DSPIC33EP512MC504-E/PT - 16-bit 70 MIPS DSC 512KB Flash | Microchip
N.º da peça: DSPIC33EP512MC504-E/PT ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $12.06 | $12,06 |
| 10 | $11.5 | $115,00 |
| 100 | $10.85 | $1.085,00 |
| 500 | $10.2 | $5.100,00 |
| 1.000 | $9.6 | $9.600,00 |
DSPIC33EP512MC504-E/PT Visão geral
A digital signal controller combines the computational architecture of a microcontroller with the arithmetic capability of a DSP. Within the power-management hierarchy of embedded systems, the DSC sits above general-purpose MCUs and below dedicated DSPs, offering deterministic control-loop execution for motor drive, digital power conversion, and sensing applications that require fast multiply-accumulate operations alongside real-time peripherals.
Key features include the dsPIC33E core with integrated DSP engine (single-cycle MAC, dual operand fetch), dedicated motor-control PWM (MCPWM) with complementary outputs and dead-time insertion, Quadrature Encoder Interface (QEI) inputs for position feedback, 4 DMA channels, and 5 timers. Per the Mouser listing, the part is specified as a 16B DSC with QEI and MCPWM peripherals, and per Master Electronics it operates from a 3 V to 3.6 V supply with 35 I/O pins.
The enhanced on-chip peripheral set - high-speed PWM, ADC with multiple sample-and-hold, comparators and op-amp options in family variants - allows closed-loop field-oriented control (FOC) of PMSM and BLDC motors at switching frequencies of tens of kilohertz while leaving CPU headroom for communication stacks such as UART, SPI, I2C, and ECAN.
Typical applications include precision BLDC and PMSM motor control, digital power supplies (LLC, PFC, buck), solar inverters, and industrial sensing nodes requiring DSP filtering. The 70 MIPS core executes sensorless FOC loops within a single PWM period.
Design consideration: the 3.0-3.6 V supply window requires a clean LDO or buck-derived 3.3 V rail; all VDD/VSS pairs must be decoupled with 100 nF ceramics placed at each pin pair.
This page synthesizes distributor pricing, drop-in same-family alternatives, and design notes beyond what the manufacturer datasheet provides, with data verified 2026-09-25.
Alternativas drop-in para DSPIC33EP512MC504-E/PT — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP512MC504-E/PT (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Core Architecture, Packaging, Programming Interface.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP512MC504-I/PT
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.05 / unidade
Ver ficha técnica →DSPIC33EP512MC504-H/PT
✅ Drop-In✓ Em estoque
$4.29 / unidade
Ver ficha técnica →DSPIC33EP512GP504T-E/PT
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →DSPIC33EP256MC504-I/PT
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4.6 / unidade
Ver ficha técnica →DSPIC33EP256MC504T-I/TL
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.32 / unidade
Ver ficha técnica →DSPIC33EP512MC504-E/PT Classificações máximas e características elétricas
| Core Architecture | 16-bit dsPIC33E DSC |
| Max CPU Speed | 70 MIPS |
| Program Memory (Flash) | 512 KB (170K x 24) |
| SRAM | 48 KB |
| Tensão de alimentação | 3 V to 3.6 V |
| Temperatura de operação | -40C to +125C (E grade) |
| Encapsulamento | 44-TQFP (10x10 mm) |
| I/O Pins | 35 |
| DMA Channels | 4 |
| Timers | 5 |
| Motor Control PWM | Yes (MCPWM) |
| Quadrature Encoder Interface | Yes (QEI) |
| Tipo de montagem | Surface Mount |
| Lead Status / RoHS | Lead-free (RoHS compliant) |
| Programming Interface | ICSP (multiple PGECx/PGEDx pairs) |
| Low-Power Modes | Supported |
| Packaging | Tray |
Guia de Configuração de Pinos do DSPIC33EP512MC504-E/PT 44-tqfp (10x10 mm)
Configuração de pinos para DSPIC33EP512MC504-E/PT (pacote 44-tqfp (10x10 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33EP512MC504-E/PT.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33EP512MC504-E/PT é adequado para 6 aplicaçãos: BLDC/PMSM Field-Oriented Motor Control, Digital Power Conversion (PFC, LLC, Solar Inverter), Industrial Sensing and Condition Monitoring, Robotics and Servo Drives, Embedded Motor-Drive Development and Prototyping, Power Monitoring and Smart Energy Meters.
