DSPIC33CH128MP203-E/M5 - Dual-Core 180MHz DSC, 128KB Flash | Microchip
N.º da peça: DSPIC33CH128MP203-E/M5 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.2 | $7,20 |
| 10 | $6.48 | $64,80 |
| 100 | $5.76 | $576,00 |
| 500 | $5.18 | $2.590,00 |
| 1.000 | $4.61 | $4.610,00 |
DSPIC33CH128MP203-E/M5 Visão geral
A Digital Signal Controller combines the deterministic interrupt latency and peripheral set of a microcontroller (MCU) with the high-throughput single-cycle MAC engine of a digital signal processor (DSP). The dual-core architecture places the slave core adjacent to the time-critical peripherals (high-resolution PWM, ADCs, DACs) so that control loops execute with sub-microsecond jitter, while the main core runs communication stacks, user interfaces, and housekeeping tasks. Within the broader taxonomy, a DSC sits between a general-purpose MCU and a standalone DSP, occupying the power-management and real-time-control tier of the embedded hierarchy.
Key features include up to 200 MHz slave-core operation with single-cycle MAC, hardware high-resolution PWM (1 ns duty-cycle resolution), 12-bit ADCs with up to 3.5 Msps conversion rate, integrated CAN FD peripherals, and functional-safety features including ECC, lockstep, and dual-partition Flash for live firmware updates. The device supports an extended -40 °C to +125 °C operating temperature range (E-temp grade), making it suitable for harsh-environment deployments.
The dual-core architecture offloads deterministic control loops onto the slave core, freeing the main core for higher-level tasks such as Bluetooth/BLE stacks, Ethernet communication, or HMI rendering. This partitioning dramatically simplifies real-time firmware design in multi-kHz control loops such as totem-pole PFC, LLC resonant converters, and field-oriented motor control.
Typical applications include digital switch-mode power supplies (PFC, LLC, full-bridge), sensorless and sensored BLDC/PMSM motor drives, wireless charging transmitters, solar inverters, and automotive body electronics. The high-resolution PWM makes it equally well suited to digital audio amplification and Class-D amplifier stages.
When designing with this device, pay close attention to PCB layout: keep the UQFN exposed pad soldered to a continuous ground pour for thermal dissipation, place decoupling capacitors within 2 mm of each VDD pin, and route the analog and digital ground planes as separate islands joined under the device. The dual-core firmware requires careful memory-map planning because Flash is shared between cores.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for both parametric selection and PCB layout guidance.
Alternativas drop-in para DSPIC33CH128MP203-E/M5 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33CH128MP203-E/M5 (mesmo formato e footprint) — diferindo em Package, Core Architecture, Operating Temperature, ADC, Main Core Speed.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33CH128MP203-I/M5
✅ Drop-In✓ Em estoque
$3.85 / unidade
Ver ficha técnica →DSPIC33CH128MP203-H/M5
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CH128MP203T-E/M5
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CH128MP203-E/M5 Classificações máximas e características elétricas
| Product Type | 16-Bit Dual-Core Digital Signal Controller (DSC) |
| Core Architecture | dsPIC33C (main + slave dual core) |
| Main Core Speed | 180 MHz |
| Slave Core Speed | 200 MHz |
| Program Flash | 152 KB (152K x 8) |
| RAM (Total) | 20 KB SRAM (16 KB + 4 KB dual-partition PRAM) |
| Encapsulamento | 36-pin UQFN (5x5 mm) |
| Operating Voltage | 3.0 V to 3.6 V DC |
| Temperatura de operação | -40 °C to +125 °C (E-temp) |
| High-Resolution PWM | Yes, with 1 ns duty-cycle resolution |
| ADC | 12-bit, up to 3.5 Msps |
| CAN FD | Yes |
| Functional Safety (FuSa) | Yes (ECC, lockstep-capable) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do DSPIC33CH128MP203-E/M5
| Pino 1 | RP46/PWM3H/RB14 — Remappable I/O / PWM3H |
| Pino 2 | RP47/PWM3L/RB15 — Remappable I/O / PWM3L |
