EP2AGX65DF29C5G - Arria II GX FPGA 60K LE 780-FBGA | Intel
N.º da peça: EP2AGX65DF29C5G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $385 | $385,00 |
| 10 | $360 | $3.600,00 |
| 100 | $320 | $32.000,00 |
| 500 | $285 | $142.500,00 |
| 1.000 | $245 | $245.000,00 |
EP2AGX65DF29C5G Visão geral
A Field Programmable Gate Array (FPGA) is a class of programmable logic device that combines configurable logic blocks, programmable interconnect, dedicated DSP/Memory/Transceiver blocks, and I/O cells on a single die. Within the broader taxonomy, an FPGA is a type of programmable logic -> semiconductor -> integrated circuit. The Arria II GX family sits in the mid-density transceiver-equipped tier of Intel (formerly Altera) FPGAs, optimized for cost-effective serial connectivity up to 6.375 Gbps while retaining rich logic and on-chip memory resources.
Key features include 60,214 logic elements, 2,530 LABs, 5,371,904 RAM bits, 364 user I/O pins, integrated transceivers for high-speed serial protocols such as PCIe Gen2, Gigabit Ethernet, Serial RapidIO, and CPRI, and dedicated hardware DSP blocks for high-throughput signal processing. The 40 nm process delivers a strong power/performance trade-off, and the 780-FBGA package provides a high-density interconnect ceiling required for 364 I/O and multiple transceiver channels.
The architecture combines a logic fabric built from adaptive logic modules (ALMs) with embedded M9K memory blocks, MLABs, and 18x18 multipliers. Hard PCIe Gen2 IP blocks and 6.375 Gbps transceivers enable immediate deployment of high-speed serial interfaces without consuming fabric for soft SERDES, freeing logic for protocol stacks, packet processing, or DSP pipelines.
Typical applications include 4G/LTE baseband and backhaul cards, Serial RapidIO bridges, HD-SDI broadcast video processing, software-defined radio (SDR) platforms, PCIe Gen2 endpoint/root complex designs, test and measurement instrumentation, and radar/signal-intelligence front ends. The combination of mid-density logic and integrated transceivers is particularly well suited to wireline line cards and wireless base station designs where BOM consolidation and time-to-market are critical.
When designing with this device, allocate pins early to transceiver channels because they are bonded to specific balls in the 780-FBGA package. Use the Quartus II / Quartus Prime design suite, and validate signal-integrity with the IBIS models Intel publishes. The C5 speed grade trades a small amount of Fmax versus faster C6/I6 grades - consider whether a faster speed grade is required for your most demanding timing path.
Alternativas drop-in para EP2AGX65DF29C5G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2AGX65DF29C5G (mesmo formato e footprint) — diferindo em Package, Speed Grade, Operating Temperature, Transceivers, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2AGX65DF29C4N
✅ Drop-In✓ Em estoque
$605 / unidade
Ver ficha técnica →EP2AGX65DF29C4G
✅ Drop-In✓ Em estoque
$219 / unidade
Ver ficha técnica →EP2AGX65DF29C3N
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →EP2AGX65DF29I5N
✅ Drop-In✓ Em estoque
$1015 / unidade
Ver ficha técnica →EP2AGX65DF29C6G
✅ Drop-In✓ Em estoque
$245.3 / unidade
Ver ficha técnica →EP2AGX65DF29C5G Classificações máximas e características elétricas
| Family | Arria II GX |
| Logic Elements | 60,214 |
| Logic Array Blocks (LABs) | 2,530 |
| Total RAM Bits | 5,371,904 |
| User I/O Pins | 364 |
| Encapsulamento | 780-ball FCBGA (FineLine BGA, 29 mm) |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V (0.87 V to 0.93 V) |
| Speed Grade | C5 |
| Temperature Range (Junction) | 0 °C to 85 °C (commercial) |
| Maximum Internal Clock Frequency | 500 MHz |
| Transceivers | Up to 12 (data rate up to 6.375 Gbps) |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do EP2AGX65DF29C5G 780-ball fcbga (fineline bga, 29 mm)
Configuração de pinos para EP2AGX65DF29C5G (pacote 780-ball fcbga (fineline bga, 29 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2AGX65DF29C5G.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2AGX65DF29C5G é adequado para 6 aplicaçãos: 4G/LTE Baseband and Backhaul Cards, PCIe Gen2 Endpoint / Root Complex Cards, HD-SDI and 3G-SDI Broadcast Video Processing, Software-Defined Radio (SDR) Platforms, Test and Measurement Instrumentation, Serial RapidIO Bridges and Switches.
