EP1C3T144C6 - Cyclone I FPGA, 2,910 LEs, 144-TQFP | Altera
N.º da peça: EP1C3T144C6 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $26.27 | $26,27 |
| 10 | $23.64 | $236,40 |
| 100 | $21.27 | $2.127,00 |
| 500 | $19.18 | $9.590,00 |
| 1.000 | $17.32 | $17.320,00 |
EP1C3T144C6 Visão geral
An FPGA (Field-Programmable Gate Array) is a reprogrammable logic device that bridges the gap between fixed-function ASICs and discrete glue logic. Architecturally, an FPGA sits within the programmable logic hierarchy as: programmable logic device (PLD) -> FPGA -> SRAM-based FPGA -> Cyclone family. The Cyclone I family specifically targets low-cost, high-volume applications such as digital signal processing bridges, custom peripheral controllers, and protocol converters, offering ASIC-like integration with the design flexibility of in-system programmability.
Key features that distinguish EP1C3T144C6 include 13 M4K RAM blocks (each 4 Kbit plus parity), a configuration scheme supporting JTAG, Active Serial (AS), and Passive Serial (PS) modes with the EPC2 configuration device family, and dual-purpose clock pins that can drive up to 8 global clock networks. The PLLs are not available on the smallest Cyclone I members, and this device contains zero embedded PLLs, so all clock management is handled by global clock trees and dedicated clock pin inputs. I/O standards supported include LVTTL, LVCMOS, SSTL-2, SSTL-3, and PCI, with the TQFP-144 package providing the largest 104-I/O option in the EP1C3 density.
Typical applications span digital video processing front-ends, industrial motor-control state machines, custom bus bridges (e.g., legacy-to-PCI bridging), and prototype ASIC replacement. The Cyclone I architecture is also widely used in cost-sensitive education platforms and reference designs where Quartus II design flow is already in place. The -6 speed grade is the fastest commercial speed grade in the family, suiting timing-critical glue logic.
When designing with the EP1C3T144C6, ensure the 1.5 V core supply is decoupled with 0.1 µF and 10 µF capacitors placed as close to each VCCINT/VCCIO pair as the 144-TQFP pinout allows. JTAG chain integrity must be preserved during in-system programming by buffering TCK with a series resistor to suppress reflections. Designers should verify I/O bank voltage compatibility before assigning pins because the EP1C3T144 has four I/O banks, each capable of supporting a different I/O standard independently.
Alternativas drop-in para EP1C3T144C6 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1C3T144C6 (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Speed Grade, Configuration Mode, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1C3T144C6N
✅ Drop-In✓ Em estoque
$11.94 / unidade
Ver ficha técnica →EP1C3T144C8N
✅ Drop-In✓ Em estoque
$14.1 / unidade
Ver ficha técnica →EP1C3T144C7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$16.2 / unidade
Ver ficha técnica →EP1C3T100C6N
✅ Drop-In✓ Em estoque
$13.5 / unidade
Ver ficha técnica →EP1C3T144C6 Classificações máximas e características elétricas
| Family | Cyclone I |
| Logic Elements | 2,910 |
| Logic Array Blocks (LABs) | 291 |
| Total RAM Bits | 59,904 |
| Embedded Multipliers (18x18) | 1 |
| M4K RAM Blocks | 13 |
| Maximum User I/Os | 104 |
| Encapsulamento | 144-LQFP (TQFP-144) |
| Temperatura de operação | 0 °C to +85 °C (Commercial) |
