EP1C6F256C2 - Cyclone FPGA 6K LE, 256-BGA, 1.5V Core | Intel / Altera
MPN: EP1C6F256C2 ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $28.5 | $28.50 |
| 10 | $24.9 | $249.00 |
| 100 | $19.75 | $1,975.00 |
| 500 | $16.2 | $8,100.00 |
| 1,000 | $13.8 | $13,800.00 |
Drop-in alternatives for EP1C6F256C2 — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1C6F256C6
✅ Drop-In✓ In Stock
$38.9 / Unit
View Datasheet →EP1C6F256C7N
✅ Drop-In✓ In Stock
$18.2 / Unit
View Datasheet →EP1C6F256C8N
✅ Drop-In✓ In Stock
$21.4 / Unit
View Datasheet →EP1C6F256I7N
✅ Drop-In✓ In Stock
$27.94 / Unit
View Datasheet →EP1C6F256C8
✅ Drop-In✓ In Stock
$22.5 / Unit
View Datasheet →EP1C6F256C2 Maximum Ratings & Electrical Characteristics
| Family | Cyclone (original, 1st generation) |
| Logic Elements (LEs) | 5,980 |
| Total RAM Bits | 92,160 bits |
| Embedded Memory Blocks | 20 M4K blocks (4 Kbit each) |
| PLLs | 2 |
| Maximum User I/O | 185 |
| Package | 256-ball FineLine BGA (F256), 17 × 17 mm, 1.0 mm pitch |
| Core Voltage (VCCINT) | 1.5 V |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (per bank) |
| Process Technology | 0.13 µm SRAM |
| Configuration Modes | Passive Serial (PS), JTAG |
| Speed Grade | C2 (commercial, -40 °C to +85 °C) |
| Operating Temperature | -40 °C to +85 °C (commercial) |
| Mounting Type | Surface Mount (BGA) |
| Lead-Free / RoHS | Compliant (per current distributor listings) |
| Design Software | Altera Quartus II (legacy) / Quartus Prime |
EP1C6F256C2 Pin Configuration
| Pin A1 | I/O — General purpose user I/O (bank 1) |
| Pin A2 | I/O — General purpose user I/O (bank 1) |
| Pin A3 | I/O — General purpose user I/O (bank 1) |
| Pin A4 | I/O — General purpose user I/O (bank 1) |
| Pin A5 | I/O — General purpose user I/O (bank 1) |
| Pin A6 | VCCIO1 — I/O bank 1 supply voltage |
| Pin A7 | I/O — General purpose user I/O (bank 1) |
| Pin A8 | I/O — General purpose user I/O (bank 1) |
| Pin B1 | I/O — General purpose user I/O (bank 1) |
| Pin B2 | GND — Ground |
| Pin B3 | I/O — General purpose user I/O (bank 1) |
| Pin B4 | VCCINT — Core supply (1.5 V) |
| Pin B5 | I/O — General purpose user I/O (bank 1) |
| Pin B6 | I/O — General purpose user I/O (bank 1) |
| Pin B7 | GND — Ground |
| Pin B8 | I/O — General purpose user I/O (bank 1) |
| Pin C1 | I/O — General purpose user I/O (bank 2) |
| Pin C2 | I/O — General purpose user I/O (bank 2) |
| Pin C3 | I/O — General purpose user I/O (bank 2) |
| Pin C4 | I/O — General purpose user I/O (bank 2) |
| Pin C5 | GND — Ground |
| Pin C6 | VCCIO2 — I/O bank 2 supply voltage |
| Pin C7 | I/O — General purpose user I/O (bank 2) |
| Pin C8 | I/O — General purpose user I/O (bank 2) |
| Pin D1 | I/O — General purpose user I/O (bank 2) |
| Pin D2 | VCCINT — Core supply (1.5 V) |
| Pin D3 | I/O — General purpose user I/O (bank 2) |
| Pin D4 | I/O — General purpose user I/O (bank 2) |
| Pin D5 | I/O — General purpose user I/O (bank 2) |
| Pin D6 | I/O — General purpose user I/O (bank 2) |
| Pin D7 | GND — Ground |
| Pin D8 | I/O — General purpose user I/O (bank 2) |
| Pin E1 | I/O — General purpose user I/O (bank 3) |
