EP2AGX65CU17I3G - Arria II GX FPGA, 60K LE, 156 I/O, 358-BGA | Intel
N.º da peça: EP2AGX65CU17I3G ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $320 | $320,00 |
| 10 | $295 | $2.950,00 |
| 100 | $268 | $26.800,00 |
| 500 | $242 | $121.000,00 |
| 1.000 | $218 | $218.000,00 |
EP2AGX65CU17I3G Visão geral
A Field Programmable Gate Array (FPGA) is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnects, and I/O cells that can be re-programmed to implement virtually any digital circuit. Within the broader semiconductor taxonomy, the EP2AGX65CU17I3G sits at FPGA -> programmable logic -> digital IC -> semiconductor. Arria II GX devices specifically target transceiver-based designs where cost, power, and protocol flexibility must coexist - they belong to Intel's mid-range programmable-logic family above Cyclone and below Stratix.
Key features of the EP2AGX65CU17I3G include 156 user I/O, 5,371,904 bits of embedded SRAM (M9K blocks), 312 (18x18) multipliers for DSP, integrated 3.75 Gbps transceivers, eight PLLs, and hard PCI Express Gen1 IP blocks. The FCBGA-358 package provides a 17 mm x 17 mm footprint with a 1.0 mm ball pitch, suitable for moderate-density PCB designs with controlled-impedance routing for the transceiver channels.
Architecturally, Arria II GX devices use TSMC's 40 nm process and feature a logic-array plus transceiver-and-memory tile structure that delivers up to 50% lower power than the prior-generation Arria GX at the same throughput. Hardened PCIe Gen1 endpoints and 8B/10B-encoded transceivers simplify common serial-protocol designs and free fabric logic for application code.
Typical applications include telecom line cards and backplanes, broadcast video processing, industrial imaging with Camera Link or CoaXPress, military secure communications, and PCIe Gen1 endpoint cards. Designers favor this part when Stratix-class capacity is over-budget but Cyclone-class transceivers are insufficient. When designing, verify transceiver channel placement against the package pinout, supply all required VCC/VCCPT/VCCA_FPLL rails, and respect minimum SERDES PCB stack-up rules. This page synthesizes distributor pricing, drop-in same-package alternatives, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para EP2AGX65CU17I3G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2AGX65CU17I3G (mesmo formato e footprint) — diferindo em Package, Speed Grade, Operating Temperature, Process Technology, Embedded Memory Bits.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2AGX65CU17I5G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
Consulte o preço
Ver ficha técnica →EP2AGX65CU17C6G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$141.28 / unidade
Ver ficha técnica →EP2AGX65CU17C5N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$178.4 / unidade
Ver ficha técnica →EP2AGX65CU17C5G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$125.4 / unidade
Ver ficha técnica →EP2AGX65CU17C4N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1125 / unidade
Ver ficha técnica →EP2AGX65CU17C4G
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$285 / unidade
Ver ficha técnica →EP2AGX65CU17I3G Classificações máximas e características elétricas
| Family | Arria II GX |
| Logic Elements | 60,214 |
| Embedded Memory Bits | 5,371,904 |
| User I/O Count | 156 |
| Transceivers | Up to 8 channels, 3.75 Gbps (GX) |
| Process Technology | 40 nm |
| Encapsulamento | LFBGA-358 (FCBGA), 17x17 mm, 1.0 mm pitch |
| Temperatura de operação | -40C to +100C (industrial, "I") |
| Speed Grade | 3 |
| Tipo de montagem | Surface Mount (BGA) |
Guia de Configuração de Pinos do EP2AGX65CU17I3G lfbga-358 (fcbga), 17x17 mm, 1.0 mm pitch
Configuração de pinos para EP2AGX65CU17I3G (pacote lfbga-358 (fcbga), 17x17 mm, 1.0 mm pitch). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2AGX65CU17I3G.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2AGX65CU17I3G é adequado para 6 aplicaçãos: Telecom Line Cards and Backplanes, Broadcast Video Processing, Industrial Imaging and Machine Vision, PCIe Gen1 Endpoint Cards, Military and Aerospace Secure Communications, Test and Measurement Instrumentation.
