DSPIC33EP64GS504-E/ML - 16-bit DSC 64KB Flash Digital Power | Microchip
N.º da peça: DSPIC33EP64GS504-E/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $5.2 | $5,20 |
| 10 | $4.68 | $46,80 |
| 100 | $4.16 | $416,00 |
| 500 | $3.74 | $1.870,00 |
| 1.000 | $3.35 | $3.350,00 |
DSPIC33EP64GS504-E/ML Visão geral
A digital signal controller combines the compute throughput of a DSP with the peripheral integration and control-oriented architecture of a microcontroller. Within the power management IC hierarchy, the dsPIC33EP GS family sits at the control layer of switched-mode power conversion systems, executing control loops for AC-to-DC converters, DC-to-DC converters, and power factor correction (PFC) stages in real time.
Key features include the interconnected high-speed PWM module, high-speed analog-to-digital converter (ADC), on-chip digital-to-analog converter (DAC), programmable gain amplifiers (PGA), and analog comparators. These peripherals are internally interconnected so that ADC sampling can be triggered precisely by PWM events with minimal CPU latency - a critical requirement for multi-loop digital power supplies where loop delay directly limits achievable control bandwidth.
Architecturally, the dsPIC33EP core uses a modified Harvard pipeline with DSP multiply-accumulate instructions, allowing proportional-integral-derivative (PID) and more advanced nonlinear control laws to execute inside single switching periods at hundreds of kilohertz. The GS family adds SMPS-specific interconnects that the general-purpose GP variants do not offer.
Typical applications include AC-to-DC converter control, interleaved power factor correction (Microchip provides a 350W interleaved PFC reference design based on this family), DC-DC converter control, and digital lighting power supplies.
Design consideration: verify PWM resolution at your target switching frequency, as high-frequency converters demand fine duty-cycle granularity for stable control loops.
This page synthesizes distributor pricing, family drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para DSPIC33EP64GS504-E/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP64GS504-E/ML (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Core, Maximum CPU Speed, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP32GS504-E/ML
✅ Drop-In✓ Em estoque
$3.75 / unidade
Ver ficha técnica →DSPIC33EP64GP504-E/MV
✅ Drop-In✓ Em estoque
$2.85 / unidade
Ver ficha técnica →DSPIC33EP64GP504T-E/TL
✅ Drop-In✓ Em estoque
$3.5 / unidade
Ver ficha técnica →DSPIC33EP64GP503T-I/TL
✅ Drop-In✓ Em estoque
$3.9 / unidade
Ver ficha técnica →DSPIC33EP64GS504-I/ML
✅ Drop-In✓ Em estoque
$4.45 / unidade
Ver ficha técnica →DSPIC33EP64GS504-E/ML Especificações (publicadas pelo fabricante)
| Core | dsPIC33EP, 16-bit |
| Max CPU Speed | 70 MIPS |
| Program Memory (Flash) | 64KB (64K x 8) |
| Encapsulamento | 44-QFN (8x8 mm) |
| Faixa de temperatura de operação | -40C to +125C (E grade) |
| Product Family | dsPIC33EP GS50X - SMPS & Digital Power Conversion DSC |
| Key Peripherals | High-Speed PWM, High-Speed ADC, DAC, Comparators, PGA |
| Target Applications | Digital Power / SMPS, AC-DC and DC-DC converters |
| Functional Safety Support | Yes (FuSa per DigiKey listing) |
| Status do ciclo de vida | In Production (per Microchip product page) |
| Tipo de montagem | Surface Mount |
Interfaces e Conectores do DSPIC33EP64GS504-E/ML
Não há lista de interfaces publicada pelo fabricante disponível para DSPIC33EP64GS504-E/ML. Consulte a documentação do fabricante para detalhes de conectores e headers.
Consulte a documentação do fabricante para a pinagem completa do conector de expansão e a numeração dos pinos do conector.
Características de potência e térmicas
| Temperatura de Funcionamento | -40C to +125C (E grade) |
Parâmetros de entrada de potência e térmicos para DSPIC33EP64GS504-E/ML, conforme publicados pelo fabricante.
