DSPIC33EP128GM304-H/ML - 70 MIPS 128KB DSC | Microchip
N.º da peça: DSPIC33EP128GM304-H/ML ✓ Ativo| Qtd. | Preço unitário | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1.000 | $0 | $0,00 |
DSPIC33EP128GM304-H/ML Visão geral
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and deterministic interrupt architecture of a microcontroller. In the embedded hierarchy, the dsPIC33EP sits above general-purpose 8-bit MCUs and alongside 16-bit MCUs, targeting closed-loop control systems where fast multiply-accumulate (MAC) operations and precise PWM generation are essential. This makes the DSC category the de facto choice for digital power conversion and motor control.
Key features of the DSPIC33EP128GM304-H/ML include the enhanced dsPIC33E core with DSP instruction extensions (MAC, DSP multiply), up to 8 input capture and 8 output compare channels, 2 quadrature encoder interface (QEI) modules, and 4 on-chip operational amplifiers that directly condition current-sense or analog feedback signals without external amplifiers. The Mouser listing confirms 12 analog channels supporting the integrated 10/12-bit ADC subsystem.
The GM304 variant integrates motor-control PWM peripherals alongside the op-amps, enabling single-chip field-oriented control (FOC) of PMSM and BLDC motors. The 70 MIPS core executes FOC current loops with cycle-level headroom, while the extended temperature rating of -40C to +150C supports under-hood and high-power industrial environments where standard -40C to +85C parts would fail.
Typical applications include brushless DC and PMSM motor drives, automotive actuator control, digital power supplies (PFC, LLC), and industrial automation sensors requiring on-chip signal conditioning. The 4 op-amps and 12 ADC channels reduce bill-of-materials cost in current-sensing chains.
When designing with this DSC, ensure a clean 3.3V supply, place 0.1uF decoupling capacitors at every VDD/VSS pair, and use the exposed pad as the primary ground connection. The 44-QFN footprint requires careful thermal land-pattern design at high ambient temperatures near +150C.
This page synthesizes verified distributor data, drop-in dsPIC33EP family alternatives, and practical design guidance not found in a single datasheet, giving engineers and buyers a complete sourcing and engineering reference in one place.
Alternativas drop-in para DSPIC33EP128GM304-H/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP128GM304-H/ML (mesmo formato e footprint) — diferindo em Package, Supply Voltage, Core, Operating Temperature Range, Program Memory (FLASH).
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP128GM304-I/ML
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP256GM304-H/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →DSPIC33EP64GM304-H/ML
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP128GM604-H/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.41 / unidade
Ver ficha técnica →DSPIC33EP128GM304-E/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.1 / unidade
Ver ficha técnica →DSPIC33EP128GM304-H/ML Classificações máximas e características elétricas
| Core Architecture | 16-bit dsPIC33E DSC (Harvard) |
| Maximum CPU Speed | 70 MIPS |
| Program Memory (FLASH) | 128 KB (43K x 24) |
| RAM | 16 KB |
| Tensão de alimentação | 3.3 V |
| Faixa de temperatura de operação | -40C to +150C (H grade) |
| Encapsulamento | 44-QFN (8x8 mm) with Exposed Pad |
| Tipo de montagem | Surface Mount |
| Qualification | Automotive, AEC-Q100 |
| Input Capture Channels | 8 |
| Output Compare Channels | 8 |
| Quadrature Encoder Interfaces (QEI) | 2 |
| On-Chip Operational Amplifiers | 4 |
| Analog Channels | 12 |
| Status RoHS | Compliant |
| Largura do barramento de dados | 16 bit |
Guia de Configuração de Pinos do DSPIC33EP128GM304-H/ML 44-qfn (8x8 mm) with exposed pad
Configuração de pinos para DSPIC33EP128GM304-H/ML (pacote 44-qfn (8x8 mm) with exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33EP128GM304-H/ML.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33EP128GM304-H/ML é adequado para 6 aplicaçãos: BLDC / PMSM Motor Control, Automotive Actuator Control, Digital Power Conversion, Industrial Automation and Sensing, High-Temperature Embedded Control, Signal Conditioning and Data Acquisition.
BLDC / PMSM Motor Control
The DSPIC33EP128GM304-H/ML fits brushless DC and permanent-magnet synchronous motor drives because its 70 MIPS DSP core with MAC instructions closes field-oriented control current loops with ample cycle margin, while 2 QEI modules and 8 input captures decode rotor position from encoders or hall sensors. The 4 on-chip op-amps amplify current-shunt signals directly into the 12-channel ADC, eliminating external amplifier ICs and reducing analog BOM cost. Motor-control PWM peripherals drive the three-phase inverter with complementary outputs and dead-time control. The -40C to +150C rating and AEC-Q100 qualification allow mounting near hot power stages. Trade-off: with 128KB FLASH, very large FOC plus field-weakening tables require careful code sizing, or use the pin-compatible 256KB variant.
Recomendado
Automotive Actuator Control
Automotive body and chassis actuators - throttle valves, headlamp leveling, pump drives - require a controller qualified to AEC-Q100 and rated for harsh thermal environments. The DSPIC33EP128GM304-H/ML meets both requirements with -40C to +150C operation, letting it sit inside actuator housings where standard +85C parts fail. The 4 on-chip op-amps close current loops for position servo control, 8 output compare channels generate auxiliary PWM signals, and the 70 MIPS core executes diagnostics and functional-safety monitoring code alongside the control loop. Designers should budget the 128KB FLASH across application code, calibration tables, and diagnostic routines; the pin-compatible DSPIC33EP256GM304-H/ML offers headroom when requirements grow.
