EP1M120B484C7A - Mercury FPGA 49K LE 484-BGA | Intel
MPN: EP1M120B484C7A ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $95 | $95.00 |
| 10 | $85.5 | $855.00 |
| 25 | $78 | $1,950.00 |
| 100 | $65 | $6,500.00 |
| 500 | $52 | $26,000.00 |
Drop-in alternatives for EP1M120B484C7A — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
EP1M120B484C7
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$122 / Unit
View Datasheet →EP1M120B484C6
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$55 / Unit
View Datasheet →EP1M120B484C5
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$65 / Unit
View Datasheet →EP1M120F484C7
✅ Drop-In✓ In Stock
$155 / Unit
View Datasheet →EP1K100FC484-1
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$52.1 / Unit
View Datasheet →EP1M120B484C7A Maximum Ratings & Electrical Characteristics
| Family | Mercury |
| Logic Elements | 49,152 |
| Total RAM Bits | 4,800 Kbit (303 Kbyte) |
| Maximum User I/O | 303 |
| Number of Logic Array Blocks | 303 LABs |
| Package | 484-BBGA / FCBGA (FineLine BGA) |
| Package Code | B484 |
| Peak Reflow Temperature | 220 C |
| Configuration Method | SRAM (volatile, JTAG or EPC device) |
| Mounting Type | Surface Mount (BGA) |
| RoHS Status | unknown |
| RoHS Status | unknown |
EP1M120B484C7A b484 Pin Configuration Guide
Complete pinout information for EP1M120B484C7A (b484 package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for EP1M120B484C7A.
Refer to the datasheet for full pin configuration.
Safe Operating Area (SOA) & Thermal Characteristics
No official SOA curve available for this digital IC. Always operate within absolute maximum ratings specified in the datasheet. Ensure adequate cooling and derate as needed.
Typical Applications
EP1M120B484C7A is suitable for 6 applications: High-Speed Protocol Bridging (PCI-X to RapidIO), Telecom Backplane Glue Logic, Network Processing Line Cards, High-Performance DSP Pre/Post-Processing, Industrial Instrumentation Front-End, Legacy Interface Replacement (Defense/Aerospace).
High-Speed Protocol Bridging (PCI-X to RapidIO)
The EP1M120B484C7A's 49,152 logic elements, 303 user I/O pins, and Mercury family's dedicated SERDES resources make it well suited for bridging between legacy parallel bus standards and modern high-speed serial protocols. Its on-chip transceivers can handle multi-gigabit serial I/O while the programmable fabric implements bus translation and protocol conversion logic. The 4,800 Kbits of embedded memory serves as packet buffering during protocol conversion, while 303 I/O pins allow multiple parallel bus interfaces to coexist with serial links on a single device.
Recommended
Telecom Backplane Glue Logic
Long-lifecycle telecom infrastructure programs (central office switches, DSLAMs, optical transport) continue to use Mercury FPGAs as backplane glue logic where they aggregate tributary interfaces, manage clock domain crossing, and perform format conversion. The EP1M120B484C7A's industrial temperature grade and SRAM configuration support field upgrades. Its 49K LE capacity supports complex state machines for SONET/SDH framer interfacing, while the 303 I/O accommodate multiple TDM bus widths in parallel.
Recommended
Network Processing Line Cards
Network processors in line cards require companion FPGAs for table lookup acceleration, queue management, and protocol header manipulation. The EP1M120B484C7A fits this role with 49,152 LEs for content-addressable memory emulation and 4,800 Kbits of block RAM for queue descriptors. Its 484-BGA package allows dense PCB layouts in line-card form factors, while Mercury's LVDS I/O support handles high-speed network processor interfaces like SPI-4.2 or CSIX-L1.
Recommended
High-Performance DSP Pre/Post-Processing
In DSP-intensive applications such as software-defined radio and radar signal processing, the EP1M120B484C7A serves as a pre- or post-processor for dedicated DSP chips. Its 49K LEs support parallel filter architectures and FFT preprocessing, while embedded MRAM blocks store coefficients and intermediate data. The Mercury's high-speed LVDS I/O can interface directly to high-sample-rate ADC/DAC devices, reducing the need for external logic.
