DSPIC33EP256GP506-E/PT - 16-bit 60MIPS DSC, 256KB Flash | Microchip
N.º da peça: DSPIC33EP256GP506-E/PT ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $6.5 | $6,50 |
| 10 | $5.85 | $58,50 |
| 100 | $5.2 | $520,00 |
| 500 | $4.68 | $2.340,00 |
| 1.000 | $4.21 | $4.210,00 |
DSPIC33EP256GP506-E/PT Visão geral
A digital signal controller combines the compute throughput of a DSP with the peripheral integration and ease of use of a microcontroller. In the embedded system hierarchy, the dsPIC33EP sits between general-purpose MCUs and full DSPs, making it a popular choice for real-time control loops, digital power conversion, and sensor-processing systems where C-programmability matters more than raw MAC throughput.
Key features include the 16-bit dsPIC33E core with DSP engine (barrel shifter, 40-bit accumulators, single-cycle MAC), integrated operational amplifiers, comparators, a Peripheral Trigger Generator (PTG) for autonomous peripheral sequencing, a Charge Time Measurement Unit (CTMU) for capacitive touch and time measurement, and a CAN 2.0B module for industrial networking. Communication coverage includes I2C, SPI, UART/USART with IrDA, and up to 53 I/O pins.
Architecturally, the device uses an enhanced Harvard architecture with a 24-bit instruction word, four DMA channels for low-CPU-overhead data movement, and low-jitter PLL clocking that scales the internal FRC or external crystal to the full 60 MIPS operating point. The E-suffix temperature grade (-40C to +125C) supports sealed industrial and automotive-adjacent environments.
Typical applications include motor control and digital power supplies (using the high-speed PWM-capable peripheral set of the 33EP family), CAN-connected industrial automation nodes, and sensor fusion or measurement systems leveraging the CTMU and on-chip op amps.
Design consideration: budget for the PLL startup sequence and use the family datasheet power-management guidance when switching clock sources at runtime; verify the exact peripheral variant of your exact ordering code (GP vs MC families share pinouts but differ in peripherals).
This page synthesizes verified distributor data, same-family drop-in alternatives, and practical design notes not consolidated in the manufacturer datasheet.
Alternativas drop-in para DSPIC33EP256GP506-E/PT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP256GP506-E/PT (mesmo formato e footprint) — diferindo em Core Architecture, Package, Operating Temperature, Series, RAM.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP256GP506-I/PT
✅ Drop-In✓ Em estoque
$4.65 / unidade
Ver ficha técnica →DSPIC33EP256GP504-I/PT
✅ Drop-In✓ Em estoque
$3.68 / unidade
Ver ficha técnica →DSPIC33EP128GP506-E/PT
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.2 / unidade
Ver ficha técnica →DSPIC33EP512GP506-E/PT
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP256GP506-E/MR
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.72 / unidade
Ver ficha técnica →DSPIC33EP256GP506-E/PT Classificações máximas e características elétricas
| Core Architecture | 16-bit dsPIC33E DSC |
| Core Speed | 60 MHz (60 MIPS) |
| Flash Program Memory | 256 KB (85.5K x 24) |
| RAM | 32 KB |
| I/O Count | 53 I/Os |
| Communication Interfaces | I2C, SPI, UART/USART, IrDA, CAN |
| Integrated Peripherals | Op Amps, Comparators, CTMU, PTG, DMA (4 channels) |
| Encapsulamento | 64-TQFP (10x10 mm) |
| Temperatura de operação | -40C to +125C (extended, E grade) |
| Tipo de montagem | Surface Mount |
| Packaging | Tray |
| Series | dsPIC 33EP (General Purpose) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do DSPIC33EP256GP506-E/PT 64-tqfp (10x10 mm)
Configuração de pinos para DSPIC33EP256GP506-E/PT (pacote 64-tqfp (10x10 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33EP256GP506-E/PT.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33EP256GP506-E/PT é adequado para 6 aplicaçãos: Industrial Motor Control, CAN Industrial Automation Nodes, Sensor Measurement and CTMU Touch Systems, Digital Power Supplies, Automotive-Adjacent and Harsh-Environment Control, Embedded Prototyping with Explorer 16.
Industrial Motor Control
The DSPIC33EP256GP506-E/PT fits motor control because its 60 MIPS DSP core executes field-oriented control (FOC) loops with single-cycle MAC and 40-bit accumulators, while on-chip op amps amplify shunt current feedback without external amplifiers. In a typical FOC drive, the ADC samples phase currents each PWM cycle and the control loop closes within tens of microseconds; the four DMA channels move ADC results to RAM without CPU intervention. The extended -40C to +125C rating supports sealed drives near heat sources. Verify the exact PWM peripheral variant of your ordering code against family datasheet DS70000657J, since GP and MC family members share pinouts but differ in PWM features.
Recomendado
CAN Industrial Automation Nodes
The integrated CAN 2.0B module makes this DSC well suited for factory automation and PLC-style I/O nodes that communicate over a CAN fieldbus. The 60 MHz core services the CAN FIFO while simultaneously running control or acquisition logic, and 256KB Flash leaves room for protocol stacks, device profiles, and OTA-style field updates. With 53 I/O pins, one device can handle local digital/analog I/O plus the network interface, and the CTMU supports capacitive human-interface inputs on the same chip. Use an external CAN transceiver such as the MCP2551 on the CANTX/CANRX pins; the extended temperature grade tolerates cabinet environments from -40C to +125C.