4G/LTE Baseband and Backhaul Cards
The EP2AGX65DF29C5G's 60,214 logic elements and up to 12 transceivers at 6.375 Gbps make it well suited for CPRI/OBSAI baseband processing cards, where 60K logic can implement MAC/PHY, scrambling, and front-haul aggregation. The 5,371,904 embedded RAM bits buffer CPRI antenna-carrier data between fronthaul and backhaul. Compared to ASIC plus companion FPGA, a single Arria II GX reduces BOM and enables late protocol changes; trade-off is higher unit cost versus fixed-function ASSP. Use 5 GB/s lanes for CPRI option 3, with the 0.9 V core and Intel PowerPlay early estimator guiding the power-tree design.
Recomendado
PCIe Gen2 Endpoint / Root Complex Cards
The EP2AGX65DF29C5G includes hard PCIe Gen2 IP blocks configurable as endpoint or root port, supporting x1/x2/x4 at 5 Gbps without consuming fabric for soft SERDES. With 60K logic elements and 364 I/O, designers can implement the application layer (DMA, interrupt controller, protocol stack) plus glue logic on a single chip. The 780-FBGA DF29 package provides the BGA balls required for the transceiver channels; PCB layout must follow the PCIe CEM or SFF-8639 routing rules. Compared to a discrete PCIe switch plus MCU, this consolidates the design and reduces host-CPU load.
Recomendado
HD-SDI and 3G-SDI Broadcast Video Processing
The EP2AGX65DF29C5G supports HD-SDI and 3G-SDI video at 1.485 Gbps and 2.97 Gbps per SMPTE standards, with on-chip transceivers handling the serial bit-clock recovery and the fabric handling de-interleaving, color-space conversion, and overlay composition. The 5,371,904 bits of embedded RAM absorb line buffers and frame stores, while the 364 I/O route parallel video, genlock, and ancillary data. The 0.9 V core and 40 nm process deliver a balance of performance and power for studio equipment; broadcast-grade designs typically pair the FPGA with a frame synchronizer and audio embedder.
Recomendado
Software-Defined Radio (SDR) Platforms
The EP2AGX65DF29C5G's 60,214 logic elements, embedded 18x18 multipliers, and 5.4 Mbit RAM can implement digital down/up-conversion, channelization, and real-time DSP for narrowband SDRs. The 12 transceivers up to 6.375 Gbps enable direct ADC/DAC interfacing at JESD204B-class rates or via legacy LVDS, while the fabric handles the MAC/PHY. Compared to a DSP-plus-FPGA partition, a single Arria II GX simplifies board layout and reduces latency. The 0.9 V core and 40 nm process are appropriate for portable SDR form factors where power and weight matter.
Recomendado
Test and Measurement Instrumentation
The EP2AGX65DF29C5G suits bench-top and PXI/PXIe instruments where reconfigurable fabric, multi-gigabit serial I/O, and a generous pin count are needed. With 60K logic and 364 I/O, the device can implement protocol-aware triggering, real-time signal processing, and front-panel glue logic, while the 12 transceivers up to 6.375 Gbps handle high-speed serial instrument busses (PXI Express, Serial RapidIO, 10 GigE via soft MAC). The 5,371,904 RAM bits buffer long acquisition captures. Designers should follow the Intel PCB layout guidelines for BGA breakout and the Quartus II / Prime Pin Planner early in the design cycle.
