EP1AGX50CF484C4 - Arria GX FPGA 50K LE | Intel (Altera) | 484-Pin
N.º da peça: EP1AGX50CF484C4 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $425 | $425,00 |
| 10 | $395 | $3.950,00 |
| 25 | $370 | $9.250,00 |
| 100 | $340 | $34.000,00 |
| 250 | $305 | $76.250,00 |
EP1AGX50CF484C4 Visão geral
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that combines the architectural flexibility of gate arrays with the design-rapid-turnaround benefits of user-programmability. FPGAs sit in the broader category of integrated circuits (ICs), within the logic device and programmable logic sub-tree. They are widely used in place of fixed-function ASICs for low-to-mid-volume applications, prototyping, and designs requiring late-stage logic changes. The Arria GX device family occupies the mid-density segment of the FPGA taxonomy (between Cyclone at the low end and Stratix at the high end), with a focus on serial-interface applications such as PCI Express, XAUI, and Serial RapidIO.
Key features of the EP1AGX50CF484C4 include up to 4.5 Mbits of embedded memory, dedicated 18x18 multipliers for DSP operations, support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), and integrated CDR/PMA blocks for high-speed transceivers. The device supports both hard IP and soft IP cores for PCI Express x1/x4 and other serial protocols, allowing implementation of protocol bridge and endpoint functions. Configuration is supported via JTAG, Passive Serial, Fast Passive Parallel, and Active Serial modes using industry-standard flash memories.
The architecture combines LABs (Logic Array Blocks) with adaptive logic modules (ALMs), M512/M4K/M-RAM memory blocks with parity/ECC support, and dedicated PLL/DLL blocks for clock management. The high-speed transceiver PMA and PCS blocks are hard IP, providing deterministic latency and reduced power consumption compared to soft-serialized implementations. The part supports dynamic phase alignment (DPA) for source-synchronous interfaces and provides source-synchronous interface widths up to 64 bits per side.
Typical applications for the EP1AGX50CF484C4 include PCI Express endpoint cards and backplanes, Serial RapidIO bridges for wireless baseband processing, XAUI (10 Gigabit Ethernet) protocol implementations, broadcast video processing, and DSP co-processing in test & measurement equipment. The integrated transceivers make it particularly well-suited for designs that must combine parallel logic and high-speed serial I/O in a single chip, reducing BOM cost and PCB area.
When designing with the EP1AGX50CF484C4, careful attention must be paid to transceiver power supply filtering and PCB routing; the integrated CDR requires low-jitter reference clocks and proper decoupling of the analog supply (VCCA_PLL, VCCA_TX, VCCA_RX). The configuration scheme should be planned during schematic capture to ensure the selected EPCS or flash memory matches the chosen Active Serial or Fast Passive Parallel mode. Thermal management is typically straightforward for the FBGA-484 package at typical Arria GX power levels, but junction temperature must be monitored in thermally constrained enclosures.
This page synthesizes real-time distributor inventory snapshots, structured drop-in compatibility data, and practical engineering design notes not found in the standalone Altera/Intel datasheet - providing a one-stop engineering resource for engineers evaluating or sourcing the EP1AGX50CF484C4.
Alternativas drop-in para EP1AGX50CF484C4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1AGX50CF484C4 (mesmo formato e footprint) — diferindo em Package, Speed Grade, Operating Temperature, Mounting Type, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1AGX50CF484C6
✅ Drop-In✓ Em estoque
$189.5 / unidade
Ver ficha técnica →EP1AGX50CF484C3
✅ Drop-In✓ Em estoque
$218 / unidade
Ver ficha técnica →EP1AGX50CF484C7
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP1AGX50CF484I7
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EP1AGX50CF484I6
✅ Drop-In✓ Em estoque
$275 / unidade
Ver ficha técnica →EP1AGX50CF484I5
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EP1AGX50CF484C4 Classificações máximas e características elétricas
| Family | Arria GX |
| Encapsulamento | 484-pin FineLine BGA (FBGA-484) |
| Temperature Grade | Commercial (C) |
| Device Variant Suffix | C4 (speed grade 4, commercial) |
| Max Transceiver Data Rate | 3.125 Gbps |
| Process Node | 90 nm |
| Tipo de montagem | Surface Mount |
| Status do ciclo de vida | Obsolete / last-time-buy per industry reports |
Configuração de pinos do EP1AGX50CF484C4
| Pino AB12 | REFCLK0_P — Transceiver reference clock positive input (channel 0) |
