CYW88335L2CUBGT - 2.4GHz WiFi/BT Combo SoC | Infineon
N.º da peça: CYW88335L2CUBGT ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.31 | $12,31 |
| 10 | $11.5 | $115,00 |
| 100 | $10.2 | $1.020,00 |
| 500 | $9.1 | $4.550,00 |
| 1.000 | $8.4 | $8.400,00 |
CYW88335L2CUBGT Visão geral
A combo wireless SoC (System-on-Chip) is a single silicon device that integrates a radio transceiver, baseband processor, and an applications microcontroller. In the wireless connectivity taxonomy, combo SoCs sit between discrete RF transceivers (which require a separate host MCU) and full application processors (which integrate CPU, memory, and peripherals but not RF). Combo SoCs like the CYW88335 enable compact, cost-optimized designs for IoT, audio streaming, and edge connectivity products where PCB real estate and BOM count are critical constraints.
Key differentiating features include simultaneous Wi-Fi/Bluetooth coexistence, 433.3 Mbps physical-layer rate on 802.11ac, -95.5 dBm RX sensitivity for extended range, and integrated power management. The device supports CCK, DSSS, and OFDM modulation, and current consumption is 46-110 mA in receive and 76-147 mA in transmit modes. The die-level integration eliminates external baluns and matching networks typically required by discrete transceivers.
Architecturally, the CYW88335 uses a 2.4 GHz single-band radio chain with internal PA, LNA, and T/R switch, paired with an ARM-class applications core and dedicated baseband accelerators. The integrated MAC and baseband offload the host CPU from real-time radio processing, while 768 kB SRAM enables on-chip protocol stack execution.
Typical applications include Wi-Fi audio streaming speakers, smart-home hubs, IoT gateways, industrial wireless sensors, and Bluetooth/Wi-Fi enabled appliances. The combo architecture is ideal for products that need both high-throughput Wi-Fi for content delivery and Bluetooth for provisioning, audio, or peripheral connectivity.
When designing with the CYW88335L2CUBGT, allocate dedicated ground islands under the WLBGA and follow Infineon's reference PCB stackup to maintain RF performance. Decouple the 3.3 V rail with 10 uF + 0.1 uF capacitors placed within 5 mm of the supply pins.
This page synthesizes distributor pricing, drop-in CYW88335 family alternatives, and practical RF layout notes not found in the manufacturer datasheet.
Alternativas drop-in para CYW88335L2CUBGT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
CYW88335L2CUBXT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
CYW88335L2CUBXGT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
CYW88335L2CUBG
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
CYW88335A2CUBGT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
CYW88335L2CUBXT
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
CYW88335L2CUBGT Especificações
| Função | Wi-Fi + Bluetooth combo RF transceiver with MCU |
| Wi-Fi Standard | 802.11ac (Wi-Fi 5) - 2.4 GHz |
| Bluetooth Standard | Bluetooth v4.1 |
| Frequency Band | 2.4 GHz |
| Maximum PHY Data Rate | 433.3 Mbps |
| Receive Sensitivity | -95.5 dBm |
| Modulation | CCK, DSSS, OFDM |
| Tensão de alimentação | 3.3 V |
| RX Current Consumption | 46 mA to 110 mA |
| TX Current Consumption | 76 mA to 147 mA |
| Integrated ROM | 640 kB |
| Integrated SRAM | 768 kB |
| Host Interfaces | I2S, SPI, UART |
| Encapsulamento | 145-UFBGA / WLBGA |
| Tipo de montagem | Surface Mount |
Guia de Configuração de Pinos do CYW88335L2CUBGT 145-ufbga / wlbga
Configuração de pinos para CYW88335L2CUBGT (pacote 145-ufbga / wlbga). A numeração dos pinos, funções e diagramas de conexão estão definidos no datasheet do fabricante. Consulte-o para o footprint exato e diretrizes de soldagem.
Nenhum dado detalhado de pinagem disponível para CYW88335L2CUBGT.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
CYW88335L2CUBGT é adequado para 6 aplicaçãos: Wi-Fi Audio Streaming Speakers, Smart Home Hubs and Gateways, Industrial Wireless IoT Sensors, Wi-Fi/Bluetooth Appliances, Wireless IP Cameras and Security Devices, Connected Medical Devices.
Wi-Fi Audio Streaming Speakers
The CYW88335L2CUBGT's 433.3 Mbps 802.11ac PHY rate and Bluetooth v4.1 coexistence make it well suited for Wi-Fi audio streaming speakers and soundbars. The high throughput supports lossless and high-bitrate audio formats over 2.4 GHz, while Bluetooth enables speakerphone and direct device pairing for fallback. Per the Infineon datasheet, the integrated 768 kB SRAM runs protocol stacks locally, reducing host MCU load. Compared to discrete Wi-Fi plus BT modules, the CYW88335 cuts BOM count and simplifies coexistence antenna design. Pair it with an external audio DAC for complete smart-speaker designs.
Recomendado
Smart Home Hubs and Gateways
For smart-home hubs aggregating Wi-Fi and Bluetooth sensors, the CYW88335L2CUBGT provides simultaneous dual-protocol connectivity in a single chip. The -95.5 dBm RX sensitivity extends range to far corners of a home, and 768 kB on-chip SRAM handles local protocol processing without external memory. According to the Infineon datasheet, the device supports I2S, SPI, and UART host interfaces for connecting to gateway application processors. Designers should follow Infineon's reference PCB stackup to maintain 2.4 GHz RF performance in dense hub enclosures.
