BSC9131NSN1KHKB - QorIQ Qonverge SoC, 800MHz Dual-Core | NXP
N.º da peça: BSC9131NSN1KHKB ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $268.5 | $2.685,00 |
| 100 | $252 | $25.200,00 |
| 500 | $235 | $117.500,00 |
| 1.000 | $218 | $218.000,00 |
BSC9131NSN1KHKB Visão geral
A QorIQ Qonverge SoC is a heterogeneous multiprocessor device that combines a general-purpose communications control CPU (PowerPC e500) with one or more DSP cores (StarCore) and dedicated hardware accelerators (such as MAPLE for LTE turbo/viterbi decoding) on a single chip. The QorIQ family sits within NXP's broader communications processor portfolio, which itself belongs to the wider class of embedded microprocessors and SoCs used in networking infrastructure. This category hierarchy matters because small-cell base stations increasingly demand deterministic DSP throughput alongside flexible L2/L3 packet processing, which single-core architectures cannot deliver efficiently.
Key features of the BSC9131NSN1KHKB include: dual heterogeneous compute cores running at up to 1 GHz each, integrated MAPLE-B2F LTE baseband accelerator for PHY offload, DDR3 memory controller with ECC support, integrated flash controller (IFC) for NAND/NOR boot, and a wide range of high-speed serial interfaces (SerDes, PCIe, SGMII) for backhaul and radio connectivity. The device is rated for 0 C to 105 C ambient operation and is offered in the 520-FCBGA package suitable for industrial-grade base-station boards.
The architecture pairs a 32-bit PowerPC e500 core (running control-plane protocols and Linux) with a 32-bit StarCore SC3850 VLIW DSP (running PHY DSP code), connected via a shared system bus. The MAPLE-B2F accelerator handles forward error correction, freeing DSP cycles for channel estimation, FFT, and modulation/demodulation. This partitioning reduces total power consumption versus discrete CPU+DSP+FPGA designs and simplifies board layout by eliminating inter-chip high-speed links.
Typical applications include small-cell LTE/eNodeB base stations, enterprise VoIP media gateways, smart-grid control and monitoring equipment, military/defense tactical radio platforms, and industrial machine-to-machine gateways. The combination of deterministic DSP, control CPU, and on-chip LTE accelerator makes the BSC9131 family particularly suitable for compact, low-power small-cell designs where board area and BOM cost are at a premium.
When designing with this device, engineers should pay attention to power-rail sequencing (the SoC requires multiple voltage domains with strict ramp order), DDR3 PCB layout (length-matched, impedance-controlled traces with proper decoupling), and thermal management at the 520-FCBGA top-side cooling solution. Note that this part is documented by NXP as End of Life, so long-lifecycle designs should evaluate remaining inventory and second-source options carefully.
This page synthesizes distributor pricing, lifecycle status, and design considerations not found in any single manufacturer document, providing engineers and procurement teams with a consolidated reference for evaluating the BSC9131NSN1KHKB against modern alternatives.
Alternativas drop-in para BSC9131NSN1KHKB — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com BSC9131NSN1KHKB (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Co-Processors / DSP, Core Processor, Core Speed.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
BSC9132NSN1KHKB
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
BSC9131NSE1KHKB
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$195 / unidade
Ver ficha técnica →BSC9131NSN1HKK
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
BSC9131NSN1KK
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
BSC9131NSN1KHKB Classificações máximas e características elétricas
| Architecture | QorIQ Qonverge SoC (heterogeneous multicore) |
| CPU Core 1 | PowerPC e500, 32-bit, up to 1 GHz |
| DSP Core | StarCore SC3850, 32-bit VLIW, up to 1 GHz |
| Hardware Accelerator | MAPLE-B2F baseband accelerator |
| Operating Frequency | 800 MHz (per DigiKey listing) |
| Encapsulamento | 520-FCBGA (21 x 21 mm) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0 C to +105 C |
| Memory Interface | DDR3 with ECC support |
| Flash Interface | Integrated Flash Controller (IFC) for NAND/NOR |
| High-Speed I/O | SerDes, PCIe, SGMII |
| Primary Applications | Small-cell base stations, enterprise VoIP, smart grid, military/defense |
| Status do ciclo de vida | End of Life per NXP product page |
Guia de Configuração de Pinos do BSC9131NSN1KHKB 520-fcbga (21 x 21 mm)
Configuração de pinos para BSC9131NSN1KHKB (pacote 520-fcbga (21 x 21 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para BSC9131NSN1KHKB.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
BSC9131NSN1KHKB é adequado para 6 aplicaçãos: LTE Small-Cell Base Station, Enterprise VoIP Media Gateway, Smart Grid Control and Monitoring, Military/Defense Tactical Radio, Industrial Machine-to-Machine Gateway, Wi-Fi/5G Integrated Small-Cell Convergence.
