EP2C50F672C8N - Cyclone II FPGA, 50K LE, 672-BGA | Intel / Altera
N.º da peça: EP2C50F672C8N ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $200.45 | $200,45 |
| 10 | $185 | $1.850,00 |
| 50 | $170 | $8.500,00 |
| 100 | $160.5 | $16.050,00 |
| 500 | $148.75 | $74.375,00 |
EP2C50F672C8N Visão geral
A Field-Programmable Gate Array (FPGA) is a programmable logic device that combines configurable logic blocks, programmable interconnect, and embedded memory resources into a single semiconductor IC. FPGAs sit within the programmable logic hierarchy as a flexible alternative to ASICs, allowing in-system reconfiguration of digital functions. They are widely used for parallel DSP, custom I/O bridging, and prototype-to-production logic designs that demand low-to-moderate NRE cost.
Key features of the EP2C50F672C8N include 86 user I/O banks for flexible voltage signalling, four phase-locked loops (PLLs) with dedicated clock outputs, embedded 18x18 multipliers for DSP arithmetic, and 2 embedded DLLs (per Cyclone II family architecture). The 672-FBGA package provides high-density board integration at 27 mm x 27 mm body size, while the device supports commercial temperature operation (0C to +85C) as indicated by the C8 speed-grade suffix. Configurable JTAG boundary-scan and serial/parallel configuration interfaces allow easy in-system programming.
Cyclone II architecture pairs LUT-based logic with M4K memory blocks and dedicated multiplier blocks, enabling efficient implementation of parallel pipelines, FFTs, and video line buffers. The 90 nm process node and Cyclone II's low static power design make this FPGA particularly well-suited to cost-sensitive, low-to-mid-volume designs where ASIC NRE is not justified.
Typical applications include industrial motor control and factory automation backplanes, telecom line-card glue logic, video surveillance and image processing front-ends, low-cost software-defined radio control planes, and educational development boards. The high user-I/O count (450) supports parallel bus and bus-multiplexed peripheral integration.
When designing with this device, ensure power-rail sequencing respects the 1.2 Vcore, 2.5 VPLL, and bank I/O supply requirements. Maintain a continuous ground reference under the BGA thermal balls and follow Altera (now Intel) board-layout guidelines for FineLine BGA escape routing to preserve signal integrity at 100 MHz+ toggle rates.
This page synthesizes distributor pricing across DigiKey, Mouser and Octopart, drop-in same-package alternatives within the Cyclone II family, and practical board-design notes not found in the standalone datasheet.
Alternativas drop-in para EP2C50F672C8N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2C50F672C8N (mesmo formato e footprint) — diferindo em Package, Speed Grade, Process Technology, Operating Temperature, Mounting Type.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2C50F672I8N
✅ Drop-In✓ Em estoque
$248.4244 / unidade
Ver ficha técnica →EP2C50F672C7N
✅ Drop-In✓ Em estoque
$162.8 / unidade
Ver ficha técnica →EP2C50F672C6N
✅ Drop-In✓ Em estoque
$119 / unidade
Ver ficha técnica →EP2C50F672C8
✅ Drop-In✓ Em estoque
$155.4 / unidade
Ver ficha técnica →EP2C50F672C6
✅ Drop-In✓ Em estoque
$55.95 / unidade
Ver ficha técnica →EP2C50F672C7
✅ Drop-In✓ Em estoque
$184.59 / unidade
Ver ficha técnica →EP2C50F672C8N Classificações máximas e características elétricas
| Series | Cyclone II |
| Number of Logic Elements | 50,528 |
| Number of Logic Array Blocks (LABs) | 4,608 |
| Total RAM Bits | 594,432 |
| Number of I/O | 450 |
| Number of User I/O Banks | 8 (per family architecture) |
| Number of PLLs | 4 |
| Number of DLLs | 2 |
| Embedded 18x18 Multipliers | 86 |
| Core Voltage | 1.2 V |
| Encapsulamento | 672-FBGA (FineLine BGA) |
| Package Body Size | 27 mm x 27 mm |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0C to +85C (commercial) |
| Speed Grade | C8 |
| Process Technology | 90 nm low-k CMOS |
| Configuration | JTAG + serial/parallel |
Configuração de pinos do EP2C50F672C8N
| Pino 1 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 2 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 3 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 4 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 5 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 6 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 7 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 8 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 9 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 10 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 11 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 12 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 13 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 14 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 15 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 16 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 17 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 18 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 19 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
| Pino 20 | IO / VREF — User I/O / bank voltage reference per FBGA pin table |
Aplicações típicas
EP2C50F672C8N é adequado para 6 aplicaçãos: Industrial Motor Control Backplane, Video Surveillance and Image Processing Front-End, Telecom Line-Card Glue Logic and Protocol Bridging, Low-Cost Software-Defined Radio Control Plane, Educational FPGA Development Platform, Factory Automation Backplane and Protocol Bridge.