Recomendado
Digital Power Conversion
Switching power supplies such as PFC stages, LLC converters, and bidirectional DC-DC modules demand fast, deterministic control. The DSPIC33EP128GM304-H/ML provides 70 MIPS of DSP throughput for average-current-mode and voltage-mode loops, 8 output compare channels for auxiliary PWM, and on-chip op-amps that condition shunt or current-transformer feedback into the 12-channel ADC. Because all loop computation is interrupt-driven on a single core, control latency is deterministic - a key advantage over software-scheduled MCU solutions. The -H temperature grade suits power supplies mounted in hot enclosures. For designs needing tighter PWM resolution, consider the newer dsPIC33CK family with 250 MIPS core and 1.04 ns PWM resolution.
Recomendado
Industrial Automation and Sensing
Factory sensors and smart transmitters benefit from the DSPIC33EP128GM304-H/ML's integrated analog front-end: the 4 op-amps condition bridge, RTD, or shunt signals on-chip, and the 12-channel ADC digitizes them without external components. The 70 MIPS core applies DSP filtering (IIR/FIR) and calibration math in real time, while UART/SPI/I2C peripherals publish results to the plant network. The 8 input capture channels also timestamp industrial events such as flowmeter pulses. With 128KB FLASH and 16KB RAM, the device holds protocol stacks plus filtering code comfortably. For lower-temperature industrial enclosures, the pin-compatible -I/ML grade offers a cost-saving option with identical firmware.
Recomendado
High-Temperature Embedded Control
Systems deployed near heat sources - downhole instruments, industrial heaters, lighting ballasts, and engine-bay electronics - need silicon rated beyond +85C. The DSPIC33EP128GM304-H/ML is specified for -40C to +150C junction operation, and its exposed-pad 44-QFN package provides the low thermal resistance path to the PCB needed at those limits. Good practice at +125C and above includes derating estimates for leakage current, using high-temperature electrolytic-free capacitors, and soldering the exposed pad to a ground pour with thermal vias. Verify long-term reliability data on the Microchip automotive qualification page when the design targets continuous operation near the upper temperature limit.
Recomendado
Signal Conditioning and Data Acquisition
Compact DAQ nodes use the DSPIC33EP128GM304-H/ML as a single-chip analog front-end plus processor: the 4 on-chip op-amps provide gain stages for thermocouples, strain gauges, and current sensors, feeding the 12-channel ADC whose samples the 70 MIPS core filters and scales in real time. Results stream out over UART, SPI, or I2C to host systems. Because amplification, digitization, and DSP all occur inside one 8x8 mm QFN, board area and noise pickup shrink versus discrete amplifier chains. The 8 output compare channels also support synchronized stimulus generation for impedance or sensor-excitation measurements. Sample timing across op-amp, ADC, and timers is tightly coordinated on the dsPIC33EP bus architecture.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP128GM304-H/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP128GM304-I/ML | DSPIC33EP256GM304-H/ML | DSPIC33EP64GM304-H/ML | DSPIC33EP128GM604-H/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm), Exposed Pad | 44-QFN (8x8 mm), Exposed Pad - same | 44-QFN (8x8 mm), Exposed Pad - same | 44-QFN (8x8 mm), Exposed Pad - same | 44-QFN (8x8 mm), Exposed Pad - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| FLASH Program Memory | 128 KB (43K x 24) | 128 KB (43K x 24) | 256 KB (86K x 24) | 64 KB (22K x 24) | 128 KB (43K x 24) |
| RAM | 16 KB | 16 KB | 32 KB | 8 KB | 16 KB |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Temperature Range | -40C to +150C | -40C to +85C | -40C to +150C | -40C to +150C | -40C to +150C |
| Qualification | Automotive, AEC-Q100 | Automotive, AEC-Q100 | Automotive, AEC-Q100 | Automotive, AEC-Q100 | Automotive, AEC-Q100 |
Principais diferenciais
- +150C extended temperature operation (vs DSPIC33EP128GM304-I/ML)
- Integrated 4-channel analog front-end (vs Generic 16-bit MCUs without on-chip op-amps)
- Memory scaling within the same footprint (vs DSPIC33EP256GM304-H/ML)
Notas de projeto
The 44-QFN exposed pad is the primary ground and thermal path for the DSPIC33EP128GM304-H/ML. Solder it to a solid ground pour with an array of 5x5 thermal vias (0.3 mm drill, filled or tented) connecting to internal ground planes. Place a 0.1uF ceramic capacitor at each VDD/VSS pin pair within 2 mm of the pin, plus one 10uF bulk capacitor near the supply entry. This becomes critical near +150C operation where ground bounce and supply noise margins shrink.
The -H grade permits junction temperatures up to +150C, but total power dissipation (core plus I/O plus op-amp quiescent) must keep Tj within that limit. Estimated: with theta_JA of a standard 8x8 mm QFN land pattern on a 4-layer board on the order of 30-40 C/W (verify exact value in the manufacturer datasheet), a worst-case ~0.5 W dissipation at 85C ambient yields roughly 100-105C junction - comfortable margin; the same power at 130C ambient approaches the limit. Verify against the datasheet thermal tables for your copper area.
Do not substitute the -I grade for the -H grade in designs with ambient temperatures above +85C - the two share an identical pinout and firmware, so the error only surfaces as field failures under thermal stress. Also note that dsPIC33EP FLASH self-write operations stall instruction fetch: use the programming executive or place critical interrupt code outside erase-page regions. Configure configuration words (FOSC, FWDT, FPOR) deliberately; default oscillator settings will not run the core at 70 MIPS without the PLL multiplier set correctly.
Informações de conformidade
Distributor listings (DigiKey) explicitly mark DSPIC33EP128GM304-H/ML as Automotive, AEC-Q100 qualified. RoHS/lead-free status consistent with Microchip current production policy; REACH, halogen-free, and conflict-minerals declarations not found in provided data.
