EP2AGX190FF35C6G - Arria II GX FPGA, 190K LE, 1152-BGA | Altera
N.º da peça: EP2AGX190FF35C6G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $258.285 | $258,29 |
| 10 | $241.066 | $2.410,66 |
| 100 | $223.847 | $22.384,70 |
| 500 | $205 | $102.500,00 |
| 1.000 | $188 | $188.000,00 |
EP2AGX190FF35C6G Visão geral
A Field Programmable Gate Array (FPGA) is a reprogrammable semiconductor device that contains an array of configurable logic blocks (CLBs), dedicated DSP blocks, block RAM, and high-speed transceivers connected by a programmable interconnect fabric. FPGAs sit in the broader taxonomy of programmable logic devices (PLDs) -> logic ICs -> integrated circuits -> semiconductors, and are differentiated from ASICs by their ability to be reconfigured in the field and from CPLDs by their higher logic density and embedded memory/DSP resources.
The EP2AGX190FF35C6G features integrated transceivers supporting data rates up to 6.375 Gbps per channel, dedicated 18x18 multipliers for DSP, and on-chip memory distributed across M9K blocks. The 1152-BBGA FCBGA package provides high I/O count with flip-chip attachment for superior thermal and electrical performance, suitable for high-speed serial designs requiring controlled-impedance signal integrity.
Architecturally, the Arria II GX family uses a 40nm process technology with adaptive logic modules (ALMs), each containing two combinational adaptive look-up tables (ALUTs) and four registers. This architecture delivers fine-grained logic utilization and supports up to 8.4 Gbps external memory interfaces through dedicated PHY blocks.
Typical applications include wireless baseband processing, 3G/4G remote radio heads, HD-SDI video broadcast equipment, high-speed serial protocol bridging (PCIe Gen1/Gen2, Serial RapidIO, SGMII), and military/aerospace signal processing where mid-range FPGA density is needed without the power of a Stratix-class device.
Design considerations include careful PCB layout for the FCBGA package's controlled-impedance differential pairs, robust power-rail decoupling to support the transceiver analog supply (VCCA), and thermal management via thermal vias and copper pours beneath the exposed-die region. Designers should reference Altera's Arria II GX handbook and pin-out tables when migrating to the EP2AGX260 (higher-density) variant for footprint-compatible scaling.
This page synthesizes Altera Arria II GX family positioning, current distributor inventory at major channels, drop-in same-package alternatives from the same family, and practical board-level design notes not found in the standalone datasheet.
Alternativas drop-in para EP2AGX190FF35C6G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2AGX190FF35C6G (mesmo formato e footprint) — diferindo em Speed Grade, Package, Operating Temperature, Mounting Type, Transceivers.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2AGX260FF35C6G
✅ Drop-In✓ Em estoque
$1320 / unidade
Ver ficha técnica →EP2AGX125FF35C6G
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP2AGX190FF35C4G
✅ Drop-In✓ Em estoque
$2350 / unidade
Ver ficha técnica →EP2AGX190FF35C5G
✅ Drop-In✓ Em estoque
$1245 / unidade
Ver ficha técnica →EP2AGX190FF35C6G Classificações máximas e características elétricas
| Family | Arria II GX |
| Series | Arria II GX |
| Logic Elements | 190,000 |
| Total RAM Bits | 9,830,400 (approximately 9.5 Mbit) |
| Temperatura de operação | 0C to +85C (commercial grade) |
| Tipo de montagem | Surface Mount |
| Encapsulamento / Caixa | 1152-BBGA, FCBGA |
| Supplier Device Package | 1152-FBGA, FCBGA |
| Speed Grade | C6 (commercial -6) |
| Temperature Grade | Commercial (C) |
| Number of Transceivers | 612 |
| Transceiver Data Rate | up to 6.375 Gbps per channel |
Guia de Configuração de Pinos do EP2AGX190FF35C6G 1152-fbga, fcbga
Configuração de pinos para EP2AGX190FF35C6G (pacote 1152-fbga, fcbga). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2AGX190FF35C6G.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2AGX190FF35C6G é adequado para 6 aplicaçãos: Wireless Baseband Processing, Broadcast HD-SDI Video Routing, High-Speed Serial Protocol Bridging, Industrial Motor Control, Test and Measurement Instrumentation, Military/Aerospace Signal Processing.
