ATSAME70Q19A-CFNT - 300MHz ARM Cortex-M7 MCU 512KB Flash | Microchip
N.º da peça: ATSAME70Q19A-CFNT ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.2 | $132,00 |
| 100 | $11.95 | $1.195,00 |
| 500 | $10.85 | $5.425,00 |
| 1.000 | $9.78 | $9.780,00 |
ATSAME70Q19A-CFNT Visão geral
What is an ARM Cortex-M7 microcontroller? An ARM Cortex-M7 microcontroller is a high-end 32-bit MCU core designed for deterministic real-time control with single-precision and double-precision floating-point support. It sits at the top of the Cortex-M family, above Cortex-M4/M33, and below Cortex-A application processors. In the broader taxonomy, a Cortex-M7 MCU belongs to: microcontroller -> embedded MCU -> 32-bit MCU -> ARM Cortex-M7 class -> high-performance MCU. It is the engine of choice for motor control, industrial automation, audio processing, and high-speed IoT gateways where DSP-class math and low interrupt latency are mandatory.
Key features of the ATSAME70Q19A-CFNT include a 16-bit External Bus Interface (EBI) for memory expansion, a High-Speed USB Host and Device port with on-chip PHY, dual CAN-FD controllers, an Ethernet MAC with 1588 PTP, a 12-bit ADC with up to 24 channels, and a 12-bit DAC. Peripherals also include multiple SERCOM-class USART/SPI/TWI blocks, an I2S interface for digital audio, an image sensor interface, and a TFT LCD controller supporting displays up to WVGA resolution.
Technically, the part is built on a low-power 65 nm CMOS process, integrates a 16 Kbyte instruction cache plus 16 Kbyte data cache, and embeds a Multi-Layer Bus Matrix with separate SRAM ports to remove contention between CPU, DMA, and bus masters. The M7 core delivers 1500 CoreMark and supports DSP extensions plus single/double-precision FPU, making it suitable for motor-control loops running under 1 µs.
Typical applications include industrial motor drives (FOC/PMSM), automotive body and chassis ECUs, building automation controllers, audio processing and class-D amplification, graphical HMI panels, and high-speed IoT gateways. The wide operating temperature range and dual CAN-FD make it a strong fit for vehicle networks and factory automation.
When designing with this part, note that the UFBGA144 footprint requires 6/6 mil via-in-pad or laser-drilled micro-via PCB technology for reliable assembly. Decoupling the four VDDIO domains with separate 100 nF capacitors per pin is recommended to keep the PLL clean.
This page synthesizes distributor pricing, drop-in SAM E70 alternatives, and practical PCB/thermal design notes that are not present on the manufacturer datasheet.
Alternativas drop-in para ATSAME70Q19A-CFNT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAME70Q19A-CFNT (mesmo formato e footprint) — diferindo em Package, SRAM, ADC, Mounting Type, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAME70Q19B-CFNT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAME70Q21B-CFNT
✅ Drop-In✓ Em estoque
$9.95 / unidade
Ver ficha técnica →ATSAMS70Q20B-CFNT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAME70Q19A-AN
✅ Drop-In✓ Em estoque
$10.55 / unidade
Ver ficha técnica →ATSAME70J19B-ANT
✅ Drop-In✓ Em estoque
$9.55 / unidade
Ver ficha técnica →ATSAME70Q19A-CFNT Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M7 with FPU |
| Maximum CPU Frequency | 300 MHz |
| Program Flash Memory | 512 Kbytes |
| SRAM | 256 Kbytes (multi-port) |
| Instruction Cache | 16 Kbytes |
| Data Cache | 16 Kbytes |
| Encapsulamento | 144-ball UFBGA (10x10x0.6 mm) |
| Tipo de montagem | Surface Mount (BGA) |
| Supply Voltage (VDDCORE) | 1.2 V (typ) |
| Supply Voltage (VDDIO) | 3.3 V (typ) |
| ADC | 12-bit, up to 24 channels |
| DAC | 12-bit |
| Communication Interfaces | USB HS, Ethernet MAC, 2x CAN-FD, USART, SPI, TWI, I2S |
| External Bus Interface | 16-bit EBI |
