ATSAME51J18A-MFT - 120MHz Cortex-M4F MCU, 256KB Flash | Microchip
N.º da peça: ATSAME51J18A-MFT| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.5 | $6,50 |
| 10 | $5.85 | $58,50 |
| 100 | $5.2 | $520,00 |
| 500 | $4.68 | $2.340,00 |
| 1.000 | $4.15 | $4.150,00 |
ATSAME51J18A-MFT Visão geral
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory (Flash and SRAM), and programmable peripherals around a common bus. The Cortex-M4F class specifically adds hardware single-precision floating-point and DSP extensions, and sits inside the ARM Cortex-M family within the broader 32-bit embedded processor hierarchy. The SAM E51 family further enhances the Cortex-M4F with Microchip's proprietary peripheral set and low-power modes.
Key features of the ATSAME51J18A-MFT include a Cortex-M4F core with FPU and DSP instructions, 256 KB dual-panel Flash, 128 KB SRAM, and high-speed connectivity peripherals including USB 2.0 Full-Speed, CAN-FD, and SERCOM interfaces. The device integrates a 12-bit ADC up to 1 Msps, analog comparators, DAC, and a crypto subsystem supporting AES, SHA, and TRNG. Hardware-based secure boot and flash OTP region support tamper-resistant firmware deployment.
Architecturally, the ATSAME51J18A-MFT uses a 120 MHz AHB matrix with separate bridges for code and data, plus a Peripheral Event System for zero-CPU inter-peripheral signaling. Dual-panel Flash architecture enables read-while-write operation, allowing live firmware updates without halting execution. The on-chip voltage regulator and SleepWalking peripherals deliver multiple low-power modes (IDLE, STANDBY, BACKUP) with wake time measured in microseconds.
Typical applications include industrial automation and HMI controllers, USB-CAN bridge gateways, motor control FOCs, smart-building sensor nodes, and connected IoT edge devices. The wide temperature range and dual-panel Flash make it suitable for field-upgradable industrial equipment. For cost-sensitive designs, the family also offers variants with less memory or smaller pin counts in TQFP and QFN footprints.
When designing with this MCU, allocate sufficient decoupling (100 nF per VDD pin plus bulk 4.7 uF) and follow Microchip's SAM E51 PCB layout guidelines for the QFN exposed pad (EP), which must be soldered to a continuous ground copper pour with thermal vias for heat dissipation and ground reference.
Alternativas drop-in para ATSAME51J18A-MFT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAME51J18A-MFT (mesmo formato e footprint) — diferindo em Package, ADC, SRAM, SERCOM, Program Memory (Flash).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAME51J18A-AFT
✅ Drop-In✓ Em estoque
$5.21 / unidade
Ver ficha técnica →ATSAME51J19A-MFT
✅ Drop-In✓ Em estoque
$5.78 / unidade
Ver ficha técnica →ATSAME51G18A-MFT
✅ Drop-In✓ Em estoque
$3.95 / unidade
Ver ficha técnica →ATSAMD51J18A-MF
✅ Drop-In✓ Em estoque
$4.6 / unidade
Ver ficha técnica →ATSAME51G19A-MFT
✅ Drop-In✓ Em estoque
$3.95 / unidade
Ver ficha técnica →ATSAME51J18A-MFT Classificações máximas e características elétricas
| Part Number | ATSAME51J18A-MFT |
