EP20K600CF672C9N - 600K Gate APEX 20KC FPGA | Intel | BGA-672
N.º da peça: EP20K600CF672C9N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $255 | $2.550,00 |
| 100 | $220 | $22.000,00 |
| 500 | $195 | $97.500,00 |
| 1.000 | $175 | $175.000,00 |
EP20K600CF672C9N Visão geral
A Field-Programmable Gate Array (FPGA) is a reconfigurable semiconductor that lets engineers implement arbitrary digital logic via an SRAM or antifuse configuration bitstream. APEX 20KC sits within the broader taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit -> semiconductor. It supersedes the APEX 20KE family by integrating MultiCore architecture with embedded system blocks, and is targeted at ASIC-replacement and high-bandwidth glue-logic designs in telecommunications, video processing, and industrial control.
Key features include a 1.71 V to 1.89 V core supply (nominally 1.8 V), 250 MHz internal operating frequency, 1.48 ns pin-to-pin delay, fine-grain Look-Up Table (LUT) logic elements, dedicated carry chains, and a thermally enhanced FC-FBGA package. The device supports in-system reconfigurability through the IEEE 1149.1 JTAG interface, plus passive or active serial configuration modes, enabling remote firmware updates without powering down the host system.
The EP20K600CF672C9N integrates MultiCore blocks that combine LUT-based logic, embedded array blocks (EABs), and FastTrack interconnect, supporting up to 311,000 RAM bits. Its 672-pin FineLine BGA at 1.00 mm pitch allows dense board layouts, while the 0 to 85 C commercial temperature grade suits indoor and controlled-airflow chassis. Architecture is centered on SRAM-based configuration memory that must be loaded at every power-up, so designers typically pair the FPGA with a configuration PROM such as the EPC16 or EPC2.
Typical applications include high-speed telecom line cards, video broadcast encoders, industrial motor control, and ASIC prototyping. With 600K gates of logic capacity, the EP20K600CF672C9N is also deployed in test-and-measurement equipment and high-performance DSP front-ends where parallel datapath throughput matters more than raw clock frequency.
When designing with this part, ensure the 1.8 V core rail is monotonic at power-up; non-monotonic ramps can corrupt SRAM configuration. Decoupling requires 0.1 µF and 10 µF capacitors placed within 5 mm of each power pin, and the JTAG chain must include a series 33 ohm termination to dampen reflections on the TCK line.
This page synthesizes distributor pricing, drop-in APEX 20KC family alternatives, and practical JTAG/power-ramp design notes not aggregated in any single manufacturer datasheet.
Alternativas drop-in para EP20K600CF672C9N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP20K600CF672C9N (mesmo formato e footprint) — diferindo em Operating Temperature, Process Technology, Package, Speed Grade, RoHS Status.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP20K600CF672C9
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$171 / unidade
Ver ficha técnica →EP20K600CF672C8N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$108 / unidade
Ver ficha técnica →EP20K600CF672C7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$108 / unidade
Ver ficha técnica →EP20K600CF672-3
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$99.5 / unidade
Ver ficha técnica →EP20K600CB672C8N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$69 / unidade
Ver ficha técnica →EP20K600CF672C9N Classificações máximas e características elétricas
| Family | APEX 20KC |
| Device Type | Loadable PLD / SRAM FPGA |
| System Gates | 600,000 |
| Logic Elements | 24,320 |
| Maximum Operating Frequency | 250 MHz |
| Propagation Delay | 1.48 ns (per logic element) |
| Core Supply Voltage | 1.71 V to 1.89 V (1.8 V nominal) |
| User I/Os | 488 |
| Total Terminals | 672 |
| Package Type | FineLine BGA (FC-FBGA), 1.00 mm pitch, 45 x 45 mm |
| Process Technology | 0.15 µm all-layer copper |
| Temperatura de operação | 0 C to 85 C (commercial) |
| Tipo de montagem | Surface Mount |
| Configuration Interface | JTAG (IEEE 1149.1), passive serial, active serial |
| Embedded Memory | MultiCore EABs supporting up to 311,000 RAM bits |
Guia de Configuração de Pinos do EP20K600CF672C9N fineline bga (fc-fbga), 1.00 mm pitch, 45 x 45 mm
Configuração de pinos para EP20K600CF672C9N (pacote fineline bga (fc-fbga), 1.00 mm pitch, 45 x 45 mm). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP20K600CF672C9N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP20K600CF672C9N é adequado para 6 aplicaçãos: Telecom Line Card Processing, Video Broadcast Encoder, ASIC Prototyping Platform, Industrial Motor Control, Test and Measurement Backplane, High-Performance DSP Front-End.
Telecom Line Card Processing
The EP20K600CF672C9N fits telecom line card datapaths because its 600K system gates, 24,320 logic elements, and 488 user I/Os can implement multi-channel packet classification, traffic shaping, and 10G MAC framer glue logic in a single device. Its 250 MHz internal Fmax supports line-rate processing on STS-192/STM-64 backplanes, while the 672-ball FC-FBGA package provides the high pin count required for parallel 64-bit datapath buses. Designers typically pair it with a POS-PHY Level-4 PHY or a quad SFI-4.2 SERDES companion.