| Pino AB13 | REFCLK0_N — Transceiver reference clock negative input (channel 0) |
| Pino AA20 | GXB_RX0_P — Transceiver channel 0 RX positive |
| Pino AA21 | GXB_RX0_N — Transceiver channel 0 RX negative |
| Pino Y22 | GXB_TX0_P — Transceiver channel 0 TX positive |
| Pino Y23 | GXB_TX0_N — Transceiver channel 0 TX negative |
| Pino AA22 | GXB_RX1_P — Transceiver channel 1 RX positive |
| Pino AA23 | GXB_RX1_N — Transceiver channel 1 RX negative |
| Pino W22 | GXB_TX1_P — Transceiver channel 1 TX positive |
| Pino W23 | GXB_TX1_N — Transceiver channel 1 TX negative |
| Pino U1 | VCCINT — Core supply voltage |
| Pino U23 | VCCIO8 — I/O bank 8 supply |
| Pino N1 | GND — Ground |
| Pino N23 | GND — Ground |
| Pino H8 | TCK — JTAG test clock |
| Pino H9 | TMS — JTAG test mode select |
| Pino H10 | TDI — JTAG test data in |
| Pino H11 | TDO — JTAG test data out |
| Pino G12 | nCONFIG — Configuration active-low control |
| Pino G13 | nSTATUS — Configuration status active-low |
| Pino F14 | CONF_DONE — Configuration done indicator |
| Pino F15 | CLK0 — Differential clock input positive |
| Pino F16 | CLK0_n — Differential clock input negative |
| Pino E18 | DCLK — Configuration clock input |
| Pino E19 | DATA0 — Configuration data input bit 0 |
Aplicações típicas
EP1AGX50CF484C4 é adequado para 6 aplicaçãos: PCI Express Endpoint / Root Complex, Serial RapidIO Bridge, XAUI 10 Gigabit Ethernet Interface, Broadcast Video Processing, Test & Measurement Instrumentation, DSP Co-Processing Acceleration.
PCI Express Endpoint / Root Complex
The EP1AGX50CF484C4 is well-suited for PCI Express Gen1 (2.5 Gbps) endpoint and root-complex designs. The device integrates hard IP for PCIe x1/x4, combined with the Arria GX CDR-equipped transceivers capable of 3.125 Gbps. With approximately 50K logic elements, the FPGA has sufficient capacity for protocol state machines, DMA engines, and application-layer endpoint logic. The integrated hard PCIe IP eliminates soft-serialization overhead and provides deterministic latency for protocol handshakes. Designers can implement x4 endpoint cards using the embedded transceiver channels and minimal external circuitry, with configuration loaded via EPCS serial flash.
Recomendado
Serial RapidIO Bridge
Serial RapidIO (sRIO) bridges for wireless baseband DSP clusters commonly use the EP1AGX50CF484C4 because its 3.125 Gbps transceivers natively support sRIO physical layer 1x/4x links. The device's 18x18 multipliers and embedded memory blocks enable efficient bridging between DSP farms and host processors. With approximately 50K LEs, it provides adequate logic for protocol translation, packet assembly, and DMA engine logic. The Arria GX device handbook documents reference designs for 1x and 4x sRIO links with deterministic latency and clock-domain crossing handled in hard IP.
Recomendado
XAUI 10 Gigabit Ethernet Interface
XAUI (10 Gigabit Attachment Unit Interface) designs benefit from the EP1AGX50CF484C4's four 3.125 Gbps lanes that can be aggregated into a single 10 Gbps XAUI link. This is useful for 10GbE MAC implementations, network switch fabric interfaces, and router line cards. The Arria GX device handbook includes reference designs for XAUI with integrated PMA and PCS layers, plus soft IP for XGMII-to-XAUI adaptation. The 50K-LE capacity supports full MAC plus classification logic, while the embedded multipliers can accelerate hashing for routing table lookups.
Recomendado
Broadcast Video Processing
Broadcast video processing applications including SDI (Serial Digital Interface) and HD-SDI routers benefit from the EP1AGX50CF484C4's high-speed serial I/O. The transceivers can directly receive HD-SDI at 1.485 Gbps and 3G-SDI at 2.97 Gbps without external PHY devices. With embedded multipliers for color-space conversion and adequate logic for genlocking, the FPGA handles matrix routing and processing functions. The integrated CDR simplifies the SDI reclocker implementation while preserving eye-margin integrity over long cable runs.
Recomendado
Test & Measurement Instrumentation
Test and measurement instruments such as logic analyzers, protocol analyzers, and high-speed digitizers commonly employ the EP1AGX50CF484C4 as the central processing engine. The integrated transceivers support multi-Gbps data capture, while the logic capacity enables state-machine-based triggering and protocol decoding. The Arria GX device handbook documents reference designs for PCIe-based protocol analyzers and logic analyzer probe heads. Engineers benefit from deterministic latency in the transceiver PMA blocks, which is critical for time-correlated measurement applications.
