DSPIC33CK32MP105-E/M4 - 100MHz 16-bit DSC, 32KB Flash | Microchip
N.º da peça: DSPIC33CK32MP105-E/M4 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
DSPIC33CK32MP105-E/M4 Visão geral
A digital signal controller combines the control peripherals of a microcontroller with the mathematical throughput of a digital signal processor in one chip. In the power-management hierarchy, the DSC sits above basic MCUs and below multi-core application processors, making it the standard device class for closed-loop digital power conversion, motor control and advanced sensing where deterministic, cycle-accurate control loops are executed at high sample rates.
Key features include the 100 MIPS (100 MHz) modified Harvard DSP core with single-cycle MAC and DSP instruction support, a high-speed 12-bit ADC capable of feeding fast control loops, multiple integrated operational amplifiers and comparators that reduce external analog BOM count, and high-resolution PWM peripherals purpose-built for power conversion topologies. The -E suffix denotes an extended -40C to +125C operating temperature range, and the device is AEC-Q100 qualified with Functional Safety (FuSa) support documentation.
Architecturally, the dsPIC33CK single-core design pairs the DSP engine with intelligent analog peripherals clocked from the same 100 MHz system clock, enabling deterministic ADC-sample-to-PWM-update latency critical for peak-current-mode control and sensorless field-oriented control (FOC). Microchip positions this family for digital power, motor control, advanced sensing and general embedded control.
Typical applications include switched-mode power supplies (AC-DC, DC-DC), PFC stages, BLDC and PMSM motor drives, LED drivers, and automotive/industrial sensing nodes.
Design consideration: validate PCB thermal relief under the UQFN exposed pad, since sustained 100 MHz operation at extended temperature requires a solid ground pour for heat spreading.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para DSPIC33CK32MP105-E/M4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33CK32MP105-E/M4 (mesmo formato e footprint) — diferindo em Package, Core, ADC Resolution, Operating Temperature, Comparators.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33CK32MP105-I/M4
✅ Drop-In✓ Em estoque
$2.94 / unidade
Ver ficha técnica →DSPIC33CK32MC105-E/M4
✅ Drop-In✓ Em estoque
$3.2 / unidade
Ver ficha técnica →DSPIC33CK64MP105-E/M4
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33CK64MC105-E/M4
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$0.8 / unidade
Ver ficha técnica →DSPIC33CK32MP105T-E/M4
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33CK32MP105-E/M4 Classificações máximas e características elétricas
| Core | dsPIC33CK 16-bit single-core DSC |
| Core Speed | 100 MHz (100 MIPS) |
| Flash Memory | 32 KB (32K x 8) |
| RAM | 8 KB |
| ADC Resolution | 12-bit |
| Integrated Op Amps | Yes |
| Comparators | Yes (high-speed) |
| PWM Peripherals | High-speed PWM |
| Tensão de alimentação | 3.3 V |
| Temperatura de operação | -40C to +125C (E grade) |
| Encapsulamento | 48-UQFN (6x6 mm), exposed pad |
| Tipo de montagem | Surface Mount |
| Qualification | AEC-Q100, Functional Safety (FuSa) |
| Product Family | dsPIC33CK (dsPIC33C DSC) |
| Application Segments | Automotive, industrial, digital power, motor control |
Guia de Configuração de Pinos do DSPIC33CK32MP105-E/M4 48-uqfn (6x6 mm), exposed pad
Configuração de pinos para DSPIC33CK32MP105-E/M4 (pacote 48-uqfn (6x6 mm), exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33CK32MP105-E/M4.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33CK32MP105-E/M4 é adequado para 6 aplicaçãos: Digital Power Supplies (AC-DC / DC-DC), Sensorless BLDC / PMSM Motor Control, Power Factor Correction (PFC) Stages, Automotive Sensing and Control Nodes, Smart Sensors and Capacitive Touch Interfaces, LED Drivers and Lighting Control.