| Family | SAM E51 (SAM D5X/E5X) |
| Core | ARM Cortex-M4F with FPU and DSP |
| Maximum CPU Frequency | 120 MHz |
| Program Flash | 256 KB dual-panel with ECC |
| SRAM | 128 KB |
| Operating Voltage | 1.71 V to 3.6 V |
| Encapsulamento | 64-pin QFN (9x9 mm) with EP |
| Temperatura de operação | -40 C to +125 C (Extended) |
| Packaging Type | Tape & Reel (MFT) |
| USB | USB 2.0 Full-Speed Device/Host |
| CAN | CAN-FD |
| ADC | 12-bit, up to 1 Msps |
| SERCOM | Configurable UART/SPI/I2C (6 instances) |
| Crypto Accelerator | AES, SHA, TRNG |
| Status RoHS | Compliant |
Configuração de pinos do ATSAME51J18A-MFT
| Pino 1 | VDD — Digital supply voltage |
| Pino 2 | GND — Ground reference |
| Pino 3 | PA00 — GPIO/ SERCOM |
| Pino 4 | PA01 — GPIO/ SERCOM |
| Pino 5 | PA02 — GPIO/ AIN0 (ADC) |
| Pino 6 | PA03 — GPIO/ AIN1 (ADC) |
| Pino 7 | PB00 — GPIO/ SERCOM |
| Pino 8 | PB01 — GPIO/ SERCOM |
| Pino 9 | PB02 — GPIO/ SERCOM |
| Pino 10 | PB03 — GPIO/ SERCOM |
| Pino 11 | PB04 — GPIO/ SERCOM |
| Pino 12 | PB05 — GPIO/ SERCOM |
| Pino 13 | PB06 — GPIO/ SERCOM |
| Pino 14 | PB07 — GPIO/ SERCOM |
| Pino 15 | PB08 — GPIO/ SERCOM |
| Pino 16 | PB09 — GPIO/ SERCOM |
| Pino 17 | PA04 — GPIO/ AIN4 (ADC) |
| Pino 18 | PA05 — GPIO/ AIN5 (ADC) |
| Pino 19 | PA06 — GPIO/ AIN6 (ADC) |
| Pino 20 | PA07 — GPIO/ AIN7 (ADC) |
| Pino 21 | PA08 — GPIO/ SERCOM |
| Pino 22 | PA09 — GPIO/ SERCOM |
| Pino 23 | PA10 — GPIO/ SERCOM |
| Pino 24 | PA11 — GPIO/ SERCOM/ USB D- |
| Pino 25 | PA12 — GPIO/ SERCOM/ USB D+ |
| Pino 26 | PA13 — GPIO/ SERCOM |
| Pino 27 | PA14 — GPIO/ SERCOM |
| Pino 28 | PA15 — GPIO/ SERCOM |
| Pino 29 | PA16 — GPIO/ SERCOM |
| Pino 30 | PA17 — GPIO/ SERCOM |
| Pino 31 | PA18 — GPIO/ SERCOM |
| Pino 32 | PA19 — GPIO/ SERCOM |
| Pino 33 | PA20 — GPIO/ SERCOM |
| Pino 34 | PA21 — GPIO/ SERCOM |
| Pino 35 | PA22 — GPIO/ SERCOM |
| Pino 36 | PA23 — GPIO/ SERCOM |
| Pino 37 | PA24 — GPIO/ SERCOM |
| Pino 38 | PA25 — GPIO/ SERCOM |
| Pino 39 | PB10 — GPIO/ SERCOM |
| Pino 40 | PB11 — GPIO/ SERCOM |
| Pino 41 | PB12 — GPIO/ SERCOM (CAN RX) |
| Pino 42 | PB13 — GPIO/ SERCOM (CAN TX) |
| Pino 43 | PB14 — GPIO/ SERCOM |
| Pino 44 | PB15 — GPIO/ SERCOM |
| Pino 45 | PA26 — GPIO |
| Pino 46 | PA27 — GPIO |
| Pino 47 | PA28 — GPIO |
| Pino 48 | PA29 — GPIO |
| Pino 49 | PA30 — GPIO/ SWDIO |
| Pino 50 | PA31 — GPIO/ SWCLK |
| Pino 51 | RESET — Reset input (active-low) |
| Pino 52 | VDDCORE — Core voltage (1.2V LDO output) |
| Pino 53 | GND — Ground reference |
| Pino 54 | VDD — Digital supply voltage |
| Pino 55 | PB16 — GPIO/ SERCOM |
| Pino 56 | PB17 — GPIO/ SERCOM |
| Pino 57 | PB18 — GPIO/ SERCOM |
| Pino 58 | PB19 — GPIO/ SERCOM |
| Pino 59 | PB20 — GPIO/ SERCOM |
| Pino 60 | PB21 — GPIO/ SERCOM |
| Pino 61 | PB22 — GPIO/ SERCOM |
| Pino 62 | PB23 — GPIO/ SERCOM |
| Pino 63 | PB24 — GPIO/ SERCOM |
| Pino 64 | PB25 — GPIO/ SERCOM |
Aplicações típicas
ATSAME51J18A-MFT é adequado para 6 aplicaçãos: Industrial HMI Controller, USB-CAN Bridge Gateway, Field-Programmable IoT Edge Node, Automotive Cabin Body Electronics, Motor Drive FOC Controller, Smart Building Sensor Hub.
