EP2AGX95DF25C6N - Arria II GX FPGA, 89K LE, 572-FCBGA | Intel
N.º da peça: EP2AGX95DF25C6N ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $2450 | $2.450,00 |
| 10 | $2295 | $22.950,00 |
| 100 | $2095 | $209.500,00 |
| 500 | $1895 | $947.500,00 |
| 1.000 | $1750 | $1.750.000,00 |
EP2AGX95DF25C6N Visão geral
An FPGA (Field-Programmable Gate Array) is a type of integrated circuit whose logic functionality is defined by the customer after manufacturing, rather than at the fab. In the broader taxonomy, FPGAs belong to programmable logic devices, which also include CPLDs (Complex Programmable Logic Devices). Arria II GX sits in the mid-range of Intel's FPGA portfolio, positioned between the low-power Cyclone family and the high-performance Stratix family. The "GX" suffix denotes integrated transceivers optimized for serial connectivity.
Key features include 3.125 Gbps transceivers, dedicated DSP blocks for high-speed arithmetic, and embedded memory blocks supporting FIFO and dual-port operation. The device includes a hard PCI Express Gen1 endpoint block and supports external memory interfaces including DDR3, DDR2, and QDRII+. Configuration is supported via JTAG, passive serial, or fast passive parallel modes.
Architecturally, the EP2AGX95DF25C6N combines a fabric of adaptive logic modules with embedded multiplier blocks, phase-locked loops for clock management, and high-speed serial transceiver channels. The 40 nm process delivers a balance of performance and power efficiency suitable for mid-volume applications.
Typical applications include telecom line cards, video processing pipelines, industrial machine vision, and wireless baseband processing where transceiver density and DSP throughput are required. The 572-ball FCBGA package supports high-speed signal integrity for multi-gigabit interfaces.
When designing with this device, ensure adequate power decoupling and thermal management. The 0.9 V core rail requires low-impedance PCB routing with bulk and ceramic decoupling placed close to the device. Signal integrity analysis is recommended for transceiver channels operating at 3.125 Gbps.
This page synthesizes distributor pricing, same-family drop-in alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternativas drop-in para EP2AGX95DF25C6N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2AGX95DF25C6N (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Speed Grade, Embedded Memory Bits, Transceiver Data Rate.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2AGX95DF25C6G
✅ Drop-In✓ Em estoque
$290 / unidade
Ver ficha técnica →EP2AGX95DF25C5G
✅ Drop-In✓ Em estoque
$768.9 / unidade
Ver ficha técnica →EP2AGX95DF25C4G
✅ Drop-In✓ Em estoque
$360 / unidade
Ver ficha técnica →EP2AGX95DF25C6N Classificações máximas e características elétricas
| Family | Arria II GX |
| Logic Elements (LE) | 89,178 |
| Logic Array Blocks (LAB) | 3,747 |
| Embedded Memory Bits | 6,839,296 |
| Maximum User I/Os | 260 |
| Process Technology | 40 nm |
| Core Voltage | 0.9 V |
| Encapsulamento | 572-ball FCBGA (Flip-Chip BGA) |
| Maximum Operating Frequency | 400 MHz |
| Transceiver Data Rate | up to 3.125 Gbps |
| Operating Temperature Grade | Commercial (C) |
| Speed Grade | 6 |
| Status RoHS | Compliant |
| Configuration Method | JTAG / Passive Serial / Fast Passive Parallel |
| Tipo de montagem | Surface Mount |
Guia de Configuração de Pinos do EP2AGX95DF25C6N 572-ball fcbga (flip-chip bga)
Configuração de pinos para EP2AGX95DF25C6N (pacote 572-ball fcbga (flip-chip bga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2AGX95DF25C6N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2AGX95DF25C6N é adequado para 6 aplicaçãos: Telecom Line Card Processing, Video Processing and Broadcast, Industrial Machine Vision, Wireless Baseband Processing, Test and Measurement Instrumentation, Aerospace and Defense Signal Processing.
Telecom Line Card Processing
The EP2AGX95DF25C6N's 89,178 logic elements and integrated 3.125 Gbps transceivers make it well-suited for telecom line card designs requiring packet processing, traffic shaping, and SERDES connectivity. Its dedicated DSP blocks deliver GMAC-level throughput for Ethernet bridging applications. Placed on the line card between the framer and network processor, the FPGA handles protocol termination and queuing functions. The 572-ball FCBGA package supports controlled-impedance routing for multi-gigabit serial links to adjacent PHYs.
Recomendado
Video Processing and Broadcast
With 3,747 LABs and dedicated DSP blocks, the EP2AGX95DF25C6N handles real-time video processing tasks including deinterlacing, scaling, and color space conversion. The 6.8 Mbits of embedded memory provide line buffers and lookup tables without external SRAM. The integrated transceivers drive SDI, HDMI, or DisplayPort outputs at broadcast-grade data rates. Designers typically pair this FPGA with external DDR3 memory for frame buffering in multi-stream broadcast equipment.
Recomendado
Industrial Machine Vision
The EP2AGX95DF25C6N's combination of DSP throughput and high-speed transceivers enables real-time machine vision processing for industrial inspection systems. Its 89,178 logic elements support complex image preprocessing algorithms, while the 260 user I/Os interface to Camera Link or CoaXPress cameras. The 0.9 V core voltage and 40 nm process balance performance with thermal envelope for factory-floor deployment. Vision system OEMs typically pair this FPGA with external PoCL or frame-grabber ASICs.