Digital Power Supplies (AC-DC / DC-DC)
The DSPIC33CK32MP105-E/M4 fits digital power conversion because its 100 MHz (100 MIPS) DSP core with single-cycle MAC executes voltage- and current-mode control loops at switching frequencies well above 100 kHz with deterministic latency, while the high-speed 12-bit ADC samples feedback with low conversion delay. The high-speed PWM peripheral provides complementary outputs, dead-time insertion and fault trip inputs required for half-bridge, full-bridge and LLC topologies, and integrated op amps condition shunt-current signals without external amplifiers, shrinking the analog BOM. In a typical topology the DSC closes the loop in firmware, replacing analog compensation networks and enabling adaptive features such as burst mode, soft-start scheduling and telemetry via UART/CAN. The -E grade (-40C to +125C) tolerates enclosure heat near the power stage, and the exposed-pad UQFN-48 spreads die heat into the PCB ground pour.
Recomendado
Sensorless BLDC / PMSM Motor Control
The DSPIC33CK32MP105-E/M4 is purpose-built for field-oriented control (FOC) of BLDC and PMSM motors: the 100 MHz single-cycle DSP core runs Clarke/Park transforms and PI current loops at PWM-synchronized rates, the 12-bit ADC performs dual-shunt or single-shunt current sampling triggered directly by the PWM peripheral, and the integrated op amps and comparators enable overcurrent protection within microseconds without external comparators. The -E extended temperature rating (-40C to +125C) suits motor-drive enclosures that run hot, and the 48-UQFN 6x6 mm footprint fits compact inverter boards. Microchip provides motor-control libraries and reference designs for the dsPIC33CK family, shortening time to a sensorless solution. Firmware portability to the 64 KB DSPIC33CK64MP105-E/M4 leaves headroom for protocol stacks such as CAN-based motion control.
Recomendado
Power Factor Correction (PFC) Stages
In boost-PFC applications the DSPIC33CK32MP105-E/M4 delivers the loop bandwidth and analog integration that PFC demands. The 12-bit high-speed ADC samples input voltage, inductor current and bulk-capacitor voltage every switching cycle, while the 100 MHz core executes average-current-mode compensation with low and predictable control latency. The high-speed PWM supports valley/leading-edge synchronization with a downstream DC-DC stage, and integrated comparators provide cycle-by-cycle overcurrent protection. Because the DSC implements the control law in firmware, THD optimization, brownout handling and frequency foldback are software features rather than hardware redesigns. The AEC-Q100 qualification and Functional Safety support make the part acceptable for server and telecom PSU front ends, and its 3.3 V operation simplifies interface with housekeeping supplies on the control board.
Recomendado
Automotive Sensing and Control Nodes
The DSPIC33CK32MP105-E/M4 is AEC-Q100 qualified and supports Functional Safety (FuSa) development, making it appropriate for automotive sensing and control nodes such as solenoid drivers, pump controllers, and analog sensor acquisition modules. The extended -40C to +125C temperature grade covers under-hood and near-actuator environments, the integrated 12-bit ADC plus op amps digitize resistive and current-loop sensors directly, and the high-speed PWM can drive valves or small actuators with closed-loop current control. Peripheral pin-select flexibility lets designers route UART, SPI and other serial functions to match existing harness and board constraints. Its 48-UQFN 6x6 mm package supports compact ECU sub-boards, and code compatibility with the broader dsPIC33CK family protects firmware investment across platform variants and future flash-size upgrades.
Recomendado
Smart Sensors and Capacitive Touch Interfaces
With intelligent analog peripherals - high-performance 12-bit ADCs, op amps, high-speed comparators and DACs - the DSPIC33CK32MP105-E/M4 implements smart-sensor nodes that condition, digitize and process signals locally before reporting over UART, SPI or I2C. Microchip notes the related dsPIC33CK MC family is loaded for real-time capacitive touch applications; the MP variant retains the same touch-capable architecture plus the motor/power-grade analog mix, so one firmware platform can serve both touch HMI and measurement channels. The 100 MHz core provides ample throughput for filtering, thresholding and even small FFT-based diagnostics on-board. In industrial control panels, appliances and automotive HMI bezels, integrating touch decoding in the same DSC that runs the power or motor loop reduces system part count and removes a separate touch controller from the BOM.