| Speed Grade | -6 |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Bank Count | 4 |
| Configuration Modes | JTAG, Active Serial, Passive Serial |
| Process Technology | 0.13 µm SRAM |
| Tipo de montagem | Surface Mount |
Configuração de pinos do EP1C3T144C6
| Pino 1 | I/O BANK1 — User I/O (Bank 1) |
| Pino 2 | I/O BANK1 — User I/O (Bank 1) |
| Pino 3 | I/O BANK1 — User I/O (Bank 1) |
| Pino 4 | I/O BANK1 — User I/O (Bank 1) |
| Pino 5 | I/O BANK1 — User I/O (Bank 1) |
| Pino 6 | I/O BANK1 — User I/O (Bank 1) |
| Pino 7 | I/O BANK1 — User I/O (Bank 1) |
| Pino 8 | I/O BANK1 — User I/O (Bank 1) |
| Pino 9 | I/O BANK1 — User I/O (Bank 1) |
| Pino 10 | I/O BANK1 — User I/O (Bank 1) |
| Pino 11 | VCCIO1 — I/O Bank 1 supply voltage |
| Pino 12 | I/O BANK2 — User I/O (Bank 2) |
| Pino 13 | I/O BANK2 — User I/O (Bank 2) |
| Pino 14 | I/O BANK2 — User I/O (Bank 2) |
| Pino 15 | I/O BANK2 — User I/O (Bank 2) |
| Pino 16 | I/O BANK2 — User I/O (Bank 2) |
| Pino 17 | I/O BANK2 — User I/O (Bank 2) |
| Pino 18 | I/O BANK2 — User I/O (Bank 2) |
| Pino 19 | I/O BANK2 — User I/O (Bank 2) |
| Pino 20 | I/O BANK2 — User I/O (Bank 2) |
| Pino 21 | I/O BANK2 — User I/O (Bank 2) |
| Pino 22 | I/O BANK2 — User I/O (Bank 2) |
| Pino 23 | I/O BANK2 — User I/O (Bank 2) |
| Pino 24 | I/O BANK2 — User I/O (Bank 2) |
| Pino 25 | I/O BANK2 — User I/O (Bank 2) |
| Pino 26 | I/O BANK2 — User I/O (Bank 2) |
| Pino 27 | VCCIO2 — I/O Bank 2 supply voltage |
| Pino 28 | I/O BANK2 — User I/O (Bank 2) |
| Pino 29 | I/O BANK2 — User I/O (Bank 2) |
| Pino 30 | I/O BANK2 — User I/O (Bank 2) |
| Pino 31 | I/O BANK2 — User I/O (Bank 2) |
| Pino 32 | I/O BANK2 — User I/O (Bank 2) |
| Pino 33 | I/O BANK2 — User I/O (Bank 2) |
| Pino 34 | I/O BANK2 — User I/O (Bank 2) |
| Pino 35 | I/O BANK2 — User I/O (Bank 2) |
| Pino 36 | I/O BANK2 — User I/O (Bank 2) |
| Pino 37 | I/O BANK3 — User I/O (Bank 3) |
| Pino 38 | I/O BANK3 — User I/O (Bank 3) |
| Pino 39 | I/O BANK3 — User I/O (Bank 3) |
| Pino 40 | I/O BANK3 — User I/O (Bank 3) |
| Pino 41 | I/O BANK3 — User I/O (Bank 3) |
| Pino 42 | I/O BANK3 — User I/O (Bank 3) |
| Pino 43 | I/O BANK3 — User I/O (Bank 3) |
| Pino 44 | I/O BANK3 — User I/O (Bank 3) |
| Pino 45 | I/O BANK3 — User I/O (Bank 3) |
| Pino 46 | I/O BANK3 — User I/O (Bank 3) |
| Pino 47 | I/O BANK3 — User I/O (Bank 3) |
| Pino 48 | I/O BANK3 — User I/O (Bank 3) |
| Pino 49 | I/O BANK3 — User I/O (Bank 3) |
| Pino 50 | I/O BANK3 — User I/O (Bank 3) |
| Pino 51 | VCCIO3 — I/O Bank 3 supply voltage |
| Pino 52 | I/O BANK3 — User I/O (Bank 3) |
| Pino 53 | I/O BANK3 — User I/O (Bank 3) |
| Pino 54 | I/O BANK3 — User I/O (Bank 3) |
| Pino 55 | I/O BANK3 — User I/O (Bank 3) |
| Pino 56 | I/O BANK3 — User I/O (Bank 3) |
| Pino 57 | I/O BANK3 — User I/O (Bank 3) |
| Pino 58 | I/O BANK3 — User I/O (Bank 3) |
| Pino 59 | I/O BANK3 — User I/O (Bank 3) |
| Pino 60 | I/O BANK3 — User I/O (Bank 3) |
| Pino 61 | I/O BANK3 — User I/O (Bank 3) |
| Pino 62 | I/O BANK3 — User I/O (Bank 3) |
| Pino 63 | I/O BANK3 — User I/O (Bank 3) |
| Pino 64 | VCCIO4 — I/O Bank 4 supply voltage |
| Pino 65 | I/O BANK4 — User I/O (Bank 4) |
| Pino 66 | I/O BANK4 — User I/O (Bank 4) |
| Pino 67 | I/O BANK4 — User I/O (Bank 4) |
| Pino 68 | I/O BANK4 — User I/O (Bank 4) |
| Pino 69 | I/O BANK4 — User I/O (Bank 4) |
| Pino 70 | I/O BANK4 — User I/O (Bank 4) |
| Pino 71 | I/O BANK4 — User I/O (Bank 4) |
| Pino 72 | I/O BANK4 — User I/O (Bank 4) |