Recommended
Industrial Instrumentation Front-End
Test and measurement equipment (oscilloscopes, spectrum analyzers, data acquisition systems) use Mercury FPGAs like the EP1M120B484C7A to interface multiple parallel ADCs and DACs, perform digital down-conversion, and drive display pipelines. The 49,152 LEs and 303 user I/O pins support multi-channel acquisition cards, while the industrial temperature grade allows operation in harsh lab or factory environments.
Recommended
Legacy Interface Replacement (Defense/Aerospace)
Defense and aerospace programs with multi-decade lifecycles use Mercury FPGAs to replace obsolete discrete TTL/CMOS interface logic while preserving mechanical and electrical backwards compatibility. The EP1M120B484C7A's 303 I/O count supports complex multi-bus interfaces (VME, MIL-STD-1553, ARINC 429), and its SRAM configuration allows field reprogramming for protocol updates. The 484-FCBGA package provides robust mechanical and thermal performance for avionics environments.
Recommended
Recommended Products Summary
Engineering reference data for EP1M120B484C7A — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | EP1M120B484C7 | EP1M120B484C6 | EP1M120B484C5 | EP1M120F484C7 | EP1K100FC484-1 |
|---|---|---|---|---|---|---|
| Package | 484-BBGA (FCBGA) | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-BBGA - same | 484-FBGA - same |
| Brand | Intel (Altera) | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same | Intel (Altera) - same |
| Family | Mercury | Mercury | Mercury | Mercury | Mercury | ACEX1K |
| Logic Elements | 49,152 | 49,152 | 49,152 | 49,152 | 49,152 | ~100,000 (ACEX1K) |
| Embedded Memory | 4,800 Kbit | 4,800 Kbit | 4,800 Kbit | 4,800 Kbit | 4,800 Kbit | ~40 Kbit (EAB) |
| Max User I/O | 303 | 303 | 303 | 303 | 303 | 333 |
| Speed Grade | C7 | C7 | C6 (slower) | C5 (slowest) | C7 | -1 |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
Key Differentiators
- Mercury family SERDES and high I/O count (vs EP1K100FC484-1)
- C7 speed grade variant (vs EP1M120B484C6)
- Embedded MRAM vs distributed EAB (vs EP1K100FC484-1)
Design Notes
The EP1M120B484C7A requires multiple supply rails (core VCCINT typically 1.5V, VCCIO for I/O banks at 3.3V/2.5V/1.8V, and VCCA_PLL for analog PLL circuits). Implement power sequencing to bring up VCCINT before VCCIO to avoid I/O driving into unpowered logic. Place 100nF decoupling capacitors close to every VCCINT/VCCIO ball and bulk 47-100uF tantalum or polymer caps near the package. Monitor inrush with a soft-start controller to avoid tripping the host power supply.
The 484-FCBGA package requires a multi-layer PCB (typically 8-12 layers) with a dedicated ground plane beneath the BGA balls and a power island for VCCINT. Use Altera's recommended ball-via pattern: microvia-in-pad or via-in-pad with filled and plated-over vias to minimize inductance. Match impedance for LVDS/clock traces to 100 ohm differential and 50 ohm single-ended, and length-match within 25 mil for high-speed parallel buses.
Estimated: 1) Always include JTAG access (TCK/TMS/TDO/TDI) on a header or test points for in-system programming; 2) Provide an EPC configuration device footprint even if not initially stuffed - field upgrades require it; 3) Do not leave unused I/O pins floating - configure as outputs driving ground or as inputs with internal pull-ups; 4) Verify the Quartus version supports the Mercury family - older Quartus II 8.0/9.0 are required for Mercury design support.
Estimated: At high toggle rates with all 303 I/O active, the EP1M120B484C7A can dissipate 1-2W. The FCBGA package's theta_JA is typically 15-20 C/W with a standard 4-layer PCB and adequate airflow. For industrial enclosures without forced airflow, derate I/O toggle rate or fit a heatsink. Use thermal vias under the die-expose region and copper pours on top/bottom layers to spread heat.
Compliance Information
The C7 suffix in Altera part numbering typically indicates a lead-bearing (non-RoHS) industrial grade. The 'A' suffix may denote a minor process revision. RoHS, REACH, and conflict-mineral compliance status could not be verified from the provided distributor data; engineers should request the manufacturer compliance certificate for the specific lot before EU/international deployment.
