DSPIC33EP64MC204T-I/ML - 70 MIPS 16-Bit DSC 64KB Flash | Microchip
N.º da peça: DSPIC33EP64MC204T-I/ML ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $3.86 | $3,86 |
| 10 | $3.48 | $34,80 |
| 100 | $3.11 | $311,00 |
| 500 | $2.84 | $1.420,00 |
| 1.000 | $2.61 | $2.610,00 |
DSPIC33EP64MC204T-I/ML Visão geral
A digital signal controller combines the computational throughput of a digital signal processor with the control peripherals and deterministic interrupt architecture of a microcontroller. In the system hierarchy, a DSC sits between a general-purpose MCU and a dedicated DSP, making the dsPIC33EP family a popular choice for embedded control loops that require math-intensive processing such as field-oriented motor control and digital power conversion.
Key features include the 70 MIPS dsPIC33E core, up to 27 general-purpose timers per the family datasheet (five hardware timers on this device), four DMA channels, and the high-speed PWM module that enables precise motor-control and power-supply waveforms without CPU-intensive bit banging. The 44-QFN (8x8) footprint conserves board area versus the 44-TQFP (10x10) alternative while keeping 0.65 mm lead pitch hand-solderable.
Architecturally, the dsPIC33E core uses a modified Harvard pipeline with DSP multiply-accumulate instructions, two 40-bit accumulators, and a dedicated address generation unit. Flash-based program memory supports in-circuit self-programming, and the peripherals attach to multiple internal bus architectures for parallel data movement through DMA.
Typical applications include brushless DC and PMSM motor control, digital power supplies and PFC stages, sensorless FOC drives, and industrial automation nodes where deterministic PWM timing is essential.
Design consideration: the 3.0-3.6 V supply rail means 5 V sensor signals require level shifting, and the QFN exposed pad must be soldered to a grounded copper pour for both thermal relief and signal integrity.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para DSPIC33EP64MC204T-I/ML — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com DSPIC33EP64MC204T-I/ML (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Core Architecture, Timers, Motor Control PWM.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
DSPIC33EP64MC204T-H/ML
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EP64MC204T-E/MLVAO
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
DSPIC33EP64MC204T-E/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.95 / unidade
Ver ficha técnica →DSPIC33EP64MC204-I/ML
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$3.6 / unidade
Ver ficha técnica →DSPIC33EP64MC204T-I/ML Classificações máximas e características elétricas
| Core Architecture | 16-bit dsPIC33E DSC core |
| Maximum Performance | 70 MIPS |
| Clock Speed | 60 MHz |
| Program Memory | 64 KB (22K x 24) Flash |
| SRAM | 8 KB |
| Supply Voltage Range | 3.0 V to 3.6 V |
| I/O Ports | 51 |
| Encapsulamento | 44-QFN (8x8 mm), 0.65 mm pitch |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (I grade) |
| DMA Channels | 4 |
| Timers | 5 |
| ROM Type | Flash |
| Technology | CMOS |
| Status do ciclo de vida | ACTIVE |
Guia de Configuração de Pinos do DSPIC33EP64MC204T-I/ML 44-qfn (8x8 mm), 0.65 mm pitch
Configuração de pinos para DSPIC33EP64MC204T-I/ML (pacote 44-qfn (8x8 mm), 0.65 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para DSPIC33EP64MC204T-I/ML.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
DSPIC33EP64MC204T-I/ML é adequado para 6 aplicaçãos: BLDC / PMSM Motor Control, Digital Power Supplies and PFC, Industrial Automation and Sensor Nodes, Battery Chargers and Power Management, Embedded Sensing and Signal Processing, Lighting and Electronic Ballasts.