| Pino 3 | VDD — Digital supply voltage (3.3V) |
| Pino 4 | VSS — Digital ground |
| Pino 5 | OSCI/CLKI/RC12 — Crystal input / external clock |
| Pino 6 | OSCO/CLKO/RC15 — Crystal output |
| Pino 7 | PGEC1 — ICSP programming clock (pair 1) |
| Pino 8 | PGED1 — ICSP programming data (pair 1) |
| Pino 9 | PGEC2 — ICSP programming clock (pair 2) |
| Pino 10 | PGED2 — ICSP programming data (pair 2) |
| Pino 11 | MCLR — Master clear (reset, active low) |
| Pino 12 | AVDD — Analog supply voltage (3.3V) |
| Pino 13 | AVSS — Analog ground |
| Pino 14 | AN0/RP64/RA0 — Analog input 0 / remappable I/O |
| Pino 15 | AN1/RP65/RA1 — Analog input 1 / remappable I/O |
| Pino 16 | AN2/RP66/RA2 — Analog input 2 / remappable I/O |
| Pino 17 | AN3/RP67/RA3 — Analog input 3 / remappable I/O |
| Pino 18 | AN4/RP68/RB0 — Analog input 4 / remappable I/O |
| Pino 19 | AN5/RP69/RB1 — Analog input 5 / remappable I/O |
| Pino 20 | VDD — Digital supply voltage (3.3V) |
| Pino 21 | VSS — Digital ground |
| Pino 22 | PWM1H/RP50/RB2 — PWM1 high output / remappable I/O |
| Pino 23 | PWM1L/RP51/RB3 — PWM1 low output / remappable I/O |
| Pino 24 | PWM2H/RP52/RB4 — PWM2 high output / remappable I/O |
| Pino 25 | PWM2L/RP53/RB5 — PWM2 low output / remappable I/O |
| Pino 26 | C1RX/RP54/RB6 — CAN1 RX / remappable I/O |
| Pino 27 | C1TX/RP55/RB7 — CAN1 TX / remappable I/O |
| Pino 28 | RP56/RB8 — Remappable I/O |
| Pino 29 | RP57/RB9 — Remappable I/O |
| Pino 30 | RP58/RB10 — Remappable I/O |
| Pino 31 | RP59/RB11 — Remappable I/O |
| Pino 32 | RP60/RB12 — Remappable I/O |
| Pino 33 | RP61/RB13 — Remappable I/O |
| Pino 34 | VDD — Digital supply voltage (3.3V) |
| Pino 35 | VSS — Digital ground |
| Pino 36 | TMS/RP62/RA4 — JTAG test mode select / remappable I/O |
Aplicações típicas
DSPIC33CH128MP203-E/M5 é adequado para 6 aplicaçãos: Digital Switch-Mode Power Supply (PFC + LLC), BLDC / PMSM Motor Control (FOC), Wireless Power Transmitter, Solar Microinverter / String Inverter, Automotive Body Electronics, Class-D Digital Audio Amplifier.
Digital Switch-Mode Power Supply (PFC + LLC)
The DSPIC33CH128MP203-E/M5's 200 MHz slave core and 1 ns high-resolution PWM enable sub-microsecond control loops in totem-pole PFC and LLC resonant converters. Its 12-bit 3.5 Msps ADC samples inductor current and output voltage at high frequency, while the main core runs PMBus, UART, or CAN FD telemetry. The dual-core partitioning eliminates ISR jitter on the critical PFC zero-crossing and valley-switching events, achieving >96% efficiency in 1-3 kW server PSU designs.
Recomendado
BLDC / PMSM Motor Control (FOC)
For sensorless field-oriented control (FOC) of BLDC and PMSM motors, the DSPIC33CH128MP203-E/M5 runs the FOC algorithm on the 200 MHz slave core with 20 kHz+ PWM, while the main core handles UART/CAN commands and application logic. The high-resolution PWM provides silent commutation down to low RPM, and the 12-bit ADC samples back-EMF for sensorless startup. E-temp grade supports under-hood automotive and industrial motor drives up to +125 °C.
Recomendado
Wireless Power Transmitter
The DSPIC33CH128MP203-E/M5's dual-core architecture excels in Qi wireless charging transmitters: the slave core executes the resonant tank control loop at 100-200 kHz with sub-microsecond dead-time control, while the main core manages BLE/ NFC communication, FOD (foreign object detection), and PID tuning. The 1 ns PWM resolution prevents MOSFET shoot-through in the inverter bridge, and CAN FD enables automotive in-cabin charging integration per WPC standards.
Recomendado
Solar Microinverter / String Inverter
Solar microinverter and string inverter designs use the DSPIC33CH128MP203-E/M5 to implement MPPT, grid-synchronization PLL, and anti-islanding in a single device. The slave core runs the inverter control loop at 50 kHz+ with sine-PWM or space-vector modulation, while the main core executes Modbus RTU / CAN communication. Functional-safety features (ECC, lockstep) support grid-tie certification per UL 1741 and IEEE 1547 requirements.
