DSPIC33CK128MC102T-I/M6 - 100MHz 16-bit DSC, 128KB Flash | Microchip
N.º da peça: DSPIC33CK128MC102T-I/M6 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $4.2 | $4,20 |
| 10 | $3.78 | $37,80 |
| 100 | $3.36 | $336,00 |
| 500 | $3.02 | $1.510,00 |
| 1.000 | $2.71 | $2.710,00 |
DSPIC33CK128MC102T-I/M6 Visão geral
A digital signal controller is a hybrid device that combines the deterministic processing core of a microcontroller with the DSP capability of a digital signal processor. Within the power-management hierarchy, the dsPIC33CK family sits between general-purpose 16-bit MCUs (PIC24) and dedicated motor-control ASICs, offering on-chip peripherals purpose-built for closed-loop control such as Field-Oriented Control (FOC) of motors and digital power conversion.
Key features include the 100 MHz dsPIC33C core with DSP instruction extensions, an integrated operational amplifier stage, a 12-bit high-speed ADC for simultaneous multi-channel sampling, and a high-resolution PWM module capable of fine edge placement for switching converters. A 4-channel DMA controller offloads data movement from the CPU, and an internal fast RC oscillator allows operation without an external crystal.
The CK-core architecture improves on the earlier dsPIC33EP generation with faster deterministic execution, zero-overhead loops, a DSP engine with dual 16-bit accumulators, and flash rated for industrial temperature ranges. The integrated op-amps can be configured for gain stages ahead of the ADC, reducing external component count in current-sense circuits.
Typical applications include brushless DC and PMSM motor control, digitally controlled AC-DC and DC-DC power supplies, power factor correction stages, and sensor signal conditioning in industrial automation.
When designing with this part, budget the peripheral pin select (PPS) mapping early in firmware design and decouple VDD with low-ESR ceramics close to the UQFN pins. The exposed pad on the M6 package should be soldered to a grounded copper pour for thermal and signal-integrity benefits.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical design guidance not found in the manufacturer datasheet.
Alternativas drop-in para DSPIC33CK128MC102T-I/M6 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33CK128MC102T-I/M6 (mesmo formato e footprint) — diferindo em ADC Resolution, Core, Packaging.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33CK128MC102T-E/M6
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CK256MC102T-I/M6
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33CK64MC102T-I/M6
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →DSPIC33CK32MC102T-I/M6
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33CK64MC102T-E/M6
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33CK128MC102T-I/M6 Classificações máximas e características elétricas
| Core | dsPIC33C 16-bit DSC core |
| Maximum CPU Speed | 100 MHz (100 MIPS) |
| Program Memory Size | 128 KB (128K x 8) Flash |
| RAM Size | 16 KB |
| ADC Resolution | 12 bit |
| Integrated Peripherals | OpAmps, 12-bit ADCs, PWM |
| DMA Channels | 4 |
| Encapsulamento | 28-UQFN (4x4x0.6 mm) |
| Temperatura de operação | -40C to +125C (I grade) |
| Tipo de montagem | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Status RoHS | Compliant |
| Technology | CMOS |
| External Interrupts | 4 |
| Serial Interfaces | 3 serial I/O ports |
Guia de Configuração de Pinos do DSPIC33CK128MC102T-I/M6 28-uqfn (4x4x0.6 mm)
Configuração de pinos para DSPIC33CK128MC102T-I/M6 (pacote 28-uqfn (4x4x0.6 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33CK128MC102T-I/M6.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33CK128MC102T-I/M6 é adequado para 6 aplicaçãos: BLDC / PMSM Motor Control (FOC), Digital Power Conversion (AC-DC / DC-DC), Power Factor Correction (PFC) Stages, Industrial Automation and Sensor Conditioning, IoT Edge Nodes and Smart Sensing, Automotive and Medical Subsystems (non-safety-critical).
BLDC / PMSM Motor Control (FOC)
The DSPIC33CK128MC102T-I/M6 is a natural fit for Field-Oriented Control of brushless DC and permanent-magnet synchronous motors. Its 100 MHz dsPIC33C core executes the Clarke/Park transforms, PI current loops, and speed loop deterministically at switching frequencies of 20-100 kHz, while the 12-bit ADC samples phase currents with tight timing control. The high-resolution PWM module provides fine duty-cycle resolution that reduces current ripple and audible noise, and the integrated op-amps amplify low-side shunt currents directly, cutting external amplifier ICs. The 128 KB Flash accommodates full FOC firmware plus a communication stack. Trade-off: the 28-pin package limits parallel peripheral use, so plan PPS pin mapping early.
Recomendado
Digital Power Conversion (AC-DC / DC-DC)
In digitally controlled power supplies, the DSPIC33CK128MC102T-I/M6 closes the voltage and current loops in firmware, replacing analog compensators. The high-resolution PWM achieves sub-nanosecond edge placement for phase-shift and buck topologies, while the fast 12-bit ADC feeds the control loop with output voltage and current feedback. The 4-channel DMA moves ADC results to RAM without CPU intervention, keeping loop latency predictable. The integrated op-amps can buffer current-shunt signals ahead of the ADC. A typical use is a 100-500 W LLC or buck converter, where the 100 MHz core sustains switching frequencies above 100 kHz with headroom for PFC coordination.