Recomendado
LED Drivers and Lighting Control
For high-power LED drivers, the DSPIC33CK32MP105-E/M4 combines the analog front end and PWM control needed for constant-current loops with dimming and fault management. The high-speed 12-bit ADC senses LED current via shunt resistors amplified by the on-chip op amps, the high-speed PWM adjusts the switching converter duty cycle for regulation, and hardware comparators trigger cycle-by-cycle current limiting for open/short protection. Dimming can be implemented through PWM duty or analog current level under firmware control, enabling color-mixing and multi-channel fixtures without dedicated LED-driver ICs. The -E extended temperature rating and AEC-Q100 qualification suit automotive exterior lighting and industrial luminaires, while the compact 48-UQFN 6x6 mm package fits driver boards inside tight luminaire housings. CAN/UART connectivity supports DALI-adjacent networked lighting architectures.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33CK32MP105-E/M4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33CK32MP105-I/M4 | DSPIC33CK32MC105-E/M4 | DSPIC33CK64MP105-E/M4 | DSPIC33CK64MC105-E/M4 | DSPIC33CK32MP105T-E/M4 |
|---|---|---|---|---|---|---|
| Package | 48-UQFN (6x6 mm), exposed pad | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 100 MHz (100 MIPS) | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Flash Memory | 32 KB | 32 KB | 32 KB | 64 KB | 64 KB | 32 KB |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| Temperature Range | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) | -40C to +125C (E grade) |
| Peripheral Variant | MP (motor control / digital power analog mix) | MP - identical | MC - touch/smart-sensing analog mix | MP - identical | MC - touch/smart-sensing analog mix | MP - identical |
Principais diferenciais
- Extended automotive temperature grade (vs DSPIC33CK32MP105-I/M4)
- Motor-control/digital-power analog mix (vs DSPIC33CK32MC105-E/M4)
- Lowest-cost entry to dsPIC33CK performance (vs DSPIC33CK64MP105-E/M4)
Notas de projeto
Estimated: a dsPIC33CK at 100 MHz with all analog peripherals active typically draws on the order of tens of milliamps from 3.3 V (datasheet current tables should be used for exact figures), so die dissipation is usually under 0.3 W; however, at the -E grade ceiling of +125C ambient, junction margin is small. Solder the UQFN-48 exposed pad to a solid ground pour with an array of thermal vias to spread heat into inner copper layers. Verify theta_JA from the Microchip datasheet and derate clock/peripheral loading for worst-case ambient in sealed enclosures.
Decouple all VDD pins with 100 nF ceramics placed within 2 mm of each pin, plus one bulk 4.7-10 uF capacitor near the device. Follow Microchip's dsPIC33C hardware design guidelines for core-supply (VDDCORE) capacitor requirements - omitting or misplacing this capacitor is the most common cause of unreliable startup. Keep the exposed pad connected to a low-impedance ground plane and use multiple vias for both thermal and return-path reasons.
For motor-control and digital-power layouts, keep ADC sense traces (shunt connections to op amp inputs) short, differential, and away from PWM switch-node copper. Use kelvin connections directly at the shunt resistor pads. Route high-speed PWM outputs away from analog front-end traces and reference the ground plane continuously under them to limit switching noise coupling into the 12-bit ADC conversions.
Do not assume the -I and -E temperature grades are interchangeable in hot environments - the -I/M4 stops at +85C. Also confirm peripheral-feature differences before substituting MC-variant parts (MC105) for MP-variant designs (MP105): the analog/peripheral configuration differs even though the pinout and footprint match. Program the correct configuration bits (oscillator, watchdog, code protection) early; defaults run from a slower internal oscillator rather than the full 100 MHz.
Informações de conformidade
AEC-Q100 qualification and Functional Safety (FuSa) support confirmed by distributor data (Hotenda, GlobalSpec). TS 16949 qualification noted for the T variant per Microchip USA. RoHS/REACH/lead-free status to be confirmed on the official Microchip product page.