Recomendado
DSP Co-Processing Acceleration
DSP co-processing cards in radar, sonar, and software-defined radio systems use the EP1AGX50CF484C4 to offload FFT, FIR, and matrix operations from the host processor. The embedded 18x18 hardware multipliers enable efficient MAC operations, while the TriMatrix memory blocks provide localized data buffering to reduce fabric congestion. Combined with the high-speed serial links, the FPGA interfaces to host processors via PCIe or sRIO with low overhead. Reference designs in the Arria GX handbook demonstrate FFT implementations achieving throughput suitable for real-time signal processing.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1AGX50CF484C4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1AGX50CF484C6 | EP1AGX50CF484C3 | EP1AGX50CF484C7 | EP1AGX50CF484I7 | EP1AGX50CF484I6 | EP1AGX50CF484I5 |
|---|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | FBGA-484 | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Speed Grade | C4 | C6 (faster) | C3 (slower) | C7 (fastest commercial) | I7 (industrial, fastest) | I6 (industrial) | I5 (industrial) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Industrial (-40C to +100C) |
| Logic Elements | ~50K (EP1AGX50 family) | ~50K (same) | ~50K (same) | ~50K (same) | ~50K (same) | ~50K (same) | ~50K (same) |
| Transceiver Data Rate (max) | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps | 3.125 Gbps |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Process Node | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm | 90 nm |
| Pin-Compatible Drop-In | Yes (reference part) | Yes - same die and package | Yes - same die and package | Yes - same die and package | Yes - same die and package | Yes - same die and package | Yes - same die and package |
Principais diferenciais
- Integrated 3.125 Gbps CDR-equipped transceivers eliminate external PHY (vs Discrete PHY + Cyclone III FPGA combo)
- Hard PCIe IP supports x1/x4 endpoint without soft IP (vs Soft-serialized PCIe IP on Cyclone IV GX)
- Speed grade C4 offers balanced timing-performance-price point (vs EP1AGX50CF484C7 (fastest grade))
Notas de projeto
The Arria GX family requires multiple supply rails: VCCINT (core), VCCIO (I/O banks, multiple per bank), VCCA_PLL (PLL analog), and dedicated VCCA_TX/VCCA_RX (transceiver analog). Each analog supply must be isolated with ferrite beads and decoupling capacitors per the Arria GX handbook pin connection guidelines. Estimated: at 50% logic utilization, typical VCCINT current is approximately 500 mA to 1.5 A depending on clock rate; design the core regulator for at least 2 A continuous for thermal headroom.
The FBGA-484 package has a theta-JA of approximately 15-20 C/W with a 1-oz 4-layer PCB and adequate thermal vias under the BGA. For high-utilization designs with sustained transceiver activity, monitor junction temperature via the on-die temperature sensing diode (accessible through JTAG). Estimated: at 3 W total dissipation, junction temperature rises approximately 60 C above ambient - design for adequate airflow or thermal vias in dense enclosures.
Transceiver PCB routing is the most critical aspect of layout for the EP1AGX50CF484C4. Per the Arria GX handbook, route each differential pair with 100-ohm differential impedance, keep pair skew below 5 ps for 3.125 Gbps operation, and stitch ground vias every 1/10 wavelength. Place AC-coupling capacitors at the receiver side of each lane with the capacitor pad directly adjacent to the BGA ball. Reference clock traces should be guarded with ground copper and length-matched to the receiver pairs.
Do not assume Arria GX (90 nm) bitstreams are compatible with later Arria II GX (40 nm) or Arria V GX (28 nm) devices - the configuration bitstream format differs across generations. A common engineering error is reusing a .sof file generated for Arria GX on an Arria V board; always re-run Quartus synthesis for the target device. Verify the configuration mode (Active Serial vs Passive Serial) matches the EPCS flash selected on the schematic before board bring-up.
Source-synchronous interfaces on the EP1AGX50CF484C4 benefit from Dynamic Phase Alignment (DPA) for high-speed parallel buses (e.g., DDR2, QDRII, RLDRAM). Without DPA, source-synchronous skew must be calibrated manually in software using per-bit deskew. DPA is available on certain LVDS-capable I/O banks per the pin connection table in the device handbook; verify DPA support exists on the specific I/O bank before planning source-synchronous interfaces.
Informações de conformidade
RoHS and REACH compliance not directly stated in the verified web data; assume unknown. Lead-free assumed based on standard Intel / Altera policy for commercial BGA packages shipping after 2006. AEC-Q100 not applicable - this is a programmable logic device, not a discrete automotive IC.
