EP2A25F672I-9 - APEX II 25K LUT FPGA, 672-BGA | Intel / Altera
N.º da peça: EP2A25F672I-9 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2.650,00 |
| 100 | $240 | $24.000,00 |
| 500 | $215 | $107.500,00 |
| 1.000 | $195 | $195.000,00 |
EP2A25F672I-9 Visão geral
An FPGA (Field Programmable Gate Array) is a programmable logic device that allows engineers to implement custom digital logic, memory, and I/O functions on a single silicon die after manufacturing. APEX II sits within the programmable logic hierarchy as: FPGA -> programmable logic device (PLD) -> logic IC -> semiconductor. APEX II specifically integrates MultiCore architecture with embedded system blocks (ESBs) for RAM/ROM/CAM and supports LVDS, LVTTL, LVCMOS, and PCI I/O standards, providing a single-chip solution for glue-logic replacement and high-speed bus interfacing.
Key features of the EP2A25F672I-9 include up to 25,000 logic elements, 1,125 Kbits of ESB memory, four phase-locked loops (PLLs), high-speed clock networks, and up to 16 high-speed transceiver-like channels via LVDS pairs. The 672-pin FCBGA package provides ample I/O count for parallel buses and memory interfaces, while the industrial temperature grade (-40 °C to +100 °C junction, indicated by the 'I' suffix) and speed grade -9 place it in the mid-density, mid-performance segment of the APEX II family.
Typical applications for the EP2A25F672I-9 span telecom backplane bridging, custom bus controllers (PCI to local bus, VME to PCI), high-speed image pre-processing pipelines, and DSP coprocessor interfaces. Designers typically pair it with external SRAM or SDRAM and a small CPLD for configuration supervision, with Quartus II software (legacy, available from the Intel FPGA archive) used for synthesis, place-and-route, and bitstream generation.
When designing with this device, allocate sufficient PCB area for the 672-ball BGA fanout and use at least six PCB routing layers with microvia technology. Confirm that the chosen configuration EPROM or JTAG programmer supports the APEX II bitstream format, and respect the 1.5 V/1.8 V core voltage sequencing required by the -9 speed grade datasheet.
This page synthesizes distributor availability, same-family alternatives, and practical design notes for engineers evaluating the EP2A25F672I-9 against modern FPGA migration paths or last-time-buy sourcing.
Alternativas drop-in para EP2A25F672I-9 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2A25F672I-9 (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade, Embedded Memory, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2A25F672I-7
✅ Drop-In✓ Em estoque
$171 / unidade
Ver ficha técnica →EP2A25F672ES
✅ Drop-In✓ Em estoque
$198 / unidade
Ver ficha técnica →EP2A25F672C9
✅ Drop-In✓ Em estoque
$700 / unidade
Ver ficha técnica →EP2A25F672C8
✅ Drop-In✓ Em estoque
$951.18 / unidade
Ver ficha técnica →EP2A25F672C7
✅ Drop-In✓ Em estoque
$118 / unidade
Ver ficha técnica →EP2A25F672I-9 Classificações máximas e características elétricas
| Family | APEX II |
| Logic Elements (typical) | 25,000 |
| Embedded System Blocks (ESB) Memory | 1,125 Kbits |
| Number of PLLs | 4 |
| Process Technology | 0.18 µm CMOS |
| Core Voltage | 1.5 V / 1.8 V (speed-grade dependent) |
| Operating Temperature Grade | Industrial (-40 °C to +100 °C junction) |
| Speed Grade | -9 |
| Encapsulamento | 672-pin FCBGA (FineLine BGA) |
| Tipo de montagem | Surface Mount (BGA) |
| Nível de sensibilidade à umidade (MSL) | 3 (per Vyrian listing) |
| Peak Reflow Temperature | 220 °C (per Vyrian listing) |
| Configuration Method | JTAG / serial configuration EPROM |
| Supported I/O Standards | LVTTL, LVCMOS, LVDS, PCI |
| Legacy Status | Obsolete - consult Altera / Intel FPGA archive for documentation |
Guia de Configuração de Pinos do EP2A25F672I-9 672-pin fcbga (fineline bga)
Configuração de pinos para EP2A25F672I-9 (pacote 672-pin fcbga (fineline bga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2A25F672I-9.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2A25F672I-9 é adequado para 6 aplicaçãos: Telecom Backplane Bridging, Custom Bus Controllers (PCI to Local Bus), DSP Coprocessor Pre-Processing Pipelines, Image Pre-Processing Front-Ends, Legacy Industrial Control PLC Backplanes, Avionics Databus Interfaces (Mil-Std-1553 / ARINC 429).
