DSPIC33EP256MC204T-E/ML - 16-bit 60MIPS DSC 256KB Flash | Microchip
N.º da peça: DSPIC33EP256MC204T-E/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.86 | $5,86 |
| 10 | $5.3 | $53,00 |
| 100 | $4.75 | $475,00 |
| 500 | $4.3 | $2.150,00 |
| 1.000 | $3.9 | $3.900,00 |
DSPIC33EP256MC204T-E/ML Visão geral
A digital signal controller combines the computational throughput of a digital signal processor with the peripheral integration and control flexibility of a microcontroller. Within the embedded control hierarchy, the dsPIC33EP sits above general-purpose 8-bit MCUs and alongside 16-bit MCU families, targeting real-time control loops where fast multiply-accumulate operations are needed, such as field-oriented motor control and digital power conversion.
Key features include a 16-bit dsPIC RISC core operating at 60 MIPs, 256KB of ECC-free Flash, 32KB of on-chip SRAM, 4 DMA channels, 5 timers, up to 3 external interrupts, and high-speed PWM peripherals purpose-built for precision motor control. Connectivity spans I2C, SPI, UART/USART, IrDA, LINbus, and QEI (quadrature encoder interface) for servo feedback.
The dsPIC33EP architecture pairs a modified Harvard bus with DSP-class instructions (MAC, DSP multiply) that accelerate control algorithms. The high-resolution PWM module with dead-time insertion and fault inputs makes closed-loop FOC and BLDC control feasible without external companion ICs. Advanced analog integration reduces bill-of-materials count in power electronics designs.
Typical applications include brushless DC and PMSM motor drives, digital power supplies (LLC, totem-pole PFC), automotive actuator control, and industrial automation nodes requiring deterministic real-time response and encoder feedback.
Design consideration: the 44-QFN exposed pad must be soldered to a grounded copper pour for both thermal dissipation and signal integrity; respect the 3.3V supply rail and decouple all VDD/VDDCORE pins per the manufacturer datasheet.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone, with pricing verified as of 2026-09-24.
Alternativas drop-in para DSPIC33EP256MC204T-E/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP256MC204T-E/ML (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Product Family, Qualification, Core.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP256MC204-E/ML
✅ Drop-In✓ Em estoque
$3.8 / unidade
Ver ficha técnica →DSPIC33EP128MC204T-E/ML
✅ Drop-In✓ Em estoque
$3.8 / unidade
Ver ficha técnica →DSPIC33EP64MC204T-E/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.95 / unidade
Ver ficha técnica →DSPIC33EP32MC204T-E/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3 / unidade
Ver ficha técnica →DSPIC33EP256MC204T-I/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →DSPIC33EP256MC204T-E/ML Classificações máximas e características elétricas
| Core Architecture | 16-bit dsPIC RISC |
| Maximum CPU Speed | 60 MIPS (60 MHz) |
| Flash Program Memory | 256 KB (85.5K x 24) |
| RAM | 32 KB |
| Tensão de alimentação | 3.3 V |
| Encapsulamento | 44-QFN (8x8 mm) with exposed pad |
| Tipo de montagem | Surface Mount |
| DMA Channels | 4 |
| Timers | 5 |
| External Interrupts | 3 |
| Connectivity Interfaces | I2C, SPI, UART/USART, IrDA, LINbus, QEI |
| Qualification | AEC-Q100 qualified |
| Packaging | Tape & Reel (T/R) |
| PWM | High-speed PWM (motor control rated) |
| Product Family | dsPIC33EP256MC204 series |
Guia de Configuração de Pinos do DSPIC33EP256MC204T-E/ML 44-qfn (8x8 mm) with exposed pad
Configuração de pinos para DSPIC33EP256MC204T-E/ML (pacote 44-qfn (8x8 mm) with exposed pad). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33EP256MC204T-E/ML.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33EP256MC204T-E/ML é adequado para 6 aplicaçãos: BLDC / PMSM Motor Drives, Digital Power Conversion, Automotive Body and Actuator Control, Industrial Automation and Servo Nodes, Embedded Sensing and IoT Control Nodes, Test, Measurement and Instrumentation.
