DSPIC33EP512GM310-H/PT - 70 MIPS 16-bit DSC 512KB TQFP-100 | Microchip
N.º da peça: DSPIC33EP512GM310-H/PT ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.9 | $8,90 |
| 10 | $8.1 | $81,00 |
| 100 | $7.35 | $735,00 |
| 500 | $6.75 | $3.375,00 |
| 1.000 | $6.2 | $6.200,00 |
DSPIC33EP512GM310-H/PT Visão geral
A digital signal controller combines the computational throughput of a digital signal processor with the deterministic control and peripheral integration of a microcontroller. Within the power-management hierarchy of embedded systems, a DSC sits above a general-purpose MCU for real-time control loops: it executes single-cycle MAC and DSP instructions while retaining Harvard-architecture C-friendly programming. The dsPIC33EP family from Microchip Technology serves this niche for motor control, digital power conversion, and embedded sensing.
Key features include the 70 MIPS dsPIC DSC core with integrated DSP engine, 512KB of self-programmable Flash, operation from a 3.3V supply, and enhanced on-chip peripherals that Microchip highlights for high-performance precision motor control systems. The -H suffix denotes an extended temperature grade suitable for harsh environments, and the /PT suffix identifies the 100-pin TQFP tray package. The device supports In-Circuit Serial Programming (ICSP) with multiple PGECx/PGEDx pin pairs for programming and debugging.
Architecturally, the dsPIC33E core integrates a DSP multiply-accumulate engine, a flexible interrupt structure, and Peripheral Pin Select (PPS) that lets designers remap digital peripherals to available pins, simplifying PCB routing on a 100-pin footprint. The GM3 family members additionally integrate analog features such as on-chip operational amplifiers, supporting current-shunt sensing in digital power and motor drive stages without external op-amps.
Typical applications include sensorless and sensored brushless DC and PMSM motor drives, digital power supplies (LLC, totem-pole PFC), automotive auxiliary systems benefiting from AEC-Q100 qualification, and industrial automation nodes that require deterministic DSP-class control in a single chip.
A key design consideration: all VDD and VSS pins must be connected and decoupled, and when using ICSP the chosen PGECx pin must be paired with its matching PGEDx pin. Plan pin selection early because PPS mapping interacts with analog pin ownership.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para DSPIC33EP512GM310-H/PT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP512GM310-H/PT (mesmo formato e footprint) — diferindo em Package, Core Architecture, Quadrature Encoder Interfaces, Supply Voltage, Core.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP512GM310-I/PT
✅ Drop-In✓ Em estoque
$6.45 / unidade
Ver ficha técnica →DSPIC33EP256GM310T-I/PT
✅ Drop-In✓ Em estoque
$4.95 / unidade
Ver ficha técnica →DSPIC33EP512GM710
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EP512GM310-H/PT Classificações máximas e características elétricas
| Core | dsPIC33E 16-bit DSC core |
| Max CPU Speed | 70 MIPS |
| Core Architecture | Harvard, 16-bit with DSP engine |
| Program Memory Size | 512KB (170K x 24) Flash |
| Tensão de alimentação | 3.3 V |
| Encapsulamento | 100-TQFP (12 x 12 mm) |
| Package Code | PT |
| Tipo de montagem | Surface Mount |
| Series | dsPIC 33EP (dsPIC33EPGM3) |
| Qualification | Automotive, AEC-Q100 |
| Temperature Grade | -H extended temperature grade |
| Integrated Op-Amps | Yes (on-chip op-amps, GM3 family) |
| Debug/Programming | ICSP via multiple PGECx/PGEDx pairs |
| Pin Remapping | Peripheral Pin Select (PPS) |
Guia de Configuração de Pinos do DSPIC33EP512GM310-H/PT pt
Configuração de pinos para DSPIC33EP512GM310-H/PT (pacote pt). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33EP512GM310-H/PT.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33EP512GM310-H/PT é adequado para 6 aplicaçãos: Precision Motor Control (FOC for BLDC/PMSM), Automotive Auxiliary Control Systems, Digital Power Conversion, Industrial Automation and Robotics, Embedded Audio and Signal Processing, Smart Sensors and IoT Edge Nodes.