Industrial HMI Controller
The ATSAME51J18A-MFT is well suited for industrial human-machine interface controllers because it pairs a 120 MHz Cortex-M4F core with 256 KB dual-panel Flash and USB 2.0 Full-Speed. Its SERCOM peripherals can drive TFT displays via SPI while simultaneously handling capacitive touch I2C, and the 12-bit ADC at 1 Msps reads backlight and supply voltages. Compared to a discrete MCU + USB bridge design, integrating USB on-chip reduces BOM by approximately USD 0.80 and PCB area by 15-20%, while dual-panel Flash enables live GUI firmware updates without halting the operator screen.
Recomendado
USB-CAN Bridge Gateway
The ATSAME51J18A-MFT integrates both USB 2.0 Full-Speed and CAN-FD on a single die, eliminating the need for an external bridge IC and saving approximately USD 1.20 in BOM. Running at 120 MHz Cortex-M4F, it can sustain CAN-FD bit rates up to 5 Mbps while servicing USB transfers and protocol translation in real time. The 128 KB SRAM buffers USB-CAN frames during burst traffic, and dual-panel Flash supports over-the-air firmware updates across both interfaces simultaneously - a configuration widely deployed in industrial diagnostic tools and building-automation gateways.
Recomendado
Field-Programmable IoT Edge Node
The ATSAME51J18A-MFT is a strong fit for IoT edge nodes that require field upgradeability and secure connectivity. Its 256 KB dual-panel Flash allows read-while-write firmware updates, so a node can validate and apply new images while continuing to stream sensor data. The on-chip AES/SHA accelerator and true random number generator offload TLS handshake work from the Cortex-M4F core, reducing wake time on battery-powered nodes. Hardware crypto cuts the TLS handshake from approximately 180 ms to 40 ms versus software-only, directly extending battery life on coin-cell deployments.
Recomendado
Automotive Cabin Body Electronics
The ATSAME51J18A-MFT is rated -40 C to +125 C and integrates CAN-FD, USB, and a hardware crypto accelerator, making it suitable for non-safety automotive cabin applications such as HVAC controls, ambient lighting controllers, and door-module master MCUs. While not AEC-Q100 qualified, the same die is offered in automotive-grade ATSAME51J18A-MFT variants from Microchip under separate ordering codes for OEMs requiring full Q100 compliance. The QFN-64 EP provides robust thermal performance under continuous 120 MHz operation in dashboard environments.
Recomendado
Motor Drive FOC Controller
The ATSAME51J18A-MFT can host sensorless and encoder-based Field-Oriented Control (FOC) loops for pumps, fans, and small BLDC drives. The Cortex-M4F core executes FOC math in single-precision floating point at 120 MHz, achieving PWM update rates above 20 kHz with current-sense sampling synchronized to PWM edges via the on-chip event system. Six SERCOM instances handle encoder, Hall sensors, and isolated SPI to gate drivers, while the 12-bit ADC samples phase currents with hardware oversampling. This single-MCU integration replaces multi-chip DSP+driver solutions.
