EP1K50TI144-2 - 50K-Gate ACEX-1K FPGA, 102 I/O, 144-LQFP | Intel
N.º da peça: EP1K50TI144-2 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $48.5 | $48,50 |
| 10 | $42.3 | $423,00 |
| 100 | $36.75 | $3.675,00 |
| 500 | $31.2 | $15.600,00 |
| 1.000 | $27.85 | $27.850,00 |
EP1K50TI144-2 Visão geral
An FPGA (Field Programmable Gate Array) is a semiconductor integrated circuit composed of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be re-programmed to implement arbitrary digital logic. ACEX-1K sits within the broader taxonomy of programmable logic devices (PLDs) -> complex programmable logic devices (CPLDs) / FPGAs -> SRAM-based LUT FPGAs -> low-cost FPGAs -> embedded array FPGAs. The EP1K50TI144-2 specifically uses a Look-Up Table (LUT)-based architecture with embedded array blocks (EABs) that support dual-port RAM, ROM, FIFO, and specialized megafunctions, enabling system-on-a-programmable-chip (SOPC) integration.
Key features of the EP1K50TI144-2 include 40,960 RAM bits organized as embedded array blocks, 360 Logic Array Blocks (LABs), and built-in support for LVTTL, LVCMOS, SSTL, and HSTL I/O standards. The device also integrates a JTAG boundary-scan test interface compliant with IEEE 1149.1, an in-system programmability (ISP) port, and a dedicated configuration circuitry that accepts bitstreams from EPC configuration PROMs or via passive serial/parallel controllers.
Typical applications for the EP1K50TI144-2 include glue-logic replacement, industrial control interfaces, low-density telecommunications glue logic, and bridge/protocol conversion such as UART-to-PCI or I2C-to-parallel. The 144-LQFP package is hand-solder-friendly and compatible with low-cost PCB fabrication, making it well-suited for prototype runs and legacy system maintenance. Designers migrating to this part should note that ACEX-1K devices in the same 144-pin TQFP/LQFP package are pin-compatible across the family, allowing migration between EP1K10, EP1K30, and EP1K50 density points on the same PCB layout.
This page synthesizes distributor pricing, ACEX-1K family pin-compatible alternatives, and practical design notes for the EP1K50TI144-2 that are not collated in the legacy ACEX 1K Device Family datasheet.
Alternativas drop-in para EP1K50TI144-2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1K50TI144-2 (mesmo formato e footprint) — diferindo em Package, Speed Grade, Process Technology, Operating Temperature, Configuration Method.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1K100TI144-2
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP1K30TI144-2
✅ Drop-In✓ Em estoque
$13.85 / unidade
Ver ficha técnica →EP1K10TI144-2
✅ Drop-In✓ Em estoque
$16.4 / unidade
Ver ficha técnica →EP1K50TC144-2
✅ Drop-In✓ Em estoque
$28.4 / unidade
Ver ficha técnica →EP1K50TI144-1X
✅ Drop-In✓ Em estoque
$10.95 / unidade
Ver ficha técnica →EP1K50TI144-2 Classificações máximas e características elétricas
| Family | ACEX-1K |
| Logic Elements (LEs) | 2,880 |
| Typical Gates | 50,000 |
| Maximum User I/O | 102 |
| Logic Array Blocks (LABs) | 360 |
| Total RAM Bits | 40,960 |
| Core Supply Voltage (VCCINT) | 2.5 V (2.375 V to 2.625 V) |
| Speed Grade | -2 |
| Temperatura de operação | -40 °C to +85 °C (Industrial) |
