EP2A25F672C7 - APEX II FPGA, 25K LE, 492 I/O, 672-BGA | Altera
N.º da peça: EP2A25F672C7 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $185 | $185,00 |
| 10 | $165 | $1.650,00 |
| 100 | $148 | $14.800,00 |
| 500 | $132 | $66.000,00 |
| 1.000 | $118 | $118.000,00 |
EP2A25F672C7 Visão geral
An FPGA (Field-Programmable Gate Array) is a semiconductor device whose internal logic blocks, interconnects, and I/O cells are reconfigured after manufacture via a configuration bitstream. FPGAs sit at the top of the programmable logic hierarchy (above CPLDs and PALs) and are widely used to implement parallel datapaths, custom interfaces, and prototype ASIC designs where time-to-market or low-volume economics preclude a custom silicon run. APEX II specifically occupies the high-density, high-I/O-count tier of the Altera portfolio, bridging the gap to early HardCopy structured ASICs.
The EP2A25F672C7 integrates 492 user I/O pins, embedded system blocks (ESBs) for memory and arithmetic functions, and high-speed LVDS channels capable of 1 Gbps operation per pair. The device supports a maximum of 1,650,000 system gates and offers up to 422,976 RAM bits, making it well suited for data-path-intensive designs such as custom bus bridges, video processing pipelines, and telecommunications infrastructure.
Typical applications include high-speed serial interface bridging, custom ASIC prototyping, parallel DSP architectures, and telecom line-card glue logic. The FineLine BGA package enables dense PCB layouts while supporting the LVDS signaling required for 1-Gbps chip-to-chip links. When migrating designs from APEX II to newer Cyclone or Stratix families, designers should review pinout compatibility and Quartus tool support, as the APEX II is supported by legacy Altera development software rather than current Quartus Prime releases.
Alternativas drop-in para EP2A25F672C7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2A25F672C7 (mesmo formato e footprint) — diferindo em Package, Process Technology, Speed Grade, Operating Temperature, Embedded Memory.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2A25F672C8
✅ Drop-In✓ Em estoque
$951.18 / unidade
Ver ficha técnica →EP2A25F672C9
✅ Drop-In✓ Em estoque
$700 / unidade
Ver ficha técnica →EP2A40F672C7
✅ Drop-In✓ Em estoque
$195 / unidade
Ver ficha técnica →EP2A25F672C7N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$195 / unidade
Ver ficha técnica →EP2A25F672I7
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$198 / unidade
Ver ficha técnica →EP2A15F672C7
✅ Drop-In✓ Em estoque
$98 / unidade
Ver ficha técnica →EP2A25F672C7 Classificações máximas e características elétricas
| Product Family | APEX II |
| Logic Elements | 25,000 |
| Maximum System Gates | 1,650,000 |
| Maximum RAM Bits | 422,976 |
| User I/O Count | 492 |
| Encapsulamento | 672-ball FCBGA (FineLine BGA) |
| Process Technology | 0.15-um all-layer copper, up to 8 metal layers |
| Supply Voltage (Core) | 1.5 V |
| LVDS Data Rate | 1 Gbps per channel (True-LVDS) |
| I/O Standards Supported | LVDS, LVPECL, PCML, HyperTransport |
| Temperatura de operação | 0C to +85C (Commercial) |
| Speed Grade | -7 |
| Configuration Mode | Passive Serial, Passive Parallel, JTAG |
| Embedded System Blocks (ESB) | Yes - RAM, ROM, CAM, multiplier support |
Guia de Configuração de Pinos do EP2A25F672C7 672-ball fcbga (fineline bga)
Configuração de pinos para EP2A25F672C7 (pacote 672-ball fcbga (fineline bga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2A25F672C7.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2A25F672C7 é adequado para 6 aplicaçãos: Telecommunications Line-Card Interface Bridging, Custom ASIC Prototyping, Video Processing Pipelines, High-Speed Test and Measurement Equipment, Industrial Control and Factory Automation, Military and Aerospace Legacy Systems.