BLDC / PMSM Motor Drives
The DSPIC33EP256MC204T-E/ML fits brushless DC and permanent-magnet synchronous motor control because its high-speed PWM module provides complementary outputs with hardware dead-time insertion and fault shutdown, while the 60 MIPS DSP core executes field-oriented control (FOC) loops fast enough for 16-20 kHz PWM frequencies. The integrated QEI interface reads quadrature encoder position without CPU overhead, and 4 DMA channels stream ADC current-sense samples into RAM, freeing cycles for the speed and current loops. Placed as the sole controller driving a three-phase gate-driver stage, the DSC replaces separate MCU-plus-DSP solutions; the trade-off is that its 3.3V I/O requires level shifting toward 5V gate drivers, and the 44-QFN exposed pad must be well-grounded to handle switching-noise coupling in power stages.
Recomendado
Digital Power Conversion
In digital power supplies such as LLC resonant converters, totem-pole PFC stages, and synchronous buck regulators, the DSPIC33EP256MC204T-E/ML provides the deterministic control timing required for switching frequencies in the 100 kHz to 500 kHz class. Its high-speed PWM supports phase-shifted and complementary topologies with nanosecond-class resolution, and the 60 MIPS core closes voltage and current loops in software with PI or 3P3Z compensators. DMA-driven ADC sampling synchronizes precisely to PWM events, minimizing control-loop delay - a key figure of merit for transient response. The AEC-Q100 qualification also makes it viable for onboard chargers and automotive DC-DC modules. Design consideration: allocate the 256KB Flash headroom for compensator tables, protection state machines, and field firmware updates; smaller 128KB family variants may suffice for fixed-function converters.
Recomendado
Automotive Body and Actuator Control
Because the DSPIC33EP256MC204T-E/ML is AEC-Q100 qualified, it targets automotive actuators such as throttle bodies, headlamp leveling motors, fuel pumps, and HVAC dampers. The -E extended temperature variant tolerates harsh underhood and chassis environments, while the LINbus and UART/USART interfaces integrate with in-vehicle networks and the QEI interface supports position feedback from brushed or stepper actuator encoders. The high-speed PWM with fault inputs implements hardware overcurrent shutdown required by functional-safety-adjacent designs, and 4 DMA channels service periodic sensor reads deterministically. Used as a single-chip actuator controller, it reduces BOM cost versus discrete MCU plus driver ASIC approaches. Designers must follow automotive ESD and EMC layout practice - ground the exposed pad on multiple vias and filter all harness-connected I/O against ISO 7637-class transients per the vehicle OEM specification.
Recomendado
Industrial Automation and Servo Nodes
In factory automation, the DSPIC33EP256MC204T-E/ML serves as a compact servo axis controller or smart sensor node. The 60 MIPS core runs PID or feed-forward motion loops at kilohertz rates, the QEI interface decodes encoder feedback for closed-loop positioning, and SPI/I2C link the node to higher-level PLCs, displays, and configuration memories. The 256KB Flash accommodates motion profiles, commutation tables, and Modbus-style protocol stacks concurrently, while 5 timers generate coordinated event sequencing for multi-axis triggers. Its 44-QFN 8x8 mm footprint fits dense multi-axis drive boards where real estate is constrained. Performance consideration: budget DMA bandwidth across the ADC, UART, and SPI streams to avoid latency spikes in the current loop, and place the exposed pad on a solid ground plane to keep encoder signal integrity clean in electrically noisy cabinet environments.
Recomendado
Embedded Sensing and IoT Control Nodes
For intelligent sensing endpoints - vibration monitors, flow meters, environmental loggers - the DSPIC33EP256MC204T-E/ML combines DSP-class signal processing (fast MAC operations for FFT and digital filtering) with low-cost 16-bit MCU simplicity. The 60 MIPS core executes real-time spectral analysis on sensor streams while 4 DMA channels move conversion results without CPU intervention, and the 256KB Flash stores calibration constants, filtering coefficients, and logging firmware alongside the application. UART/USART and I2C interfaces connect to cellular, LoRa, or RS-485 link modules for cloud reporting. The 3.3V supply aligns directly with battery-backed and energy-harvesting power architectures through an LDO. Because the QFN exposed pad doubles as thermal and ground anchor, a modest copper pour keeps junction temperature low even in sealed enclosures, where passive cooling is the only mechanism available to the designer.