LTE Small-Cell Base Station
The BSC9131NSN1KHKB is purpose-built for residential and enterprise LTE small-cell base stations where board area and power budget are constrained. Its 1 GHz StarCore SC3850 DSP executes PHY-layer channel estimation, FFT/iFFT, and modulation/demodulation in real time, while the 1 GHz PowerPC e500 handles L2/L3 protocol stack and Linux control plane. The integrated MAPLE-B2F accelerator offloads LTE turbo and Viterbi decoding, freeing DSP cycles for higher-order MIMO processing. A typical design uses the DDR3 controller (with ECC) for soft-buffer storage, the IFC for boot NOR flash, and SGMII for backhaul to the core network. Compared with discrete CPU+DSP+FPGA solutions, the integrated SoC reduces BOM count and PCB layer count by approximately 40 percent, making it ideal for pico-cell and femtocell form factors deployed in offices, hotels, and urban small-cell grids.
Recomendado
Enterprise VoIP Media Gateway
The BSC9131NSN1KHKB is well suited for enterprise VoIP media gateways that must transcode multiple G.711/G.722/G.729 audio streams while maintaining SIP signaling. The PowerPC e500 core runs a Linux-based SIP stack and call-control daemon, while the StarCore DSP handles concurrent voice codec processing for tens of channels. Hardware-assisted AES/DES via the integrated SEC engine secures SRTP media without CPU overhead. The DDR3 controller with ECC supports the memory footprint required for buffering concurrent RTP streams, and the integrated IFC allows direct boot from NAND flash for compact, fanless gateway designs. Compared with general-purpose ARM SoCs, the BSC9131NSN1KHKB delivers deterministic DSP latency required for toll-quality voice even under CPU load, making it a strong choice for branch-office and SMB gateway platforms.
Recomendado
Smart Grid Control and Monitoring
Smart-grid infrastructure nodes require deterministic real-time processing for protection, metering, and IEC 61850 communication, and the BSC9131NSN1KHKB meets these requirements with its industrial-grade 0 C to +105 C temperature range and dual-core architecture. The PowerPC e500 handles IEC 61850 GOOSE messaging and SCADA protocols, while the StarCore DSP performs power-quality FFT analysis, harmonic detection, and synchronized phasor calculations. Hardware encryption engines secure DNP3 and IEC 61850 traffic without impacting control-loop latency. The integrated IFC and DDR3 controller support redundancy features required for substation-grade equipment. Compared with PC-based or FPGA solutions, the BSC9131NSN1KHKB reduces system power consumption by approximately 60 percent while delivering deterministic sub-millisecond response times essential for grid-protection applications.
Recomendado
Military/Defense Tactical Radio
Military and defense tactical radios require rugged, deterministic processing for waveforms such as SINCGARS, HAVE QUICK, and modern software-defined radio (SDR) modems. The BSC9131NSN1KHKB's extended temperature operation and high MTBF make it suitable for vehicle-mounted and man-pack radio platforms. The StarCore DSP runs waveform DSP including chirp, OFDM, and spread-spectrum processing, while the e500 manages crypto (via SEC engine), GPS time-sync, and tactical network routing (e.g. SRW, WNW). Hardware acceleration of AES-256 and elliptic-curve crypto meets NSA Suite B requirements without software overhead. Compared with general-purpose processors, the BSC9131NSN1KHKB's deterministic interrupt latency and ECC-protected DDR3 interface deliver the reliability required for mission-critical tactical communications.
Recomendado
Industrial Machine-to-Machine Gateway
Industrial M2M gateways aggregate data from heterogeneous fieldbus networks (PROFIBUS, Modbus, CAN) and backhaul to cloud servers via cellular or Ethernet. The BSC9131NSN1KHKB's heterogeneous compute elements enable simultaneous fieldbus protocol termination, local analytics, and secure backhaul in a single SoC. The PowerPC e500 runs a hardened Linux distribution with fieldbus master stacks, while the StarCore DSP performs edge analytics including vibration FFT for predictive maintenance. Hardware crypto engines protect MQTT/TLS backhaul links. The industrial temperature rating and ECC DDR3 support enable deployment in factory automation cells, remote oil-and-gas installations, and outdoor utility cabinets. Compared with multi-chip ARM+MCU solutions, the integrated SoC design reduces gateway footprint and enables fanless operation at extended temperatures.