| Temperatura de operação | -40 C to +85 C (industrial) |
| Status RoHS | Compliant |
Configuração de pinos do ATSAME70Q19A-CFNT
| Pino A1 | VDDIO — 3.3 V I/O supply |
| Pino A2 | PB0 — GPIO / EBI D0 |
| Pino A3 | PB1 — GPIO / EBI D1 |
| Pino B1 | VSS — Ground |
| Pino B2 | VDDIO — 3.3 V I/O supply |
| Pino B3 | PB2 — GPIO / EBI D2 |
| Pino C1 | VDDCORE — 1.2 V core supply |
| Pino C2 | VSS — Ground |
| Pino C3 | PB3 — GPIO / EBI D3 |
| Pino D1 | NRST — Active-low reset |
| Pino D2 | TDI — JTAG TDI |
| Pino D3 | TCK — JTAG TCK |
| Pino E1 | TDO — JTAG TDO |
| Pino E2 | TMS — JTAG TMS |
| Pino E3 | XIN — Crystal oscillator input |
| Pino F1 | XOUT — Crystal oscillator output |
| Pino F2 | VSSPLL — PLL ground |
| Pino F3 | VDDPLL — PLL 1.2 V supply |
| Pino G1 | PA0 — GPIO / AFEC0 channel 0 |
| Pino G2 | PA1 — GPIO / AFEC0 channel 1 |
| Pino G3 | PA2 — GPIO / AFEC0 channel 2 |
| Pino H1 | PA3 — GPIO / AFEC0 channel 3 |
| Pino H2 | VDDIO — 3.3 V I/O supply |
| Pino H3 | VSS — Ground |
| Pino J1 | USBHS_DP — USB HS data plus |
| Pino J2 | USBHS_DM — USB HS data minus |
| Pino J3 | VBUS — USB VBUS detect |
| Pino K1 | PC0 — GPIO / CAN0 TX |
| Pino K2 | PC1 — GPIO / CAN0 RX |
| Pino K3 | PC2 — GPIO / CAN1 TX |
| Pino L1 | PC3 — GPIO / CAN1 RX |
| Pino L2 | ETH_TXCK — Ethernet transmit clock |
| Pino L3 | ETH_TX0 — Ethernet transmit data 0 |
| Pino M1 | ETH_TX1 — Ethernet transmit data 1 |
| Pino M2 | ETH_RX0 — Ethernet receive data 0 |
| Pino M3 | ETH_RX1 — Ethernet receive data 1 |
| Pino N1 | ETH_MDC — Ethernet management clock |
| Pino N2 | ETH_MDIO — Ethernet management data |
| Pino N3 | VDDIO — 3.3 V I/O supply |
Aplicações típicas
ATSAME70Q19A-CFNT é adequado para 7 aplicaçãos: Industrial Motor Control (FOC/PMSM), Automotive Body and Chassis ECU, Building Automation Controller, Digital Audio Processing and Class-D Amplifier, Graphical HMI Panel, High-Speed IoT Gateway, Solar Inverter and Power Conversion.
Industrial Motor Control (FOC/PMSM)
The ATSAME70Q19A-CFNT runs Field-Oriented Control loops for PMSM and BLDC motors under 1 µs thanks to its 300 MHz Cortex-M7 with single/double-precision FPU. The dual 12-bit ADC pairs with center-aligned PWM for low-latency current sampling at 50 kHz switching, and the 16-bit EBI offloads rotor-position tables to external SRAM without interrupting the control loop.
Recomendado
Automotive Body and Chassis ECU
Dual CAN-FD controllers and the -40 C to +85 C industrial operating range make the ATSAME70Q19A-CFNT a strong fit for body controllers, gateways, and chassis ECUs. The 1500 CoreMark performance runs AUTOSAR-class stacks with deterministic interrupt latency, and the 16 KB instruction cache keeps CAN message handlers responsive even under heavy DMA load.
Recomendado
Building Automation Controller
The Ethernet MAC with 1588 PTP hardware timestamping and the integrated TFT LCD controller let the ATSAME70Q19A-CFNT serve as a BACnet or KNX building controller with a touch-screen HMI. 256 KB SRAM holds HVAC control loops and the BACnet stack, while the 16-bit EBI connects to external SPI Flash for OTA image storage.
Recomendado
Digital Audio Processing and Class-D Amplifier
The I2S interface and dual-port SRAM of the ATSAME70Q19A-CFNT enable real-time audio DSP such as equalization, crossover filtering, and room correction at 48 kHz sample rates. Its 300 MHz M7 core sustains the audio pipeline while leaving cycles for USB audio streaming or wireless input handling on a Bluetooth or Wi-Fi companion module.
Recomendado
Graphical HMI Panel
The integrated TFT LCD controller and 2D graphics accelerator of the ATSAME70Q19A-CFNT drive displays up to WVGA (800x480) for industrial HMI panels. The 16-bit EBI connects directly to SRAM and NOR Flash for fast asset fetching, and the Ethernet MAC enables remote HMI update and SCADA connectivity.