Recomendado
Sensor Measurement and CTMU Touch Systems
For measurement-centric designs, the DSPIC33EP256GP506-E/PT combines the Charge Time Measurement Unit (CTMU) for precise capacitive or time-domain measurements, integrated op amps for signal conditioning, and comparators for threshold detection - reducing board-level analog BOM. Typical uses include capacitive touch panels, ultrasonic time-of-flight, and current or moisture sensing. The 32KB RAM buffers acquisition datasets, while the Peripheral Trigger Generator (PTG) sequences ADC sampling autonomously for deterministic timing. The 60 MIPS core applies DSP filtering (IIR/FIR) in real time. Design the analog front end per the family datasheet CTMU and op amp sections, and calibrate CTMU charge current in-system to meet accuracy targets.
Recomendado
Digital Power Supplies
Switching power converters (PFC, LLC, buck/boost) benefit from this DSC's fast 60 MIPS core, ADC-triggered-by-PWM sampling, and comparator-based fast overcurrent protection paths. The DSP engine executes control-law mathematics at fixed sample rates, and the PTG can autonomously trigger acquisition sequences, minimizing loop jitter. The extended -40C to +125C operating range is important for power stages with elevated local ambient. When designing digital power on this part, review the family datasheet timing sections for ADC-to-PWM latency and validate the compensation loop in simulation before hardware. For full complementary-PWM with dead-time and fault blanking, evaluate the pin-compatible MC-family variant DSPIC33EP256MC506.
Recomendado
Automotive-Adjacent and Harsh-Environment Control
The E temperature grade (-40C to +125C) allows deployment in under-hood-adjacent and high-temperature industrial locations such as engine-bay sensor hubs, battery-pack supervision, and heavy-equipment controllers. The CAN interface integrates directly with vehicle-style networks, 256KB Flash holds diagnostics and logging firmware, and the 16-bit core provides deterministic real-time response without an RTOS in many designs. Note that this specific ordering code is the standard (non-AEC-Q100-qualified) grade; for designs requiring full automotive qualification flow, source the corresponding automotive-qualified variant from Microchip's automotive portfolio and verify PPAP support with your distributor.
Recomendado
Embedded Prototyping with Explorer 16
Microchip's MA330030 plug-in module (PIM) carries a 64-pin dsPIC33EP256GP506 TQFP device and mates with the Explorer 16 development board, per Microchip document 52100a, letting teams evaluate the 60 MIPS dsPIC33E core, CAN, op amps, CTMU, and PTG peripherals before PCB commitment. Because the PIM maps the 64-pin TQFP onto the 100-pin Explorer 16 footprint, code and pin assignments migrate cleanly to production boards, including higher-density 100-pin family members. MPLAB X IDE with the XC16 compiler supports full debugging via ICD or REAL ICE, and firmware written for the GP506 is source-compatible across the dsPIC33EP GP50x family, protecting early development effort.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP256GP506-E/PT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP256GP506-I/PT | DSPIC33EP256GP504-I/PT | DSPIC33EP128GP506-E/PT | DSPIC33EP512GP506-E/PT |
|---|---|---|---|---|---|
| Package | 64-TQFP (10x10 mm) | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same | 64-TQFP (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 256 KB | 256 KB | 128 KB | 512 KB |
| Core Speed | 60 MHz (60 MIPS) | 60 MHz (60 MIPS) | 60 MHz (60 MIPS) | 60 MHz (60 MIPS) | 60 MHz (60 MIPS) |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +125C |
| Peripheral Set | Full GP506 set: CAN, op amps, CTMU, PTG, comparators | Identical to GP506 | Reduced GP504 set (per DS70000657J Table 1) | Identical GP506 set | Identical GP506 set |
Principais diferenciais
- Extended 125C operation at no hardware cost (vs DSPIC33EP256GP506-I/PT)
- Full general-purpose peripheral complement (vs DSPIC33EP256GP504-I/PT)
- Memory sizing flexibility on the same footprint (vs DSPIC33EP512GP506-E/PT)
Notas de projeto
Verify the exact peripheral set of your ordering code before layout sign-off. The dsPIC33EP GP50x and MC50x families share the 64-pin TQFP pinout, but GP devices carry general-purpose peripherals (CAN, op amps, CTMU, PTG) while MC devices carry motor-control PWM variants. Designs sized around GP506 features (e.g., PTG sequencing or CTMU measurement) will not port to an MC part without firmware redesign. Cross-check Table 1 of family datasheet DS70000657J, which lists device names, pin counts, memory sizes, and peripheral availability per family.
The extended -E temperature grade (-40C to +125C) means junction-to-ambient headroom is consumed faster than with the -I grade. Estimated: if the device dissipates roughly 0.15-0.25 W at 60 MHz with moderate I/O loading (typical 16-bit MCU figures - verify with your own current measurement), a TQFP-64 theta_JA near 50 C/W yields about 8-13 C junction rise; combined with hot-ambient enclosures this can approach the 125 C limit. Provide solid ground planes under the 10x10 mm body and measure actual ICC at your clock configuration early in the project.
Decouple all VDD/VDDCORE pins with 0.1 uF ceramic capacitors placed within 2-3 mm of each pin pair, plus one bulk 10 uF per supply domain, following the power delivery guidance in the family datasheet DS70000657J. Keep the VDDCORE capacitor especially close - the internal regulator is sensitive to layout. Route the oscillator traces short and guarded when using an external crystal with the PLL to reach 60 MIPS; use the MCLR pin with a 10 kOhm pull-up and keep ICSPCLK/ICPGD programming traces accessible on a header for in-circuit reprogramming.
Informações de conformidade
RoHS compliant per Microchip standard packaging for active 16-bit MCU products and distributor listings (DigiKey/Mouser). Not an AEC-Q100 automotive-qualified ordering code; the E suffix denotes temperature grade only.
