EP2AGX95EF29C4G - Arria II GX FPGA 89K LE 780-FCBGA | Intel
N.º da peça: EP2AGX95EF29C4G ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $1217.37 | $1.217,37 |
| 10 | $1180 | $11.800,00 |
| 25 | $1140 | $28.500,00 |
| 100 | $1080 | $108.000,00 |
| 500 | $980 | $490.000,00 |
EP2AGX95EF29C4G Visão geral
What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit built around an array of configurable logic blocks (CLBs), programmable interconnect, and embedded resources such as block RAM, DSP slices, and high-speed transceivers. FPGAs occupy a unique position in the computing hierarchy between general-purpose CPUs/GPUs and fixed-function ASICs: they offer hardware re-programmability while delivering ASIC-like parallelism for latency-critical workloads. Within Intel's product taxonomy, Arria II GX belongs to the mid-range Arria family, positioned above Cyclone low-density parts and below Stratix high-density parts, targeting cost-sensitive applications requiring transceivers and DSP.
Key features include 8-input adaptive logic modules (ALMs) supporting 6-input LUT-based architectures, dedicated 18x18 multipliers and hard DSP blocks for high-throughput signal processing, and on-chip memory controllers supporting DDR2/DDR3/LPDDR2 external interfaces. The -4 speed grade and C-grade commercial temperature (0C to +85C) suffix denote the device's timing closure and operating envelope. The Arria II GX architecture embeds PCI Express hard IP blocks and multi-gigabit transceivers (MGTs), reducing external PHY BOM cost.
The device targets applications including wireless baseband processing, video broadcast infrastructure, military radar signal processing, and ASIC prototyping. Typical design entry uses Intel Quartus II design software with HDL synthesis and place-and-route. The 780-pin FCBGA package exposes all transceiver pins, PLLs, and I/O banks required for high-speed memory and SERDES connectivity, requiring careful PCB layout with controlled-impedance traces and matched-length routing.
When designing with EP2AGX95EF29C4G, careful attention to transceiver channel placement, decoupling network design, and power supply sequencing is essential. Multiple supply rails (VCC, VCCAUX, VCCPT, VCCPD, and transceiver supplies) require separate decoupling and power-on order. JTAG configuration via the enhanced configuration block supports AS, PS, JTAG, and FPP modes.
Alternativas drop-in para EP2AGX95EF29C4G — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2AGX95EF29C4G (mesmo formato e footprint) — diferindo em Speed Grade, Package, Process Technology, Operating Temperature, Transceiver Data Rate.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2AGX95EF29C5G
✅ Drop-In✓ Em estoque
$1305 / unidade
Ver ficha técnica →EP2AGX95EF29I4G
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP2AGX95EF29C6G
✅ Drop-In✓ Em estoque
$465 / unidade
Ver ficha técnica →EP2AGX95EF29C4
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP2AGX95EF29C5
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP2AGX95EF29C4G Classificações máximas e características elétricas
| Family | Arria II GX |
| Logic Elements | 89,178 |
| Embedded Memory (bits) | 6,839,296 |
| Maximum User I/Os | 372 |
| Transceivers | Up to 12 |
| Transceiver Data Rate | Up to 3.75 Gbps |
| Encapsulamento | 780-pin FCBGA (flip-chip BGA) |
| Speed Grade | -4 |
| Temperature Grade | Commercial (0C to +85C) |
| Process Technology | 40 nm TSMC |
| Tipo de montagem | Surface Mount |
Guia de Configuração de Pinos do EP2AGX95EF29C4G 780-pin fcbga (flip-chip bga)
Configuração de pinos para EP2AGX95EF29C4G (pacote 780-pin fcbga (flip-chip bga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2AGX95EF29C4G.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2AGX95EF29C4G é adequado para 6 aplicaçãos: Wireless Baseband Signal Processing, Video Broadcasting and Image Processing, ASIC Prototyping and Emulation, PCIe Endpoint Expansion and Acceleration, Industrial Motor Control and Servo Drive, Test and Measurement Instrumentation.