Telecom Backplane Bridging
The EP2A25F672I-9 fits telecom backplane bridging because its 25,000 logic elements and four PLLs deliver parallel datapath fabric for protocol conversion between legacy TDM buses (H.110, MVIP) and packet backplanes. Its LVDS and LVTTL I/O support up to 16 high-speed serial-like channels, and the 672-pin FCBGA exposes sufficient I/O for dual redundant backplane interfaces. Industrial temperature grade makes it usable in central-office environments without derating. Designers typically pair the device with a small EPCS configuration EPROM and a power sequencer for the 1.5 V/1.8 V rails.
Recomendado
Custom Bus Controllers (PCI to Local Bus)
With PCI-compliant I/O support and up to 25,000 logic elements, the EP2A25F672I-9 fits custom PCI-to-local-bus bridge designs, particularly when protocol translation or proprietary side-band signaling is required. The 672-pin FCBGA provides ample user I/O for 32-bit/64-bit PCI plus parallel SRAM/Flash buses, and the embedded system blocks (ESBs) implement dual-port RAM mailbox registers. Performance is typically limited by PCI 33/66 MHz signaling rather than internal fabric Fmax, making the -9 speed grade appropriate.
Recomendado
DSP Coprocessor Pre-Processing Pipelines
The EP2A25F672I-9's 1,125 Kbits of ESB memory and four PLLs suit DSP coprocessor pre-processing pipelines where data buffering, decimation, and FFT pre-processing must occur before hand-off to a fixed-point DSP. The LVDS high-speed I/O moves digitized IF or video samples into the FPGA at hundreds of MHz, while the embedded memory buffers samples for block processing. Industrial temperature grade supports outdoor or ruggedized military DSP cards. Place-and-route in Quartus II reliably achieves 150-200 MHz on datapath-critical paths.
Recomendado
Image Pre-Processing Front-Ends
Camera and machine-vision front-ends use the EP2A25F672I-9 to perform Bayer-to-YUV conversion, histogram equalization, and region-of-interest cropping in real time before handing pixel streams to an external processor. The 672-ball FCBGA exposes sufficient user I/O to interface with multiple parallel CMOS sensors at 40-80 MHz pixel clocks, while the four PLLs synthesize independent video, memory, and pixel clocks. The industrial temperature grade enables use in factory-floor machine-vision enclosures.
Recomendado
Legacy Industrial Control PLC Backplanes
Long-lifecycle industrial PLC platforms with installed base running APEX II benefit from the EP2A25F672I-9 as a drop-in replacement for failed units. The 25,000 logic elements implement custom analog/digital signal conditioning, encoder decoding (incremental, SSI, BiSS), and high-speed deterministic I/O scanning above the throughput of legacy microcontrollers. Industrial temperature grade (-40 °C to +100 °C junction) and the 672-ball FCBGA footprint match the existing PCB, avoiding costly requalification.