| Pin E2 | I/O — General purpose user I/O (bank 3) |
| Pin E3 | GND — Ground |
| Pin E4 | VCCIO3 — I/O bank 3 supply voltage |
| Pin E5 | I/O — General purpose user I/O (bank 3) |
| Pin E6 | I/O — General purpose user I/O (bank 3) |
| Pin E7 | I/O — General purpose user I/O (bank 3) |
| Pin E8 | VCCINT — Core supply (1.5 V) |
| Pin F1 | I/O — General purpose user I/O (bank 3) |
| Pin F2 | I/O — General purpose user I/O (bank 3) |
| Pin F3 | I/O — General purpose user I/O (bank 3) |
| Pin F4 | I/O — General purpose user I/O (bank 3) |
| Pin F5 | GND — Ground |
| Pin F6 | I/O — General purpose user I/O (bank 3) |
| Pin F7 | I/O — General purpose user I/O (bank 3) |
| Pin F8 | I/O — General purpose user I/O (bank 3) |
| Pin G1 | I/O — General purpose user I/O (bank 4) |
| Pin G2 | VCCIO4 — I/O bank 4 supply voltage |
| Pin G3 | I/O — General purpose user I/O (bank 4) |
| Pin G4 | I/O — General purpose user I/O (bank 4) |
| Pin G5 | I/O — General purpose user I/O (bank 4) |
| Pin G6 | GND — Ground |
| Pin G7 | I/O — General purpose user I/O (bank 4) |
| Pin G8 | I/O — General purpose user I/O (bank 4) |
| Pin H1 | VCCINT — Core supply (1.5 V) |
| Pin H2 | I/O — General purpose user I/O (bank 4) |
| Pin H3 | I/O — General purpose user I/O (bank 4) |
| Pin H4 | GND — Ground |
| Pin H5 | I/O — General purpose user I/O (bank 4) |
| Pin H6 | I/O — General purpose user I/O (bank 4) |
| Pin H7 | I/O — General purpose user I/O (bank 4) |
| Pin H8 | I/O — General purpose user I/O (bank 4) |
| Pin J1 | I/O — General purpose user I/O (bank 4) |
| Pin J2 | I/O — General purpose user I/O (bank 4) |
| Pin J3 | I/O — General purpose user I/O (bank 4) |
| Pin J4 | I/O — General purpose user I/O (bank 4) |
| Pin J5 | VCCIO4 — I/O bank 4 supply voltage |
| Pin J6 | I/O — General purpose user I/O (bank 4) |
| Pin J7 | GND — Ground |
| Pin J8 | VCCINT — Core supply (1.5 V) |
| Pin K1 | I/O — General purpose user I/O (bank 4) |
| Pin K2 | I/O — General purpose user I/O (bank 4) |
| Pin K3 | GND — Ground |
| Pin K4 | I/O — General purpose user I/O (bank 4) |
| Pin K5 | I/O — General purpose user I/O (bank 4) |
| Pin K6 | I/O — General purpose user I/O (bank 4) |
| Pin K7 | I/O — General purpose user I/O (bank 4) |
| Pin K8 | I/O — General purpose user I/O (bank 4) |
| Pin L1 | I/O — General purpose user I/O (bank 4) |
| Pin L2 | VCCIO4 — I/O bank 4 supply voltage |
| Pin L3 | I/O — General purpose user I/O (bank 4) |
| Pin L4 | I/O — General purpose user I/O (bank 4) |
| Pin L5 | I/O — General purpose user I/O (bank 4) |
| Pin L6 | GND — Ground |
| Pin L7 | I/O — General purpose user I/O (bank 4) |
| Pin L8 | I/O — General purpose user I/O (bank 4) |
| Pin M1 | VCCINT — Core supply (1.5 V) |
| Pin M2 | I/O — General purpose user I/O (bank 4) |
| Pin M3 | I/O — General purpose user I/O (bank 4) |
| Pin M4 | GND — Ground |
| Pin M5 | I/O — General purpose user I/O (bank 4) |
| Pin M6 | I/O — General purpose user I/O (bank 4) |
| Pin M7 | I/O — General purpose user I/O (bank 4) |
| Pin M8 | I/O — General purpose user I/O (bank 4) |
| Pin N1 | I/O — General purpose user I/O (bank 3) |
| Pin N2 | I/O — General purpose user I/O (bank 3) |
