DSPB56367AG150 - 150MHz 24-Bit Audio DSP | NXP Semiconductors
N.º da peça: DSPB56367AG150 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $66.1 | $66,10 |
| 10 | $62.8 | $628,00 |
| 100 | $59.5 | $5.950,00 |
| 500 | $56.2 | $28.100,00 |
| 1.000 | $52.9 | $52.900,00 |
DSPB56367AG150 Visão geral
A digital signal processor is a specialized microprocessor whose architecture is optimized for the fast, repetitive mathematics of real-time signal processing, such as filtering, convolution and transforms. Within the semiconductor hierarchy, the DSPB56367AG150 sits under the DSP56300 family, under digital signal processors, under embedded processors and controllers.
Key features include a 24-bit fixed-point data path with 56-bit accumulator, a 150 MHz core clock delivering roughly 150 MIPS of sustained DSP throughput, and an on-chip peripheral set covering Host Interface, I2C, SAI and SPI for audio and control connectivity. The 240 kB ROM enables mask-programmed firmware for cost-optimized production, while 69 kB of on-chip RAM supports zero-wait-state execution from internal memory.
Technically, the DSP56367 uses the DSP56300 core: a symmetric dual-Harvard architecture with separate program and X/Y data buses, a hardware MAC (multiply-accumulate) unit, and dedicated addressing modes for circular buffering and bit-reversed FFT addressing. This makes it particularly efficient for multi-channel audio algorithms such as filters, sample-rate conversion and codecs.
Typical applications include professional audio effects processors, automotive amplifiers, teleconferencing systems and digital loudspeaker management, where deterministic 24-bit audio processing at 150 MHz is required. Its SAI and I2C ports connect directly to audio codecs and ADC/DAC front ends.
Design consideration: this part is flagged End of Life by NXP, so new designs should plan for last-time-buy quantities or evaluate the DSP56367 datasheet replacement guidance before committing to production.
This page synthesizes distributor pricing, family drop-in alternatives, and EOL lifecycle guidance not found in a single manufacturer datasheet.
Alternativas drop-in para DSPB56367AG150 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPB56367AG150 (mesmo formato e footprint) — diferindo em Host Interface, Instruction Throughput, Package.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPB56367AG120
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPB56366AG150
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPB56362AG120R2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPB56367AG150 Especificações
| Core Type | DSP56300 24-bit fixed-point DSP core |
| Frequência máxima de clock | 150 MHz |
| Program Memory Type | ROM |
| Non-Volatile Memory (ROM) | 240 kB |
| On-Chip RAM | 69 kB |
| Largura do barramento de dados | 24 bit |
| Interfaces | Host Interface, I2C, SAI, SPI |
| Application Type | Audio Processor |
| Encapsulamento / Caixa | 144-LQFP (20x20 mm) |
| Tipo de montagem | Surface Mount |
| Terminal Form | Gull Wing |
| Packaging | Tray |
| Status RoHS | Lead Free (per Mouser listing) |
| Qualification | Not Qualified (per Partstack) |
| Status do ciclo de vida | End of Life (per NXP product page) |
Guia de Configuração de Pinos do DSPB56367AG150 144-lqfp (20x20 mm)
Configuração de pinos para DSPB56367AG150 (pacote 144-lqfp (20x20 mm)). A numeração dos pinos, funções e diagramas de conexão estão definidos no datasheet do fabricante. Consulte-o para o footprint exato e diretrizes de soldagem.
Nenhum dado detalhado de pinagem disponível para DSPB56367AG150.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPB56367AG150 é adequado para 6 aplicaçãos: Professional Audio Effects Processors, Digital Loudspeaker Management Systems, Automotive Audio Amplifiers, Teleconferencing and Echo Cancellation Systems, Studio and Broadcast Audio Interfaces, Industrial Audio Annunciation and PA Systems.
Professional Audio Effects Processors
The DSPB56367AG150 is purpose-built for professional audio effects: its 150 MHz DSP56300 core delivers roughly 150 MIPS of sustained fixed-point throughput, and its 24-bit data path with 56-bit accumulators preserves dynamic range through long reverb decay networks and cascaded biquad filters without audible truncation noise. In a typical effects unit, the SAI port streams multi-channel audio to/from codec front ends while the Host Interface accepts parameter updates from a control microcontroller. The 240 kB on-chip ROM stores the complete effect firmware mask-programmed, removing external flash cost. Performance consideration: at 150 MHz, headroom for high-channel-count impulse-response convolution should be budgeted via cycle-count analysis, since a single core must schedule both DSP kernels and control tasks.
Recomendado
Digital Loudspeaker Management Systems
In active loudspeaker processors, the DSPB56367AG150 performs crossover filtering, driver EQ, delay alignment and limiter dynamics on each output channel. The symmetric dual-Harvard DSP56300 architecture with dedicated circular-buffer addressing runs FIR/IIR crossover banks efficiently, while 69 kB on-chip RAM provides zero-wait-state storage for coefficient tables and delay lines. The 150 MHz clock supports 24-bit processing at 48 kHz or 96 kHz sample rates across multiple output channels, and the I2C port configures connected codecs and volume controls. Performance consideration: total delay-line memory must fit within the 69 kB on-chip RAM budget, so long venue-level delays should be implemented externally or at reduced resolution.
