DSPIC33EP128MC506-H/MR - 16-bit 60 MIPS DSC 64-VQFN | Microchip
N.º da peça: DSPIC33EP128MC506-H/MR ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.34 | $6,34 |
| 10 | $5.72 | $57,20 |
| 100 | $5.15 | $515,00 |
| 500 | $4.65 | $2.325,00 |
| 1.000 | $4.2 | $4.200,00 |
DSPIC33EP128MC506-H/MR Visão geral
A digital signal controller combines the computational architecture of a microcontroller with the DSP engine of a digital signal processor. In the semiconductor hierarchy, the dsPIC33EP sits within Microchip's 16-bit MCU/DSC portfolio, adding hardware multiply-accumulate (MAC), division support, and fast interrupt handling to a classic RISC core, making it a power management and control-loop IC capable of executing high-bandwidth closed-loop algorithms in real time.
Key features include the 60 MIPS dsPIC core with integrated DSP engine, high-speed PWM peripherals purpose-built for motor control, on-chip connectivity covering CANbus, I2C, IrDA, LINbus, QEI (quadrature encoder interface), SPI, and UART/USART, and 128KB of self-programmable FLASH with 43K x 24-bit instruction word organization. The MC variant family adds motor-control-oriented peripherals such as complementary PWM outputs and analog modules tuned for sensing current and position.
Architecturally, the device pairs the 16-bit CPU with a pipelined instruction set, hardware DSP instructions, and multiple serial engines that can operate concurrently with the control loop. The CAN module supports automotive and industrial fieldbus networking, while the QEI interface directly decodes encoder feedback from servo motors without CPU overhead.
Typical applications include precision and sensorless BLDC/ACIM motor control, automotive auxiliary drives, industrial inverters, digital power supplies, and embedded motion systems. The AEC-Q100 qualification and extended temperature range make it specifically suited to under-hood and harsh-environment automotive deployments.
A key design consideration: the H/MR grade prioritizes extended operating temperature; verify supply decoupling on the exposed thermal pad and confirm peripheral clock configuration, since the family supports up to 70 MIPS on higher grades while this part is specified at 60 MIPS.
This page synthesizes distributor pricing, drop-in alternatives, comparison tables, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para DSPIC33EP128MC506-H/MR — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP128MC506-H/MR (mesmo formato e footprint) — diferindo em Core, Package, Operating Temperature, Supply Voltage, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP128MC506-I/MR
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EP128MC506-E/MR
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →DSPIC33EP256MC506-I/MR
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP64MC506-I/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.4 / unidade
Ver ficha técnica →DSPIC33EP128GP506-I/MR
✅ Drop-In✓ Em estoque
$3.42 / unidade
Ver ficha técnica →DSPIC33EP128MC506-H/MR Classificações máximas e características elétricas
| Core | 16-bit dsPIC DSC |
| Core Speed | 60 MIPS |
| Program Memory Size | 128 KB (43K x 24) FLASH |
| RAM Size | 8 KB |
| Tensão de alimentação | 3.3 V (min 2.95 V, max 3.6 V) |
| Connectivity | CANbus, I2C, IrDA, LINbus, QEI, SPI, UART/USART |
| Encapsulamento | 64-VQFN (9x9 mm), exposed pad |
| Tipo de montagem | Surface Mount |
| Qualification | AEC-Q100 qualified (automotive) |
| Series | dsPIC 33EP |
| Program Memory Type | FLASH |
| PWM Peripherals | High-speed PWM (motor control) |
| Oscillator Frequency | 70 MHz max device clock reference |
| Applications | Automotive, precision motor control |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do DSPIC33EP128MC506-H/MR 64-vqfn (9x9 mm), exposed pad
Configuração de pinos para DSPIC33EP128MC506-H/MR (pacote 64-vqfn (9x9 mm), exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33EP128MC506-H/MR.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33EP128MC506-H/MR é adequado para 6 aplicaçãos: BLDC/PMSM Motor Control Drives, Automotive Auxiliary Motor Systems, Industrial Inverters and Digital Power, Robotics and Servo Motion Control, Embedded Sensing and IoT Nodes, Automotive and Industrial Networking Gateways.