BLDC / PMSM Motor Control
The DSPIC33EP64MC204T-I/ML is purpose-built for precision motor control: its 70 MIPS DSP core executes field-oriented control (FOC) current loops at switching frequencies of 20 kHz or higher, while the high-speed PWM module generates complementary outputs with hardware dead time. Four DMA channels offload ADC result transfers so the CPU spends cycles on Clarke/Park transforms and PI regulators rather than data movement. In a typical sensorless BLDC drive, the DSC reads phase currents through its on-chip ADC, runs FOC at the PWM rate, and drives a three-phase inverter; the 51 I/O pins leave room for gate-driver enables, fault inputs, and a UART or CAN link to a host controller.
Recomendado
Digital Power Supplies and PFC
In digitally controlled power supplies, boost PFC stages, and LLC converters, the DSPIC33EP64MC204T-I/ML replaces analog control loops with firmware compensation. The 60 MHz clock and DSP multiply-accumulate instructions compute PID compensators fast enough for 100-500 kHz switching converters, while the high-speed PWM module provides precise duty resolution and phase-shifted outputs. The 4-channel DMA streams ADC samples of input/output voltage and inductor current into RAM without CPU stalls. The 3.0-3.6 V supply simplifies interfacing with precision sense dividers through op-amp conditioning. Designers should budget the exposed-pad QFN layout carefully, as the controller sits near noisy gate-drive traces and benefits from a solid ground pour.
Recomendado
Industrial Automation and Sensor Nodes
For factory automation endpoints such as actuators, encoders, and condition-monitoring nodes, the DSPIC33EP64MC204T-I/ML provides DSP-grade signal processing alongside standard MCU peripherals. The 70 MIPS core can run FIR/IIR filters on vibration sensor data for predictive maintenance, while five timers and 51 I/O handle quadrature encoder decoding, limit-switch inputs, and relay outputs. The -40C to +85C industrial temperature grade covers unconditioned cabinets and machine-mounted electronics. Firmware connects upward through UART, SPI, or I2C to gateways. Because program memory is 64 KB Flash with self-programming capability, field firmware updates over a communication link are practical without external memory in many designs.
Recomendado
Battery Chargers and Power Management
Multi-chemistry battery chargers benefit from the DSPIC33EP64MC204T-I/ML's combination of high-speed PWM buck control and rich analog sensing. The DSC implements CC/CV charge profiles, coulomb-style state estimation, and safety cutoffs in firmware, with the PWM module driving the synchronous buck stage at hundreds of kHz and the ADC sampling battery voltage and current through DMA. The 3.0-3.6 V operating range pairs directly with common 3.3 V fuel-gauge and protection ICs on the I2C bus. The 64 KB Flash leaves room for charge-profile tables for Li-ion, LiFePO4, and lead-acid chemistries, and five timers support staged charge sequencing and watchdog protection in a single compact 8x8 mm QFN.
Recomendado
Embedded Sensing and Signal Processing
Applications such as ultrasonic distance measurement, load-cell digitization, and acoustic analysis exploit the DSP engine of the DSPIC33EP64MC204T-I/ML: 40-bit accumulators, single-cycle MAC, and hardware modulo addressing make FIR filtering and correlation efficient at 70 MIPS. The on-chip ADC with DMA supports periodic sample capture for FFT-style spectral monitoring, while 8 KB of SRAM buffers short data windows. The Peripheral Pin Select system lets designers route capture timers and serial ports to optimal physical pins, simplifying mixed-signal PCB layout around sensitive analog front ends. Where higher resolution is needed, external delta-sigma converters on the SPI/I2C bus complement the internal ADC.