Recomendado
Wireless Baseband Processing
The Arria II GX EP2AGX95DF25C6N targets wireless baseband applications requiring DSP-heavy FIR filtering, channelization, and digital up/down conversion. Its 3.125 Gbps transceivers connect to RF front-end ADCs/DACs and CPRI/OBSAI links to base station controllers. The 6.8 Mbits embedded memory supports symbol-rate buffers and constellation tables. LTE and WiMAX system designers leverage this FPGA's logic density for physical-layer processing in macro-cell base stations.
Recomendado
Test and Measurement Instrumentation
Test equipment manufacturers leverage the EP2AGX95DF25C6N's logic density and transceiver channels for protocol analyzers, bit-error-rate testers, and arbitrary waveform generators. The 260 user I/Os provide parallel test bus interfaces, while the integrated transceivers handle high-speed serial protocols like USB 3.0, SATA, and PCIe Gen1. The C6 speed grade offers conservative timing for measurement-grade signal integrity. The 572-ball FCBGA package supports high-bandwidth probe connections.
Recomendado
Aerospace and Defense Signal Processing
Defense system integrators deploy the EP2AGX95DF25C6N in radar signal processing, electronic warfare subsystems, and secure communications. The 89,178 logic elements support beamforming, FFT pipelines, and encryption acceleration. Integrated transceivers drive fiber-optic backplanes and RF digitizer interfaces. Although the C6 commercial grade is standard, Intel offers -I (industrial) and -M (military) screening options in the same family for harsh-environment programs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2AGX95DF25C6N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2AGX95DF25C6G | EP2AGX95DF25C5G | EP2AGX95DF25C4G | XC7K160T-1FFG676 |
|---|---|---|---|---|---|
| Package | 572-ball FCBGA | 572-ball FCBGA - same | 572-ball FCBGA - same | 572-ball FCBGA - same | 676-ball FBG (FBGA) |
| Brand | Intel | Intel | Intel | Intel | Xilinx |
| Logic Elements | 89,178 | 89,178 | 89,178 | 89,178 | 162,240 logic cells |
| Speed Grade | C6 (slowest) | C6 | C5 (faster) | C4 (fastest) | -1 (Kintex-7 speed grade) |
| Embedded Memory (bits) | 6,839,296 | 6,839,296 | 6,839,296 | 6,839,296 | 11,700,608 |
| Maximum User I/Os | 260 | 260 | 260 | 260 | 400 |
| Transceiver Data Rate | up to 3.125 Gbps | up to 3.125 Gbps | up to 3.125 Gbps | up to 3.125 Gbps | up to 6.6 Gbps (GTX) |
| Process Technology | 40 nm | 40 nm | 40 nm | 40 nm | 28 nm |
| Lifecycle Status | NRND | NRND | NRND | NRND | Production |
Principais diferenciais
- Pb-free tray option for lead-free assembly compliance (vs EP2AGX95DF25C6G)
- Faster speed grade improves timing margin (vs EP2AGX95DF25C5G)
- Different package footprint - not a true drop-in (vs XC7K160T-1FFG676)
Notas de projeto
The EP2AGX95DF25C6N requires a regulated 0.9 V core supply capable of delivering up to 2-3 A during typical operation, with transients exceeding 4 A during configuration. Use a multi-phase buck regulator with bulk ceramic decoupling (typically 4x 22 uF X5R plus 10x 0.1 uF X7R) placed within 5 mm of the package. Separate rails for VCCPD (3.0 V), VCCIO (1.5/1.8/2.5/3.3 V banks), and PLL analog supplies are mandatory per Intel hardware design guidelines.
Estimated: at 0.9 V core and 3 A typical current, the FPGA dissipates approximately 2.7 W; under full DSP utilization with all transceivers active, this can exceed 5 W. The 572-ball FCBGA package has theta_JA of approximately 8-12 C/W with appropriate thermal via array and heat spreader. Design for case temperature below 85 C (commercial grade) or 100 C (industrial grade) with adequate airflow or passive heatsink.
Maintain 100 ohm differential impedance for transceiver channels with matched trace lengths within 150 mils. Reference transceiver signals to a continuous ground plane with no plane splits across the BGA field. Use the Intel Arria II GX pin-out file generator in Quartus II to validate ball assignments before PCB layout. Decoupling capacitors must be placed on the BGA side opposite the package, with vias minimized to reduce inductance.
For 3.125 Gbps transceiver operation, perform pre-layout signal integrity simulation using IBIS-AMI models available from Intel. Account for package skew, via stub effects, and crosstalk from adjacent channels. The FCBGA substrate introduces approximately 0.5-1.0 ns of channel skew that must be budgeted into the link timing. Use AC-coupled capacitors (0.1 uF X7R 0402) at transmitter outputs.
Do not apply power before all configuration pins are properly driven; floating MSEL[3:0] pins cause configuration failure. The C6 speed grade is the slowest Arria II GX bin - if timing closure is not achieved, step to C5 (EP2AGX95DF25C5G) before re-architecting the design. Do not confuse the DF25 package code with DF29 - the DF29 variant is a different 780-ball BGA footprint and is not pin-compatible.
Informações de conformidade
RoHS compliance confirmed by Intel product page. AEC-Q100 not applicable - this is an FPGA for industrial/commercial use, not automotive-qualified. Halogen-free status not explicitly confirmed in available data.