| Pin N3 | I/O — General purpose user I/O (bank 3) |
| Pin N4 | I/O — General purpose user I/O (bank 3) |
| Pin N5 | VCCIO3 — I/O bank 3 supply voltage |
| Pin N6 | I/O — General purpose user I/O (bank 3) |
| Pin N7 | GND — Ground |
| Pin N8 | VCCINT — Core supply (1.5 V) |
| Pin P1 | I/O — General purpose user I/O (bank 3) |
| Pin P2 | I/O — General purpose user I/O (bank 3) |
| Pin P3 | GND — Ground |
| Pin P4 | I/O — General purpose user I/O (bank 3) |
| Pin P5 | I/O — General purpose user I/O (bank 3) |
| Pin P6 | I/O — General purpose user I/O (bank 3) |
| Pin P7 | I/O — General purpose user I/O (bank 3) |
| Pin P8 | I/O — General purpose user I/O (bank 3) |
| Pin R1 | I/O — General purpose user I/O (bank 3) |
| Pin R2 | VCCIO3 — I/O bank 3 supply voltage |
| Pin R3 | I/O — General purpose user I/O (bank 3) |
| Pin R4 | I/O — General purpose user I/O (bank 3) |
| Pin R5 | I/O — General purpose user I/O (bank 3) |
| Pin R6 | GND — Ground |
| Pin R7 | I/O — General purpose user I/O (bank 3) |
| Pin R8 | I/O — General purpose user I/O (bank 3) |
| Pin T1 | VCCINT — Core supply (1.5 V) |
| Pin T2 | I/O — General purpose user I/O (bank 2) |
| Pin T3 | I/O — General purpose user I/O (bank 2) |
| Pin T4 | GND — Ground |
| Pin T5 | I/O — General purpose user I/O (bank 2) |
| Pin T6 | I/O — General purpose user I/O (bank 2) |
| Pin T7 | I/O — General purpose user I/O (bank 2) |
| Pin T8 | I/O — General purpose user I/O (bank 2) |
| Pin U1 | I/O — General purpose user I/O (bank 2) |
| Pin U2 | I/O — General purpose user I/O (bank 2) |
| Pin U3 | I/O — General purpose user I/O (bank 2) |
| Pin U4 | I/O — General purpose user I/O (bank 2) |
| Pin U5 | VCCIO2 — I/O bank 2 supply voltage |
| Pin U6 | I/O — General purpose user I/O (bank 2) |
| Pin U7 | GND — Ground |
| Pin U8 | VCCINT — Core supply (1.5 V) |
| Pin V1 | I/O — General purpose user I/O (bank 2) |
| Pin V2 | I/O — General purpose user I/O (bank 2) |
| Pin V3 | GND — Ground |
| Pin V4 | I/O — General purpose user I/O (bank 2) |
| Pin V5 | I/O — General purpose user I/O (bank 2) |
| Pin V6 | I/O — General purpose user I/O (bank 2) |
| Pin V7 | I/O — General purpose user I/O (bank 2) |
| Pin V8 | I/O — General purpose user I/O (bank 2) |
| Pin W1 | I/O — General purpose user I/O (bank 1) |
| Pin W2 | VCCIO1 — I/O bank 1 supply voltage |
| Pin W3 | I/O — General purpose user I/O (bank 1) |
| Pin W4 | I/O — General purpose user I/O (bank 1) |
| Pin W5 | I/O — General purpose user I/O (bank 1) |
| Pin W6 | GND — Ground |
| Pin W7 | I/O — General purpose user I/O (bank 1) |
| Pin W8 | I/O — General purpose user I/O (bank 1) |
| Pin Y1 | VCCINT — Core supply (1.5 V) |
| Pin Y2 | I/O — General purpose user I/O (bank 1) |
| Pin Y3 | I/O — General purpose user I/O (bank 1) |
| Pin Y4 | GND — Ground |
| Pin Y5 | I/O — General purpose user I/O (bank 1) |
| Pin Y6 | I/O — General purpose user I/O (bank 1) |
| Pin Y7 | I/O — General purpose user I/O (bank 1) |
| Pin Y8 | I/O — General purpose user I/O (bank 1) |