BLDC/PMSM Field-Oriented Motor Control
The DSPIC33EP512MC504-E/PT was architected precisely for precision motor control: its 70 MIPS DSP core with single-cycle MAC executes Clarke/Park transforms, PI current loops, and sensorless observers inside one PWM period, while the dedicated MCPWM module generates complementary outputs with hardware dead-time insertion - eliminating CPU overhead for gate drive timing. In a typical PMSM servo, the QEI interface reads the encoder at hardware speed and the ADC synchronizes current sampling to PWM centers to avoid switching noise. Designers should place current-sense op-amps close to the shunt resistors and route ADC inputs away from PWM traces; the 3.0-3.6 V supply and -40C to +125C range fit sealed industrial drives where junction temperatures climb under sustained load.
Recomendado
Digital Power Conversion (PFC, LLC, Solar Inverter)
Digital power stages need deterministic loop closure at tens to hundreds of kilohertz. The 70 MIPS core closes voltage and current loops in firmware, while the MCPWM module produces phase-shifted or complementary PWM with programmable dead time suited to LLC half-bridges and interleaved PFC. The 4 DMA channels stream ADC results to RAM without CPU intervention, keeping interrupt latency predictable during transient events like load steps. In a 3.3 V logic domain, the controller interfaces to gate drivers via optocouplers or digital isolators. The extended -40C to +125C operation suits outdoor solar micro-inverter enclosures where ambient plus self-heating is severe; the 512 KB Flash leaves room for multiple protection state machines, logging, and in-field firmware update bootloaders.
Recomendado
Industrial Sensing and Condition Monitoring
Vibration, current, and acoustic condition-monitoring nodes benefit from the DSP engine: single-cycle MAC accelerates FIR/IIR filtering and FFT analysis of sampled sensor data, while 48 KB SRAM buffers acquisition windows for spectral processing. The 12-bit ADC with DMA offloads continuous sampling, and ECAN/UART links publish features to PLC or cloud gateways. Operating from a single 3.3 V rail at 3.0-3.6 V tolerance simplifies powering from industrial 24 V buses through a buck regulator. In motor-attached sensors, the E-grade -40C to +125C rating survives drive-enclosure temperatures that defeat commercial-grade MCUs. Firmware flexibility of the 512 KB Flash supports multi-protocol deployments from one PCB, reducing SKU proliferation across monitoring product lines.
Recomendado
Robotics and Servo Drives
Robot joint and gimbal controllers combine high-rate current loops with position feedback - exactly what the MCPWM plus QEI pairing delivers. The 70 MIPS core runs cascaded position/velocity/current loops at kilohertz rates, and hardware QEI decodes encoder quadrature without CPU load, freeing cycles for trajectory interpolation and CAN-based command handling. Complementary PWM outputs with programmable dead time drive three-phase inverters safely, while fault inputs can trip PWM outputs in hardware microseconds after overcurrent events. The 35 I/O pins accommodate limit switches, brakes, and expansion headers. With -40C to +125C operation, controllers mounted inside actuator housings tolerate stall-induced heating; the 44-TQFP 10x10 body fits dense multi-axis boards.
Recomendado
Embedded Motor-Drive Development and Prototyping
The dsPIC33EP512MC504 is a common choice for motor-control development kits and proof-of-concept drives because MPLAB X IDE, the XC16 compiler, and Microchip's motor-control libraries (FOC firmware frameworks) target it directly. ICSP programming uses any matched PGECx/PGEDx pair, so a single 5-pin header supports both flash programming and in-circuit debugging - critical when iterating observer gains. The 512 KB Flash accommodates instrumented builds with logging that would overflow 256 KB variants, letting engineers capture current/voltage traces during commissioning. Because pin-compatible 256 KB and industrial-temperature siblings exist, a prototype PCB moves to production variants without layout revision, protecting schedule when final memory and temperature requirements settle late in the program.