Aplicações típicas
DSPIC33EP64GS504-E/ML é adequado para 6 aplicaçãos: AC-DC Converter Digital Control, Interleaved Power Factor Correction (PFC), DC-DC Converter Control, Digital Lighting Power Supplies, Motor Control Power Stages, Digital Power Monitoring and UPS Systems.
AC-DC Converter Digital Control
The DSPIC33EP64GS504-E/ML is explicitly designed by Microchip for AC-to-DC converter control within its SMPS & Digital Power Conversion family. Its high-speed PWM generates precisely resolved drive waveforms for the primary-side switching stage, while the high-speed ADC samples output voltage and input current synchronously with PWM events through the internal peripheral interconnect, minimizing loop delay. The on-chip comparators provide cycle-by-cycle overcurrent protection without CPU latency, which is essential during AC line transients and startup. Running at 70 MIPS, the DSC executes voltage and current control loops in real time within each switching period, enabling higher bandwidth and better transient response than fixed-frequency analog controllers. The extended -40C to +125C E-grade temperature rating suits sealed power supply enclosures.
Recomendado
Interleaved Power Factor Correction (PFC)
Microchip provides an Interleaved PFC reference design based on the dsPIC33EP GS family that accepts universal AC input and produces a single high-voltage DC output up to 350W - a validated architecture the DSPIC33EP64GS504-E/ML implements directly. Interleaved PFC requires two PWM channels operating with accurate phase offset, which the high-speed PWM module supports with fine resolution, while the high-speed ADC captures inductor current per phase each switching cycle through the interconnect fabric. The 70 MIPS DSP core with multiply-accumulate instructions executes average-current-mode control plus feedforward compensation in real time. Digital implementation allows adaptive gain scheduling across the universal input range (90-264 VAC), improving hold-up time and THD compared to fixed analog solutions, and the 64KB Flash accommodates the full PFC firmware with margin.
Recomendado
DC-DC Converter Control
For digitally controlled DC-DC converters - buck, boost, half-bridge, and full-bridge topologies - the DSPIC33EP64GS504-E/ML pairs its high-speed PWM with the high-speed ADC via the family's peripheral interconnect so that current-mode samples land exactly at the midpoint of the PWM off-time, avoiding switching-noise corruption. The programmable gain amplifiers (PGA) condition low-level current-shunt signals on-chip, reducing external op-amp count, and the DACs supply precise references for the analog comparators that implement hardware overcurrent trip. At 70 MIPS, PID and nonlinear control laws execute well above typical 100-500 kHz switching frequencies. The 44-QFN 8x8 mm package keeps the controller close to the power stage on dense converter PCBs, and the extended temperature grade supports telecom and automotive-adjacent power bricks.
Recomendado
Digital Lighting Power Supplies
LED drivers and electronic ballast-class power supplies benefit from the DSPIC33EP64GS504-E/ML's combination of high-resolution PWM dimming control and digitally managed power conversion. The high-speed PWM can drive the switching stage while simultaneously generating dimming waveforms with fine granularity, enabling flicker-free current regulation across a wide dimming range. The high-speed ADC monitors LED string current and board temperature each cycle, supporting derating and fault logging in firmware - features analog drivers cannot offer. Because control parameters live in software, a single hardware design can be re-tuned in firmware for different LED string voltages or topologies, cutting SKU proliferation. The -40C to +125C extended rating tolerates luminaire heat soak, and the 44-QFN footprint fits compact driver boards.
Recomendado
Motor Control Power Stages
Beyond pure power supplies, the DSPIC33EP64GS504-E/ML serves inverter and motor-drive control stages where precise PWM generation and fast current sensing determine torque smoothness and efficiency. Lisleapex application analysis identifies motor control as a primary use area for the dsPIC33EP64GS504 series. The 70 MIPS DSP engine executes field-oriented control (FOC) mathematics with hardware multiply-accumulate support, while multiple PWM channels drive three-phase bridges with programmable dead-time. The high-speed ADC synchronized to the PWM center samples phase currents at optimal points, and on-chip comparators implement overcurrent shutdown within the switching period. Digital implementation enables sensorless observer algorithms and fault diagnostics in firmware, and the 64KB Flash holds complete FOC plus communication stacks for industrial drive nodes.
