DSPIC33EP32GP504-E/MV - 16-bit DSC 60 MIPS 32KB Flash | Microchip
N.º da peça: DSPIC33EP32GP504-E/MV ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2.93 | $2,93 |
| 10 | $2.64 | $26,40 |
| 100 | $2.35 | $235,00 |
| 500 | $2.1 | $1.050,00 |
| 1.000 | $1.88 | $1.880,00 |
DSPIC33EP32GP504-E/MV Visão geral
A Digital Signal Controller combines the compute characteristics of a microcontroller with the arithmetic throughput of a DSP. In the embedded hierarchy, the dsPIC33E sits between general-purpose 16-bit MCUs and dedicated DSPs, pairing a fixed-point DSP engine with a rich peripheral set, which makes it a strong fit for control loops and signal conditioning that a conventional MCU struggles to close at speed.
Key features include 60 MIPS operation from an internal PLL clocked oscillator, high-speed PWM outputs for precision power conversion, integrated op amps and advanced analog peripherals for signal-chain consolidation, 4 DMA channels for low-CPU-overhead data movement, 5 timers, and 35 general-purpose I/O pins in the UQFN-48 (MV) pin count. Flash self-programming supports field firmware updates.
Architecturally, the CMOS dsPIC33E core uses a modified Harvard bus with multiple internal bus architectures and DSP-class multiply-accumulate instructions, executing from zero-wait-state Flash at full speed while the DMA controller services ADC results and UART/SPI buffers without core intervention. The operating voltage window is 3.0V to 3.6V.
Typical applications include digital power supplies and SMPS control, brushless DC and PMSM motor control, industrial sensing and automation nodes, and embedded signal conditioning where on-chip analog replaces external op-amp stages. The extended -40C to +125C range supports harsh industrial and automotive-adjacent environments.
Design consideration: the UQFN-48 (MV) package exposes a thermal pad and fine pitch - verify the internal core regulator capacitor (VCAP) placement and decoupling layout early, as rerouting a 0.5 mm pitch QFN is costly.
This page synthesizes distributor pricing, drop-in same-family alternatives, pinout data, and practical design notes not found on the manufacturer product page.
Alternativas drop-in para DSPIC33EP32GP504-E/MV — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP32GP504-E/MV (mesmo formato e footprint) — diferindo em Package, Core, Operating Temperature, PWM, Program Memory Size.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP32GP504-I/MV
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
DSPIC33EP32GP504T-E/MV
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EP64GP504-E/MV
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.85 / unidade
Ver ficha técnica →DSPIC33EP128GP504-E/MV
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.3 / unidade
Ver ficha técnica →DSPIC33EP32MC504-E/MV
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.35 / unidade
Ver ficha técnica →DSPIC33EP32GP502T-E/MM
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$2.98 / unidade
Ver ficha técnica →DSPIC33EP32GP504-E/MV Classificações máximas e características elétricas
| Core | dsPIC33E 16-bit DSC |
| Maximum CPU Speed | 60 MIPS (60 MHz) |
| Program Memory Size | 32 KB (10.7K x 24) Flash |
| RAM Size | 4 KB (2K x 16) |
| Operating Voltage Range | 3 V to 3.6 V |
| Faixa de temperatura de operação | -40C to +125C (Extended, E) |
| Encapsulamento | 48-UQFN (6x6 mm), MV |
| I/O Pins | 35 |
| Timers | 5 |
| DMA Channels | 4 |
| PWM | High-Speed PWM |
| Analog Peripherals | Op Amps, Advanced Analog |
| Technology | CMOS |
| Tipo de montagem | Surface Mount |
| Low Power Modes | Yes |