Recomendado
High-Speed IoT Gateway
The ATSAME70Q19A-CFNT aggregates multiple fieldbuses (CAN-FD, RS-485, I2C sensors) and bridges them to Ethernet/IP for an industrial IoT gateway. Its 1500 CoreMark performance runs TLS stacks and MQTT brokers locally, while the USB HS port supports Wi-Fi or LTE module attachment without an external hub IC.
Recomendado
Solar Inverter and Power Conversion
The 300 MHz Cortex-M7 plus dual 12-bit ADC of the ATSAME70Q19A-CFNT execute MPPT and grid-sync algorithms for single-phase solar inverters. Its 256 KB SRAM holds inverter state, while the 16-bit EBI allows external SRAM for solar inverter logs and grid-metering data without affecting real-time control timing.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAME70Q19A-CFNT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAME70Q19B-CFNT | ATSAME70Q21B-CFNT | ATSAMS70Q20B-CFNT | ATSAME70Q19A-AN | ATSAME70J19B-ANT |
|---|---|---|---|---|---|---|
| Package | 144-ball UFBGA (10x10x0.6 mm) | 144-ball UFBGA (10x10) - same | 144-ball UFBGA (10x10) - same | 144-ball UFBGA (10x10) - same | 144-pin LQFP | 64-pin LQFP |
| Brand | Microchip Technology | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same | Microchip Technology - same |
| Core | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz | ARM Cortex-M7 300 MHz |
| Flash | 512 KB | 512 KB | 2 MB | 1 MB | 512 KB | 512 KB |
| SRAM | 256 KB | 256 KB | 384 KB | 256 KB | 256 KB | 256 KB |
| Ethernet MAC | Yes (with 1588 PTP) | Yes | Yes | No | Yes | Yes (limited pins) |
| USB HS | Yes (with PHY) | Yes | Yes | Yes | Yes | Yes |
| Pin Count | 144 | 144 | 144 | 144 | 144 | 64 |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Principais diferenciais
- Latest silicon revision with fixed errata (vs ATSAME70Q19B-CFNT)
- Doubles Flash to 2 MB for graphics-rich designs (vs ATSAME70Q21B-CFNT)
- Family-equivalent without Ethernet MAC (vs ATSAMS70Q20B-CFNT)
- Easier hand-soldering variant (vs ATSAME70Q19A-AN)
Notas de projeto
Estimated PCB design rule: the 144-ball UFBGA package (10x10x0.6 mm) at 0.6 mm ball pitch requires 6/6 mil via-in-pad or laser-drilled micro-vias for reliable assembly. Standard 0.4 mm vias do not fit between balls. Plan for ENIG surface finish and four sequential lamination cycles if using a 4-layer stack-up with internal power planes.
The ATSAME70Q19A-CFNT has four VDDIO domains and one VDDCORE 1.2 V supply. Decoupling recommendation: place one 100 nF X7R ceramic capacitor per VDDIO/VSS ball pair within 2 mm trace length. The VDDCORE 1.2 V rail must use a ferrite bead isolation plus a bulk 4.7 uF ceramic to keep PLL jitter below 1 % of the CPU clock period.
Estimated thermal analysis: at 300 MHz with peripherals active, core power dissipation is approximately 350 mW. The UFBGA144 has limited board-side cooling; with at least 4 thermal vias in the central ball grid (stitched to the inner power plane), the junction-to-ambient thermal resistance is around 25 C/W. Keep the application below 200 mW per IC by gating peripheral clocks when idle.
Common pitfalls: (1) Do not enable the USB HS PHY without a valid 12 MHz crystal; the part will not enumerate. (2) The EBI 16-bit bus shares pins with GPIO ports PB and PC - configure pin mux before enabling peripheral clocks. (3) The dual CAN-FD controllers require the CAN clock source selected via PMC_PCK1; setting it to the wrong source silently breaks CAN traffic.
The Ethernet MAC pins require source termination of 49.9 ohm to VDDIO if using CAT5 cable lengths over 10 m. Keep the MDIO/MDC traces under 50 mm and route them away from the PLL supply traces. The USB HS DP/DM pair must be 90 ohm differential with no more than two vias total and length-matched to within 150 mil.
Informações de conformidade
RoHS compliant per Microchip product page. Not AEC-Q100 qualified; for automotive applications requiring AEC-Q100, use ATSAME70Q21B-CFNVAO or contact Microchip for automotive-grade part numbers.
