DSPIC33EP16GS502-I/SO - 70 MIPS 16-Bit Digital Power DSC | Microchip
N.º da peça: DSPIC33EP16GS502-I/SO ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.62 | $3,62 |
| 10 | $3.28 | $32,80 |
| 100 | $2.87 | $287,00 |
| 500 | $2.55 | $1.275,00 |
| 1.000 | $2.31 | $2.310,00 |
DSPIC33EP16GS502-I/SO Visão geral
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and control architecture of a microcontroller. Within the power management IC hierarchy, DSCs sit at the firmware level of switching power systems: they close control loops for switch-mode power supplies (SMPS), power factor correction (PFC) stages, and DC-DC converters that would otherwise require analog control ICs. The dsPIC33EP GS family extends this concept with interconnected high-speed peripherals purpose-built for digital power.
Key features include the dsPIC33EP core running at 70 MIPS, flash execution with hardware DSP multiply-accumulate instructions, Functional Safety (FuSa) support documented by Microchip, and an industrial temperature rating of -40C to +85C denoted by the I suffix. The GS50x family integrates interconnected high-speed PWM, high-speed ADC, PGA (programmable gain amplifier), comparators, and DAC peripherals specifically architected for power conversion.
Technically, the interconnected peripherals allow the ADC, PWM, and comparators to trigger and respond without CPU intervention, enabling sub-microsecond loop latency for peak-current-mode control. This is the defining architecture difference versus general-purpose PIC24 or dsPIC33EP MC families. According to the dsPIC33EPXXGS50X family datasheet (Microchip document 70005127), the family targets 16-bit digital signal controllers for digital power applications.
Typical applications include digital SMPS, interleaved power factor correction (Microchip provides a dedicated reference design), AC-DC and DC-DC converters, battery chargers, LED drivers, and lighting ballasts.
When designing, budget flash carefully: 16KB is sufficient for single-loop SMPS firmware with compensators, but multi-loop systems with state machines may require the 32KB or 64KB GS502 variants, which are pin-compatible.
This page synthesizes distributor pricing context, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para DSPIC33EP16GS502-I/SO — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP16GS502-I/SO (mesmo formato e footprint) — diferindo em Package, Core, Flash Memory, Operating Temperature Range.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP32GS502-I/SO
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP64GS502-I/SO
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP16GS502-E/SO
✅ Drop-In✓ Em estoque
$3.08 / unidade
Ver ficha técnica →DSPIC33EP16GS202-I/SO
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.25 / unidade
Ver ficha técnica →DSPIC33EP16GS502-I/SO Classificações máximas e características elétricas
| Core | dsPIC33EP 16-bit DSC core |
| Maximum CPU Speed | 70 MIPS |
| Flash Memory | 16KB (16K x 8) |
| RAM | 2KB |
| Encapsulamento | 28-SOIC (7.5 mm wide body) |
| Faixa de temperatura de operação | -40C to +85C (I grade) |
| Programmable Gain Amplifier | Yes (PGA, family feature) |
| Functional Safety Support | Yes (FuSa) |
| Target Applications | Digital Power, SMPS, High-Speed ADC, DAC |
| Tipo de montagem | Surface Mount |
| Status do ciclo de vida | In Production (per Microchip product page) |
| Programming/Debug Interface | In-Circuit Serial Programming (ICSP), supported by SEGGER tools |
Guia de Configuração de Pinos do DSPIC33EP16GS502-I/SO 28-soic (7.5 mm wide body)
Configuração de pinos para DSPIC33EP16GS502-I/SO (pacote 28-soic (7.5 mm wide body)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33EP16GS502-I/SO.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33EP16GS502-I/SO é adequado para 6 aplicaçãos: Digital Switch-Mode Power Supply (SMPS), Interleaved Power Factor Correction (PFC), DC-DC Converter Digital Control, Battery Chargers, LED Drivers and Electronic Lighting Ballasts, Industrial Sensing with High-Speed ADC and DAC.
Digital Switch-Mode Power Supply (SMPS)
The DSPIC33EP16GS502-I/SO is purpose-built for digital SMPS control: its 70 MIPS core executes compensator algorithms such as 2P2Z or 3P3Z at loop rates unattainable by general-purpose MCUs, while the interconnected high-speed PWM, high-speed ADC, PGA, and comparators respond to transient events without CPU latency. In a typical implementation, the ADC samples the output voltage and inductor current each PWM cycle, and the firmware updates the PWM duty cycle within the same switching period, closing the loop for buck, boost, flyback, or LLC topologies. Unlike analog controllers, digital control enables adaptive compensation across load ranges, firmware-tunable protection thresholds, and telemetry reporting. The 16KB flash accommodates single-loop or dual-loop SMPS firmware including startup sequencing and fault handling.
Recomendado
Interleaved Power Factor Correction (PFC)
Microchip provides a dedicated Interleaved Power Factor Correction reference design based on the SMPS dsPIC DSC family to which the DSPIC33EP16GS502-I/SO belongs. PFC requires simultaneous control of a fast inner current loop (to shape input current sinusoidally) and a slower outer voltage loop (to regulate the DC bus); the 70 MIPS core and hardware DSP multiply-accumulate instructions execute both compensators within each switching cycle. The interconnected ADC triggers synchronized with the high-speed PWM zero-vector, minimizing switching-noise-induced sampling error. The programmable gain amplifier scales low-amplitude shunt or current-transformer signals to match the ADC input range, improving measurement resolution. Interleaving two converter phases reduces input ripple and spread-spectrum EMI, and firmware phase-balance logic fits comfortably in 16KB flash.