| Programming Interface | ICSP (PGECx/PGEDx pairs) |
| Status RoHS | Compliant |
Configuração de pinos do DSPIC33EP32GP504-E/MV
| Pino 1 | VDD — Positive supply for core logic |
| Pino 2 | AN0/VREF+/CN2/RB0 — Analog input 0 / positive voltage reference / change notification / port B |
| Pino 3 | AN1/VREF-/CN3/RB1 — Analog input 1 / negative voltage reference / change notification / port B |
| Pino 4 | PGED1/AN2/C1IN-/RP1/RB2 — ICSP data 1 / analog input / comparator input / remappable pin |
| Pino 5 | PGEC1/AN3/C1IN+/RP2/RB3 — ICSP clock 1 / analog input / comparator input / remappable pin |
| Pino 6 | AN4/C2IN-/RP3/RB4 — Analog input 4 / comparator input / remappable pin |
| Pino 7 | PGED3/AN5/C2IN+/RP4/RB5 — ICSP data 3 / analog input / comparator input / remappable pin |
| Pino 8 | PGEC3/AN6/RP5/RB6 — ICSP clock 3 / analog input / remappable pin |
| Pino 9 | AN7/RP6/RB7 — Analog input 7 / remappable pin |
| Pino 10 | AN8/RP7/RB8 — Analog input 8 / remappable pin |
| Pino 11 | AN9/RP8/RB9 — Analog input 9 / remappable pin |
| Pino 12 | VSS — Ground reference |
| Pino 13 | AN10/RP9/RB10 — Analog input 10 / remappable pin |
| Pino 14 | AN11/RP10/RB11 — Analog input 11 / remappable pin |
| Pino 15 | AN12/RP11/RB12 — Analog input 12 / remappable pin |
| Pino 16 | TCK/AN13/RP12/RB13 — JTAG test clock / analog input / remappable pin |
| Pino 17 | TDI/AN14/RP13/RB14 — JTAG test data in / analog input / remappable pin |
| Pino 18 | TDO/AN15/RB15 — JTAG test data out / analog input / port B |
| Pino 19 | VCAP/VDDCORE — Internal core regulator capacitor connection |
| Pino 20 | AVSS — Analog ground |
| Pino 21 | AVDD — Analog supply |
| Pino 22 | MCLR — Master clear reset (active low) / programming voltage input |
| Pino 23 | RC1/SOSCI/CN0 — Secondary oscillator input / change notification |
| Pino 24 | RC0/SOSCO/T1CK/CN1 — Secondary oscillator output / Timer1 clock / change notification |
| Pino 25 | RC4/SCL1/CN5 — I2C1 clock / change notification |
| Pino 26 | RC3/SDA1/CN4 — I2C1 data / change notification |
| Pino 27 | PWM1H1/RE0 — High-speed PWM output 1H / port E |
| Pino 28 | PWM1L1/RE1 — High-speed PWM output 1L / port E |
| Pino 29 | PWM1H2/RE2 — High-speed PWM output 2H / port E |
| Pino 30 | PWM1L2/RE3 — High-speed PWM output 2L / port E |
| Pino 31 | PWM1H3/RE4 — High-speed PWM output 3H / port E |
| Pino 32 | PWM1L3/RE5 — High-speed PWM output 3L / port E |
| Pino 33 | VDD — Positive supply for core logic |
| Pino 34 | VSS — Ground reference |
| Pino 35 | RA0/OPA1OUT/PS1CK — Port A / op amp 1 output / parallel slave port clock |
| Pino 36 | RA1/OPA2OUT/PS1CS1 — Port A / op amp 2 output / parallel slave port chip select |
| Pino 37 | RP14/RF0 — Remappable pin / port F |
| Pino 38 | RP15/RF1 — Remappable pin / port F |
| Pino 39 | RF2/U1RX/CSDI — UART1 receive / SPI data in |
| Pino 40 | RF3/U1TX/CSCK — UART1 transmit / SPI clock |
| Pino 41 | RF7/SDO1 — SPI1 data out |
| Pino 42 | RF6/SS1 — SPI1 slave select |
| Pino 43 | OSC1/CLKI — Primary oscillator input / external clock input |
| Pino 44 | OSC2/CLKO/RC15 — Primary oscillator output / clock output / port C |
| Pino 45 | RD0/PGD — Port D / debug data |
| Pino 46 | RD1/PGC — Port D / debug clock |
| Pino 47 | RP17/RD2 — Remappable pin / port D |
| Pino 48 | RP18/RD3 — Remappable pin / port D |
Aplicações típicas
DSPIC33EP32GP504-E/MV é adequado para 6 aplicaçãos: Digital Power Conversion, BLDC and PMSM Motor Control, Industrial Sensing and Automation Nodes, Embedded Signal Conditioning, Hearing Instruments and Battery Powered DSP, Automotive-Adjacent and Harsh Environment Control.