Recomendado
Video Broadcast Encoder
The EP20K600CF672C9N's 24,320 logic elements and 311 kbit embedded memory support real-time HD-SDI video encoding pipelines, including discrete cosine transform, motion estimation, and entropy coding blocks. Its 488 I/O pins accommodate 10-bit parallel video buses at 148.5 MHz pixel clock with room for audio embedding and ancillary data paths. The 1.8 V core and 0 to 85 C commercial temperature range suit studio-grade chassis without active cooling, and the FC-FBGA package's 1.00 mm pitch supports dense multi-board chassis layouts.
Recomendado
ASIC Prototyping Platform
The EP20K600CF672C9N delivers 600K gates of SRAM-based logic capacity, making it an ideal platform for ASIC prototyping where designers map RTL designs onto the FPGA for hardware verification before tape-out. Its fine-grain LUT architecture preserves synthesis timing fidelity versus the target ASIC, and the JTAG interface enables rapid bitstream reload cycles during iterative debug. The 672-ball FC-FBGA package with 488 user I/Os gives prototype boards ample stimulus/observation channels, and the 1.8 V core simplifies bench power design.
Recomendado
Industrial Motor Control
The EP20K600CF672C9N handles multi-axis industrial servo and stepper control loops where its 250 MHz performance drives simultaneous FOC, space-vector PWM, and encoder interface logic for up to 6 axes. Its 488 user I/Os accept quadrature encoder inputs from multiple motors, while the SRAM-based configuration supports field firmware updates over JTAG or active serial. The commercial 0 to 85 C operating range and surface-mount FC-FBGA package fit sealed industrial enclosures with conduction cooling.
Recomendado
Test and Measurement Backplane
The EP20K600CF672C9N's high logic density and 488 I/Os make it well suited for protocol-aware test equipment backplanes, implementing multi-lane BERT, pattern generator, and protocol decoder functions in a single FPGA. Its 1.48 ns propagation delay per logic element ensures deterministic timing margins for compliance test fixtures, while the 1.00 mm pitch BGA simplifies multi-board stack assembly. Designers use the JTAG port for boundary-scan and In-System Programmability to update test patterns without disassembling the chassis.
Recomendado
High-Performance DSP Front-End
The EP20K600CF672C9N supports radar, sonar, and software-defined radio DSP front-ends where its 24,320 logic elements implement multi-tap FIR filters, FFT butterflies, and digital down-conversion in parallel. Its 250 MHz internal Fmax drives sample rates up to 200 MSPS on 16-bit datapaths, while the 488 user I/Os accept multiple ADC/DAC channels with margin for control and status. The SRAM configuration enables runtime reconfiguration for mode switching between radar pulse profiles or radio waveforms.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP20K600CF672C9N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP20K600CF672C9 | EP20K600CF672C8N | EP20K600CF672C7N | EP20K600CF672-3 | EP20K600CB672C8N |
|---|---|---|---|---|---|---|
| Package | 672-ball FC-FBGA | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same | 672-ball FC-FBGA - same |
| Brand | Intel | Intel - same | Intel - same | Intel - same | Intel - same | Intel - same |
| System Gates | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 | 600,000 |
| Speed Grade | 9 (fastest) | 9 | 8 | 7 | 3 (industrial) | 8 |
| User I/Os | 488 | 488 | 488 | 488 | 488 | 488 |
| Internal Fmax | 250 MHz | 250 MHz | 200 MHz | 170 MHz | 230 MHz | 200 MHz |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C | 0 C to 85 C | 0 C to 85 C | -40 C to 85 C (industrial) | 0 C to 85 C |
| Configuration Interface | JTAG, passive serial, active serial | Same | Same | Same | Same | Same |
Principais diferenciais
- Highest APEX 20KC speed grade (9) with 250 MHz Fmax (vs EP20K600CF672C8N)
- Industrial temperature range option in same package (vs EP20K600CF672-3)
- SRAM-configurable vs. once-only antifuse alternatives (vs EP20K600CF672C7N)
Notas de projeto
The 1.8 V VCCINT rail must rise monotonically within 1 ms to avoid SRAM configuration memory corruption. Estimated: at 250 MHz and typical 60% toggle rate, the EP20K600CF672C9N draws roughly 1.5 A from VCCINT and 0.4 A from VCCIO, so use a 3 A LDO or buck converter with at least 10 µF bulk + 0.1 µF decoupling within 5 mm of each power ball. Tie all unused VCCIO pins to the active I/O bank supply.
The 672-ball FC-FBGA at 1.00 mm pitch requires microvia or laser-drilled stacked-via PCB technology. Per Altera APEX 20KC layout guidelines, escape-route the inner balls on a 0.5 mm grid with via-in-pad if board area is constrained, and use a 6-8 layer stackup with dedicated ground planes beneath the BGA. Ground balls should be stitched with at least 8 vias each to a continuous ground plane.
Series-terminate each LVTTL/LVCMOS output to 33 ohm at the FPGA pin to dampen reflections on the 50 ohm microstrip traces. Estimated: at 250 MHz toggle, trace lengths above 50 mm require source termination. For DDR-style interfaces, place the resistor 5 mm from the FPGA ball, and use signal-length matching to within 1.5 mm across the byte lane.
Do not leave CONFIG_DONE floating - tie it to VCCIO through a 10 kohm pull-up so the FPGA signals completion of configuration. A floating CONFIG_DONE can prevent downstream devices from seeing a valid configuration. Also, JTAG TCK requires a 33 ohm series termination at the FPGA pin to dampen ringing on long daisy-chained scan paths.
Informações de conformidade
Compliance status not specified in verified web data; the APEX 20KC family predates many modern compliance declarations. RoHS status flagged as [DATA_NEEDED] in specs.