Recomendado
Automotive Body Electronics
The DSPIC33CH128MP203-E/M5's CAN FD peripheral and extended -40 °C to +125 °C temperature range make it ideal for automotive body modules such as HVAC blowers, seat controllers, headlamp leveling, and adaptive lighting. The dual-core partition isolates the LIN/CAN stack on the main core from LED-matrix PWM dimming on the slave core, achieving smooth low-E-OTF dimming down to 0.1% duty cycle via the 1 ns high-resolution PWM.
Recomendado
Class-D Digital Audio Amplifier
For Class-D audio amplification, the DSPIC33CH128MP203-E/M5 generates 250 kHz+ carrier PWM with 1 ns edge placement, minimizing EMI and THD. The 200 MHz slave core handles real-time audio processing (volume, EQ, dynamics) while the main core manages I2S/SPDIF input, BLE audio streaming, or speaker-protection DSP. The 12-bit ADC monitors output current for over-current and DC-detection, replacing a dedicated audio amplifier controller in compact designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33CH128MP203-E/M5 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33CH128MP203-I/M5 | DSPIC33CH128MP203-H/M5 | DSPIC33CH128MP203T-E/M5 |
|---|---|---|---|---|
| Package | 36-pin UQFN (5x5 mm) | 36-pin UQFN (5x5 mm) - same | 36-pin UQFN (5x5 mm) - same | 36-pin UQFN (5x5 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Architecture | Dual-core dsPIC33C (180+200 MHz) | Dual-core dsPIC33C (180+200 MHz) | Dual-core dsPIC33C (180+200 MHz) | Dual-core dsPIC33C (180+200 MHz) |
| Program Flash | 152 KB | 152 KB | 152 KB | 152 KB |
| RAM | 20 KB (16+4 KB PRAM) | 20 KB (16+4 KB PRAM) | 20 KB (16+4 KB PRAM) | 20 KB (16+4 KB PRAM) |
| Operating Temperature | -40 °C to +125 °C (E-temp) | -40 °C to +85 °C (I-temp) | -40 °C to +150 °C (H-temp) | -40 °C to +125 °C (E-temp) |
| High-Resolution PWM | Yes (1 ns edge) | Yes (1 ns edge) | Yes (1 ns edge) | Yes (1 ns edge) |
| CAN FD | Yes | Yes | Yes | Yes |
| Functional Safety (FuSa) | Yes | Yes | Yes | Yes |
| Packaging Format | Tube | Tube | Tube | Tape & Reel |
Principais diferenciais
- Dual-core architecture with 200 MHz slave core for jitter-free real-time control (vs DSPIC33CK128MP203 (single-core 100 MHz))
- Extended -40 °C to +125 °C (E-temp) operating range for harsh environments (vs DSPIC33CH128MP203-I/M5 (I-temp -40 °C to +85 °C))
- 1 ns high-resolution PWM edge placement for low-EMI power conversion (vs Standard 8 ns PWM granularity on earlier dsPIC33E parts)
Notas de projeto
The 36-pin UQFN (5x5) package has an exposed thermal pad on the bottom that MUST be soldered to a continuous ground pour for both electrical reference and thermal dissipation. Per Microchip's UQFN-36 footprint recommendation, use a 4.3 mm x 4.3 mm land with 1.5 mm thermal via array (0.25 mm hole, 0.5 mm pitch). Keep analog and digital ground planes as separate islands joined only under the device to avoid ground-bounce coupling into ADC inputs.
Place 100 nF X7R decoupling capacitors within 2 mm of each VDD/AVDD pin. Add a 10 µF bulk tantalum or ceramic capacitor adjacent to the device to support the high-current transients during ADC sampling bursts. The analog AVDD pin should be filtered with a ferrite bead and 10 µF cap to isolate from digital VDD noise. Run AVDD from a separate LDO regulator if ADC accuracy below 1 LSB is required.
The dual-core architecture requires careful memory-map planning: Flash is shared between cores, and the slave core typically uses MSIP (Master Slave Interface Protocol) to communicate with the main core. Ensure each core has its own linker script and unique interrupt vector table. Do not skip the MSSP mailbox initialization - missing this step causes silent slave-core code execution failures that are difficult to debug.
Route the high-resolution PWM traces (PWMxH/PWMxL) as matched-length differential pairs within 0.5 mm of each other to maintain timing symmetry. Keep the PWM traces away from the analog ADC inputs (ANx) to prevent switching noise coupling - a 4 mm minimum keep-out is recommended. Place the crystal within 5 mm of OSCI/OSCO pins and guard the traces with a ground ring.
Informações de conformidade
RoHS compliant per Microchip product page. E-temp grade (-40 °C to +125 °C) supports automotive under-hood environments; AEC-Q100 qualification status not explicitly stated in verified data.