Recomendado
Industrial Wireless IoT Sensors
The CYW88335L2CUBGT operates across industrial temperature ranges and provides 802.11ac plus Bluetooth for factory-floor IoT sensors. With 46-110 mA RX and 76-147 mA TX current, it is suitable for line-powered industrial nodes; battery-powered sensors should use sleep modes aggressively. Per Infineon, the 145-ball WLBGA package is suitable for compact sensor PCBs. The CCK, DSSS, and OFDM modulation support ensures robust connectivity in noisy industrial RF environments, and -95.5 dBm sensitivity handles long cable runs to access points.
Recomendado
Wi-Fi/Bluetooth Appliances
Consumer appliances such as smart refrigerators, washers, and air conditioners use the CYW88335L2CUBGT for Wi-Fi cloud connectivity plus Bluetooth provisioning. The integrated 640 kB ROM stores firmware for direct cloud onboarding, while 768 kB SRAM supports local UI logic. Compared to separate Wi-Fi and BT chips, the combo SoC reduces PCB area and simplifies RF coexistence tuning. According to Infineon specifications, the device supports SPI and UART host interfaces for appliance mainboard integration.
Recomendado
Wireless IP Cameras and Security Devices
For indoor Wi-Fi cameras, the CYW88335L2CUBGT's 433.3 Mbps PHY rate supports HD video streaming over 2.4 GHz Wi-Fi, while Bluetooth v4.1 enables local provisioning via smartphone. The high throughput reduces latency and supports multi-megapixel streams. Per the manufacturer datasheet, the integrated RF chain eliminates external baluns, shrinking PCB size for compact camera modules. Pair the combo SoC with an image sensor processor for complete security camera designs.
Recomendado
Connected Medical Devices
The CYW88335L2CUBGT suits connected medical devices such as telehealth hubs and wireless patient monitors that require reliable Wi-Fi plus Bluetooth coexistence. The -95.5 dBm RX sensitivity ensures stable connectivity across clinical environments, and 802.11ac throughput supports real-time vital-sign data transmission. According to Infineon, the device operates from 3.3 V with predictable current consumption for medical-grade power budgeting. Designers must validate IEC 60601 EMI/EMC compliance at the system level; the combo SoC is one component within that compliance boundary.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para CYW88335L2CUBGT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | CYW88335L2CUBXT | CYW88335L2CUBXGT | CYW88335L2CUBG | CYW88335A2CUBGT |
|---|---|---|---|---|---|
| Package | 145-UFBGA / WLBGA | 145-UFBGA / WLBGA - same | 145-UFBGA / WLBGA - same | 145-UFBGA / WLBGA - same | 145-UFBGA / WLBGA - same |
| Brand | Infineon | Infineon | Infineon | Infineon | Infineon |
| Wi-Fi Standard | 802.11ac (2.4 GHz) | 802.11ac (2.4 GHz) | 802.11ac (2.4 GHz) | 802.11ac (2.4 GHz) | 802.11ac (2.4 GHz) |
| Maximum PHY Data Rate | 433.3 Mbps | 433.3 Mbps | 433.3 Mbps | 433.3 Mbps | 433.3 Mbps |
| RX Sensitivity | -95.5 dBm | -95.5 dBm | -95.5 dBm | -95.5 dBm | -95.5 dBm |
| Bluetooth Version | v4.1 | v4.1 | v4.1 | v4.1 | v4.1 |
| Integrated SRAM | 768 kB | 768 kB | 768 kB | 768 kB | 768 kB |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Principais diferenciais
- 802.11ac (Wi-Fi 5) support at 433.3 Mbps in 2.4 GHz band (vs CYW43455 (802.11n))
- Larger integrated SRAM (768 kB vs typical 512 kB) (vs CYW43012)
- Integrated combo Wi-Fi + Bluetooth v4.1 in single chip (vs Discrete Wi-Fi module + separate BT IC)
Notas de projeto
Use a 4-layer PCB stackup with a continuous ground plane beneath the CYW88335L2CUBGT to control impedance for the 2.4 GHz RF traces. Route the antenna feed on the top side with 50 ohm controlled impedance and keep the ground pour clear under the antenna area. Follow Infineon's reference PCB layout in the datasheet for ball-to-trace transitions on the WLBGA.
Decouple the 3.3 V supply rail with a 10 uF bulk capacitor plus 0.1 uF and 1 nF ceramics placed within 5 mm of the supply balls. Peak TX current can reach 147 mA, so the 3.3 V regulator must supply at least 200 mA with low noise. Add a ferrite bead if the 3.3 V rail is shared with noisy digital circuits to prevent RF supply coupling.
The 145-ball WLBGA requires precise reflow profile per JEDEC J-STD-020; peak temperature must not exceed 260 C for the MSL classification marked on the package. Do not place tall components near the antenna keep-out zone. Ensure the firmware image matches the part suffix - L2CUBGT and A2CUBGT may require different firmware revisions even though the package is identical.
Match the SPI clock trace length to within 2 mm of the corresponding slave traces to avoid reflections at high speeds. Place a series resistor near the CYW88335 SPI ball if the trace exceeds 25 mm. For I2S audio, route clock and data together with ground shielding to suppress crosstalk into RF circuits.
Informações de conformidade
RoHS compliant per Infineon product listing. Lead-free reflow compatible per JEDEC J-STD-020. Halogen-free status not explicitly stated in retrieved data.
