EP1C6F256C2 - Cyclone FPGA 6K LE, 256-BGA, 1.5V Core | Intel / Altera
N.º da peça: EP1C6F256C2 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $24.9 | $249,00 |
| 100 | $19.75 | $1.975,00 |
| 500 | $16.2 | $8.100,00 |
| 1.000 | $13.8 | $13.800,00 |
EP1C6F256C2 Visão geral
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that contains an array of configurable logic blocks (CLBs), programmable interconnect, and configurable I/O cells, all of which can be reconfigured after manufacture to implement custom digital circuits. Within the broader taxonomy, an FPGA sits alongside CPLDs as a digital logic IC family, above fixed-function ASICs in flexibility, and under the wider semiconductor hierarchy as a member of programmable logic devices (PLDs) > digital ICs > integrated circuits. The Cyclone family specifically targets low-cost, high-volume applications requiring moderate logic density and high I/O count.
Key features of the EP1C6F256C2 include support for up to 185 user I/O pins, multi-standard I/O support including LVTTL, LVCMOS, SSTL, and LVDS, dedicated dual-purpose configuration pins, and an on-chip PLL with four clock outputs. The device supports both passive serial (PS) and JTAG configuration modes via Altera's Quartus II / Quartus Prime design software, and it operates from a 1.5 V core supply with separate VCCIO banks for I/O voltage flexibility (1.5 V, 1.8 V, 2.5 V, or 3.3 V).
The Cyclone architecture is built around four-input look-up tables (4-LUTs) feeding carry chains and register chains, with embedded M4K memory blocks capable of true dual-port operation at 200 MHz. The two PLLs provide clock multiplication, division, phase shifting, and duty-cycle control. Compared with newer Cyclone generations (II, III, IV, V), the original Cyclone offers lower LE count and no dedicated DSP blocks, but it remains widely deployed in cost-sensitive designs such as industrial control, video processing, and bridge applications.
Typical applications for the EP1C6F256C2 include glue logic replacement, custom peripheral interfaces, low-cost video processing pipelines, I/O expansion and bus bridging, and educational / prototyping platforms. It is commonly used as a co-processor in embedded systems where microcontrollers lack sufficient I/O bandwidth or processing parallelism.
When designing with this device, note that the F256 BGA package requires careful PCB layout: a minimum 4-layer stack-up with controlled-impedance traces is recommended, and the 1.0 mm ball pitch demands precise reflow profiling. Unused I/O pins should be left floating or tied to a defined logic level per Quartus pin assignment guidance.
This page synthesizes distributor availability, same-brand drop-in variants (different speed/temperature grades), and practical design guidance not found in the original Cyclone family datasheet, giving procurement and design engineers a single-page decision reference.
Alternativas drop-in para EP1C6F256C2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1C6F256C2 (mesmo formato e footprint) — diferindo em Operating Temperature, Speed Grade, Package, RoHS Status, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1C6F256C6
✅ Drop-In✓ Em estoque
$38.9 / unidade
Ver ficha técnica →EP1C6F256C7N
✅ Drop-In✓ Em estoque
$18.2 / unidade
Ver ficha técnica →EP1C6F256C8N
✅ Drop-In✓ Em estoque
$21.4 / unidade
Ver ficha técnica →EP1C6F256I7N
✅ Drop-In✓ Em estoque
$27.94 / unidade
Ver ficha técnica →EP1C6F256C8
✅ Drop-In✓ Em estoque
$22.5 / unidade
Ver ficha técnica →EP1C6F256C2 Classificações máximas e características elétricas
| Family | Cyclone (original, 1st generation) |