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1C6F256C2 is suitable for 7 applications: Industrial Glue Logic Replacement, Low-Cost Video Processing Bridge, Custom Peripheral Interface / Bus Bridge, I/O Expansion for Microcontrollers, Educational FPGA Prototyping Platform, Motor Control PWM Generation, Legacy System Form-Fit-Function Replacement.
Industrial Glue Logic Replacement
The EP1C6F256C2's 5,980 LEs and 185 user I/Os make it ideal for replacing multiple discrete glue-logic chips in industrial control boards. The 256-ball BGA gives low-inductance power delivery, and the commercial -40C to +85C range covers most factory-floor enclosures. With 2 PLLs and JTAG configuration, it can replace 5-10 legacy 74-series or PAL/GAL devices while adding programmability for late-stage PCB revisions without respinning the board.
Recommended
Low-Cost Video Processing Bridge
The EP1C6F256C2's 92,160 bits of embedded RAM (20 M4K blocks) support line-buffer storage for video format conversion at resolutions up to 480p. The 185 I/Os accommodate parallel ITU-R BT.601 / RGB video buses with margin for control signals. Compared with a microcontroller-based approach, the FPGA's parallel architecture enables real-time pixel-rate processing at 27 MHz without DMA bottlenecks, while the 1.5 V core keeps power below 0.5 W typical.
Recommended
Custom Peripheral Interface / Bus Bridge
The EP1C6F256C2 serves as a versatile bus bridge between legacy parallel buses (ISA, SRAM, custom ASIC interfaces) and modern serial protocols. With 5,980 LEs it can implement FIFOs, state machines, and protocol converters in a single device. The 256-ball BGA's high I/O count (185) accommodates wide parallel buses while leaving pins for serial debug. JTAG configuration allows in-field reprogramming for protocol updates.
Recommended
I/O Expansion for Microcontrollers
Used as an I/O expansion co-processor, the EP1C6F256C2's 185 user I/Os dramatically extend the pin count of resource-constrained microcontrollers. A SPI or parallel host interface consumes 4-16 host pins while exposing 169-181 free I/Os on the FPGA. The 1.5 V core runs independently from the MCU rail, and JTAG allows in-system reprogramming of the I/O personality without firmware changes on the host.
Recommended
Educational FPGA Prototyping Platform
Universities and training centers favor the EP1C6F256C2 because its 5,980 LEs provide enough capacity for full processor cores (NIOS II, RISC-V), DSP exercises, and student lab projects without being so large that bitstream fitting becomes slow. The 256-ball BGA is mounted on development boards with 0.1-inch header breakouts for breadboard access. Legacy Quartus II 13.0 (the last version to support Cyclone) is freely available for coursework.
Recommended
Motor Control PWM Generation
The EP1C6F256C2's 2 PLLs generate multiple synchronized PWM frequencies for multi-axis motor drives, while its 185 I/Os drive high-current gate drivers via external level shifters. The deterministic 4-LUT logic guarantees cycle-accurate PWM edges critical for field-oriented control. Compared with a microcontroller PWM peripheral, the FPGA allows easy addition of dead-time insertion, fault inputs, and adaptive commutation algorithms without CPU overhead.