Telecommunications Line-Card Interface Bridging
The EP2A25F672C7 is well suited to telecom line-card interface bridging where the device's 1 Gbps True-LVDS channels and 492 user I/O enable simultaneous conversion between legacy parallel buses (UTOPIA, POS-PHY) and high-speed serial backplanes. Its 25,000 logic elements accommodate custom packet-processing datapaths, while the 422,976 bits of embedded RAM serve as on-chip lookup tables for routing tables. The 672-FCBGA package's high ball density supports the multi-bank LVDS/LVPECL assignments required to break out 16+ serial channels without external muxes, reducing board area versus discrete SERDES solutions.
Recomendado
Custom ASIC Prototyping
The EP2A25F672C7 is widely deployed for ASIC prototyping where 1,650,000 system gates and 25K logic elements provide sufficient capacity to emulate mid-complexity ASICs before mask commitment. The device's fine-grain architecture and embedded system blocks (ESBs) support distributed dual-port RAM, FIFO buffers, and hardware multipliers required for DSP prototyping. Quartus II software (legacy releases up to 9.1) generates timing-accurate bitstreams, and the 1.5V core voltage keeps dynamic power within thermal limits during long verification runs in laboratory test racks.
Recomendado
Video Processing Pipelines
The EP2A25F672C7's 492 user I/O and 1 Gbps LVDS capability support real-time video processing pipelines handling SDI, DVI, or Camera Link inputs. Its 422,976 RAM bits are sufficient for line buffers in deinterlacing and color-space conversion blocks, while the 25K logic elements implement motion-estimation or scaling engines. The 672-FCBGA package's fine-pitch BGA accommodates the dozens of differential pairs required for parallel video buses without placing components on both sides of the PCB, simplifying thermal management in broadcast equipment.
Recomendado
High-Speed Test and Measurement Equipment
The EP2A25F672C7 is used in test and measurement instruments where custom triggering, pattern generation, and protocol decoding demand flexible parallel logic. Its 492 I/O support direct connection to high-speed ADCs and DACs via LVDS or LVPECL without intermediate buffers, preserving signal integrity at sample rates above 500 MSPS. Embedded system blocks implement per-channel statistics counters and trigger logic, while the 1.5V core minimizes thermal load in densely populated rack-mounted instruments where many FPGAs operate in parallel.
Recomendado
Industrial Control and Factory Automation
The EP2A25F672C7's high I/O count makes it suitable for industrial control systems managing dozens of sensor inputs, actuator drivers, and fieldbus interfaces simultaneously. Its logic capacity supports custom protocols such as PROFINET, EtherCAT, or CANopen soft-cores alongside real-time motion-control loops. While the C7 suffix indicates commercial temperature range, the I-grade variants (EP2A25F672I7) extend operation to industrial -40C to +100C environments typical of factory floors. The 672-FCBGA package supports long-term reliability in vibration-prone installations when properly underfilled.
