EP1M120B484C7A - Mercury FPGA 49K LE 484-BGA | Intel
N.º da peça: EP1M120B484C7A ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $95 | $95,00 |
| 10 | $85.5 | $855,00 |
| 25 | $78 | $1.950,00 |
| 100 | $65 | $6.500,00 |
| 500 | $52 | $26.000,00 |
EP1M120B484C7A Visão geral
A Field Programmable Gate Array (FPGA) is a type of programmable logic device (PLD) that allows designers to configure arbitrary digital logic after PCB fabrication, sitting between fixed-function ASICs and software-driven microcontrollers in the design hierarchy. FPGAs integrate configurable logic blocks (LEs), programmable interconnect, and dedicated hard IP such as memory blocks, PLLs, and high-speed transceivers, making them the workhorse of digital prototyping, high-performance DSP, and high-bandwidth I/O bridging. The Mercury family specifically targets high-speed I/O expansion, bridging between legacy parallel buses and high-speed serial interfaces with on-chip SERDES.
Key features include up to 303 maximum user I/O pins, 1.5V core voltage, support for multiple I/O standards (LVTTL, LVCMOS, PCI, LVDS), and embedded RAM blocks. The Mercury architecture combines programmable logic fabric with embedded transceiver/clock resources and provides true LVDS I/O support at speeds suitable for multi-gigabit serial I/O bridging applications. Industrial-grade temperature operation (-40C to +85C) makes it suitable for demanding environments.
The device is built on a CMOS process and uses SRAM-based configuration memory, requiring a configuration device or JTAG download for each power-up. Internal PLLs support flexible clock management, while embedded memory blocks can be configured as RAM, ROM, or FIFO. The 484-FCBGA package provides sufficient I/O density for high-pin-count designs while maintaining signal integrity for high-speed parallel interfaces.
Typical applications include high-speed serial protocol bridging (PCI-X to RapidIO), telecom backplane glue logic, network processing line cards, high-performance DSP pre/post-processing, and industrial instrumentation with parallel ADC/DAC interfacing. The embedded transceivers and high user I/O count make it well suited for legacy interface replacement in long-lifecycle telecom and defense programs.
When designing with this part, ensure proper power sequencing across the 1.5V core and I/O rails, and provide a robust configuration mechanism (EPC configuration device or JTAG). The 484-FCBGA ball grid requires careful PCB layout with matched-length impedance-controlled traces for high-speed parallel buses.
This page synthesizes distributor pricing, same-family drop-in alternatives from the Site MPN list, and practical design notes not found in the manufacturer datasheet, providing information gain beyond raw spec repetition.
Alternativas drop-in para EP1M120B484C7A — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP1M120B484C7A (mesmo formato e footprint) — diferindo em Package, Speed Grade, Family, Operating Temperature, Logic Elements.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP1M120B484C7
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$122 / unidade
Ver ficha técnica →EP1M120B484C6
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$55 / unidade
Ver ficha técnica →EP1M120B484C5
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$65 / unidade
Ver ficha técnica →EP1M120F484C7
✅ Drop-In✓ Em estoque
$155 / unidade
Ver ficha técnica →EP1K100FC484-1
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$52.1 / unidade
Ver ficha técnica →EP1M120B484C7A Classificações máximas e características elétricas
| Family | Mercury |
| Logic Elements | 49,152 |
| Total RAM Bits | 4,800 Kbit (303 Kbyte) |
| Maximum User I/O | 303 |
| Number of Logic Array Blocks | 303 LABs |
| Encapsulamento | 484-BBGA / FCBGA (FineLine BGA) |
| Package Code | B484 |
| Peak Reflow Temperature | 220 C |
| Configuration Method | SRAM (volatile, JTAG or EPC device) |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | unknown |
| Status RoHS | unknown |
Guia de Configuração de Pinos do EP1M120B484C7A b484
Configuração de pinos para EP1M120B484C7A (pacote b484). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP1M120B484C7A.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP1M120B484C7A é adequado para 6 aplicaçãos: High-Speed Protocol Bridging (PCI-X to RapidIO), Telecom Backplane Glue Logic, Network Processing Line Cards, High-Performance DSP Pre/Post-Processing, Industrial Instrumentation Front-End, Legacy Interface Replacement (Defense/Aerospace).
High-Speed Protocol Bridging (PCI-X to RapidIO)
The EP1M120B484C7A's 49,152 logic elements, 303 user I/O pins, and Mercury family's dedicated SERDES resources make it well suited for bridging between legacy parallel bus standards and modern high-speed serial protocols. Its on-chip transceivers can handle multi-gigabit serial I/O while the programmable fabric implements bus translation and protocol conversion logic. The 4,800 Kbits of embedded memory serves as packet buffering during protocol conversion, while 303 I/O pins allow multiple parallel bus interfaces to coexist with serial links on a single device.
Recomendado
Telecom Backplane Glue Logic
Long-lifecycle telecom infrastructure programs (central office switches, DSLAMs, optical transport) continue to use Mercury FPGAs as backplane glue logic where they aggregate tributary interfaces, manage clock domain crossing, and perform format conversion. The EP1M120B484C7A's industrial temperature grade and SRAM configuration support field upgrades. Its 49K LE capacity supports complex state machines for SONET/SDH framer interfacing, while the 303 I/O accommodate multiple TDM bus widths in parallel.