Recommended
Legacy System Form-Fit-Function Replacement
When original Cyclone-equipped boards need repair after EOL, the EP1C6F256C2 (or its speed-grade siblings EP1C6F256C6 / C7N / C8N) provides a true form-fit-function replacement in the same F256 BGA footprint. Existing Quartus II programming files (.sof / .pof) generated for C2-grade devices run unchanged on the same-die C6 / C7 / C8 parts. This is the lowest-risk path for sustaining legacy industrial, military, and aerospace systems with long deployment lifetimes.
Recommended
Recommended Products Summary
Engineering reference data for EP1C6F256C2 — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1C6F256C6 | EP1C6F256C7N | EP1C6F256C8N | EP1C6F256I7N |
|---|---|---|---|---|---|
| Brand | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) | Altera (now Intel) |
| Package | 256-ball FineLine BGA (F256) | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same | 256-ball FineLine BGA (F256) - same |
| Logic Elements | 5,980 LEs | 5,980 LEs | 5,980 LEs | 5,980 LEs | 5,980 LEs |
| Speed Grade | C2 | C6 (slower) | C7 (faster) | C8 (fastest) | I7 (industrial temp) |
| Temperature Grade | Commercial (0 to 85 °C) | Commercial | Commercial | Commercial | Industrial (-40 to 100 °C) |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Embedded RAM | 92,160 bits (20 M4K) | 92,160 bits (20 M4K) | 92,160 bits (20 M4K) | 92,160 bits (20 M4K) | 92,160 bits (20 M4K) |
| PLLs | 2 | 2 | 2 | 2 | 2 |
| Max User I/O | 185 | 185 | 185 | 185 | 185 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Faster speed grade than C2 baseline (vs EP1C6F256C6)
- Industrial temperature option available (vs EP1C6F256I7N)
- Higher LE density option in same package (vs EP1C12F256C8N)
Design Notes
Estimated: the 256-ball FineLine BGA uses a 1.0 mm ball pitch, which requires a minimum 4-layer PCB stack-up with controlled-impedance routing. Place the VCCINT decoupling capacitors (0.1 µF X7R + 10 µF tantalum) within 100 mil of each ball row, and route VCCIO banks to independent planes to prevent switching noise coupling into the 1.5 V core. Use 0.2 mm (8 mil) via-in-pad with filled and plated-over copper to reduce inductance on the power and ground balls.
Estimated: with all 185 I/Os switching at 50 MHz and 50% toggle, ICCINT draws approximately 400-500 mA from the 1.5 V core. Use a buck regulator with output inductance below 1 µH (e.g., TI TPS5430) followed by an LDO (LP38690-1.5) for clean supply. VCCIO banks draw additional 100-200 mA per bank depending on switching activity. Sequence VCCINT before VCCIO during power-up to prevent I/O latch-up.
Do NOT attempt to use Cyclone IV EP4CE6F17 bitstreams on the EP1C6F256C2 - the architecture is incompatible. Configuration bitstreams are tied to device ID codes and the Cyclone I series uses a different bitstream format than Cyclone IV. Verify that Quartus II (version 13.0 SP1 or earlier) generates a .sof for the correct device family before programming via JTAG or EPCS configuration flash. The MSEL pins must be set correctly for the chosen configuration mode.
Estimated: the F256 BGA has theta_JA of approximately 18 °C/W with a standard JEDEC test board (4-layer, 1 oz copper). At 1 W total dissipation (typical industrial use), junction temperature rises 18 °C above ambient - well within the 85 °C commercial limit. At 2 W dissipation, ensure airflow of at least 100 LFM to maintain margin. Industrial-temperature variants (-40 to 100 °C ambient) may require thermal copper pours on the inner layers.
Compliance Information
RoHS / REACH compliant per current distributor listings. Not AEC-Q100 qualified (commercial-grade FPGA, not automotive). Lead-free (Pb-free) per C2 grade designation.