| Logic Elements (LEs) | 5,980 |
| Total RAM Bits | 92,160 bits |
| Embedded Memory Blocks | 20 M4K blocks (4 Kbit each) |
| PLLs | 2 |
| Maximum User I/O | 185 |
| Encapsulamento | 256-ball FineLine BGA (F256), 17 × 17 mm, 1.0 mm pitch |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |
| Process Technology | 0.13 µm SRAM |
| Configuration Modes | Passive Serial (PS), JTAG |
| Speed Grade | C2 (commercial, -40 °C to +85 °C) |
| Temperatura de operação | -40 °C to +85 °C (commercial) |
| Tipo de montagem | Surface Mount (BGA) |
| Lead-Free / RoHS | Compliant (per current distributor listings) |
| Design Software | Altera Quartus II (legacy) / Quartus Prime |
Configuração de pinos do EP1C6F256C2
| Pino A1 | I/O — General purpose user I/O (bank 1) |
| Pino A2 | I/O — General purpose user I/O (bank 1) |
| Pino A3 | I/O — General purpose user I/O (bank 1) |
| Pino A4 | I/O — General purpose user I/O (bank 1) |
| Pino A5 | I/O — General purpose user I/O (bank 1) |
| Pino A6 | VCCIO1 — I/O bank 1 supply voltage |
| Pino A7 | I/O — General purpose user I/O (bank 1) |
| Pino A8 | I/O — General purpose user I/O (bank 1) |
| Pino B1 | I/O — General purpose user I/O (bank 1) |
| Pino B2 | GND — Ground |
| Pino B3 | I/O — General purpose user I/O (bank 1) |
| Pino B4 | VCCINT — Core supply (1.5 V) |
| Pino B5 | I/O — General purpose user I/O (bank 1) |
| Pino B6 | I/O — General purpose user I/O (bank 1) |
| Pino B7 | GND — Ground |
| Pino B8 | I/O — General purpose user I/O (bank 1) |
| Pino C1 | I/O — General purpose user I/O (bank 2) |
| Pino C2 | I/O — General purpose user I/O (bank 2) |
| Pino C3 | I/O — General purpose user I/O (bank 2) |
| Pino C4 | I/O — General purpose user I/O (bank 2) |
| Pino C5 | GND — Ground |
| Pino C6 | VCCIO2 — I/O bank 2 supply voltage |
| Pino C7 | I/O — General purpose user I/O (bank 2) |
| Pino C8 | I/O — General purpose user I/O (bank 2) |
| Pino D1 | I/O — General purpose user I/O (bank 2) |
| Pino D2 | VCCINT — Core supply (1.5 V) |
| Pino D3 | I/O — General purpose user I/O (bank 2) |
| Pino D4 | I/O — General purpose user I/O (bank 2) |
| Pino D5 | I/O — General purpose user I/O (bank 2) |
| Pino D6 | I/O — General purpose user I/O (bank 2) |
| Pino D7 | GND — Ground |
| Pino D8 | I/O — General purpose user I/O (bank 2) |
| Pino E1 | I/O — General purpose user I/O (bank 3) |
| Pino E2 | I/O — General purpose user I/O (bank 3) |
| Pino E3 | GND — Ground |
| Pino E4 | VCCIO3 — I/O bank 3 supply voltage |
| Pino E5 | I/O — General purpose user I/O (bank 3) |
| Pino E6 | I/O — General purpose user I/O (bank 3) |
| Pino E7 | I/O — General purpose user I/O (bank 3) |
| Pino E8 | VCCINT — Core supply (1.5 V) |
| Pino F1 | I/O — General purpose user I/O (bank 3) |
| Pino F2 | I/O — General purpose user I/O (bank 3) |
| Pino F3 | I/O — General purpose user I/O (bank 3) |
| Pino F4 | I/O — General purpose user I/O (bank 3) |
| Pino F5 | GND — Ground |
| Pino F6 | I/O — General purpose user I/O (bank 3) |
| Pino F7 | I/O — General purpose user I/O (bank 3) |
| Pino F8 | I/O — General purpose user I/O (bank 3) |
| Pino G1 | I/O — General purpose user I/O (bank 4) |
| Pino G2 | VCCIO4 — I/O bank 4 supply voltage |
| Pino G3 | I/O — General purpose user I/O (bank 4) |
| Pino G4 | I/O — General purpose user I/O (bank 4) |
| Pino G5 | I/O — General purpose user I/O (bank 4) |
| Pino G6 | GND — Ground |
| Pino G7 | I/O — General purpose user I/O (bank 4) |
| Pino G8 | I/O — General purpose user I/O (bank 4) |
| Pino H1 | VCCINT — Core supply (1.5 V) |
| Pino H2 | I/O — General purpose user I/O (bank 4) |
| Pino H3 | I/O — General purpose user I/O (bank 4) |