Recomendado
Power Monitoring and Smart Energy Meters
Energy metering front-ends need simultaneous voltage/current sampling and DSP-grade computation for RMS, power factor, and harmonic analysis - workload the dsPIC33EP's MAC engine and DMA-driven ADC pipeline handle efficiently at 70 MIPS. The 3.0-3.6 V operation matches battery-backed or capacitor-backed supplies used for tamper-proof metering, and low-power modes reduce consumption between measurement bursts. Multiple UART/SPI/I2C ports connect to optical ports, RF modules, and display drivers simultaneously. The E temperature grade covers outdoor meter cabinets specified to +85C ambient with solar gain margins up to +125C. The QEI and MCPWM peripherals remain unused in this application but cost nothing, so one approved component serves both metering and actuator product lines.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP512MC504-E/PT — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP512MC504-I/PT | DSPIC33EP512MC504-H/PT | DSPIC33EP512GP504T-E/PT | DSPIC33EP256MC504-I/PT | DSPIC33EP256MC504T-I/TL |
|---|---|---|---|---|---|---|
| Package | 44-TQFP (10x10 mm) | 44-TQFP (10x10) - same | 44-TQFP (10x10) - same | 44-TQFP (10x10) - same | 44-TQFP (10x10) - same | 44-TQFP (10x10, VFTLA exposed pad) |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 512 KB (170K x 24) | 512 KB | 512 KB | 512 KB | 256 KB | 256 KB |
| Core Speed | Up to 70 MIPS | Up to 70 MIPS | Up to 70 MIPS (H-speed grade) | Up to 70 MIPS | Up to 70 MIPS | Up to 70 MIPS |
| Motor-Control Peripherals (MCPWM + QEI) | Yes | Yes | Yes | No (GP peripheral set) | Yes | Yes |
| Supply Voltage | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V | 3 V to 3.6 V |
Principais diferenciais
- Extended temperature operation to +125C (vs DSPIC33EP512MC504-I/PT)
- Maximum Flash and SRAM in the 504 pin class (vs DSPIC33EP256MC504-I/PT)
- Dedicated motor-control peripherals (vs DSPIC33EP512GP504T-E/PT)
Notas de projeto
Supply the DSPIC33EP512MC504-E/PT from a clean 3.3 V rail within its 3.0-3.6 V window. Estimated: at full 70 MIPS family-typical core current of roughly 50-70 mA, a 150 mA LDO such as the MCP1700-class parts provides margin. Place 100 nF ceramic capacitors at every VDD/VSS pin pair within 2 mm of the pins, plus one 10 uF bulk capacitor. Do not connect a supply pin to ground by mistake - the 44-TQFP has interleaved power pairs and miswiring a single pair prevents ICSP programming.
For motor-control layouts, keep the MCPWM output traces short and matched per phase to the gate drivers, and route current-sense ADC inputs as a differential pair away from PWM switching nodes. Assign any matched PGECx/PGEDx pair to the programming header - but never split a pair across connectors - per Microchip ICSP guidance (northernsoftware.com summary of the device: multiple PGECx/PGEDx pairs exist and must be used as matched pairs). Connect all VDD/VSS pins on the PCB; the device will not program reliably with floating supply pins.
The most common failure is thermal budget misgrading: the -I variant is limited to +85C while this -E part reaches +125C, but junction temperature - not ambient - determines reliability. Estimated: in a sealed drive at +70C ambient with ~0.2 W dissipation and TQFP theta_JA of roughly 50-60 C/W, junction rise is only 10-12 C, but verify with the actual datasheet theta_JA for your board stack-up. Also confirm PLL configuration: exceeding the 70 MIPS family limit causes erratic ADC sampling rather than a clean failure.
Informações de conformidade
Verified web data describes the part as lead-free; RoHS compliant per Microchip standard product page. REACH, halogen-free, and conflict-minerals status not stated in provided data.