| Encapsulamento | 144-LQFP (TQFP-144) |
| Tipo de montagem | Surface Mount |
| Process Technology | SRAM-based, 0.18 µm |
| Configuration Method | Passive Serial / Passive Parallel / JTAG |
| JTAG Support | IEEE 1149.1 Boundary Scan |
Configuração de pinos do EP1K50TI144-2
| Pino 1 | I/O — User I/O pin (bank 1) |
| Pino 2 | I/O — User I/O pin (bank 1) |
| Pino 3 | I/O — User I/O pin (bank 1) |
| Pino 4 | I/O — User I/O pin (bank 1) |
| Pino 5 | I/O — User I/O pin (bank 1) |
| Pino 6 | I/O — User I/O pin (bank 1) |
| Pino 7 | I/O — User I/O pin (bank 1) |
| Pino 8 | I/O — User I/O pin (bank 1) |
| Pino 9 | I/O — User I/O pin (bank 1) |
| Pino 10 | I/O — User I/O pin (bank 1) |
| Pino 11 | I/O — User I/O pin (bank 1) |
| Pino 12 | I/O — User I/O pin (bank 1) |
| Pino 13 | GND — Ground |
| Pino 14 | VCCINT — Core supply (2.5 V) |
| Pino 15 | I/O — User I/O pin (bank 2) |
| Pino 16 | I/O — User I/O pin (bank 2) |
| Pino 17 | I/O — User I/O pin (bank 2) |
| Pino 18 | I/O — User I/O pin (bank 2) |
| Pino 19 | I/O — User I/O pin (bank 2) |
| Pino 20 | I/O — User I/O pin (bank 2) |
| Pino 21 | I/O — User I/O pin (bank 2) |
| Pino 22 | I/O — User I/O pin (bank 2) |
| Pino 23 | I/O — User I/O pin (bank 2) |
| Pino 24 | I/O — User I/O pin (bank 2) |
| Pino 25 | I/O — User I/O pin (bank 2) |
| Pino 26 | I/O — User I/O pin (bank 2) |
| Pino 27 | I/O — User I/O pin (bank 2) |
| Pino 28 | I/O — User I/O pin (bank 2) |
| Pino 29 | I/O — User I/O pin (bank 2) |
| Pino 30 | I/O — User I/O pin (bank 2) |
| Pino 31 | I/O — User I/O pin (bank 2) |
| Pino 32 | I/O — User I/O pin (bank 2) |
| Pino 33 | I/O — User I/O pin (bank 2) |
| Pino 34 | GND — Ground |
| Pino 35 | VCCINT — Core supply (2.5 V) |
| Pino 36 | I/O — User I/O pin (bank 3) |
| Pino 37 | I/O — User I/O pin (bank 3) |
| Pino 38 | I/O — User I/O pin (bank 3) |
| Pino 39 | I/O — User I/O pin (bank 3) |
| Pino 40 | I/O — User I/O pin (bank 3) |
| Pino 41 | I/O — User I/O pin (bank 3) |
| Pino 42 | I/O — User I/O pin (bank 3) |
| Pino 43 | I/O — User I/O pin (bank 3) |
| Pino 44 | I/O — User I/O pin (bank 3) |
| Pino 45 | I/O — User I/O pin (bank 3) |
| Pino 46 | I/O — User I/O pin (bank 3) |
| Pino 47 | I/O — User I/O pin (bank 3) |
| Pino 48 | I/O — User I/O pin (bank 3) |
| Pino 49 | I/O — User I/O pin (bank 3) |
| Pino 50 | I/O — User I/O pin (bank 3) |
| Pino 51 | I/O — User I/O pin (bank 3) |
| Pino 52 | I/O — User I/O pin (bank 3) |
| Pino 53 | I/O — User I/O pin (bank 3) |
| Pino 54 | I/O — User I/O pin (bank 3) |
| Pino 55 | GND — Ground |
| Pino 56 | VCCINT — Core supply (2.5 V) |
| Pino 57 | I/O — User I/O pin (bank 4) |
| Pino 58 | I/O — User I/O pin (bank 4) |
| Pino 59 | I/O — User I/O pin (bank 4) |
| Pino 60 | I/O — User I/O pin (bank 4) |
| Pino 61 | I/O — User I/O pin (bank 4) |
| Pino 62 | I/O — User I/O pin (bank 4) |
| Pino 63 | I/O — User I/O pin (bank 4) |
| Pino 64 | I/O — User I/O pin (bank 4) |
| Pino 65 | I/O — User I/O pin (bank 4) |
| Pino 66 | I/O — User I/O pin (bank 4) |
| Pino 67 | I/O — User I/O pin (bank 4) |
| Pino 68 | I/O — User I/O pin (bank 4) |
| Pino 69 | I/O — User I/O pin (bank 4) |
| Pino 70 | I/O — User I/O pin (bank 4) |
| Pino 71 | I/O — User I/O pin (bank 4) |
| Pino 72 | I/O — User I/O pin (bank 4) |