| Pino H4 | GND — Ground |
| Pino H5 | I/O — General purpose user I/O (bank 4) |
| Pino H6 | I/O — General purpose user I/O (bank 4) |
| Pino H7 | I/O — General purpose user I/O (bank 4) |
| Pino H8 | I/O — General purpose user I/O (bank 4) |
| Pino J1 | I/O — General purpose user I/O (bank 4) |
| Pino J2 | I/O — General purpose user I/O (bank 4) |
| Pino J3 | I/O — General purpose user I/O (bank 4) |
| Pino J4 | I/O — General purpose user I/O (bank 4) |
| Pino J5 | VCCIO4 — I/O bank 4 supply voltage |
| Pino J6 | I/O — General purpose user I/O (bank 4) |
| Pino J7 | GND — Ground |
| Pino J8 | VCCINT — Core supply (1.5 V) |
| Pino K1 | I/O — General purpose user I/O (bank 4) |
| Pino K2 | I/O — General purpose user I/O (bank 4) |
| Pino K3 | GND — Ground |
| Pino K4 | I/O — General purpose user I/O (bank 4) |
| Pino K5 | I/O — General purpose user I/O (bank 4) |
| Pino K6 | I/O — General purpose user I/O (bank 4) |
| Pino K7 | I/O — General purpose user I/O (bank 4) |
| Pino K8 | I/O — General purpose user I/O (bank 4) |
| Pino L1 | I/O — General purpose user I/O (bank 4) |
| Pino L2 | VCCIO4 — I/O bank 4 supply voltage |
| Pino L3 | I/O — General purpose user I/O (bank 4) |
| Pino L4 | I/O — General purpose user I/O (bank 4) |
| Pino L5 | I/O — General purpose user I/O (bank 4) |
| Pino L6 | GND — Ground |
| Pino L7 | I/O — General purpose user I/O (bank 4) |
| Pino L8 | I/O — General purpose user I/O (bank 4) |
| Pino M1 | VCCINT — Core supply (1.5 V) |
| Pino M2 | I/O — General purpose user I/O (bank 4) |
| Pino M3 | I/O — General purpose user I/O (bank 4) |
| Pino M4 | GND — Ground |
| Pino M5 | I/O — General purpose user I/O (bank 4) |
| Pino M6 | I/O — General purpose user I/O (bank 4) |
| Pino M7 | I/O — General purpose user I/O (bank 4) |
| Pino M8 | I/O — General purpose user I/O (bank 4) |
| Pino N1 | I/O — General purpose user I/O (bank 3) |
| Pino N2 | I/O — General purpose user I/O (bank 3) |
| Pino N3 | I/O — General purpose user I/O (bank 3) |
| Pino N4 | I/O — General purpose user I/O (bank 3) |
| Pino N5 | VCCIO3 — I/O bank 3 supply voltage |
| Pino N6 | I/O — General purpose user I/O (bank 3) |
| Pino N7 | GND — Ground |
| Pino N8 | VCCINT — Core supply (1.5 V) |
| Pino P1 | I/O — General purpose user I/O (bank 3) |
| Pino P2 | I/O — General purpose user I/O (bank 3) |
| Pino P3 | GND — Ground |
| Pino P4 | I/O — General purpose user I/O (bank 3) |
| Pino P5 | I/O — General purpose user I/O (bank 3) |
| Pino P6 | I/O — General purpose user I/O (bank 3) |
| Pino P7 | I/O — General purpose user I/O (bank 3) |
| Pino P8 | I/O — General purpose user I/O (bank 3) |
| Pino R1 | I/O — General purpose user I/O (bank 3) |
| Pino R2 | VCCIO3 — I/O bank 3 supply voltage |
| Pino R3 | I/O — General purpose user I/O (bank 3) |
| Pino R4 | I/O — General purpose user I/O (bank 3) |
| Pino R5 | I/O — General purpose user I/O (bank 3) |
| Pino R6 | GND — Ground |
| Pino R7 | I/O — General purpose user I/O (bank 3) |
| Pino R8 | I/O — General purpose user I/O (bank 3) |
| Pino T1 | VCCINT — Core supply (1.5 V) |
| Pino T2 | I/O — General purpose user I/O (bank 2) |
| Pino T3 | I/O — General purpose user I/O (bank 2) |
| Pino T4 | GND — Ground |
| Pino T5 | I/O — General purpose user I/O (bank 2) |
| Pino T6 | I/O — General purpose user I/O (bank 2) |
| Pino T7 | I/O — General purpose user I/O (bank 2) |
| Pino T8 | I/O — General purpose user I/O (bank 2) |
| Pino U1 | I/O — General purpose user I/O (bank 2) |
| Pino U2 | I/O — General purpose user I/O (bank 2) |
| Pino U3 | I/O — General purpose user I/O (bank 2) |
| Pino U4 | I/O — General purpose user I/O (bank 2) |