Recomendado
Power Factor Correction (PFC) Stages
The DSPIC33CK128MC102T-I/M6 implements average-current-mode or critical-conduction PFC in firmware with the precision the 100 MHz core provides. The 12-bit ADC captures the AC input waveform and bus voltage synchronously with the PWM period, and the on-chip op-amps condition the current-shunt signal without external amplifiers. Because the PFC and downstream DC-DC loops can run on the same single-core DSC, a 28-pin part covers both stages in compact industrial supplies. The 128 KB Flash leaves room for power-metering and fault-logging firmware. Designers should reserve DMA channels for ADC result transfer to minimize control-loop jitter at light load.
Recomendado
Industrial Automation and Sensor Conditioning
In factory automation nodes, the DSPIC33CK128MC102T-I/M6 combines control and communication: three serial ports (UART/SPI/I2C) link to sensors, actuators, and backplanes, while the DSP engine performs filtering such as FIR/IIR on acquired signals. The integrated op-amps front-end small differential sensor signals (strain gauges, thermocouples via external conditioning), and the 12-bit ADC digitizes up to factory automation channel counts within the 28-pin budget. Its -40C to +125C industrial temperature rating supports enclosures near motors and drives. The internal fast RC oscillator removes the crystal from the BOM in applications tolerant to a few percent clock accuracy.
Recomendado
IoT Edge Nodes and Smart Sensing
For connected sensing endpoints, the DSPIC33CK128MC102T-I/M6 offers a low-cost 16-bit DSC with enough headroom for DSP pre-processing, such as RMS computation, FFT windowing, or vibration signature analysis, before transmission. The 128 KB Flash holds the application plus a serial communication stack (UART-to-Wi-Fi or LoRa module bridges over SPI/UART), and the 4-channel DMA offloads streaming data. Sleep and idle modes reduce average current in battery-backed nodes, and the internal oscillator supports low-cost clocking. The 4x4 mm UQFN footprint suits compact sensor PCBs, though designers should confirm the I-grade thermal envelope against enclosure conditions.
Recomendado
Automotive and Medical Subsystems (non-safety-critical)
Distributor data positions the dsPIC33CK MC10 series for automotive-adjacent and medical device applications such as pump control, fan and blower drives, and portable diagnostic instruments. The -40C to +125C industrial rating overlaps many under-hood and sterilization-adjacent temperature requirements, and the deterministic 100 MHz core handles closed-loop pump or valve control with predictable latency. Note this specific I-grade part is not AEC-Q100 qualified; for formal automotive qualification, evaluate the E-temperature variant and confirm qualification status with Microchip. The 12-bit ADC and op-amps also serve biosignal front ends where moderate resolution and low external part count matter.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33CK128MC102T-I/M6 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33CK128MC102T-E/M6 | DSPIC33CK256MC102T-I/M6 | DSPIC33CK64MC102T-I/M6 | DSPIC33CK32MC102T-I/M6 |
|---|---|---|---|---|---|
| Package | 28-UQFN (4x4x0.6 mm) | 28-UQFN (4x4) - same | 28-UQFN (4x4) - same | 28-UQFN (4x4) - same | 28-UQFN (4x4) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 128 KB | 128 KB | 256 KB | 64 KB | 32 KB |
| CPU Speed | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) | 100 MHz (100 MIPS) |
| Operating Temperature | -40C to +125C (I grade) | Extended (E) grade | -40C to +125C (I grade) | -40C to +125C (I grade) | -40C to +125C (I grade) |
| Integrated Op-Amps | Yes | Yes | Yes | Yes | Yes |
| Best Use Case | Balanced FOC firmware + comms stack | High-ambient / harsh environment | Large firmware, future headroom | Cost-optimized lean FOC | Lowest cost minimal control |
Principais diferenciais
- Double the Flash in the same footprint available (vs DSPIC33CK64MC102T-I/M6)
- Extended-temperature sibling exists for harsh designs (vs DSPIC33CK128MC102T-E/M6)
- Integrated op-amps reduce BOM in current-sense designs (vs DSPIC33CK32MC102T-I/M6)
Notas de projeto
The 28-UQFN (M6) package has an exposed die pad that must be soldered to a PCB ground pour. Specify an SMD stencil with approximately 60-70% pad coverage on the exposed pad via array to avoid voiding. The 0.5 mm pin pitch requires careful reflow profile control; check the Microchip package outline drawing for exact land-pattern dimensions before finalizing the footprint. This is the most common assembly defect source for M6-packaged dsPIC33CK parts.
Decouple all VDD pins with 100 nF low-ESR ceramics placed within 2 mm of each supply pin, plus a bulk 4.7-10 uF capacitor near the device. When the high-resolution PWM drives power switches, ground bounce on the analog ground can degrade 12-bit ADC accuracy; use a solid ground plane with the exposed pad stitched to it and separate the analog feedback routing from PWM switching loops. Verify the exact supply voltage range in the dsPIC33CK128MC102 family datasheet before finalizing the rail design.
The Peripheral Pin Select (PPS) system maps digital functions to physical pins at runtime, so two firmware teams can produce conflicting mappings for the same board. Define a locked PPS mapping table at project start and verify it against the 28-pin UQFN pinout in the datasheet - several pins on this device are analog-only and cannot be remapped to digital functions. Also confirm Flash sizing headroom: the 128 KB part cannot be upgraded in-system if firmware grows past capacity; the same-footprint 256 KB variant is the escape path.
Informações de conformidade
Newark listing explicitly states ROHS COMPLIANT: YES. Not an AEC-Q100 qualified part (I-grade industrial temperature); verify automotive qualification status with Microchip if required.