Wireless Baseband Signal Processing
The EP2AGX95EF29C4G's 12 multi-gigabit transceivers at 3.75 Gbps make it well-suited for wireless baseband processing in 3G/4G remote radio heads and small-cell base stations. The device's hard DSP blocks perform channelization, FFT/IFFT, crest-factor reduction, and digital predistortion (DPD) at sample rates up to 245.76 Msps. Its 89,178 logic elements and 6.8 Mbit embedded memory handle multi-antenna (MIMO 2x2 / 4x4) datapaths within a single chip. Compared to DSP-only processors, the FPGA's parallel datapath reduces CPRI latency by 10x, which is critical for TDD-LTE timing requirements. Engineers typically pair it with ADI AD9361 or AD9371 RF transceivers via CPRI or JESD204B links.
Recomendado
Video Broadcasting and Image Processing
The EP2AGX95EF29C4G is widely deployed in broadcast video infrastructure such as SDI/HD-SDI routers, format converters, and video overlay processors. Its 372 user I/Os can directly drive multiple 3G-SDI outputs and high-resolution LVDS display panels. Embedded DSP slices perform real-time de-interlacing, scaling, color-space conversion, and H.264/MJPEG encoding at 1080p60. The 6.8 Mbit embedded block RAM buffers full HD frames without external memory, reducing BOM cost. Compared to ASSP video processors, the FPGA allows custom proprietary codecs and overlay graphics, which broadcast OEMs require for product differentiation. Typical reference designs target SMPTE 424M and SMPTE 425M 3G-SDI interfaces.
Recomendado
ASIC Prototyping and Emulation
The EP2AGX95EF29C4G serves as a mid-capacity ASIC prototyping platform, hosting designs up to roughly 5-10 million gates when using multiple FPGAs with high-speed serial interconnect. Its 3.75 Gbps transceivers implement chip-to-chip tile links, while 372 user I/Os provide breakout to ASIC package balls for bring-up. Quartus II's TimeQuest sign-off flow gives ASIC designers predictable timing closure. Compared to dedicated emulators (e.g., Cadence Palladium), Arria II GX prototyping saves $1M+ in non-recurring engineering for projects where full gate-level visibility is not required. Common use cases include pre-silicon validation of networking ASICs, SSD controllers, and graphics IP.
Recomendado
PCIe Endpoint Expansion and Acceleration
The EP2AGX95EF29C4G's hard PCIe Gen1 IP block supports x1, x2, and x4 PCIe endpoint designs for storage, instrumentation, and machine-learning acceleration cards. Its 89,178 logic elements implement DMA engines, device drivers in hardware, and custom register interfaces. With 6.8 Mbit block RAM, packet buffers are absorbed on-chip, eliminating external SRAM. Compared to ASSP PCIe bridges, the FPGA allows custom protocol layers and proprietary accelerator logic. Common applications include NVMe SSD controllers, low-latency network capture cards, and FPGA-based ML inference engines in PCIe form factor.
Recomendado
Industrial Motor Control and Servo Drive
The EP2AGX95EF29C4G is found in industrial motor drives where its combination of DSP blocks, transceivers, and high I/O count suits field-oriented control (FOC) loops and multi-axis servo control. Hard DSP slices perform Park/Clarke transforms, SVPWM, and PI current loops at switching frequencies up to 100 kHz. Industrial-grade -I variant (EP2AGX95EF29I4G) extends operation to -40C. EtherCAT, PROFIBUS, and SERCOS III industrial protocols use the MGT channels for real-time deterministic communication. Compared to microcontrollers, the FPGA's parallel logic achieves sub-microsecond current-loop latency essential for high-speed spindle control.
