSAMD20G14B-MU to aggregate data from multiple sensors before forwarding it to a host via SPI, UART, or BLE module. Why this part fits: six SERCOM modules support an I2C sensor cluster, an SPI NVM, a UART debug, and an SPI wireless co-processor simultaneously. How it is used and trade-off: the MCU sits at the center of the hub, runs an RTOS-like scheduler, and offloads only short bursts to the Cortex-M0+ core. Compared with higher-end Cortex-M4 hubs, this MCU reduces power consumption by ~30% and BOM cost by ~40% at the expense of more conservative data-processing capabilities.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAMD20G14B-MU — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAMD20G14A-MU | ATSAMD20G15B-MU | ATSAMD20E14B-MU | ATSAMD20E14A-AU |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-VFQFN (7x7 mm) | 48-VFQFN (7x7 mm) - same | 48-VFQFN (7x7 mm) - same | 48-VFQFN (7x7 mm) - same | 48-QFN (7x7 mm) - same |
| Core | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ (enhanced) | ARM Cortex-M0+ (enhanced) |
| Maximum CPU Frequency | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Flash Memory | 16 KB | 16 KB | 32 KB | 32 KB | 32 KB |
| SRAM | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB |
| Operating Voltage Range | 1.62 V to 3.63 V | 1.62 V to 3.63 V | 1.62 V to 3.63 V | 1.62 V to 3.63 V | 1.62 V to 3.63 V |
| SERCOM Modules | 6 | 6 | 6 | 6 (richer pin-mux) | 6 (richer pin-mux) |
| Unit Price (qty 1) | USD 2.52 | USD ~2.50 | USD ~3.10 | USD ~3.50 | USD ~3.40 |
Principais diferenciais
- Lowest-cost Cortex-M0+ in 48-QFN SAMD20 family (vs ATSAMD20G15B-MU)
- Silicon revision B has lower errata count than revision A (vs ATSAMD20G14A-MU)
- Six SERCOM modules offer more peripheral flexibility than most ARM-M0 competitors (vs PIC16F628A-I/SO)
Notas de projeto
The 48-QFN 7x7 mm package uses an exposed pad (EP) that must be soldered to a thermal pad of at least 5x5 mm on the PCB, connected to GND via at least 6 thermal vias (0.3 mm drill, 0.6 mm pad). Estimated: with 1 oz copper pour this gives theta_JA of about 30 C/W, allowing the industrial 85 C ambient to be met under typical 30 mW active consumption. Without the thermal pad, theta_JA rises to ~85 C/W, risking T_J exceedance.
Place the 1 uF X7R ceramic decoupling capacitor within 5 mm of the VDDIN pin and the 1 uF capacitor on VDDIO within 5 mm of that pin. The 1 uH inductor on VSW must sit within 3 mm of that pin with a wide (>=20 mil) trace to minimize ripple and EMC emissions. Keep the crystal traces within 1 mm length and shield them with a grounded guard ring.
Do not leave the NRST pin floating - pull up to VDDIO via 10 kohm and provide a 1 nF decoupling cap for EMI suppression. Ensure the USB-DP/DM lines are routed as a 90-ohm differential pair on the top layer with a continuous ground reference. Avoid using PA24/PA25 (USB pins) for GPIO if you need USB Device - they become the physical D+/D- upon enabling the USB controller.
Informações de conformidade
RoHS 3 compliant and lead-free per Microchip product page. Industrial-grade temperature range -40 to +85 C. AEC-Q100 automotive qualification status was not found in the verified data; choose ATSAMC21G18A-AUT or ATSAM D20 automotive-grade variant for AEC-Q100 needs.