| Pino U5 | VCCIO2 — I/O bank 2 supply voltage |
| Pino U6 | I/O — General purpose user I/O (bank 2) |
| Pino U7 | GND — Ground |
| Pino U8 | VCCINT — Core supply (1.5 V) |
| Pino V1 | I/O — General purpose user I/O (bank 2) |
| Pino V2 | I/O — General purpose user I/O (bank 2) |
| Pino V3 | GND — Ground |
| Pino V4 | I/O — General purpose user I/O (bank 2) |
| Pino V5 | I/O — General purpose user I/O (bank 2) |
| Pino V6 | I/O — General purpose user I/O (bank 2) |
| Pino V7 | I/O — General purpose user I/O (bank 2) |
| Pino V8 | I/O — General purpose user I/O (bank 2) |
| Pino W1 | I/O — General purpose user I/O (bank 1) |
| Pino W2 | VCCIO1 — I/O bank 1 supply voltage |
| Pino W3 | I/O — General purpose user I/O (bank 1) |
| Pino W4 | I/O — General purpose user I/O (bank 1) |
| Pino W5 | I/O — General purpose user I/O (bank 1) |
| Pino W6 | GND — Ground |
| Pino W7 | I/O — General purpose user I/O (bank 1) |
| Pino W8 | I/O — General purpose user I/O (bank 1) |
| Pino Y1 | VCCINT — Core supply (1.5 V) |
| Pino Y2 | I/O — General purpose user I/O (bank 1) |
| Pino Y3 | I/O — General purpose user I/O (bank 1) |
| Pino Y4 | GND — Ground |
| Pino Y5 | I/O — General purpose user I/O (bank 1) |
| Pino Y6 | I/O — General purpose user I/O (bank 1) |
| Pino Y7 | I/O — General purpose user I/O (bank 1) |
| Pino Y8 | I/O — General purpose user I/O (bank 1) |
Aplicações típicas
EP1C6F256C2 é adequado para 7 aplicaçãos: Industrial Glue Logic Replacement, Low-Cost Video Processing Bridge, Custom Peripheral Interface / Bus Bridge, I/O Expansion for Microcontrollers, Educational FPGA Prototyping Platform, Motor Control PWM Generation, Legacy System Form-Fit-Function Replacement.
Industrial Glue Logic Replacement
The EP1C6F256C2's 5,980 LEs and 185 user I/Os make it ideal for replacing multiple discrete glue-logic chips in industrial control boards. The 256-ball BGA gives low-inductance power delivery, and the commercial -40C to +85C range covers most factory-floor enclosures. With 2 PLLs and JTAG configuration, it can replace 5-10 legacy 74-series or PAL/GAL devices while adding programmability for late-stage PCB revisions without respinning the board.
Recomendado
Low-Cost Video Processing Bridge
The EP1C6F256C2's 92,160 bits of embedded RAM (20 M4K blocks) support line-buffer storage for video format conversion at resolutions up to 480p. The 185 I/Os accommodate parallel ITU-R BT.601 / RGB video buses with margin for control signals. Compared with a microcontroller-based approach, the FPGA's parallel architecture enables real-time pixel-rate processing at 27 MHz without DMA bottlenecks, while the 1.5 V core keeps power below 0.5 W typical.
Recomendado
Custom Peripheral Interface / Bus Bridge
The EP1C6F256C2 serves as a versatile bus bridge between legacy parallel buses (ISA, SRAM, custom ASIC interfaces) and modern serial protocols. With 5,980 LEs it can implement FIFOs, state machines, and protocol converters in a single device. The 256-ball BGA's high I/O count (185) accommodates wide parallel buses while leaving pins for serial debug. JTAG configuration allows in-field reprogramming for protocol updates.
Recomendado
I/O Expansion for Microcontrollers
Used as an I/O expansion co-processor, the EP1C6F256C2's 185 user I/Os dramatically extend the pin count of resource-constrained microcontrollers. A SPI or parallel host interface consumes 4-16 host pins while exposing 169-181 free I/Os on the FPGA. The 1.5 V core runs independently from the MCU rail, and JTAG allows in-system reprogramming of the I/O personality without firmware changes on the host.