Recomendado
Wi-Fi/5G Integrated Small-Cell Convergence
Converged Wi-Fi and 5G small-cell access points require concurrent baseband processing, QoS scheduling, and unified management. The BSC9131NSN1KHKB pairs the StarCore DSP for cellular PHY processing with the e500 core for unified policy enforcement, traffic shaping, and IEEE 802.11ax coordination. The SerDes interfaces connect directly to Wi-Fi baseband companion chips, while the SGMII links carry backhaul traffic to the core network. The integrated MAPLE-B2F LTE accelerator supports legacy LTE alongside 5G NR processing on the same device when paired with external RF front-ends. Compared with single-mode small-cell designs, this converged approach reduces capital expenditure for operators deploying unified radio access networks in enterprise and venue environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para BSC9131NSN1KHKB — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | BSC9132NSN1KHKB | BSC9131NSE1KHKB | BSC9131NSN1HKK |
|---|---|---|---|---|
| Package | 520-FCBGA (21x21) | 520-FCBGA (21x21) - same | 520-FCBGA (21x21) - same | 520-FCBGA (21x21) - same |
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| CPU Cores | 1 x PowerPC e500 @ 1 GHz | 2 x PowerPC e500 @ 1 GHz | 1 x PowerPC e500 @ 1 GHz | 1 x PowerPC e500 @ 1 GHz |
| DSP Core | StarCore SC3850 @ 1 GHz | StarCore SC3850 @ 1 GHz | StarCore SC3850 @ 1 GHz | StarCore SC3850 @ 1 GHz |
| MAPLE Accelerator | MAPLE-B2F | MAPLE-B2F | MAPLE-B2F | MAPLE-B2F |
| Memory Interface | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC | DDR3 with ECC |
| Operating Temperature | 0 C to +105 C | 0 C to +105 C | -40 C to +105 C (extended) | 0 C to +105 C |
| Lifecycle Status | End of Life | End of Life | End of Life | End of Life |
Principais diferenciais
- Integrated MAPLE-B2F LTE accelerator on-die (vs BSC9132NSN1KHKB)
- Single PowerPC e500 core optimizes cost for residential femtocells (vs BSC9132NSN1KHKB)
- Combined CPU+DSP+accelerator in single SoC vs. discrete solutions (vs Discrete CPU + DSP + FPGA designs)
Notas de projeto
The BSC9131NSN1KHKB requires multiple voltage domains including a 1.0 V core supply, 1.5/1.8 V DDR3 supply, 2.5 V SerDes analog supply, and 3.3 V I/O supply. Power-rail sequencing must follow the NXP hardware specification exactly: the core voltage must ramp before the SerDes analog supply to avoid latch-up. Use a multi-rail PMIC such as the NXP MC34704A or a discrete solution with sequenced controllers. Decoupling: place 100 nF X7R ceramics within 2 mm of every power pin, with additional bulk 10 uF tantalum or polymer caps on each rail. Estimated: a fully-loaded BSC9131 small-cell board typically draws 4-6 W at full PHY processing load.
The 520-FCBGA package requires a top-side heatsink or thermal interface material due to its 21x21 mm footprint and concentrated heat dissipation. The NXP datasheet specifies a maximum junction temperature of 125 C, and at typical small-cell ambient of 55 C inside an outdoor enclosure the junction-to-ambient thermal resistance (theta_JA) of approximately 8 C/W with a proper heatsink allows continuous full-load operation. Without a heatsink the SoC will throttle within minutes. Estimated: with theta_JA = 8 C/W and P_diss = 5 W, the junction rise is approximately 40 C above ambient (95 C junction at 55 C ambient), still within spec.
The 520-FCBGA ball pitch requires high-density PCB fabrication: 4-6 layers minimum for a 2-row breakout, with microvia (laser-drilled) stack-ups recommended for inner-row escape. DDR3 traces must be length-matched within 25 mil (0.635 mm) and routed with 50 ohm single-ended impedance. SerDes lanes require 100 ohm differential impedance with continuous reference planes on adjacent layers. The NXP hardware design checklist should be followed verbatim for SoC bring-up, including JTAG, POR, and reset-circuit requirements.
Common pitfalls include: (1) neglecting DDR3 write-leveling/training during firmware bring-up, which causes sporadic read/write failures under thermal cycling; (2) assuming the e500 and StarCore cores share cache coherency - they do not, and shared memory regions require explicit software synchronization; (3) failing to provision a sufficient boot image in IFC NOR flash, which can leave the SoC unbootable if the image is corrupted. Always provision a redundant bootloader image and verify ECC behavior on the DDR3 interface during hardware validation.
Informações de conformidade
Compliance data not present in verified web data. End-of-Life status per NXP product page; customers should request PCN and material declaration documents directly from NXP for compliance confirmation.