Recomendado
Digital Power Monitoring and UPS Systems
Uninterruptible power supplies and advanced power monitoring units use the DSPIC33EP64GS504-E/ML to fuse power conversion control with measurement telemetry. The high-speed ADC with PGA front-end digitizes AC voltage and current waveforms for RMS, power factor, and harmonic calculation in firmware, while the same device controls the inverter/charger conversion stage through its high-speed PWM. Running at 70 MIPS leaves headroom to run both the fast control loop and slower monitoring routines concurrently with interrupt prioritization. The on-chip DAC and comparators provide hardware-level protection thresholds independent of software state, important for battery safety. The extended -40C to +125C rating and In Production lifecycle status support long-lifetime infrastructure products, and Functional Safety (FuSa) support per DigiKey documentation aids certified designs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP64GS504-E/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP32GS504 | DSPIC33EP64GP504-E/MV | DSPIC33EP64GP504T-E/TL | DSPIC33EP64GS504-I/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64KB (64K x 8) | 32KB | 64KB | 64KB | 64KB |
| Core Performance | 16-bit, 70 MIPS | 16-bit, 70 MIPS | 16-bit, 70 MIPS | 16-bit, 70 MIPS | 16-bit, 70 MIPS |
| SMPS Peripheral Interconnect | Yes (GS family) | Yes (GS family) | No (GP family) | No (GP family) | Yes (GS family) |
| Target Application | Digital power / SMPS | Digital power / SMPS | General purpose | General purpose | Digital power / SMPS |
Principais diferenciais
- Dedicated SMPS peripheral interconnect fabric (vs DSPIC33EP64GP504-E/MV)
- Extended temperature range in the same footprint (vs DSPIC33EP64GS504-I/ML)
- Double the code headroom of the smallest drop-in (vs DSPIC33EP32GS504)
Notas de projeto
The 44-QFN (8x8 mm) package uses a perimeter pad array plus exposed thermal pad. Connect the exposed pad to a solid ground plane with an array of thermal vias to minimize junction-to-ambient resistance - critical in sealed power supply enclosures where ambient can approach the +125C extended rating. Keep the high-speed ADC sense traces away from PWM switch nodes; route analog grounds as a star or dedicated analog island tied back at a single point. Estimated: at typical DSC operating currents (tens of mA at 3.3V), dissipation is well under 0.5W, so thermal design is usually dominated by nearby power components rather than the controller itself.
The GS family's peripheral interconnect exists specifically to shorten the ADC-sample-to-PWM-update path, but its benefit is lost if board-level noise corrupts ADC inputs. Place RC anti-alias filters at current-sense inputs ahead of the PGA, sized for the ADC sampling bandwidth rather than the switching frequency alone. Trigger ADC sampling at PWM off-time midpoints (center-aligned triggering) to dodge switching-edge transients. Keep the crystal/oscillator traces short and guarded, since the 70 MIPS pipeline tolerates no clock jitter in phase-shifted interleaved topologies.
Two frequent substitution mistakes: first, swapping in the DSPIC33EP64GP504 (same 44-QFN footprint) without realizing it lacks the GS SMPS peripheral interconnect - the PCB works but control-loop latency degrades and protection comparators may not map identically. Second, confusing -E/ML (extended, +125C) and -I/ML (industrial, +85C) grades in BOMs; the same die is offered in both, but a design validated at 105C ambient will fail with the I-grade. Always verify Flash density against compiled code size plus 30% reserve margin before stepping down to the DSPIC33EP32GS504.
Informações de conformidade
Compliance statuses were not stated in the provided Verified Web Data; consult the Microchip product page environmental datasheet for RoHS/REACH confirmation.
