EP20K600EBC652-3 - APEX 20KE FPGA 600K 488 I/O BGA-652 | Intel
N.º da peça: EP20K600EBC652-3 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $446.4 | $446,40 |
| 10 | $420 | $4.200,00 |
| 100 | $380 | $38.000,00 |
| 250 | $360 | $90.000,00 |
| 500 | $340 | $170.000,00 |
EP20K600EBC652-3 Visão geral
What is an FPGA? An FPGA (Field Programmable Gate Array) is a programmable logic device that lets engineers implement custom digital circuits via a hardware description language. The APEX 20KE family introduced embedded memory blocks and Look-Up Table (LUT) based logic on a unified fabric, positioning FPGAs above CPLDs and below fixed-function ASICs in the programmable logic taxonomy: CPLD -> SPLD -> FPGA -> ASIC -> ASSP. The EP20K600EBC652-3 belongs to the high-density end of this hierarchy.
Key features include 24320 LEs, 311296 embedded SRAM bits organized in EABs (Embedded Array Blocks), 488 user I/Os, four phase-locked loops (PLLs) for clock management, multi-volt I/O support for interfacing to 3.3 V, 2.5 V, and 1.8 V rails, and in-system programmability via JTAG. The device is built on a 0.15-micron copper CMOS process with 1.8 V core voltage.
The architectural depth lies in the PLD's hybrid logic-and-memory fabric: each Logic Array Block (LAB) contains ten LEs, while the EAB blocks deliver dual-port RAM, ROM, or content-addressable memory. PLLs provide on-chip clock multiplication, division, and phase shifting, removing the need for external clock buffers in many designs. The 1.48 ns propagation delay per LE and high I/O count suit multi-channel data processing systems.
Typical applications include telecommunication line cards, ASIC prototyping, high-speed image processing, DSP co-processing, network routers, and industrial automation controllers. With 488 user I/Os, the device can interface directly to legacy PCI, LVDS, and parallel SRAM buses without external glue logic.
When designing with this part, verify that your power supply can deliver the in-rush current required during configuration. The 652-ball BGA demands a 6-layer or thicker PCB with controlled-impedance traces. Quartus II design software (legacy versions) is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in APEX 20KE alternatives, and practical BGA design notes not aggregated on the manufacturer datasheet, giving procurement and engineering teams a single reference for sourcing and replacement decisions.
Alternativas drop-in para EP20K600EBC652-3 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP20K600EBC652-3 (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Process Technology, Family, Logic Elements.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP20K600EBC652-2X
✅ Drop-In✓ Em estoque
$275 / unidade
Ver ficha técnica →EP20K600EBC652-1X
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →EP20K600CB652C7
✅ Drop-In✓ Em estoque
$1320 / unidade
Ver ficha técnica →EP20K600CB652C8
✅ Drop-In✓ Em estoque
$105 / unidade
Ver ficha técnica →EP20K600CB652C9
✅ Drop-In✓ Em estoque
$142.5 / unidade
Ver ficha técnica →EP20K600CB652I7
✅ Drop-In✓ Em estoque
$149 / unidade
Ver ficha técnica →EP20K600EBC652-3 Classificações máximas e características elétricas
| Series | APEX-20KE |
| Family | APEX 20K |
| Device Type | FPGA (Field Programmable Gate Array) / SPLD Loadable |
| Logic Elements | 24320 |
| Embedded Memory | 311296 bits |
| User I/Os | 488 |
| Number of Terminals | 652 |
| Package Type | BGA-652 (45 x 45 mm, 1.27 mm pitch) |
| Tipo de montagem | Surface Mount |
| Propagation Delay | 1.48 ns |
| Temperatura de operação | 0 C to 85 C |
| Speed Grade | -3 |
| Process Technology | 0.15-micron all-layer copper CMOS |
| I/O Voltage Support | Multi-volt 3.3 V / 2.5 V / 1.8 V |
| Configuration Method | JTAG / serial / passive parallel |
| PLLs | 4 |
Guia de Configuração de Pinos do EP20K600EBC652-3 bga-652 (45 x 45 mm, 1.27 mm pitch)
Configuração de pinos para EP20K600EBC652-3 (pacote bga-652 (45 x 45 mm, 1.27 mm pitch)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP20K600EBC652-3.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP20K600EBC652-3 é adequado para 6 aplicaçãos: Telecommunication Line Cards, ASIC Prototyping and Emulation, High-Speed Image Processing Pipelines, Network Routers and Switches, DSP Co-Processing, Industrial Automation Controllers.