Precision Motor Control (FOC for BLDC/PMSM)
The DSPIC33EP512GM310-H/PT is purpose-built for field-oriented control of brushless DC and permanent magnet synchronous motors. Its 70 MIPS dsPIC33E core executes Clarke/Park transforms, PI current loops at 10-20 kHz, and speed loops with single-cycle DSP MAC instructions, delivering deterministic loop timing that general-purpose MCUs cannot match. The GM3 family's on-chip operational amplifiers condition low-side shunt currents without external op-amps, reducing BOM cost and offset error, while Peripheral Pin Select (PPS) lets the complementary PWM and ADC triggers route to optimal pins on the 100-TQFP. Microchip explicitly positions the dsPIC33E family for high-performance, precision motor control systems, and the 512KB Flash accommodates full FOC stacks with position estimation and communication stacks in one image.
Recomendado
Automotive Auxiliary Control Systems
With AEC-Q100 qualification and the extended -H temperature grade, the DSPIC33EP512GM310-H/PT targets automotive auxiliary functions such as pump and fan control, actuators, and body-domain motor nodes. The 512KB Flash provides headroom for AUTOSAR-style drivers, diagnostics, and OTA update loaders, while the 70 MIPS core handles sensor fusion for position and current feedback in real time. Automotive environments impose wide supply transients and temperature extremes; the -H grade extends the operating envelope beyond the industrial -I variant, and the 100-TQFP (12 x 12 mm) package offers robust solder joints and straightforward inspection. Designs already qualified on the -I/PT variant can move to the -H/PT without schematic or layout changes.
Recomendado
Digital Power Conversion
Digital power supplies - LLC resonant converters, totem-pole PFC stages, and synchronous buck platforms - demand fast, deterministic control loops triggered by ADC conversion-complete events. The DSPIC33EP512GM310-H/PT's 70 MIPS core and integrated DSP engine execute compensator equations with cycle-accurate latency, and the GM3 on-chip op-amps buffer current-shunt signals directly into the ADC path. The 512KB Flash stores multiple firmware profiles for different operating modes or product variants, and Peripheral Pin Select allows the PWM module to map to gate-driver interface pins cleanly on the 100-TQFP. Compared with analog control, the DSC approach enables adaptive soft-start, nonlinear gain scheduling, and digital telemetry without hardware redesign.
Recomendado
Industrial Automation and Robotics
Factory automation nodes - servo drives, stepper controllers, and robotic joint drivers - benefit from the DSPIC33EP512GM310-H/PT's combination of 70 MIPS deterministic control and rich peripheral set on a single 100-TQFP die. The 512KB Flash holds trajectory planners, fieldbus protocol stacks, and safety-limit routines concurrently, while ICSP debugging through multiple PGECx/PGEDx pairs accelerates bench bring-up. The extended -H temperature rating tolerates enclosure heat near drives and switch cabinets where ambient temperatures climb past standard industrial ranges. On-chip op-amps simplify encoder and current-feedback signal conditioning, and the AEC-Q100 qualification provides an extra reliability margin valued in continuous-duty industrial equipment.
Recomendado
Embedded Audio and Signal Processing
The GM3 dsPIC33EP family integrates audio-grade peripherals, and the DSPIC33EP512GM310-H/PT's single-cycle MAC, 40-bit accumulator, and 70 MIPS throughput handle real-time filtering, compression, and analysis on 16-bit sample streams. Typical embedded audio uses include active noise cancellation in appliances, acoustic diagnostics, and speech-band processing in industrial intercoms. The 512KB Flash accommodates filter coefficient banks plus multiple algorithm profiles, and 3.3V operation interfaces directly with common audio codecs and MEMS microphone front ends. Peripheral Pin Select lets designers place I2S/serial paths on optimal 100-TQFP pins for short analog-digital loop routing, reducing board-level noise pickup in mixed-signal sections.