BLDC/PMSM Motor Control Drives
The DSPIC33EP128MC506-H/MR fits precision brushless DC and permanent-magnet synchronous motor control because its 60 MIPS DSP core executes field-oriented control (FOC) loops with hardware MAC instructions, while the MC subfamily's high-speed PWM generates complementary outputs with dead-time insertion. The QEI interface decodes encoder feedback without CPU load. Typical deployment places the MCU between the current-sense amplifiers and the three-phase gate drivers, sampling phase currents at PWM frequency and updating duty cycles each cycle. The 128KB FLASH accommodates FOC plus communication stacks (CAN, UART). Trade-off: at 3.3V logic it requires external gate drivers and level shifting for 12V/48V power stages.
Recomendado
Automotive Auxiliary Motor Systems
As an AEC-Q100 qualified, H temperature-grade device (per Microchip USA), the DSPIC33EP128MC506-H/MR targets automotive auxiliary drives such as pumps, fans, HVAC blowers, and throttle actuators that operate in harsh thermal environments. The on-chip CAN module integrates the drive into vehicle networks, and LIN/IrDA support covers body-domain subnets. In use, the controller runs sensorless estimation algorithms in the DSP engine while the CAN stack handles diagnostics (UDS-style messaging) concurrently. The extended-grade rating permits mounting near heat-generating actuators where industrial parts cannot survive. Design consideration: verify board-level thermal design, since the exposed VQFN pad must solder to a ground plane to dissipate junction heat.
Recomendado
Industrial Inverters and Digital Power
The 60 MIPS core and high-speed PWM make this DSC effective for industrial motor inverters, solar micro-inverters, and digitally controlled power supplies, where control-loop update rates of tens of kilohertz are needed. The MC subfamily PWM supports center-aligned modes for clean current sampling, and the ADC can be triggered by the PWM to synchronize sampling with switching events, minimizing ripple-induced measurement error. CAN and SPI interfaces connect to supervisory PLCs and power-module telemetry. With 128KB FLASH, resonant-controller or predictive-current algorithms fit alongside firmware bootloaders. Engineers should budget RAM carefully - 8KB constrains algorithm buffering compared to 16KB+ competitors, favoring fixed-point, single-buffered control schemes.
Recomendado
Robotics and Servo Motion Control
In robotics, the QEI quadrature encoder interface directly decodes joint-encoder signals in hardware while the DSP core runs cascaded position/velocity/current loops at 60 MIPS, giving deterministic multi-axis coordination from a single 64-pin device. Multiple UART/SPI ports interface to IMUs, stepper/servo drivers, and higher-level controllers, and CAN links multi-axis nodes on mobile platforms. The 128KB (43K x 24) FLASH holds trajectory planners plus kinematics for compact articulated arms or AGV wheel drives. Because the device is surface-mount VQFN, it suits dense PCB stackups in joint housings. Limitation to note: RAM of 8KB restricts large trajectory tables, so stream paths from external storage or the host controller.
Recomendado
Embedded Sensing and IoT Nodes
Beyond motion, the dsPIC DSP engine suits embedded nodes performing real-time signal processing - vibration monitoring, power metering, and acoustic analysis - where FFT filtering at 60 MIPS outperforms generic MCUs without an FPU. I2C and SPI buses acquire data from external sensors, while UART or CAN forwards processed results to gateways. The H-grade temperature rating permits mounting in outdoor or machinery-adjacent enclosures, and AEC-Q100 qualification adds supply-chain reliability assurance. 128KB FLASH retains FFT tables, calibration data, and an OTA-style bootloader simultaneously. Design tip: use the device DMA-capable peripheral set to stream ADC samples into RAM buffers, since the 8KB RAM requires double-buffered, block-based processing rather than long capture windows.