Recomendado
Test, Measurement and Instrumentation
The DSPIC33EP256MC204T-E/ML suits portable instrumentation - handheld meters, sensor calibrators, data loggers - where DSP throughput and rich peripherals must fit a small 8x8 mm footprint. The 60 MIPS core performs averaging, windowing, and RMS computation on ADC streams in real time; the high-speed PWM doubles as a configurable stimulus generator for excitation-based measurement (e.g., inductive and capacitive sensing), and UART/SPI interfaces drive displays, memory cards, and USB bridge chips. The 256KB Flash hosts protocol stacks and firmware-updatable calibration routines, a meaningful advantage over 128KB or 64KB family variants when shipping multi-function instruments. A practical trade-off: the QFN package requires reflow assembly and X-ray or AOI inspection capability, which low-volume instrument builders should factor into manufacturing choices, or select the identical tray-packaged DSPIC33EP256MC204-E/ML for prototype builds.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP256MC204T-E/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP256MC204-E/ML | DSPIC33EP128MC204T-E/ML | DSPIC33EP64MC204T-E/ML | DSPIC33EP32MC204T-E/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) EP | 44-QFN (8x8 mm) EP - same | 44-QFN (8x8 mm) EP - same | 44-QFN (8x8 mm) EP - same | 44-QFN (8x8 mm) EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Program Memory | 256 KB | 256 KB | 128 KB | 64 KB | 32 KB |
| RAM | 32 KB | 32 KB | 16 KB | 8 KB | 4 KB |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Automotive Qualification | AEC-Q100 qualified (-E extended temp) | AEC-Q100 qualified (-E) | AEC-Q100 qualified (-E) | AEC-Q100 qualified (-E) | AEC-Q100 qualified (-E) |
| Packaging Format | Tape & Reel (T suffix) | Tray (no T suffix) | Tape & Reel | Tape & Reel | Tape & Reel |
Principais diferenciais
- Maximum Flash in the 44-QFN MC204 family (vs DSPIC33EP128MC204T-E/ML)
- Automotive extended-temperature tape-and-reel variant (vs DSPIC33EP256MC204-E/ML)
- Balance of memory and cost (vs DSPIC32MC204T-E/ML (32KB variant))
- Extended temperature grade availability (vs DSPIC33EP256MC204T-I/ML)
Notas de projeto
The 44-QFN exposed pad (EP) is the primary ground and thermal anchor. Connect it to the PCB ground plane through an array of at least 4x4 thermal vias (0.3 mm drill, filled or tented per assembly capability). Per Microchip package outline guidance, the EP is not optional - floating it degrades ground integrity and thermal performance. Place VDD and VDDCORE decoupling capacitors (100 nF ceramic each) within 2 mm of their pins, and add a low-ESR bulk capacitor (4.7-10 uF) near the supply entry. Keep the crystal/oscillator traces short and guard them with ground pour.
Estimated: at 60 MIPS with a typical dsPIC33EP core current of roughly 40-50 mA (input-value: family datasheet typical ICC figures at full speed), a 3.3V rail delivers about 165 mW of internal dissipation plus I/O load current. This is well within the QFN package capability without heatsinking, but in motor-drive PCBs the controller should be thermally isolated from gate-driver hotspots. Verify actual current with your code profile; DMA-heavy and floating-point-emulating workloads increase core current. A local LDO with at least 150 mA headroom (e.g., a 300 mA-rated 3.3V LDO) provides comfortable margin for I/O driving LEDs or gate-driver logic inputs.
Three frequent issues with this family: (1) configuration fuse words (FOSC, FWDT, FPOR, FICD) are burned into the hex - wrong oscillator settings brick startup, so always verify the config bits match your crystal and PLL divider design targeting 60 MIPS (e.g., 7.37 MHz internal FRC or external crystal with correct PLL pre/post dividers). (2) The -E extended temperature grade must not be substituted with -I grade in underhood designs. (3) PWM fault inputs should be wired and enabled in hardware, not polled in software, to guarantee safe shutdown during MOSFET overcurrent events. Consult Microchip's dsPIC33EP family datasheet DS70000657J peripheral chapters before finalizing pin mapping.
Informações de conformidade
AEC-Q100 qualified per Microchip USA product page. RoHS/lead-free status typical for current Microchip production parts; confirm on the Microchip product page environmental section. REACH and halogen-free status not stated in provided data.