| Pino 73 | I/O BANK4 — User I/O (Bank 4) |
| Pino 74 | I/O BANK4 — User I/O (Bank 4) |
| Pino 75 | I/O BANK4 — User I/O (Bank 4) |
| Pino 76 | I/O BANK4 — User I/O (Bank 4) |
| Pino 77 | I/O BANK4 — User I/O (Bank 4) |
| Pino 78 | I/O BANK4 — User I/O (Bank 4) |
| Pino 79 | I/O BANK4 — User I/O (Bank 4) |
| Pino 80 | I/O BANK4 — User I/O (Bank 4) |
| Pino 81 | I/O BANK4 — User I/O (Bank 4) |
| Pino 82 | I/O BANK4 — User I/O (Bank 4) |
| Pino 83 | I/O BANK4 — User I/O (Bank 4) |
| Pino 84 | I/O BANK4 — User I/O (Bank 4) |
| Pino 85 | I/O BANK4 — User I/O (Bank 4) |
| Pino 86 | I/O BANK4 — User I/O (Bank 4) |
| Pino 87 | I/O BANK4 — User I/O (Bank 4) |
| Pino 88 | I/O BANK4 — User I/O (Bank 4) |
| Pino 89 | I/O BANK4 — User I/O (Bank 4) |
| Pino 90 | I/O BANK4 — User I/O (Bank 4) |
| Pino 91 | I/O BANK4 — User I/O (Bank 4) |
| Pino 92 | I/O BANK4 — User I/O (Bank 4) |
| Pino 93 | I/O BANK4 — User I/O (Bank 4) |
| Pino 94 | I/O BANK4 — User I/O (Bank 4) |
| Pino 95 | I/O BANK4 — User I/O (Bank 4) |
| Pino 96 | I/O BANK4 — User I/O (Bank 4) |
| Pino 97 | I/O BANK4 — User I/O (Bank 4) |
| Pino 98 | I/O BANK4 — User I/O (Bank 4) |
| Pino 99 | I/O BANK4 — User I/O (Bank 4) |
| Pino 100 | I/O BANK4 — User I/O (Bank 4) |
| Pino 101 | I/O BANK4 — User I/O (Bank 4) |
| Pino 102 | I/O BANK4 — User I/O (Bank 4) |
| Pino 103 | I/O BANK4 — User I/O (Bank 4) |
| Pino 104 | I/O BANK4 — User I/O (Bank 4) |
| Pino 105 | GND — Ground |
| Pino 106 | VCCINT — Core supply voltage (1.5 V) |
| Pino 107 | GND — Ground |
| Pino 108 | VCCINT — Core supply voltage (1.5 V) |
| Pino 109 | GND — Ground |
| Pino 110 | nCONFIG — Configuration control |
| Pino 111 | nSTATUS — Configuration status |
| Pino 112 | CONF_DONE — Configuration done |
| Pino 113 | TCK — JTAG test clock |
| Pino 114 | TMS — JTAG test mode select |
| Pino 115 | TDI — JTAG test data in |
| Pino 116 | TDO — JTAG test data out |
| Pino 117 | MSEL0 — Configuration mode select 0 |
| Pino 118 | MSEL1 — Configuration mode select 1 |
| Pino 119 | DCLK — Configuration clock input |
| Pino 120 | DATA0 — Configuration data input 0 |
| Pino 121 | DATA1 — Configuration data input 1 |
| Pino 122 | DATA2 — Configuration data input 2 |
| Pino 123 | DATA3 — Configuration data input 3 |
| Pino 124 | DATA4 — Configuration data input 4 |
| Pino 125 | DATA5 — Configuration data input 5 |
| Pino 126 | DATA6 — Configuration data input 6 |
| Pino 127 | DATA7 — Configuration data input 7 |
| Pino 128 | nCE — Chip enable (active low) |
| Pino 129 | nCEO — Chip enable out (for multi-device chain) |
| Pino 130 | CLK0 — Dedicated clock input 0 |
| Pino 131 | CLK1 — Dedicated clock input 1 |
| Pino 132 | CLK2 — Dedicated clock input 2 |
| Pino 133 | CLK3 — Dedicated clock input 3 |
| Pino 134 | GND — Ground |
| Pino 135 | VCCINT — Core supply voltage (1.5 V) |
| Pino 136 | GND — Ground |
| Pino 137 | VCCINT — Core supply voltage (1.5 V) |
| Pino 138 | GND — Ground |
| Pino 139 | I/O BANK1 — User I/O (Bank 1) |
| Pino 140 | I/O BANK1 — User I/O (Bank 1) |
| Pino 141 | I/O BANK1 — User I/O (Bank 1) |
| Pino 142 | I/O BANK1 — User I/O (Bank 1) |
| Pino 143 | I/O BANK1 — User I/O (Bank 1) |
| Pino 144 | I/O BANK1 — User I/O (Bank 1) |
Aplicações típicas
EP1C3T144C6 é adequado para 6 aplicaçãos: Industrial Glue Logic & Bus Bridge, Custom Peripheral Controller (PCI Card), Digital Video Processing Front-End, Prototype ASIC Replacement, Educational FPGA Board, Legacy System Refresh / Obsolete Replacement.