Recomendado
Automotive and Industrial Networking Gateways
With CANbus, LINbus, I2C, SPI, and multiple UART/USART channels on chip, the DSPIC33EP128MC506-H/MR serves as protocol-bridging gateway silicon: translating LIN sub-networks onto CAN backbone buses in vehicles, or connecting legacy serial industrial equipment to CAN-based PLC networks. The 60 MIPS core handles frame routing, filtering, and transformation with headroom for diagnostics. The AEC-Q100 qualification (per Microchip USA) makes it admissible in automotive ECU partitions, while the H grade tolerates high under-dash or engine-bay-adjacent temperatures. Firmware fits comfortably in 128KB, including both protocol stacks. Placement near the CAN transceiver with proper split-termination and ESD protection on bus pins is essential for EMC compliance.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP128MC506-H/MR — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP128MC506-I/MR | DSPIC33EP256MC506-I/MR | DSPIC33EP64MC506-I/MR | DSPIC33EP128GP506-I/MR |
|---|---|---|---|---|---|
| Package | 64-VQFN (9x9), exposed pad | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Program FLASH | 128 KB (43K x 24) | 128 KB (43K x 24) | 256 KB (85K x 24) | 64 KB (22K x 24) | 128 KB (43K x 24) |
| Peripheral Focus | Motor control (high-speed PWM, QEI) | Motor control (identical) | Motor control | Motor control | General purpose (superior ADC, CTMU, op-amps, PTG) |
| Temperature Grade / Qualification | H grade, AEC-Q100 qualified | I grade, industrial | I grade, industrial | I grade, industrial | I grade, industrial |
Principais diferenciais
- Automotive H-temperature grade with AEC-Q100 qualification (vs DSPIC33EP128MC506-I/MR)
- Memory upgrade path without board change (vs DSPIC33EP256MC506-I/MR)
- Purpose-built motor-control peripherals (vs DSPIC33EP128GP506-I/MR)
- Cost optimization for smaller firmware (vs DSPIC33EP64MC506-I/MR)
Notas de projeto
The 64-VQFN 9x9 package includes an exposed thermal pad that is the primary ground connection. Design the PCB land pattern with a corresponding thermal pad and a matrix of thermal vias (typically 4x4 or 5x5 array, ~0.3 mm drill) down to the ground plane to ensure reliable solder joints and low thermal resistance. Follow the land-pattern geometry in the family datasheet (DS70000657J); undersized pads cause solder wicking onto the fine-pitch perimeter pins during reflow.
ICSP programming requires matched PGECx/PGEDx pin pairs. Per the dsPIC33EP128MC506 programming documentation (northernsoftware.com notes), if PGEC2 is used for ICSPCLK then ICSPDAT must connect to PGED2 - mixing pins from different pairs prevents programming. Header out at least one full PGEC/PGED pair plus MCLR, VDD, VSS, and VCAP to a 6-pin programming header on every production board; retrofitting these traces later requires bodge wires.
Supply the device at 3.3V within the 2.95V to 3.6V window shown in the family datasheet. Decouple each VDD pin with 100 nF ceramic capacitors placed within 2 mm of the pin, plus one bulk 10 uF capacitor near the device. The dsPIC33EP core derives its internal supply from an external VCAP capacitor - use the exact capacitance specified in the datasheet with a low-ESR ceramic, and never route switching-load returns through the VCAP ground path to avoid core-rail noise on the 60 MIPS clock domain.
For motor-control use, keep the high-speed PWM outputs to the gate drivers short and routed away from ADC sense lines; synchronize ADC sampling to the PWM period using the peripheral trigger so current samples land in the PWM center (zero-vector) window. Separate the analog ground region for current-sense conditioning from the power ground under the exposed pad, tying them at a single point to prevent gate-drive switching currents from corrupting ADC readings.
Informações de conformidade
AEC-Q100 qualification stated by Microchip USA product page; Hotenda listing also notes Automotive AEC-Q100. RoHS compliance assumed from current Microchip production status; REACH and halogen-free status not stated in provided data.