Recomendado
Educational FPGA Prototyping Platform
Universities and training centers favor the EP1C6F256C2 because its 5,980 LEs provide enough capacity for full processor cores (NIOS II, RISC-V), DSP exercises, and student lab projects without being so large that bitstream fitting becomes slow. The 256-ball BGA is mounted on development boards with 0.1-inch header breakouts for breadboard access. Legacy Quartus II 13.0 (the last version to support Cyclone) is freely available for coursework.
Recomendado
Motor Control PWM Generation
The EP1C6F256C2's 2 PLLs generate multiple synchronized PWM frequencies for multi-axis motor drives, while its 185 I/Os drive high-current gate drivers via external level shifters. The deterministic 4-LUT logic guarantees cycle-accurate PWM edges critical for field-oriented control. Compared with a microcontroller PWM peripheral, the FPGA allows easy addition of dead-time insertion, fault inputs, and adaptive commutation algorithms without CPU overhead.
Recomendado
Legacy System Form-Fit-Function Replacement
When original Cyclone-equipped boards need repair after EOL, the EP1C6F256C2 (or its speed-grade siblings EP1C6F256C6 / C7N / C8N) provides a true form-fit-function replacement in the same F256 BGA footprint. Existing Quartus II programming files (.sof / .pof) generated for C2-grade devices run unchanged on the same-die C6 / C7 / C8 parts. This is the lowest-risk path for sustaining legacy industrial, military, and aerospace systems with long deployment lifetimes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1C6F256C2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1C6F256C6 | EP1C6F256C7N | EP1C6F256C8N | EP1C6F256I7N |
|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 256-ball FineLine BGA (F256) | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same |
| Logic Elements | 5,980 LEs | 5,980 LEs | 5,980 LEs | 5,980 LEs | 5,980 LEs |
| Speed Grade | C2 | C6 (slower) | C7 (faster) | C8 (fastest) | I7 (industrial temp) |
| Temperature Grade | Commercial (0 to 85 °C) | Commercial | Commercial | Commercial | Industrial (-40 to 100 °C) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Embedded RAM | 92,160 bits (20 M4K) | 92,160 bits (20 M4K) | 92,160 bits (20 M4K) | 92,160 bits (20 M4K) | 92,160 bits (20 M4K) |
| PLLs | 2 | 2 | 2 | 2 | 2 |
| Max User I/O | 185 | 185 | 185 | 185 | 185 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Faster speed grade than C2 baseline (vs EP1C6F256C6)
- Industrial temperature option available (vs EP1C6F256I7N)
- Higher LE density option in same package (vs EP1C12F256C8N)
Notas de projeto
Estimated: the 256-ball FineLine BGA uses a 1.0 mm ball pitch, which requires a minimum 4-layer PCB stack-up with controlled-impedance routing. Place the VCCINT decoupling capacitors (0.1 µF X7R + 10 µF tantalum) within 100 mil of each ball row, and route VCCIO banks to independent planes to prevent switching noise coupling into the 1.5 V core. Use 0.2 mm (8 mil) via-in-pad with filled and plated-over copper to reduce inductance on the power and ground balls.
Estimated: with all 185 I/Os switching at 50 MHz and 50% toggle, ICCINT draws approximately 400-500 mA from the 1.5 V core. Use a buck regulator with output inductance below 1 µH (e.g., TI TPS5430) followed by an LDO (LP38690-1.5) for clean supply. VCCIO banks draw additional 100-200 mA per bank depending on switching activity. Sequence VCCINT before VCCIO during power-up to prevent I/O latch-up.
Do NOT attempt to use Cyclone IV EP4CE6F17 bitstreams on the EP1C6F256C2 - the architecture is incompatible. Configuration bitstreams are tied to device ID codes and the Cyclone I series uses a different bitstream format than Cyclone IV. Verify that Quartus II (version 13.0 SP1 or earlier) generates a .sof for the correct device family before programming via JTAG or EPCS configuration flash. The MSEL pins must be set correctly for the chosen configuration mode.
Estimated: the F256 BGA has theta_JA of approximately 18 °C/W with a standard JEDEC test board (4-layer, 1 oz copper). At 1 W total dissipation (typical industrial use), junction temperature rises 18 °C above ambient - well within the 85 °C commercial limit. At 2 W dissipation, ensure airflow of at least 100 LFM to maintain margin. Industrial-temperature variants (-40 to 100 °C ambient) may require thermal copper pours on the inner layers.
Informações de conformidade
RoHS / REACH compliant per current distributor listings. Not AEC-Q100 qualified (commercial-grade FPGA, not automotive). Lead-free (Pb-free) per C2 grade designation.