Digital Power Conversion
The DSPIC33EP32GP504-E/MV fits digital SMPS and power conversion designs through its high-speed PWM peripheral and 60 MIPS core, which together close voltage- and current-mode control loops at switching frequencies well into the hundreds of kHz. The 4 DMA channels stream ADC conversion results into RAM without CPU intervention, leaving the core free for the compensator calculation each PWM cycle. Placed as the standalone controller driving gate drivers from the PWM outputs, the DSC replaces analog compensation networks with firmware, enabling adaptive mode changes and digital telemetry. The 3.0V to 3.6V supply and -40C to +125C range suit industrial power supplies and telecom rectifiers.
Recomendado
BLDC and PMSM Motor Control
For brushless DC and permanent-magnet synchronous motor drives, the device provides high-speed PWM outputs for the three-phase inverter and a 60 MIPS core that executes field-oriented control inner current loops deterministically. The integrated op amps and advanced analog block condition shunt-current sense signals on-chip, reducing the external analog bill of materials, while DMA moves ADC current samples each PWM period. Extended temperature rating to +125C supports drives near heat sources. Firmware complexity is the main trade-off versus dedicated gate-driver-plus-MCU solutions, but the flexibility of sensorless algorithm updates in Flash repays it in multi-motor product families.
Recomendado
Industrial Sensing and Automation Nodes
In factory automation nodes, the DSC combines 35 GPIO, multiple serial interfaces, and on-chip analog to interface sensors, switches, and actuators within one 6x6 mm footprint. The 32KB Flash accommodates protocol stacks and calibration tables, while the 4KB RAM buffers sensor streams via DMA. The -40C to +125C extended grade tolerates enclosure-mounted installations near motors and heaters where consumer-grade MCUs drift out of specification. Compared with a PIC16 plus external ADC, this part consolidates the analog front end and control logic, reducing PCB area; the trade-off is a narrower 3.0V to 3.6V supply window requiring a local 3.3V regulator.
Recomendado
Embedded Signal Conditioning
The on-chip op amps and advanced analog peripherals let the DSPIC33EP32GP504-E/MV amplify and filter sensor outputs - strain gauges, thermistors, current shunts - before digital processing, replacing discrete op-amp stages with firmware-configurable internal blocks. At 60 MIPS the DSP engine runs IIR/FIR filters and FFT-based analysis in real time, with DMA feeding sample buffers at line rates. This consolidation shortens the analog signal path, improving noise immunity versus off-chip routing. Designers should budget the op-amp bandwidth and check that internal amplifier gain-bandwidth meets the signal band; for precision metrology beyond its analog specs, an external precision amplifier remains advisable.
Recomendado
Hearing Instruments and Battery Powered DSP
The dsPIC33E low-power modes and small 6x6 mm UQFN-48 footprint suit compact, battery-operated digital signal processing products where board area is scarce. The 60 MIPS throughput executes audio-band filtering and compression algorithms, while sleep and idle modes cut average current for battery life. The extended temperature option supports wearables exposed to body and environmental heat. Compared with a general-purpose 16-bit MCU, the DSP engine's single-cycle MAC instructions deliver several times the algorithmic throughput at the same clock; the 3.0V to 3.6V supply matches a single lithium coin cell or Li-ion rail through an LDO.