Wireless Baseband Processing
The EP2AGX190FF35C6G fits wireless baseband processing because it combines 190K logic elements with 612 integrated transceivers supporting up to 6.375 Gbps per channel, enabling CPRI/OBSAI fronthaul aggregation for 3G/4G/5G remote radio heads (RRH). Its 9.5 Mbit embedded RAM is sufficient for uplink/downlink buffer stages, while dedicated 18x18 multipliers accelerate FFT, channel coding (Turbo/LDPC), and digital predistortion (DPD). Placed adjacent to the baseband SoC, the Arria II GX handles the PHY layer and digital up-conversion, offloading heavy DSP from the host processor. Compared with an ASIC, the FPGA offers field-upgradable CPRI rates as 5G NR evolves.
Recomendado
Broadcast HD-SDI Video Routing
The EP2AGX190FF35C6G fits broadcast video routing because its 612 integrated transceivers easily exceed the bandwidth required to multiplex dozens of HD-SDI (1.485 Gbps) or 3G-SDI (2.97 Gbps) streams. The 190K LEs implement crosspoint switching, audio embedding/de-embedding, and ancillary data processing, while the embedded 9.5 Mbit RAM holds line buffers for frame synchronization. Placed in a broadcast video router, the part replaces multiple fixed-function crosspoint ASICs with a single programmable device that can be reconfigured for new video formats (e.g., UHD-SDI) via firmware update.
Recomendado
High-Speed Serial Protocol Bridging
The EP2AGX190FF35C6G fits protocol bridging because its transceivers natively support PCIe Gen1/Gen2 (2.5/5 Gbps), Serial RapidIO, XAUI, SGMII, and CEI-6G protocols without external PHYs. The 190K LEs implement protocol state machines, DMA engines, and on-chip bus arbiters, while the 9.5 Mbit RAM holds packet buffers. Placed on a line card backplane, the FPGA bridges between ASIC/ASSP endpoints and switch fabric chips, offloading protocol conversion. Compared with a discrete PHY + FPGA design, the integrated transceiver approach reduces BOM cost and PCB area by 30-50 percent.
Recomendado
Industrial Motor Control
The EP2AGX190FF35C6G fits industrial motor control because its DSP blocks accelerate field-oriented control (FOC) loops, space-vector PWM (SVPWM), and encoder interfaces (EnDat, Hiperface). The 190K LEs are sufficient for multi-axis servo control of up to 8 axes simultaneously, while the 9.5 Mbit RAM buffers current/torque sample streams. Placed on the control board, the FPGA executes sub-microsecond control loops that would be impossible in a software-only MCU implementation. The commercial 0C to +85C temperature range covers factory-floor enclosures.
Recomendado
Test and Measurement Instrumentation
The EP2AGX190FF35C6G fits T&M instrumentation because its 6.375 Gbps transceivers drive high-speed ADC/DAC interfaces (e.g., JESD204B lanes), while the 190K LEs implement real-time DSP for FFT, filtering, and protocol-aware trigger logic. The 9.5 Mbit RAM serves as acquisition memory for digitizer front-ends. Placed between the analog front-end and the display/processor subsystem, the FPGA performs real-time waveform processing at sample rates that overwhelm general-purpose processors. Field-upgradability via JTAG enables post-sale feature additions for oscilloscopes, BERT testers, and protocol analyzers.