Telecommunication Line Cards
The EP20K600EBC652-3's 24320 logic elements and 488 user I/Os enable single-chip implementation of multi-channel T1/E1 framer, HDLC controller, and ATM segmentation-and-reassembly engines. With 311296 bits of embedded SRAM organized in EAB blocks, the device buffers packet payloads on-chip, reducing external memory cost. The four on-chip PLLs provide independent clock domains for TDM buses, Ethernet MACs, and backplane SERDES, while the 1.48 ns propagation delay per LE supports 155 MHz Utopia/Posphy interfaces. APEX 20KE was widely deployed in legacy ATM switches and SONET/SDH add-drop multiplexers where pin density and multi-volt I/O were critical.
Recomendado
ASIC Prototyping and Emulation
The EP20K600EBC652-3 provides ASIC prototyping capacity for designs targeting up to 600K gates, with 24320 LEs and 311296 embedded memory bits allowing direct mapping of mid-complexity ASIC RTL. Quartus II synthesis can target the device directly, and the multi-volt I/O banks (1.8 V, 2.5 V, 3.3 V) allow the FPGA to emulate mixed-voltage ASIC interfaces without level shifters. Engineers use multiple EP20K600EBC652-3 devices in parallel emulation rigs to prototype gate-array-class ASICs before mask commitment, validating functional correctness and timing closure at near-real-time speeds.
Recomendado
High-Speed Image Processing Pipelines
The EP20K600EBC652-3's 488 user I/Os and 311296 embedded SRAM bits make it ideal for multi-channel video capture and pre-processing pipelines. Engineers can interface directly to LVDS camera links, BT.656 video streams, and parallel image sensors without external bridge logic. The four PLLs generate independent pixel clocks for multi-camera arrays, while the EAB blocks implement line buffers and convolution kernels in dual-port RAM mode. The 1.48 ns propagation delay supports 80-100 MHz pixel rates, sufficient for standard-definition and entry-level HD video pipelines used in machine vision and medical imaging.
Recomendado
Network Routers and Switches
With 488 user I/Os, the EP20K600EBC652-3 interfaces directly to multiple Gigabit Ethernet MACs, switch fabrics, and packet memory buses in mid-range routers and Layer-2/3 switches. The 24320 LEs implement forwarding tables, QoS schedulers, and packet classifiers, while 311296 embedded SRAM bits provide on-chip CAM-like structures for MAC address lookup. The four PLLs generate independent clocks for fabric, PHY, and CPU interface domains. APEX 20KE was deployed in legacy enterprise switches from multiple OEMs in the early 2000s and remains in long-lifecycle telecom deployments.
Recomendado
DSP Co-Processing
The EP20K600EBC652-3 serves as a co-processor alongside DSP chips in radar, sonar, and software-defined radio systems, offloading FFT, Viterbi decoding, and baseband modulation tasks. Its 24320 LEs implement parallel FIR filters and correlators at sample rates exceeding 100 MHz, while the 311296 embedded memory bits hold FFT twiddle factors and Viterbi trellis data. The 488 user I/Os provide glueless connection to TI TMS320C6000 or Analog Devices SHARC DSP hosts via external memory interface (EMIF) or host port. Multi-volt I/O support allows direct connection to 3.3 V DSP buses without level translation.