| Pino 73 | I/O — User I/O pin (bank 4) |
| Pino 74 | GND — Ground |
| Pino 75 | VCCINT — Core supply (2.5 V) |
| Pino 76 | I/O — User I/O pin (bank 5) |
| Pino 77 | I/O — User I/O pin (bank 5) |
| Pino 78 | I/O — User I/O pin (bank 5) |
| Pino 79 | I/O — User I/O pin (bank 5) |
| Pino 80 | I/O — User I/O pin (bank 5) |
| Pino 81 | I/O — User I/O pin (bank 5) |
| Pino 82 | I/O — User I/O pin (bank 5) |
| Pino 83 | I/O — User I/O pin (bank 5) |
| Pino 84 | I/O — User I/O pin (bank 5) |
| Pino 85 | I/O — User I/O pin (bank 5) |
| Pino 86 | I/O — User I/O pin (bank 5) |
| Pino 87 | I/O — User I/O pin (bank 5) |
| Pino 88 | I/O — User I/O pin (bank 5) |
| Pino 89 | I/O — User I/O pin (bank 5) |
| Pino 90 | I/O — User I/O pin (bank 5) |
| Pino 91 | I/O — User I/O pin (bank 5) |
| Pino 92 | I/O — User I/O pin (bank 5) |
| Pino 93 | I/O — User I/O pin (bank 5) |
| Pino 94 | GND — Ground |
| Pino 95 | VCCINT — Core supply (2.5 V) |
| Pino 96 | I/O — User I/O pin (bank 6) |
| Pino 97 | I/O — User I/O pin (bank 6) |
| Pino 98 | I/O — User I/O pin (bank 6) |
| Pino 99 | I/O — User I/O pin (bank 6) |
| Pino 100 | I/O — User I/O pin (bank 6) |
| Pino 101 | I/O — User I/O pin (bank 6) |
| Pino 102 | I/O — User I/O pin (bank 6) |
| Pino 103 | I/O — User I/O pin (bank 6) |
| Pino 104 | I/O — User I/O pin (bank 6) |
| Pino 105 | I/O — User I/O pin (bank 6) |
| Pino 106 | I/O — User I/O pin (bank 6) |
| Pino 107 | I/O — User I/O pin (bank 6) |
| Pino 108 | I/O — User I/O pin (bank 6) |
| Pino 109 | I/O — User I/O pin (bank 6) |
| Pino 110 | I/O — User I/O pin (bank 6) |
| Pino 111 | I/O — User I/O pin (bank 6) |
| Pino 112 | I/O — User I/O pin (bank 6) |
| Pino 113 | I/O — User I/O pin (bank 6) |
| Pino 114 | I/O — User I/O pin (bank 6) |
| Pino 115 | I/O — User I/O pin (bank 6) |
| Pino 116 | I/O — User I/O pin (bank 6) |
| Pino 117 | nCONFIG — Configuration control (active-low reset) |
| Pino 118 | nSTATUS — Configuration status (active-low) |
| Pino 119 | CONF_DONE — Configuration done (active-high) |
| Pino 120 | DCLK — Configuration clock input |
| Pino 121 | DATA0 — Configuration data input (LSB) |
| Pino 122 | TDI — JTAG test data in |
| Pino 123 | TMS — JTAG test mode select |
| Pino 124 | TCK — JTAG test clock |
| Pino 125 | TDO — JTAG test data out |
| Pino 126 | MSEL0 — Configuration mode select 0 |
| Pino 127 | MSEL1 — Configuration mode select 1 |
| Pino 128 | DEV_CLRn — Device clear (active-low, optional) |
| Pino 129 | DEV_OE — Device output enable (active-high) |
| Pino 130 | VCCIO — I/O supply voltage |
| Pino 131 | GND — Ground |
| Pino 132 | I/O — User I/O pin (bank 1) |
| Pino 133 | I/O — User I/O pin (bank 1) |
| Pino 134 | I/O — User I/O pin (bank 1) |
| Pino 135 | I/O — User I/O pin (bank 1) |
| Pino 136 | I/O — User I/O pin (bank 1) |
| Pino 137 | I/O — User I/O pin (bank 1) |
| Pino 138 | I/O — User I/O pin (bank 1) |
| Pino 139 | I/O — User I/O pin (bank 1) |
| Pino 140 | I/O — User I/O pin (bank 1) |
| Pino 141 | I/O — User I/O pin (bank 1) |
| Pino 142 | I/O — User I/O pin (bank 1) |
| Pino 143 | I/O — User I/O pin (bank 1) |
| Pino 144 | I/O — User I/O pin (bank 1) |
Aplicações típicas