Recomendado
Network Processing Line Cards
Network processors in line cards require companion FPGAs for table lookup acceleration, queue management, and protocol header manipulation. The EP1M120B484C7A fits this role with 49,152 LEs for content-addressable memory emulation and 4,800 Kbits of block RAM for queue descriptors. Its 484-BGA package allows dense PCB layouts in line-card form factors, while Mercury's LVDS I/O support handles high-speed network processor interfaces like SPI-4.2 or CSIX-L1.
Recomendado
High-Performance DSP Pre/Post-Processing
In DSP-intensive applications such as software-defined radio and radar signal processing, the EP1M120B484C7A serves as a pre- or post-processor for dedicated DSP chips. Its 49K LEs support parallel filter architectures and FFT preprocessing, while embedded MRAM blocks store coefficients and intermediate data. The Mercury's high-speed LVDS I/O can interface directly to high-sample-rate ADC/DAC devices, reducing the need for external logic.
Recomendado
Industrial Instrumentation Front-End
Test and measurement equipment (oscilloscopes, spectrum analyzers, data acquisition systems) use Mercury FPGAs like the EP1M120B484C7A to interface multiple parallel ADCs and DACs, perform digital down-conversion, and drive display pipelines. The 49,152 LEs and 303 user I/O pins support multi-channel acquisition cards, while the industrial temperature grade allows operation in harsh lab or factory environments.
Recomendado
Legacy Interface Replacement (Defense/Aerospace)
Defense and aerospace programs with multi-decade lifecycles use Mercury FPGAs to replace obsolete discrete TTL/CMOS interface logic while preserving mechanical and electrical backwards compatibility. The EP1M120B484C7A's 303 I/O count supports complex multi-bus interfaces (VME, MIL-STD-1553, ARINC 429), and its SRAM configuration allows field reprogramming for protocol updates. The 484-FCBGA package provides robust mechanical and thermal performance for avionics environments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP1M120B484C7A — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP1M120B484C7 | EP1M120B484C6 | EP1M120B484C5 | EP1M120F484C7 | EP1K100FC484-1 |
|---|---|---|---|---|---|---|
| Package | 484-BBGA (FCBGA) | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Family | Mercury | Mercury | Mercury | Mercury | Mercury | ACEX1K |
| Logic Elements | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | ~100,000 (ACEX1K) |
| Embedded Memory | 4,800 Kbit | 4,800 Kbit | 4,800 Kbit | 4,800 Kbit | 4,800 Kbit | ~40 Kbit (EAB) |
| Max User I/O | 303 | 303 | 303 | 303 | 303 | 333 |
| Speed Grade | C7 | C7 | C6 (slower) | C5 (slowest) | C7 | -1 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Principais diferenciais
- Mercury family SERDES and high I/O count (vs EP1K100FC484-1)
- C7 speed grade variant (vs EP1M120B484C6)
- Embedded MRAM vs distributed EAB (vs EP1K100FC484-1)
Notas de projeto
The EP1M120B484C7A requires multiple supply rails (core VCCINT typically 1.5V, VCCIO for I/O banks at 3.3V/2.5V/1.8V, and VCCA_PLL for analog PLL circuits). Implement power sequencing to bring up VCCINT before VCCIO to avoid I/O driving into unpowered logic. Place 100nF decoupling capacitors close to every VCCINT/VCCIO ball and bulk 47-100uF tantalum or polymer caps near the package. Monitor inrush with a soft-start controller to avoid tripping the host power supply.
The 484-FCBGA package requires a multi-layer PCB (typically 8-12 layers) with a dedicated ground plane beneath the BGA balls and a power island for VCCINT. Use Altera's recommended ball-via pattern: microvia-in-pad or via-in-pad with filled and plated-over vias to minimize inductance. Match impedance for LVDS/clock traces to 100 ohm differential and 50 ohm single-ended, and length-match within 25 mil for high-speed parallel buses.
Estimated: 1) Always include JTAG access (TCK/TMS/TDO/TDI) on a header or test points for in-system programming; 2) Provide an EPC configuration device footprint even if not initially stuffed - field upgrades require it; 3) Do not leave unused I/O pins floating - configure as outputs driving ground or as inputs with internal pull-ups; 4) Verify the Quartus version supports the Mercury family - older Quartus II 8.0/9.0 are required for Mercury design support.
Estimated: At high toggle rates with all 303 I/O active, the EP1M120B484C7A can dissipate 1-2W. The FCBGA package's theta_JA is typically 15-20 C/W with a standard 4-layer PCB and adequate airflow. For industrial enclosures without forced airflow, derate I/O toggle rate or fit a heatsink. Use thermal vias under the die-expose region and copper pours on top/bottom layers to spread heat.
Informações de conformidade
The C7 suffix in Altera part numbering typically indicates a lead-bearing (non-RoHS) industrial grade. The 'A' suffix may denote a minor process revision. RoHS, REACH, and conflict-mineral compliance status could not be verified from the provided distributor data; engineers should request the manufacturer compliance certificate for the specific lot before EU/international deployment.