Recomendado
Industrial Automation Controllers
The EP20K600EBC652-3 functions as a programmable logic controller (PLC) and motion controller in factory automation systems, where its 24320 LEs implement multiple PID loops, encoder counters, and fieldbus interfaces simultaneously. The 488 user I/Os connect directly to multi-axis servo drives, stepper motor controllers, and industrial sensor arrays. The four PLLs generate independent timing for CAN, PROFIBUS, and EtherCAT fieldbus segments. The 0 to 85 C operating range covers typical factory-floor environments, and the 652-ball BGA provides mechanical robustness against industrial vibration profiles.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP20K600EBC652-3 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP20K600EBC652-2X | EP20K600EBC652-1X | EP20K600CB652C7 | EP20K600CB652I7 |
|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | BGA-652 (45x45 mm) | BGA-652 (45x45 mm) - same | BGA-652 (45x45 mm) - same | BGA-652 (45x45 mm) - same | BGA-652 (45x45 mm) - same |
| Logic Elements | 24320 | 24320 - same | 24320 - same | 24320 - same | 24320 - same |
| Embedded Memory (bits) | 311296 | 311296 - same | 311296 - same | 311296 - same | 311296 - same |
| User I/Os | 488 | 488 - same | 488 - same | 488 - same | 488 - same |
| Speed Grade | -3 (fastest) | -2X (slower) | -1X (slowest) | C7 | I7 |
| Operating Temperature | 0 C to 85 C | 0 C to 85 C - same | 0 C to 85 C - same | 0 C to 85 C - same | -40 C to 100 C (industrial) |
Principais diferenciais
- Highest speed grade in the APEX 20KE 652-ball family (vs EP20K600EBC652-2X)
- Commercial temperature range versus industrial variant (vs EP20K600CB652I7)
- Highest user I/O density for 652-ball package in the APEX family (vs EP20K400EBC652-3)
Notas de projeto
Estimated: At typical APEX 20KE power consumption of approximately 3-5 W in the 652-ball BGA, the device requires a thermal pad or copper pour on the PCB. The 652-ball BGA exposes a thermal pad on the underside that should be soldered to a thermal via array (typically 4x4 or 5x5 vias on 1.0 mm pitch) connecting to inner-layer copper planes. Without this thermal path, the junction temperature may exceed the 85 C ambient limit during continuous operation at high toggle rates.
The 652-ball BGA at 1.27 mm pitch demands a 6-layer or thicker PCB with microvia or via-in-pad technology for reliable assembly. Solder paste stencil apertures should be 0.4 mm diameter for the 1.27 mm pitch balls, and reflow profile must follow JEDEC J-STD-020 MSL-3 handling for moisture-sensitive devices. PCB design must include matched-length traces within 150 mils for LVDS pairs to maintain signal integrity at 100 MHz+ toggle rates.
Estimated: APEX 20KE devices require separate VCCINT (1.8 V core) and VCCIO (3.3 V / 2.5 V / 1.8 V I/O bank) rails. Decoupling requires at least one 100 uF bulk capacitor per rail plus 0.1 uF and 0.01 uF ceramic capacitors placed within 5 mm of each power pin pair. Power-on sequencing must ensure VCCINT ramps before VCCIO to prevent I/O latchup; the device tolerates simultaneous ramp but recommends VCCIO >= VCCINT - 0.5 V during power-up.
The APEX 20KE family requires Quartus II version 9.0 or earlier for synthesis; Quartus Prime has dropped support entirely. New bitstreams cannot be generated in modern toolchains. When sourcing pre-programmed parts, verify the configuration mode (passive serial vs JTAG) and ensure the EPC configuration device or microcontroller can supply the correct bitstream format.
Informações de conformidade
RoHS and lead-free status not specified in available data. APEX 20KE is an obsolete family; original datasheets predate current RoHS documentation. For automotive applications, AEC-Q100 qualification is not applicable to this commercial-grade device.