Recomendado
Serial RapidIO Bridges and Switches
The EP2AGX65DF29C5G can implement Serial RapidIO Gen2 endpoints and small switches thanks to the 12 transceivers at up to 6.375 Gbps and the embedded M9K memory blocks that buffer SRIO transactions. With 60,214 logic elements, the device can implement the SRIO physical layer plus a small switch fabric or a translation bridge (for example, SRIO to Ethernet, PCIe, or Aurora). The 780-FBGA package supports the high I/O and channel count needed for 4x/8x SRIO link widths. Industrial-grade migration uses the I5N variant in the same DF29 footprint.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2AGX65DF29C5G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2AGX65DF29C4N | EP2AGX65DF29C4G | EP2AGX65DF29C3N | EP2AGX65DF29I5N | EP2AGX65DF29C6G |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-FBGA (DF29) | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same | 780-FBGA (DF29) - same |
| Logic Elements | 60,214 | 60,214 (same die) | 60,214 (same die) | 60,214 (same die) | 60,214 (same die) | 60,214 (same die) |
| Speed Grade | C5 | C4 (slower) | C4 (slower) | C3 (slowest) | I5 (industrial, slightly slower) | C6 (faster) |
| Temperature Grade | Commercial (0C to 85C junction) | Commercial | Commercial | Commercial | Industrial (-40C to 100C) | Commercial |
| User I/O Pins | 364 | 364 | 364 | 364 | 364 | 364 |
| Total RAM Bits | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 | 5,371,904 |
| Transceivers (up to 6.375 Gbps) | 12 | 12 | 12 | 12 | 12 | 12 |
Principais diferenciais
- Mid-density Arria II GX with 12 transceivers at 6.375 Gbps (vs EP2AGX45DF29C5G)
- Hard PCIe Gen2 IP block integrated (vs EP2A40F1020C7 (Stratix II / Arria earlier family))
- C5 speed grade balance of cost and Fmax (vs EP2AGX65DF29C6G (faster C6))
Notas de projeto
Estimated: The 780-FBGA DF29 package is a high-density BGA with multiple transceiver channels and a 0.9 V core; at full transceiver utilization (12 lanes at 6.375 Gbps) plus 60K logic at 70% toggle rate, total power can exceed 10 W. The package has a modest exposed-die top heat-spreader attach surface - use a heatsink with thermal interface material, and ensure the PCB has a continuous ground plane under the BGA for thermal spreading. Use the Intel PowerPlay early power estimator to size the thermal solution before PCB commitment.
BGA escape routing for the 780-FBGA DF29 package requires 4-6 layer PCB with fine-line/spacing (typically 4 mil/4 mil or better) and microvia stackups if you target standard FR-4. Use the Intel Arria II GX Pin Connection Guidelines and the Quartus II / Prime Pin Planner to lock the pin-out early; transceiver balls are bonded to specific positions and re-spins are expensive. Decoupling: place bulk ceramics within 100 mils of each power pin and use a power-plane stackup for the 0.9 V core, with separate analog supplies for the transceiver PLLs.
Do not mix I/O standards across banks without verifying the VCCIO levels - the EP2AGX65DF29C5G supports multiple I/O voltages (typically 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V) and groups pins into banks that must share a common VCCIO. For configuration, follow the recommended sequence in the Arria II GX Configuration Handbook; missing the early POR sequence or the proper MSEL[3:0] setting causes configuration failures that look like a bad part. Finally, verify last-time-buy status with Intel because Arria II GX is a mature family.
Informações de conformidade
RoHS and lead-free confirmed by the 'G' suffix in the ordering code (lead-free, Pb-free). Reach and conflict-minerals compliance per Intel program documentation. AEC-Q100 not applicable for a non-automotive FPGA; automotive-grade would be an Arria II GX-A variant if offered in the same family.