Recomendado
Test and Measurement Instrumentation
The EP2AGX95EF29C4G powers high-end test and measurement equipment such as logic analyzers, protocol analyzers, and bit-error-rate testers. The 3.75 Gbps transceivers acquire PRBS patterns at wire-speed, while 372 user I/Os drive high-pin-count probe fixtures. Embedded block RAM stores captured waveforms for real-time triggering. Compared to fixed-function BERT chips, the FPGA allows custom protocol decoding (e.g., USB 3.0, SATA, PCIe Gen1) on a single instrument. The -4 speed grade offers the Fmax headroom required for 8b/10b encoding and COM (channel operating margin) testing in serial-link validation setups.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2AGX95EF29C4G — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2AGX95EF29C5G | EP2AGX95EF29I4G | EP2AGX95EF29C6G |
|---|---|---|---|---|
| Brand | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) | Intel (formerly Altera) |
| Package | 780-pin FCBGA | 780-pin FCBGA (same) | 780-pin FCBGA (same) | 780-pin FCBGA (same) |
| Logic Elements | 89,178 | 89,178 | 89,178 | 89,178 |
| Embedded Memory (bits) | 6,839,296 | 6,839,296 | 6,839,296 | 6,839,296 |
| Maximum User I/Os | 372 | 372 | 372 | 372 |
| Transceivers | Up to 12 @ 3.75 Gbps | Up to 12 @ 3.75 Gbps | Up to 12 @ 3.75 Gbps | Up to 12 @ 3.75 Gbps |
| Speed Grade | -4 | -5 (faster) | -4 | -6 (slower) |
| Temperature Grade | Commercial (0C to +85C) | Commercial (0C to +85C) | Industrial (-40C to +100C TJ) | Commercial (0C to +85C) |
Principais diferenciais
- Same 89K-LE core, faster Fmax speed bin (vs EP2AGX95EF29C5G)
- Industrial temperature grade for harsh environments (vs EP2AGX95EF29I4G)
- Slower speed bin for lower power (vs EP2AGX95EF29C6G)
Notas de projeto
The EP2AGX95EF29C4G requires multiple supply rails: VCCINT (core), VCCAUX (auxiliary), VCCPT (programmable power technology), VCCPD (I/O pre-drivers), and per-bank VCCIO. Each rail has separate decoupling requirements per Arria II GX handbook Chapter 5. A typical design uses 0.1uF X7R ceramic capacitors within 100 mils of every supply pin, plus bulk 47-100uF tantalum or polymer capacitors. Power-on order: VCCINT, then VCCAUX, then VCCIO - critical for hot-socketing support.
The 780-pin FCBGA has 1.0 mm ball pitch, requiring 4-6 layer PCB with microvia (laser-drilled) stack-up. Per Arria II GX handbook, transceiver channels require 100-ohm differential routing with <5 mil intra-pair skew and <100 mil inter-pair skew. Use the Intel-provided reference PCB stack-up to meet insertion loss targets for 3.75 Gbps SERDES. Impedance-controlled traces must be verified with TDR measurement on coupons before fabrication.
At maximum toggle rate, the EP2AGX95EF29C4G can dissipate 5-8W. With 780-FCBGA theta-JA around 12-15 C/W on a standard 4-layer PCB, junction temperature rises 60-120C above ambient. For closed enclosures, attach a heatsink or thermal interface material (TIM) and provide minimum 100 LFM airflow. Monitor the on-chip temperature-sensing diode via the ALTPLL or temperature-sensing block for thermal protection shutdown.
Common design pitfalls with EP2AGX95EF29C4G: (1) using JTAG chain without TCK/TMS pull-ups - causes configuration failure; (2) omitting CONF_DONE pull-up to VCCPD - prevents boot status indication; (3) crossing I/O bank voltages between 3.3V and 2.5V rails - corrupts I/O buffers; (4) leaving unused transceiver channels floating - tie TXP/TXN to ground through 0.1uF caps per handbook section 7.4; (5) exceeding MSL3 moisture sensitivity during rework.
For external DDR2/DDR3 memory interfaces, use the UniPHY IP core in Quartus II and follow Arria II GX external memory interface handbook. Read/write deskew calibration should be run at first power-up. Place external memory on the same PCB layer as the FPGA and use matched-length traces within +/- 25 mil. Series termination resistors (33 ohm) on DDR output drivers are typically required.
Informações de conformidade
RoHS and REACH compliance status not directly stated in verified web data; industrial-temperature variant EP2AGX95EF29I4G should be selected if automotive/aerospace compliance is required. Conflict minerals compliance per Intel's corporate policy.