Recomendado
Automotive-Adjacent and Harsh Environment Control
With the -E extended temperature rating of -40C to +125C, the part serves harsh-environment control units - engine bay-adjacent actuators, agricultural equipment, and industrial drives - where industrial-grade silicon at +85C would be marginal. The high-speed PWM drives solenoids and actuators, the analog peripherals read resistive and current-loop sensors, and Flash self-programming supports field parameter updates in deployed units. Note this is not an AEC-Q100 qualified automotive part; for formal automotive programs, select a Microchip automotive-grade dsPIC variant instead. The 32KB Flash is ample for control logic but limits protocol-heavy firmware, so plan memory headroom early.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP32GP504-E/MV — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP32GP504-I/MV | DSPIC33EP64GP504-E/MV | DSPIC33EP128GP504-E/MV | DSPIC33EP32MC504-E/MV |
|---|---|---|---|---|---|
| Package | 48-UQFN (6x6 mm) MV | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same | 48-UQFN (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Flash Memory | 32 KB | 32 KB | 64 KB | 128 KB | 32 KB |
| Temperature Range | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) | -40C to +125C (E) |
| Peripheral Emphasis | General purpose + high-speed PWM, op amps | General purpose (identical) | General purpose | General purpose | Motor control emphasis |
| Lifecycle Status | In Production (active) | Active | Active | Active | Active |
Principais diferenciais
- Extended temperature range in the same footprint (vs DSPIC33EP32GP504-I/MV)
- On-chip op amps reduce external analog BOM (vs DSPIC33EP32GP504-I/MV and generic 16-bit MCUs)
- 60 MIPS DSP core versus general-purpose 16-bit MCU (vs PIC16LF1789 family)
- Flash upgrade path without PCB change (vs DSPIC33EP128GP504-E/MV)
Notas de projeto
The dsPIC33E uses an internal core regulator whose output appears on the VCAP/VDDCORE pin. Connect a low-ESR capacitor (value per the manufacturer datasheet, typically on the order of 10 uF) from VCAP to VSS as close to the pin as possible; omitting or under-sizing this capacitor is the most common cause of erratic reset behavior on dsPIC33E boards. The external supply window is 3.0V to 3.6V - a 3.3V LDO with at least 200 mA headroom covers the I/O budget for 35 GPIO. Decouple each VDD pin with 100 nF ceramic plus one bulk 10 uF capacitor per supply domain.
The 48-UQFN (MV) 6x6 mm package has 0.5 mm pin pitch and a central exposed thermal pad that must be soldered to a ground flood - use an array of 4 to 6 vias under the pad to tie it to the ground plane for both thermal and EMI performance. For ICSP programming, expose a header on any PGECx/PGEDx pair plus MCLR, VDD and VSS; keep the chosen PGEC/PGED traces under 10 cm and away from PWM lines to avoid flash programming errors. Route the analog pins (ANx, AVDD, AVSS) over a quiet analog ground area separated from PWM return currents.
Three recurring traps with this device: (1) remappable peripheral pins (RPx) are assigned in firmware via PPS registers - configure them before enabling the peripheral, and disable write-protect on PPS Unlock in the config bits or PPS writes silently fail; (2) the narrow 3.0V to 3.6V supply range means 5V-tolerant I/O must not be assumed - add level shifting or series resistors when interfacing 5V sensors; (3) comparator inputs C1IN/C2IN share pins with AN2/AN5 - if the ADC scans those channels while comparators are active, set the TRIS and ANSEL registers consistently or conversion results will be corrupted.
Estimated: at moderate loading the die dissipates well under 0.5W from a 3.3V rail with tens of mA of I/O current, so natural convection through the exposed pad suffices for most boards; a 6x6 mm QFN with a solid ground flood typically shows a junction-to-ambient thermal resistance in the 30-45 C/W range per comparable QFN-48 packages. The -E grade provides margin up to +125C ambient, but verify the actual theta-JA in the manufacturer datasheet thermal section for your copper area before committing to an enclosure without airflow.
Informações de conformidade
Part is In Production per Microchip product page. Extended temperature (-40C to +125C) is not AEC-Q100 automotive qualification - not stated in provided data. Confirm REACH and conflict-minerals declarations from Microchip compliance documentation.