Recomendado
DC-DC Converter Digital Control
For point-of-load and intermediate-bus DC-DC converters, the DSPIC33EP16GS502-I/SO replaces discrete analog control ICs with firmware-defined behavior. Peak-current-mode or voltage-mode control is implemented using the on-chip analog comparators for cycle-by-cycle current limiting, with the high-speed PWM supporting sub-nanosecond-class duty resolution via its family architecture. The 16-bit core at 70 MIPS sustains sampling and compensation at hundreds of kilohertz switching frequencies typical of telecom and industrial bus converters. Digital implementation adds value through soft-start profiling, output discharge sequencing, and PID retuning across operating modes. The -40C to +85C I-grade rating suits industrial power shelves; select the -E/SO variant for enclosures exceeding 85C ambient.
Recomendado
Battery Chargers
Smart battery chargers benefit from the DSPIC33EP16GS502-I/SO's combination of high-speed control and analog integration. The high-speed ADC with PGA monitors cell voltage and charge current with adjustable gain to cover both low-current trickle phases and high-current CC phases, while the comparators and PWM support protective current limiting with hardware latency. The 70 MIPS core runs charge-state algorithms (CC/CV, taper termination, temperature-derated profiles per JEITA-style logic) alongside the fast power-stage loop in 16KB flash. On-chip DAC outputs can drive status indication or auxiliary control signals. Charger designs also exploit the remappable pin architecture of the dsPIC33EP family to route UART communication for battery-pack host interfaces without moving to a larger package.
Recomendado
LED Drivers and Electronic Lighting Ballasts
Dimmable LED drivers require precise constant-current regulation plus dimming control, both of which map directly onto the DSPIC33EP16GS502-I/SO peripheral set. The high-speed PWM generates the power-conversion switching waveform, while a second PWM channel produces dimming (PWM dimming or analog dimming via the on-chip DAC). The high-speed ADC samples LED string current for closed-loop regulation, and the comparators implement fast over-current protection between firmware cycles. At 70 MIPS, firmware can simultaneously run the control loop, dimming curves, fault statistics, and optional DALI or DMX communication. The industrial temperature grade and small 28-SOIC footprint suit enclosed LED driver housings where thermal margin is limited.
Recomendado
Industrial Sensing with High-Speed ADC and DAC
Beyond power conversion, the DSPIC33EP16GS502-I/SO serves as a compact industrial sensing controller: its high-speed ADC captures fast analog transients (current shunts, piezo sensors, photo-detectors) while the programmable gain amplifier adapts signal amplitude without external gain stages, and the integrated DAC provides reference or excitation outputs. The 70 MIPS DSP core applies digital filtering (IIR/FIR), RMS computation, or FFT-based analysis directly in firmware. A single 28-SOIC device thus replaces separate op-amp gain chains plus a general MCU in nodes such as motor-current monitors and power-quality sensors. SEGGER and MPLAB tool support simplifies integration, and 2KB RAM accommodates moderate buffering for sampled data.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP16GS502-I/SO — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP32GS502-I/SO | DSPIC33EP64GS502-I/SO | DSPIC33EP16GS502-E/SO | DSPIC33EP16GS202-I/SO |
|---|---|---|---|---|---|
| Package | 28-SOIC | 28-SOIC - same | 28-SOIC - same | 28-SOIC - same | 28-SOIC - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Flash Memory | 16KB | 32KB | 64KB | 16KB | 16KB |
| Temperature Grade | -40C to +85C (I) | -40C to +85C (I) | -40C to +85C (I) | -40C to +125C (E) | -40C to +85C (I) |
| Digital Power Peripheral Set (GS50x) | Full (interconnected HS PWM, HS ADC, PGA, comparators) | Full - same | Full - same | Full - same | Reduced (GS202) |
| Lifecycle Status | In Production | In Production | In Production | In Production | In Production |
Principais diferenciais
- Smallest flash in the pin-compatible GS50x family at lowest cost (vs DSPIC33EP32GS502-I/SO)
- Industrial temperature grade standard (vs DSPIC33EP16GS502-E/SO)
- Full interconnected digital-power peripheral set (vs DSPIC33EP16GS202-I/SO)
Notas de projeto
Decouple each VDD pin with 0.1uF ceramic capacitors placed within 2 mm of the pin, plus one 4.7uF to 10uF bulk capacitor near the device. In digital power designs the controller sits close to the switching stage, so route a local ground island (analog ground referenced to the PG/AGND structure per the family datasheet) to keep switching currents out of analog measurement paths. Separate the ADC ground reference from the power ground with a single-point connection at the shunt or bus capacitor.
Use the peripheral pin select (PPS) capability to route UART and other remappable peripherals away from the high dv/dt traces of the power stage. Keep the oscillator traces (OSC1/OSC2) short and away from PWM output lines. Provide a via-stitched ground plane beneath the DSC, and reserve an ICSP header (MCLR, PGD, PGC, VDD, GND) footprint on every production board for firmware updates in the field.
The most common migration error is underestimating 16KB flash: code compiled with -O0 optimization and full MPLAB libraries can exceed it even for single-loop SMPS firmware. Compile with XC16 optimization level 1 or higher and verify the memory map early. When substituting the GS202 variant, confirm the peripheral set difference against the family datasheet (Microchip 70005127) - the interconnected digital-power peripherals of the GS502 are not fully replicated in the GS202.
Informações de conformidade
RoHS-compliant, lead-free in current Microchip production for SOIC-packaged dsPIC33EP devices. Related automotive AEC-Q100 grade exists as separate -E automotive variants of the dsPIC family, not this industrial I-grade part. Verify certificates via MicrochipDirect.