Telecom Line Cards and Backplanes
The EP2AGX65CU17I3G fits telecom line-card applications because its 60K logic elements plus 8 hardened 3.75 Gbps transceivers cover 1G/2.5G CPRI and OBSAI links without fabric-based SERDES. Designers place the FPGA between TDM framers and packet processors, using M9K memory blocks for cell buffering and the 18x18 multipliers for FEC/CRC offload. The 156 user I/O accommodate parallel bus interfaces to network processors. Industrial temperature grade allows outdoor cabinet deployment. Power consumption is dominated by transceiver channels; designers typically budget 4-6 W total.
Recomendado
Broadcast Video Processing
The EP2AGX65CU17I3G is well-suited to broadcast video routers and frame synchronizers because its 5.3 Mbit of embedded SRAM holds multiple video line buffers and the 312 18x18 multipliers accelerate 2D scaling kernels. SDI transceivers connect over LVDS I/O at 270/1.5G/3G rates; the integrated PCIe Gen1 hard IP links to a host CPU for control. The LFBGA-358 package provides manageable BGA fan-out at 1.0 mm pitch for 6-layer PCB stack-ups typical of broadcast gear. Speed grade 3 is sufficient for SD/HD pipelines; 4K workflows usually require the I5 speed grade.
Recomendado
Industrial Imaging and Machine Vision
The EP2AGX65CU17I3G fits machine-vision controllers using Camera Link, CoaXPress, or GigE Vision because its 156 I/O handle full Camera Link base/medium/full configurations and its transceivers interface directly to CoaXPress 1.0/1.1 at up to 3.125 Gbps per lane. Embedded M9K blocks provide line buffers for image pre-processing; 18x18 multipliers run Sobel and convolution kernels at full camera frame rate. Industrial temperature grade (-40C to +100C) supports factory-floor deployment. Power budget typically 5-8 W with all transceivers active.
Recomendado
PCIe Gen1 Endpoint Cards
The EP2AGX65CU17I3G integrates a hardened PCIe Gen1 endpoint that consumes no fabric logic, freeing the 60K logic elements for application code such as data acquisition, DSP, or protocol offload. Designers implement x1 or x4 PCIe Gen1 endpoints in 1-2 hours using the Quartus Prime PCIe hard IP wizard. The 5.3 Mbit embedded RAM buffers DMA transfers; 312 multipliers accelerate signal processing. Industrial temperature and 358-ball LFBGA are compatible with half-height PCIe card mechanical envelopes.
Recomendado
Military and Aerospace Secure Communications
The EP2AGX65CU17I3G suits tactical radio and secure-comm modules because its industrial temperature grade and 40 nm process deliver reliable operation across -40C to +100C ambient with low SEU sensitivity when paired with mitigation. The 8 hardened transceivers support tactical radio data links up to 3.75 Gbps, while 5.3 Mbit of embedded RAM holds encryption contexts and frame buffers. Designers implement AES/SHA acceleration in fabric using the 312 multipliers. The 17x17 mm LFBGA footprint fits standard VPX and SOSA-aligned module profiles.