Recomendado
Military and Aerospace Legacy Systems
The EP2A25F672C7 has seen deployment in military and aerospace applications where mature, characterized silicon is preferred over the latest FPGAs. Its extended silicon revision history and established reliability data make it attractive for long-life-cycle programs requiring decades of parts availability. The 672-FCBGA package with controlled-impedance LVDS channels supports sensor aggregation in radar, electronic warfare, and avionics databus systems. System integrators should confirm DSCC or MIL-PRF-38535 qualification status with the manufacturer given the NRND product lifecycle designation.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2A25F672C7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2A25F672C8 | EP2A25F672C9 | EP2A40F672C7 | EP2A15F672C7 |
|---|---|---|---|---|---|
| Package | 672-FCBGA (FineLine BGA) | 672-FCBGA - identical | 672-FCBGA - identical | 672-FCBGA - identical | 672-FCBGA - identical |
| Brand | Altera (Intel PSG) | Altera | Altera | Altera | Altera |
| Logic Elements | 25,000 | 25,000 (same) | 25,000 (same) | 40,000 (+60%) | 15,000 (-40%) |
| Speed Grade | -7 | -8 (~15-20% Fmax faster) | -9 (~25-30% Fmax faster) | -7 | -7 |
| User I/O | 492 | 492 | 492 | 492 | 492 |
| LVDS Data Rate | 1 Gbps | 1 Gbps | 1 Gbps | 1 Gbps | 1 Gbps |
| Core Voltage | 1.5 V | 1.5 V | 1.5 V | 1.5 V | 1.5 V |
| Operating Temperature | 0C to +85C (Commercial) | 0C to +85C | 0C to +85C | 0C to +85C | 0C to +85C |
Principais diferenciais
- Lower cost than the EP2A25F672C8 within the same speed profile (vs EP2A25F672C8)
- Higher logic density than the EP2A15F672C7 in the same package (vs EP2A15F672C7)
- Lower density than EP2A40F672C7 but with established production history (vs EP2A40F672C7)
- Proven APEX II architecture with extensive legacy ecosystem (vs EP20K600CF672C7 (APEX 20KE family))
Notas de projeto
The EP2A25F672C7 requires a low-noise 1.5V core supply capable of delivering up to 2-3A under full logic utilization at the -7 speed grade, plus a 3.3V auxiliary supply for I/O banks and configuration circuits. Use a dedicated LDO (e.g., TPS74401) for the 1.5V rail rather than a switching converter to minimize jitter coupling into the LVDS channels. Place 220uF bulk + 10uF + 0.1uF ceramic decoupling within 5mm of each supply pin pair to suppress simultaneous switching noise.
The 672-FCBGA FineLine BGA package has 1.00mm ball pitch, requiring 4-6 layer PCB stackup with microvia HDI construction for breakout routing. Use an outer escape pattern of dog-bone fanout with via-in-pad (VIPPO) on inner layers to maintain signal integrity for the 1 Gbps LVDS pairs. The BGA thermal pad must be soldered to a copper pour of at least 1 square inch with thermal vias (0.3mm pitch, 12+ vias) for adequate heat dissipation. Reflow profile per JEDEC J-STD-020 MSL3 conditions.
Match LVDS trace lengths within a channel to within 150 mil (3.8mm) to maintain the 1 Gbps eye opening. Implement 100-ohm differential impedance with coupled microstrip or stripline; avoid 90-degree bends and route over continuous reference planes. AC-couple LVDS links using 100nF capacitors placed near the receiver end; Altera APEX II supports both DC- and AC-coupled LVDS depending on bank configuration. Use IBIS models from Intel PSG for pre-layout simulation.
Do not assume 100% pinout compatibility between APEX II density variants: while the 672-FCBGA ball map is consistent across 15K/25K/40K LE devices, some dedicated pins (CLK, PLL, configuration) differ in function. Re-run pin assignment in Quartus II against the new device's pinout file before assuming drop-in compatibility. APEX II is supported only by legacy Quartus II versions (up to 9.1); newer Quartus Prime releases do not include APEX II support, complicating bitstream regeneration.
Estimated: At full logic utilization (~80% LE), 200 MHz internal clock, and 50% LVDS toggle rate, the EP2A25F672C7 dissipates approximately 3-4W. The 672-FCBGA package has a typical theta_JA of 15-20 C/W with proper thermal via array, resulting in junction temperature rise of 45-80C above ambient. Active airflow of 200 LFM is recommended when ambient exceeds 50C to maintain junction below the 125C maximum. Use thermal simulation to validate before committing to production layouts.
Informações de conformidade
RoHS, REACH, lead-free, halogen-free, and conflict minerals compliance not explicitly confirmed in the verified web data retrieved 2026-09-08. AEC-Q100 not applicable as APEX II is not marketed for automotive use. Compliance status should be verified against the specific lot's documentation.