Recomendado
Smart Sensors and IoT Edge Nodes
Edge nodes that perform local signal conditioning before transmission - vibration monitors, smart flow meters, and predictive-maintenance sensors - gain from the DSPIC33EP512GM310-H/PT's ability to run FFT and filter chains locally on the 70 MIPS core, sending only processed features upstream. The 512KB Flash stores both the DSP pipeline and communication firmware, and the AEC-Q100 -H grade supports harsh or outdoor deployments where temperature excursions exceed commercial limits. The 100-TQFP (12 x 12 mm) surface-mount package supports automated assembly, and ICSP programming enables in-field firmware refresh through a spare PGEC/PGED pair routed to a service connector.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP512GM310-H/PT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP512GM310-I/PT | DSPIC33EP256GM310T-I/PT | DSPIC33EP512GM710 |
|---|---|---|---|---|
| Package | 100-TQFP (12x12) | 100-TQFP (12x12) - same | 100-TQFP (12x12) - same | 100-TQFP (12x12) - same (per PIM sheet) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Speed | dsPIC33E 16-bit, 70 MIPS | dsPIC33E 16-bit, 70 MIPS | dsPIC33E 16-bit, 70 MIPS | dsPIC33E 16-bit, 70 MIPS |
| Flash Program Memory | 512KB (170K x 24) | 512KB (170K x 24) | 256KB (85K x 24) | 512KB (170K x 24) |
| On-chip Op-Amps | Yes (GM3 family) | Yes (GM3 family) | Yes (GM3 family) | Yes (GM7 family) |
| Supply Voltage | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Key Trade-off | Extended temperature grade, higher unit cost | Lower cost, industrial temp only | Lower cost, half the Flash | More peripheral density, verify pinout before reuse |
Principais diferenciais
- Extended -H temperature grade with AEC-Q100 qualification (vs DSPIC33EP512GM310-I/PT)
- Double the program memory within the same footprint (vs DSPIC33EP256GM310T-I/PT)
- GM3 on-chip operational amplifiers eliminate external signal conditioning (vs DSPIC33EP512GM710)
Notas de projeto
Connect and decouple every VDD and VSS pin pair on the 100-TQFP; Northern Software's device support notes explicitly state that all VSS and VDD pins must be used for ICSP operation and reliable power delivery. Place a 100 nF ceramic capacitor within 2 mm of each supply pin and at least one bulk 4.7-10 uF capacitor near the device. The exposed nature of TQFP leads makes this straightforward, but skipping a supply pin is a common cause of intermittent brown-out resets and failed ICSP sessions on dsPIC33EP designs.
The dsPIC33EP512GM310 has multiple PGECx/PGEDx programming pin pairs, and ICSP requires a matched pair: if PGEC2 carries ICSPCLK, PGED2 must carry ICSPDAT. Mixing pins from different pairs is a frequent bring-up failure. Route one chosen pair to a standard programming header (MCLR, VDD, GND, PGD, PGC) and keep analog peripherals off those pins. Also plan Peripheral Pin Select (PPS) mappings early, because PPS-remappable digital pins conflict with analog-channel ownership that cannot be remapped.
The -H grade of the DSPIC33EP512GM310 exists specifically for elevated ambient environments, so thermal design still matters: estimated at 70 MIPS with heavy peripheral activity, core current on dsPIC33EP parts typically falls in the tens of mA range, and a 12 x 12 mm TQFP on a standard 4-layer PCB with solid ground plane keeps junction rise modest (tens of degrees C above ambient). Verify exact theta-JA and current figures against the Microchip family datasheet (document 70000689) for your stackup, and provide copper pour under the package in enclosed automotive modules.
Informações de conformidade
AEC-Q100 automotive qualification confirmed by distributor listings (Hotenda, DigiKey) and Microchip product data. RoHS/REACH/lead-free status not stated in the provided verified data - [DATA_NEEDED: RoHS/REACH status].