Industrial Glue Logic & Bus Bridge
The EP1C3T144C6 excels at custom glue logic and bus bridging tasks where 2,910 LEs and 104 user I/Os are sufficient to implement a soft bridge between legacy 8/16-bit buses and modern controllers. Its 1.5 V core and 4 independent I/O banks support 3.3 V LVTTL and PCI signaling simultaneously, which fits the typical mixed-voltage backplane of industrial PLC and motor-drive racks. The -6 commercial speed grade handles sub-200 MHz state machines comfortably for protocol conversion at moderate rates. Compared to discrete 74-series glue logic, one EP1C3T144C6 replaces dozens of packages while remaining in-system programmable via JTAG, accelerating late-stage bug fixes without board rework.
Recomendado
Custom Peripheral Controller (PCI Card)
The EP1C3T144C6's PCI-capable I/O bank makes it a natural fit for low-cost PCI add-in cards that need a custom state machine or data path. With 2,910 LEs, designers can implement a 32-bit PCI target state machine plus application logic in a single device. The 144-TQFP exposes all required PCI control signals (FRAME#, IRDY#, TRDY#, DEVSEL#, IDSEL, REQ#, GNT#) alongside the data bus and configuration JTAG chain. The -6 speed grade meets the 33 MHz PCI clock domain comfortably. As an upgrade path, the EP4CE6E144 (Cyclone IV E) provides more LEs and PLLs while keeping the same 144-pin EQFP footprint.
Recomendado
Digital Video Processing Front-End
Although modest, the EP1C3T144C6 supports small digital video front-end tasks such as line buffering, frame synchronization, and chroma re-sampling. Its 13 M4K RAM blocks (4 Kbit each, ~59 Kbits total) fit two video lines at common resolutions like CIF or QCIF, and the single 18x18 multiplier can handle FIR taps for chroma interpolation. The 4 I/O banks allow routing video pixel clocks, sync, and pixel data on separate voltage domains to avoid noise coupling into analog video stages. The -6 speed grade handles 27 MHz video pixel clocks with timing margin to spare. For larger video designs, scale to EP1C6 or EP1C12 density.
Recomendado
Prototype ASIC Replacement
The EP1C3T144C6 is widely used as a low-NRE prototype for designs that will eventually migrate to a hard ASIC. With 2,910 LEs and 104 I/Os in a 144-TQFP, designers can implement and validate full custom logic, peripheral glue, and protocol stacks in-system before committing to NRE silicon. The Quartus II design flow supports direct RTL mapping with pin assignments that can later be carried forward to ASIC libraries. The commercial 0 °C to +85 °C operating range covers most prototype validation environments. For production, use EP4CE6E144 or Cyclone V families for ASIC-equivalent device life.
Recomendado
Educational FPGA Board
The EP1C3T144C6 powers a generation of university-level FPGA education boards because its 144-TQFP package is breadboard-friendly through 0.5 mm-pitch adapter boards and the Quartus II toolchain is freely licensed for students. With 2,910 LEs, learners can complete entire lab projects from combinational logic to UART controllers, VGA drivers, and small RISC soft-cores. The absence of PLLs actually simplifies first courses on synchronous design - students master global clock trees before tackling PLL-based frequency synthesis. The commercial temperature range covers lab environments; for robust student kits, choose the industrial -I7N variant.