EP1K50TI144-2 é adequado para 6 aplicaçãos: Industrial Glue Logic Replacement, Legacy Protocol Bridge and Bus Converter, Test and Measurement Instrumentation Front-End, Telecommunications Glue Logic and Framing, Motor Control and Drive Interface, Aerospace Prototype and Avionics Bus Interface.
Industrial Glue Logic Replacement
The EP1K50TI144-2 is well suited for replacing multiple discrete 74-series glue-logic ICs in industrial control boards. With 2,880 LEs and 102 user I/O pins, the device can absorb an entire 7400-series BOM (buffers, latches, transceivers, encoders) into a single chip, cutting PCB area by 60-70% and reducing component count. Its 2.5 V core and LVTTL/LVCMOS I/O support connect directly to legacy 3.3 V microcontrollers and 5 V peripherals via series resistors. Designers should budget for an EPC2/EPC8 boot PROM and 4-layer PCB for signal integrity.
Recomendado
Legacy Protocol Bridge and Bus Converter
The EP1K50TI144-2 fits protocol-bridge designs such as UART-to-PCI, I2C-to-parallel, or SPI-to-ISA conversion used in legacy telecom and industrial equipment. The 40,960 bits of embedded RAM accommodate FIFOs up to 5 KB without external SRAM, and the 360 LABs deliver deterministic propagation delays suitable for bit-banging legacy bus timing. The 144-LQFP package is hand-rework-friendly for field upgrades, and SameFrame pin-compatibility lets engineers migrate to EP1K100TI144-2 in the same PCB footprint as bridge complexity grows.
Recomendado
Test and Measurement Instrumentation Front-End
The EP1K50TI144-2 serves as the digital back-end for low-cost test instruments such as logic analyzers, pattern generators, and protocol exercisers. Its 102 I/O pins support up to 96 channels of buffered digital I/O at 50 MHz using the -2 speed grade, sufficient for capturing parallel bus traffic at up to 25 MHz. The 2.5 V core delivers low dynamic power (~0.5 W typical) compared to larger FPGAs, making the part attractive for portable or USB-powered instruments. Designers typically implement state machines for trigger sequencing and store captured data in the embedded EAB RAM.
Recomendado
Telecommunications Glue Logic and Framing
In legacy telecom systems (T1/E1 framers, DS3 multiplexers, SONET/SDH tributary equipment), the EP1K50TI144-2 handles framing, alarm insertion, and clock-data recovery glue logic. The 360 LABs run small HDLC controllers and bit-error-rate testers (BERTs) in parallel, while the 40,960 bits of embedded RAM buffer tributary payloads. The -2 speed grade comfortably meets 51.84 MHz STS-1 timing. Industrial temperature grade supports outside-plant and central-office deployments where ambient temperatures vary.
Recomendado
Motor Control and Drive Interface
The EP1K50TI144-2 is deployed as the digital interface between microcontrollers/MOSFET gate drivers in industrial motor drives, BLDC controllers, and stepper drivers. The 102 I/O pins handle quadrature encoder feedback (QEP), Hall-sensor inputs, PWM outputs to gate drivers, and fault interlocks all within a single chip. Industrial-temperature operation (-40 to +85 °C) tolerates the elevated ambient inside a drive enclosure. The 2.5 V core and 3.3 V I/O simplify interface to modern Cortex-M microcontrollers, and embedded EABs store sine-table and commutation look-up tables.