Recomendado
Avionics Databus Interfaces (Mil-Std-1553 / ARINC 429)
The EP2A25F672I-9 is suitable for avionics databus interface cards that bridge Mil-Std-1553 or ARINC 429 channels to a host processor over PCI or VME. The PLLs generate precise 1 MHz ARINC bit clocks and 1553 1 Mbps manchester-encoded bit clocks, while LVDS I/O connects to external transceivers. Its industrial temperature grade matches avionics bay environments after conformal coating. Quartus II IP cores implement encoder/decoder state machines efficiently within the 25,000 LE fabric.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2A25F672I-9 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2A25F672I-7 | EP2A25F672ES | EP2A25F672C9 | EP2A25F672C8 | EP2A25F672C7 |
|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 672-pin FCBGA (FineLine BGA) | 672-pin FCBGA - same | 672-pin FCBGA - same | 672-pin FCBGA - same | 672-pin FCBGA - same | 672-pin FCBGA - same |
| Family | APEX II | APEX II - same | APEX II - same | APEX II - same | APEX II - same | APEX II - same |
| Logic Elements | ~25,000 | ~25,000 | ~25,000 | ~25,000 | ~25,000 | ~25,000 |
| ESB Memory (Kbits) | 1,125 | 1,125 | 1,125 | 1,125 | 1,125 | 1,125 |
| Temperature Grade | Industrial (-40 to +100C junction) | Industrial | Extended supply (industrial equivalent) | Commercial (0 to +85C) | Commercial (0 to +85C) | Commercial (0 to +85C) |
| Speed Grade | -9 (fastest) | -7 (slower, ~20% Fmax) | -9 equivalent | -9 (same) | -8 | -7 (slowest) |
| Lifecycle Status | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete | Obsolete |
| Drop-In Compatibility | Reference | Yes (slower Fmax) | Yes (full) | Yes (lower temp grade) | Yes (lower temp + slower Fmax) | Yes (lower temp + slowest Fmax) |
Principais diferenciais
- Fastest APEX II speed grade in industrial temperature (vs EP2A25F672I-7)
- Industrial temperature vs commercial temperature grade (vs EP2A25F672C9)
- Legacy long-term supply vs active procurement (vs EP2A25F672ES)
Notas de projeto
The 672-ball FineLine BGA uses a 1.0 mm ball pitch, requiring at least six PCB routing layers with microvia (laser-drilled) stack-up. Use 0.5 oz copper on outer layers for signal escape, and allocate at least 4 sq cm of unbroken copper pour directly under the BGA for thermal dissipation and core voltage decoupling. Match the package thermal pad footprint exactly to the BGA center balls - APEX II devices rely on these for GND and VCCINT return paths.
Estimated: APEX II core current draw at -9 speed grade and 25,000 LEs active is approximately 0.5-1.5 A depending on toggle rate. Provide 1.5 V and 1.8 V rails via low-dropout regulators rated for at least 2 A continuous, with 10 µF ceramic plus 0.1 µF high-frequency bypass placed within 5 mm of the VCCINT balls. Sequence the 1.8 V PLL analog rail before the 1.5 V core rail to prevent latch-up during power-up.
Do not assume any modern Altera/Intel programmer supports APEX II - Quartus II Web Edition v9.1 or earlier is required for bitstream generation. Many JTAG programmers (e.g. USB-Blaster II) will not enumerate APEX II devices. Use legacy ByteBlasterMV, MasterBlaster, or older USB-Blaster (revision A) hardware. Verify configuration EPROM density: APEX II 25K requires an EPC16 or larger configuration device for compressed bitstreams.
The 672-ball FCBGA without forced airflow will derate industrial-grade junction temperature at continuous 100% utilization. Attach the part to a copper spreader pad of at least 6 sq cm and consider 200-400 LFM airflow in sealed enclosures. Without a heat spreader, sustained operation at junction > 100 °C accelerates electromigration in the 0.18 µm process. Plan for thermal validation during design verification.
LVDS inputs on APEX II require 100 Ω differential termination across the LVDS pair, placed as close as possible to the receiver ball. For clock inputs driving PLLs, keep trace length under 25 mm and avoid layer transitions that create stubs. Series-termination is generally not required for LVTTL outputs at < 24 mA drive strength, but check Quartus II pin planner output slew-rate settings if your bus is > 100 MHz.
Informações de conformidade
RoHS, REACH, lead-free, and halogen-free status are not explicitly stated in the verified distributor listings for EP2A25F672I-9 (as of 2026-09-08). Many APEX II production lots were assembled before RoHS enforcement. Request material declaration from supplier before qualifying for new designs.