Recomendado
Test and Measurement Instrumentation
The EP2AGX65CU17I3G is a good fit for portable test gear because it integrates protocol transceivers (PCIe, LVDS, custom serial) plus enough logic to implement a full stimulus-response engine in a single chip. Designers use the 18x18 multipliers for FFT/iFFT acceleration and the M9K blocks for waveform storage. The 156 user I/O support mixed-signal front-end connectivity, while the 358-ball LFBGA enables compact 4-layer PCB designs. Speed grade 3 closes timing at 250 MHz fabric typical of mid-range instruments.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2AGX65CU17I3G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2AGX65CU17I5G | EP2AGX65CU17C6G | EP2AGX65CU17C5N | EP2AGX65CU17C4G |
|---|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel |
| Package | LFBGA-358 (17x17 mm, 1.0 mm pitch) | LFBGA-358 - same | LFBGA-358 - same | LFBGA-358 - same | LFBGA-358 - same |
| Logic Elements | 60,214 | 60,214 | 60,214 | 60,214 | 60,214 |
| Temperature Grade | Industrial (-40C to +100C) | Industrial (-40C to +100C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Speed Grade | 3 | 5 (faster) | 6 (fastest C-grade) | 5 | 4 |
| User I/O | 156 | 156 | 156 | 156 | 156 |
| Embedded Memory Bits | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 |
| Transceivers | Up to 8 @ 3.75 Gbps | Up to 8 @ 3.75 Gbps | Up to 8 @ 3.75 Gbps | Up to 8 @ 3.75 Gbps | Up to 8 @ 3.75 Gbps |
| Process / Family | 40 nm / Arria II GX | 40 nm / Arria II GX | 40 nm / Arria II GX | 40 nm / Arria II GX | 40 nm / Arria II GX |
Principais diferenciais
- Highest logic capacity within the LFBGA-358 Arria II GX CU17 package family (vs EP2AGX45CU17I3G)
- Industrial temperature grade at speed grade 3 balance (vs EP2AGX65CU17I5G)
- 8 hardened 3.75 Gbps transceivers free fabric logic (vs EP2AGX45DF29I3G)
Notas de projeto
The EP2AGX65CU17I3G requires four separate power rails: VCCINT (core), VCCIO (I/O banks), VCCPD (pre-drivers), and VCCA/VCCP (transceiver and PLL analog). Each rail must be decoupled with a 0.1 uF MLCC placed within 3 mm of every supply pin per the Arria II GX handbook. Estimated: with all 8 transceivers active at 3.75 Gbps, total power can exceed 6 W - use at least a 4-layer PCB with continuous power planes and verify thermal envelope against the FCBGA-358 31 C/W typical theta-JA.
The 358-ball LFBGA at 1.0 mm pitch requires a 6-layer PCB stack-up with 0.5 oz copper outer and 1 oz inner, microvia-in-pad is recommended for the BGA break-out. Matched-length routing is mandatory for the transceiver lanes (max skew 0.127 mm within an 8-channel group). Maintain continuous reference ground beneath all transceiver TX/RX pairs; do not route LVDS or DDR signals across transceiver reference plane splits.
Transceiver channels should be AC-coupled with 0.1 uF 0402 capacitors placed within 6 mm of the transmitter ball. Reference differential impedance of 100 ohm +/- 10% for transceiver lanes; LVDS I/O require 100 ohm differential or 50 ohm single-ended controlled impedance. Always include the recommended per-channel common-mode choke footprint for EMI mitigation on the line card.
Do not assume the EP2AGX65CU17I3G and EP2AGX45CU17I3G share the same pinout - both fit the LFBGA-358 footprint but pin assignments differ for transceiver channels and PLL supplies. Always regenerate pin assignments using the Quartus Prime pin planner before PCB migration. Also verify JTAG chain order and dedicated configuration pin placement against the selected serial configuration flash (EPCQ recommended).
Estimated: at full load (60K LE @ 80% utilization, 8 transceivers active) the FPGA dissipates 5-7 W. With theta-JA of ~31 C/W (still air, JEDEC 4-layer), junction temperature rises 155-217 C above ambient - exceeding the 100 C industrial limit without airflow. Attach a heatsink or forced airflow above 3 W dissipation. Use the Altera / Intel PowerPlay early power estimator before PCB commit.
Informações de conformidade
RoHS and lead-free compliance confirmed per Altera/Intel product pages; AEC-Q100 not applicable for FPGAs; halogen-free status not explicitly stated in verified data - marked unknown.