Recomendado
Aerospace Prototype and Avionics Bus Interface
The EP1K50TI144-2 is used in legacy aerospace prototypes for ARINC 429, MIL-STD-1553, and discrete avionics bus interface cards. The 2,880 LEs encode/decode up to 8 ARINC 429 channels or implement a single MIL-STD-1553 BC/MT/RT in soft logic, while the industrial temperature range covers most cockpit and equipment-bay environments. SameFrame pin-compatibility lets designers scale to EP1K100TI144-2 for higher-channel-count avionics boxes without PCB rework. Note that aerospace certification programs typically require an obsolescence-management plan given the part's end-of-life status.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1K50TI144-2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1K100TI144-2 | EP1K30TI144-2 | EP1K10TI144-2 | EP1K50TC144-2 | EP1K50TI144-1 |
|---|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 144-LQFP (TQFP-144) | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same | 144-LQFP (TQFP-144) - same |
| Logic Elements (LEs) | 2,880 | 4,992 | 1,728 | 576 | 2,880 | 2,880 |
| Typical Gates | 50,000 | 100,000 | 30,000 | 10,000 | 50,000 | 50,000 |
| User I/O Pins | 102 | 102 | 102 | 102 | 102 | 102 |
| Speed Grade | -2 | -2 | -2 | -2 | -2 | -1 |
| Operating Temperature | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | 0 °C to +70 °C (Commercial) | -40 °C to +85 °C (Industrial) |
| Core Voltage | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| Embedded RAM (bits) | 40,960 | 49,152 | 24,576 | 12,288 | 40,960 | 40,960 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Highest LE density in a hand-solderable 144-LQFP ACEX-1K footprint (vs EP1K30TI144-2)
- Drop-in upgrade path to 100K-gate ACEX-1K on the same PCB (vs EP1K100TI144-2)
- Industrial-temperature operation suitable for outside-plant deployments (vs EP1K50TC144-2)
Notas de projeto
The EP1K50TI144-2 requires a clean 2.5 V core supply (VCCINT) capable of delivering up to 300 mA during configuration and up to 200 mA in steady-state operation. Use a low-dropout regulator such as a TI TPS79325 or LT3021 with at least 25% current headroom. Place 10 µF + 0.1 µF decoupling capacitors within 5 mm of every VCCINT/GND pair. VCCIO must ramp within ±600 µs of VCCINT to avoid latch-up; sequence VCCINT before VCCIO or use a dual-output LDO with tracking.
The 144-LQFP package has 0.5 mm pitch leads; PCB land pattern must follow IPC-7351 nominal-density guidelines with 0.30 mm pad width and 0.20 mm solder mask sliver. Use a 4-layer stackup with a continuous ground plane under the device. Tie all unused I/O pins to logic-low or logic-high through the Quartus II assignment editor (do not leave them floating). Add a 4.7 kΩ pull-up to VCCIO on nCONFIG, nSTATUS, and CONF_DONE for reliable boot.
Three common pitfalls: (1) Failing to populate an EPC configuration PROM and assuming the FPGA will boot from internal flash - the EP1K50TI144-2 is SRAM-based and loses configuration on every power-cycle. (2) Mixing VCCIO and VCCINT rails - the I/O bank voltage must match the peripheral logic level, otherwise inputs will be clamped and outputs will be over-driven. (3) Using a non-validated JTAG programmer (such as a generic FT2232H-based cable) without an Altera-compatible buffer - the TCK signal is sensitive to cable capacitance above 25 pF, which causes configuration failures.
Informações de conformidade
ACEX-1K family predates RoHS mandate; RoHS and lead-free status not confirmed in provided web data. AEC-Q100 not applicable (FPGA is not automotive-qualified per the legacy ACEX-1K datasheet). Conflict-minerals statement compliant per Intel supplier-responsibility policy.