Recomendado
Military/Aerospace Signal Processing
The EP2AGX190FF35C6G fits MIL/AERO signal processing because of its high logic density, integrated transceivers for radar/datacomm links, and the ability to host firmware-defined waveform upgrades. The 190K LEs implement pulse compression, MTI filtering, and beamforming for radar arrays, while the 9.5 Mbit RAM holds range/Doppler bins. Placed on a VPX or VME signal-processing card, the Arria II GX accelerates compute-intensive EW/SIGINT tasks. For applications requiring -40C to +100C operation, migrate to the EP2AGX190FF35I6G (industrial/I-grade) drop-in variant in the same package.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2AGX190FF35C6G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2AGX260FF35C6G | EP2AGX125FF35C6G | EP2AGX190FF35C4G | EP2AGX190FF35C5G |
|---|---|---|---|---|---|
| Package | 1152-BBGA FCBGA (F35) | 1152-BBGA FCBGA (F35) - same | 1152-BBGA FCBGA (F35) - same | 1152-BBGA FCBGA (F35) - same | 1152-BBGA FCBGA (F35) - same |
| Brand | Altera (Intel) | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same | Altera (Intel) - same |
| Logic Elements | 190,000 | 260,000 | 125,000 | 190,000 | 190,000 |
| Speed Grade | C6 | C6 | C6 | C4 (faster) | C5 (faster) |
| Transceivers | 612 | 612 | 612 | 612 | 612 |
| Embedded RAM | 9.5 Mbit | 9.5 Mbit | 6.5 Mbit | 9.5 Mbit | 9.5 Mbit |
| Temperature Grade | Commercial (0C to +85C) | Commercial | Commercial | Commercial | Commercial |
| Process Technology | 40 nm TSMC | 40 nm TSMC | 40 nm TSMC | 40 nm TSMC | 40 nm TSMC |
| RoHS / Lead-Free (G suffix) | Yes (G suffix) | Yes | Yes | Yes | Yes |
Principais diferenciais
- Highest density with 190K LEs in the F35 commercial package tier (vs EP2AGX125FF35C6G)
- Lowest-cost speed grade (C6) at the 190K-LE density point (vs EP2AGX190FF35C4G)
- Same F35 footprint as EP2AGX260FF35C6G, allowing in-family scaling (vs EP2AGX260FF35C6G)
Notas de projeto
The 1152-FBGA F35 package requires a 12-14 layer PCB with a dedicated ground plane beneath the package. Use 0.4 mm pitch microvia technology (stacked or staggered) for breakout from the BGA ball pads. Differential pair routing for transceivers must maintain 100 ohm differential impedance with intra-pair skew less than 5 mil (per Altera Arria II GX handbook recommendations). Reference the manufacturer's pin-out tables to verify ball assignments; signal integrity simulation (3DEM/ADS) is strongly recommended above 3 Gbps.
Power the EP2AGX190FF35C6G from multiple rails: VCC (core), VCCA (transceiver analog), VCCPD (I/O pre-drive), and VCCIO (I/O banks). Decoupling: 0.1 uF + 10 uF ceramic at each VCC pin, plus bulk 220 uF polymer per rail. Estimated: a fully-utilized EP2AGX190 at 100 percent toggle rate may dissipate 12-15 W requiring forced-air cooling; thermal vias under the exposed die (35-mil pitch) and a copper heatsink are recommended. Estimate based on Altera Arria II GX power calculator typical workloads.
Estimated: at junction temperature 85C (commercial max) with 15 W dissipation, the F35 FCBGA package thermal resistance theta_JA is approximately 0.6 C/W (with 35-mil thermal via array and forced-air). Without thermal enhancement, junction-to-ambient exceeds the operating limit. Implement a minimum 16x16 thermal via array (0.3 mm drill, 1 mm pitch) on the PCB, and consider an aluminum heat spreader for >10 W designs. Verify thermal margin against the Altera power-calculator worst-case utilization profile.
Common pitfalls: (1) Mixing transceiver supply VCCA with digital VCC causes jitter degradation - keep them on separate planes with single-point star ground. (2) JTAG chain length should not exceed 6 inches; longer chains cause programming failures. (3) Configuration mode pins MSEL must match the chosen configuration scheme (AS, FPP, JTAG) - wrong values cause silent configuration failures. (4) The C6 speed grade is the slowest - if Fmax timing fails in compile, do NOT downgrade; instead migrate to C5 (EP2AGX190FF35C5G) drop-in variant. (5) Bank I/O voltage VCCIO must match your external logic (1.5/1.8/2.5/3.3 V) - mixing causes I/O failure.
Place decoupling capacitors as close as physically possible to each power pin, on the same layer or with microvia to adjacent layers. Series termination on high-speed LVDS outputs (25-33 ohm) reduces reflections. For DDR3 interfaces, follow the Altera External Memory Interface Handbook - matched trace lengths within +/-25 mil, fly-by termination for clock, and proper read/write deskew calibration. Clock input traces should be 50 ohm controlled impedance with length matching across the bank. Reference the Arria II GX Board Design Guidelines document for full layout rules.
Informações de conformidade
G suffix indicates lead-free / RoHS compliant terminal finish per Altera (Intel) product packaging standards. AEC-Q100 not applicable to FPGAs; commercial 0C to +85C temperature range only; for industrial/military temp grades use I-grade or M-grade variants.