Recomendado
Automotive Audio Amplifiers
Automotive amplifier platforms use the DSPB56367AG150 for signal shaping ahead of power stages: speed-dependent volume compensation, cabin EQ, speaker protection and bus-derived audio decoding. The 144-LQFP (20x20 mm) gull-wing package withstands standard automotive SMT assembly, and the AG (lead-free) suffix suits modern assembly processes. The Host Interface lets a body-controller MCU upload parameters over the SPI/Host ports, while SAI moves audio to D-class modulators. Performance consideration: per Partstack data this commercial part is Not Qualified for automotive AEC flows, so designers of safety-relevant ECUs must perform their own qualification or select a qualified variant; thermal design should also target the elevated in-cabinet ambient temperatures of automotive installations.
Recomendado
Teleconferencing and Echo Cancellation Systems
Conference-room speakerphones rely on the DSPB56367AG150's hardware MAC unit and fast accumulators to run acoustic echo cancellation (AEC), noise reduction and automatic gain control in real time. The 150 MHz clock sustains multi-hundred-tap adaptive FIR filters required for room-path echo cancellation at 16-48 kHz sampling, and 69 kB of on-chip RAM holds adaptive coefficient state with zero wait states. The I2C and Host interfaces manage codec configuration and call-control messaging from an application processor. Performance consideration: AEC convergence algorithms are cycle-hungry; engineers should reserve margin on the 150 MIPS budget for double-talk detection and comfort-noise generation alongside the core echo path estimate.
Recomendado
Studio and Broadcast Audio Interfaces
Recording and broadcast equipment uses the DSPB56367AG150 for monitoring mixes, format conversion and dynamic processing between the converter stage and the digital interface. The 24-bit fixed-point path matches professional converter resolution bit-for-bit, while the SAI port interconnects with multichannel codecs and the SPI port services user-interface peripherals such as rotary encoders and displays. The 240 kB mask ROM embeds production firmware for repeatable channel presets across manufactured units. Performance consideration: at 96 kHz session rates, per-sample processing time halves versus 48 kHz, so algorithm complexity must be re-budgeted on the 150 MHz core to avoid buffer under-runs; the DSP56367 datasheet provides cycle-accurate instruction timings for this analysis.
Recomendado
Industrial Audio Annunciation and PA Systems
Public-address, evacuation and machine-annunciation systems benefit from the DSPB56367AG150's deterministic real-time behavior: messages are mixed, equalized, delayed across zones and limited for intelligibility without OS-induced jitter. The 150 MHz core runs paging-priority mixing and feedback suppression simultaneously, and 240 kB of mask ROM stores both firmware and short prompt tables on-chip. I2C connects to audio matrix peripherals, and the Host Interface links to the PA system controller. Performance consideration: the part's End-of-Life status means long-life industrial deployments should secure last-time-buy inventory via Rochester Electronics or design a firmware-portable DSP56300-compatible successor before factory commitments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPB56367AG150 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPB56367AG120 | DSPB56366AG150 | DSPB56362AG120R2 |
|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP | 144-LQFP |
| Brand | NXP Semiconductors (originally Freescale/Motorola) | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Core Clock | 150 MHz | 120 MHz | 150 MHz | 120 MHz |
| Data Path Width | 24 bit | 24 bit | 24 bit | 24 bit |
| Interfaces | Host Interface, I2C, SAI, SPI | Host Interface, I2C, SAI, SPI | Host Interface, I2C, SAI, SPI | Host Interface, I2C, SAI, SPI |
Principais diferenciais
- Highest speed grade in the DSP56367 family (vs DSPB56367AG120)
- Largest on-chip memory in its class within the family (vs DSPB56362AG120R2)
- Mask-ROM cost optimization (vs DSPB56367AG120)
Notas de projeto
The DSPB56367AG150 is flagged End of Life on NXP's official product page, which lists discontinuance and replacement Product Change Notice information. Before committing a production build, secure last-time-buy quantities through Rochester Electronics (authorized post-EOL source, listed on DigiKey Marketplace) or complete a firmware-portability review toward the DSP5672x family. Do not assume ongoing factory supply from standard distribution after residual stock is depleted.
The DSP56300 family uses separate core and I/O supply rails; consult the electrical characteristics section of the NXP DSP56367 datasheet (nxp.com/docs/en/data-sheet/DSP56367.pdf) for nominal values, sequencing requirements and decoupling. Place 100 nF ceramic capacitors at each supply pin pair of the 144-LQFP plus bulk capacitance near the package. Observe any specified power-rail sequencing between core and I/O to avoid latch-up during startup.
At 150 MHz, the SAI bit clocks and Host Interface lines on this 24-bit audio DSP need controlled routing: keep audio serial lines short, match SAI clock/data skews within a fraction of the bit period, and guard the crystal/oscillator input with a local ground plane. For multi-board audio chains, route SAI as point-to-point with series termination near the driver to control ringing on gull-wing LQFP stubs.
The 144-LQFP (20x20 mm) gull-wing footprint requires careful land-pattern adherence to the datasheet mechanical drawing; 0.5 mm-class pitch QFP pads benefit from solder-mask-defined pads and a ~1 mm paste aperture reduction per outer pins to reduce bridging during reflow. Provide thermal relief through ground-plane stitching under the package since LQFP has no exposed pad; junction-to-ambient resistance is dominated by copper pour area.
Informações de conformidade
Mouser listing explicitly identifies 'LEAD FREE DSP56367'; AG suffix denotes lead-free packaging. Detailed REACH/halogen declarations should be confirmed on nxp.com/part/DSPB56367AG150. Partstack notes Qualification: Not Qualified (not AEC-qualified).