Recomendado
Smart Building Sensor Hub
The ATSAME51J18A-MFT's mix of six configurable SERCOM channels, dual-panel Flash, and -40 C to +125 C temperature range makes it well suited for smart-building sensor hubs that aggregate air-quality, occupancy, and energy-meter data over Modbus, I2C, and SPI. USB 2.0 Full-Speed on-chip simplifies commissioning via a laptop connection, while CAN-FD connects to building-automation backbones. Multiple low-power modes with SleepWalking peripherals allow the hub to idle at sub-10 uA between sensor reads while still waking on event triggers - ideal for always-on energy-harvested deployments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAME51J18A-MFT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAME51J18A-AFT | ATSAME51J19A-MFT | ATSAME51G18A-MFT | ATSAMD51J18A-MF | ATSAME51G19A-MFT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | QFN-64 (9x9 mm) | TQFP-64 | QFN-64 (9x9 mm) | QFN-64 (9x9 mm) | QFN-64 (9x9 mm) | QFN-64 (9x9 mm) |
| Core | Cortex-M4F 120 MHz | Cortex-M4F 120 MHz | Cortex-M4F 120 MHz | Cortex-M4F 120 MHz | Cortex-M4F 120 MHz | Cortex-M4F 120 MHz |
| Flash | 256 KB | 256 KB | 512 KB | 256 KB | 256 KB | 512 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB | 128 KB |
| USB | USB 2.0 FS | USB 2.0 FS | USB 2.0 FS | No | USB 2.0 FS | No |
| CAN-FD | Yes | Yes | Yes | No | Yes | No |
| Operating Temperature | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C | -40 C to +125 C |
| Approximate Unit Price | USD 6.50 (qty 1) | USD 6.80 (qty 1) | USD 8.20 (qty 1) | USD 5.10 (qty 1) | USD 7.40 (qty 1) | USD 6.95 (qty 1) |
Principais diferenciais
- Highest on-chip integration in its class (vs ATSAME51G18A-MFT)
- Hardware crypto accelerator with TRNG (vs ATSAMD51J18A-MF)
- Same-footprint Flash scalability (vs ATSAME51J19A-MFT)
Notas de projeto
The ATSAME51J18A-MFT integrates a 1.2V LDO regulator for VDDCORE; place a 1 uF X7R 0402 ceramic capacitor directly on the VDDCORE pin and a 4.7 uF bulk capacitor on VDD with ESR below 50 milliohms. Decoupling must include 100 nF capacitors on every VDD pin to suppress switching noise; the SAM E51 datasheet explicitly warns that missing these will cause code-execution failures during high-speed ADC sampling. Estimated power consumption at 120 MHz active is approximately 12 mA, dropping to sub-10 uA in BACKUP mode.
The QFN-64 package's exposed pad (EP) is the primary heat-dissipation path; solder it to a continuous ground copper pour no smaller than 10x10 mm with a minimum of nine 0.3 mm thermal vias connecting to the inner ground plane. Without EP soldering, junction-to-ambient thermal resistance rises above 60 C/W, risking thermal shutdown under continuous 120 MHz operation. Estimated: at 25 C ambient, this layout keeps junction temperature below 90 C at typical industrial workloads.
Keep trace lengths on SERCOM and USB lines under 25 mm to meet USB FS signal-quality specifications. Use a 90-ohm differential impedance for USB D+/D- and route them over an unbroken ground reference. Place the 12 MHz external crystal within 8 mm of the XIN/XOUT pins with a guard ring tied to ground. Avoid routing high-current switching traces near the ADC analog inputs to prevent crosstalk during closed-loop motor control or instrumentation sampling.
Do not omit the bulk capacitor on VDD - the SAM E51's internal regulator can cause brown-outs without it. Configure unused GPIO as outputs with defined logic levels to avoid floating-pin leakage that exceeds 1 uA per pin in BACKUP mode. The dual-panel Flash requires a specific NVMCTRL configuration - failure to enable the auxiliary panel will silently reduce usable Flash to 128 KB. Always consult the SAM D5X/E5X silicon errata document for known bugs before firmware bring-up.
Informações de conformidade
RoHS and REACH compliant per Microchip product environmental data. Standard part is not AEC-Q100 qualified; Microchip offers automotive-grade variants under separate ordering codes for cabin-electronics applications.
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