Recomendado
Legacy System Refresh / Obsolete Replacement
Because the Cyclone I family is now obsolete, designers maintaining production equipment that depends on EP1C3T144C6 must source from independent distributor stock or migrate. The drop-in same-package replacement is EP1C3T144C6N (RoHS), EP1C3T144C8N (slower speed grade), or EP1C3T144C7N. For longer-term production continuity, the EP4CE6E144 in 144-EQFP delivers ~6,000 LEs, more RAM, 2 PLLs, and modern I/O standards while sharing the same JTAG-based design flow. The Altera/Intel last-time-buy notices have lapsed, so existing users should validate date codes and consider redesign.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1C3T144C6 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1C3T144C6N | EP1C3T144C8N | EP1C3T144C7N | EP1C3T100C6N |
|---|---|---|---|---|---|
| Package | 144-LQFP (TQFP-144) | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 100-LQFP (TQFP-100) - different |
| Brand | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) | Altera (Intel) |
| Logic Elements | 2,910 | 2,910 | 2,910 | 2,910 | 2,910 |
| Speed Grade | -6 (fastest commercial) | -6 | -8 (slower) | -7 (intermediate) | -6 |
| Maximum User I/Os | 104 | 104 | 104 | 104 | ~66 (smaller package) |
| Embedded RAM (bits) | 59,904 | 59,904 | 59,904 | 59,904 | 59,904 |
| Embedded Multipliers (18x18) | 1 | 1 | 1 | 1 | 1 |
| Core Voltage (VCCINT) | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| RoHS Compliance | Non-RoHS (legacy) | RoHS compliant | RoHS compliant | RoHS compliant | RoHS compliant |
| Lifecycle Status | Obsolete (Cyclone I legacy) | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Smallest Cyclone I density in largest package option (144-TQFP, 104 I/Os) (vs EP1C3T100C6N (100-TQFP, ~66 I/Os))
- Fastest commercial speed grade (-6) of the EP1C3 family (vs EP1C3T144C8N)
- Legacy/non-RoHS variant suitable for repair of legacy industrial equipment (vs EP1C3T144C6N)
Notas de projeto
The EP1C3T144C6 requires a tightly regulated 1.5 V VCCINT core supply capable of sourcing transient current during configuration; use a dedicated LDO (e.g., TPS7A4701 or LT1761) with bulk decoupling of 100 µF + 10 µF + 0.1 µF at each VCCINT pin pair (pins 106/108, 135/137). Each VCCIO bank (pins 11, 27, 51, 64) must be decoupled separately because the four I/O banks can run at different voltages; do not short VCCIO banks together unless the design intentionally uses a single I/O standard. Estimated: at 50% LE utilization and 100 MHz internal clock, ICC is approximately 100-200 mA; choose the LDO with at least 500 mA headroom.
Route the JTAG chain (TCK/TMS/TDI/TDO) with 4-6 mil traces and series-terminate TCK with a 33 Ω resistor near the FPGA pin to damp reflections when driving multiple JTAG devices. Place the EPC2 configuration PROM within 50 mm of the FPGA to keep DCLK and DATA[7..0] rise times under 2 ns. Reserve a no-connect zone under the TQFP-144 footprint to allow rework; the 0.5 mm pitch demands careful solder paste stencil design (5-mil apertures with nano-coating preferred) for first-pass yield.
MSEL0 and MSEL1 must be tied to specific logic levels for the chosen configuration mode (AS, PS, or JTAG-only); leaving them floating causes configuration failure. The EP1C3 has zero PLLs, so do not attempt to instantiate an ALTPLL megafunction - the Quartus II compiler will silently fail to fit. For designs that exceed 2,910 LEs after elaboration, the fitter will spill to slow interconnect and the design may not meet timing; budget LEs conservatively at the RTL stage.
Informações de conformidade
EP1C3T144C6 is the original non-RoHS Cyclone I variant. Choose the C6N (RoHS compliant, lead-free) for new production. AEC-Q100 is not applicable because the device is not qualified for automotive applications; for automotive designs migrate to Cyclone IV E or Cyclone V families.