Recomendado
Lighting and Electronic Ballasts
High-intensity and specialty lighting controllers use the DSPIC33EP64MC204T-I/ML to drive resonant half-bridge and phase-cut topologies with the high-speed PWM module, achieving stable lamp current with digital feedback. The 70 MIPS core runs averaging filters on current-sense signals for constant-power regulation and fault detection (open lamp, over-current), while the 44-QFN 8x8 mm footprint fits ballast housings with tight vertical clearance. The industrial temperature range covers enclosed luminaires. The 3.0-3.6 V supply and low peripheral count keep the bill of materials small; typically only an LDO, gate driver, and sense network surround the controller on the low-voltage side.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para DSPIC33EP64MC204T-I/ML — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | DSPIC33EP64MC204T-H/ML | DSPIC33EP64MC204T-E/MLVAO | DSPIC33EP64MC204T-E/ML | DSPIC33EP64MC204-I/ML |
|---|---|---|---|---|---|
| Package | 44-QFN (8x8 mm) | 44-QFN (8x8 mm) - same | 44-pin PQCC (QFN) - same | 44-QFN (8x8 mm) - same | 44-QFN (8x8 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Performance | 70 MIPS / 60 MHz | 70 MIPS / 60 MHz | 70 MIPS / 60 MHz | 70 MIPS / 60 MHz | 70 MIPS / 60 MHz |
| Flash Memory | 64 KB (22K x 24) | 64 KB | 64 KB | 64 KB | 64 KB |
| SRAM | 8 KB | 8 KB | 8192 words | 8 KB | 8 KB |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
| DMA Channels / Timers | 4 DMA / 5 timers | 4 DMA / 5 timers | 4 DMA / 5 timers | 4 DMA / 5 timers | 4 DMA / 5 timers |
Principais diferenciais
- Pin-to-pin industrial-grade default for the family footprint (vs DSPIC33EP64MC204T-E/MLVAO)
- 70 MIPS DSP core with hardware MAC (vs DSPIC33FJ64MC204T-I/ML)
- Compact 8x8 mm QFN versus 10x10 TQFP (vs DSPIC33EP64MC204T-I/PT)
Notas de projeto
The 44-QFN (8x8) package includes an exposed pad that must be soldered to a grounded copper pour with an array of thermal vias. This pad is a primary ground return for the DSC; leaving it unsoldered causes unreliable ground connectivity, erratic operation, and poor thermal performance. Follow Microchip's QFN layout guidelines: 0.65 mm pitch lands matched to the datasheet footprint, solder-mask-defined pads, and via stitching under the pad. Verify the stencil aperture design (typically 50-70% coverage) to avoid excessive solder squeeze-out onto adjacent lands.
The 3.0-3.6 V supply window is narrow; a 3.3 V LDO with adequate transient response is recommended, with 0.1 uF ceramic decoupling at each VDD pin plus a 10 uF bulk capacitor. All VDD/VSS pairs must be connected - unconnected power pins are a common cause of hard-to-diagnose failures on dsPIC33EP parts. In motor-drive environments, place a ferrite bead between the logic 3.3 V rail and the controller supply to attenuate gate-drive switching noise coupling into the ADC references.
The /ML QFN package and /PT TQFP package are electrically identical but have different footprints - do not assume board interchangeability. Second, the 'T' suffix means tape-and-reel: order cut-tape or the non-T MPN (DSPIC33EP64MC204-I/ML) for prototypes to avoid minimum reel quantities. Third, configure the Peripheral Pin Select (PPS) registers early in firmware; unmapped peripherals silently produce no output, and PPS misconfiguration is the most frequent dsPIC33EP bring-up issue reported on developer forums.
Keep the PWM outputs to gate drivers as short as practical and route them away from the ADC input traces and the oscillator circuit. The on-chip ADC reference should share a quiet ground; in digital power designs, a Kelvin connection to the current-sense resistor improves measurement accuracy. Estimated: at 60 MHz internal operation with typical I/O loading, ground bounce on poorly returned QFN lands can reach hundreds of millivolts, so a minimum of eight ground vias under the exposed pad is a sound practice.
Informações de conformidade
Lifecycle status confirmed ACTIVE via distributor lifecycle data. Formal RoHS/REACH/lead-free certificates should be obtained from Microchip's product page or distributor compliance documents; not independently verified in the provided data.