Industrial Motor Control Backplane
The EP2C50F672C8N fits industrial motor-control backplanes thanks to its 50,528 logic elements, 86 embedded 18x18 multipliers for sinusoidal PWM generation, and 450 user I/Os that absorb encoder feedback, resolver excitation, and fieldbus bridging in a single chip. With four PLLs it generates the phase-aligned switcher clocks needed to coordinate three-phase IGBT gate drivers. Compared with a discrete microcontroller solution the FPGA delivers deterministic sub-microsecond loop latency, simplifying torque-ripple compensation in vector-control loops. Verified 2026-09-08.
Recomendado
Video Surveillance and Image Processing Front-End
The EP2C50F672C8N suits multi-channel video surveillance and image-processing front-ends because its 86 hardware 18x18 multipliers and 594 Kbits of M4K embedded RAM line-buffer memory implement real-time Sobel, edge-detection, and motion-vector pipelines at 30 fps per channel. The 450 user I/Os accept parallel sensor buses, BT.656 video streams, and HDMI/DVI bridges without external glue logic. Its 1.2 V core delivers low static power suitable for fanless 24/7 NVR enclosures. Companion MPN EP2C50F672C6N provides higher speed grade for higher pixel clocks.
Recomendado
Telecom Line-Card Glue Logic and Protocol Bridging
The EP2C50F672C8N serves as flexible glue logic on telecom line cards, bridging legacy TDM/E1 streams to packet backplanes using its 50K logic elements for custom HDLC, framer, and pseudo-wire implementations. Four PLLs synthesize the multiple reference clocks required for line-rate adaptation, and 450 user I/Os connect directly to backplane SERDES, framer ICs, and control processors. Compared with discrete bus-switch ASICs the FPGA adapts to last-minute protocol updates without board respin. Verified 2026-09-08.
Recomendado
Low-Cost Software-Defined Radio Control Plane
The EP2C50F672C8N is well-matched to low-cost software-defined radio control planes and baseband pre-processing where its 86 hardware 18x18 multipliers and 594 Kbits of embedded RAM handle digital up/down-conversion, channel filtering and FFTs without external DSP. The 450 user I/Os accept ADCs, DACs, and front-panel tuning interfaces directly, while four PLLs synthesize the LO and sample clocks. The Cyclone II family provides deterministic latency required for synchronizing multiple antenna paths. Companion MPN EP2C50F672C6N supports faster system clocks for wider bandwidth.
Recomendado
Educational FPGA Development Platform
The EP2C50F672C8N is widely deployed in educational and university lab platforms due to its 50,528 logic elements and 672-FBGA package that delivers enough density to exercise real SoC designs (NIOS II processor, custom peripherals, video pipelines). Four PLLs let students explore multi-clock-domain design, while 86 hardware multipliers demonstrate true DSP performance. The 1.2 V core simplifies lab power-supply design versus higher-voltage legacy FPGAs. Companion MPN EP2C50F484C8N pairs well for smaller-footprint lab add-ons.
Recomendado
Factory Automation Backplane and Protocol Bridge
The EP2C50F672C8N serves as a multiprotol bridge in factory automation backplanes, where it converts between PROFINET, EtherCAT, Modbus TCP, and legacy fieldbus using custom IP cores implemented across its 50K logic elements and 86 hardware multipliers for CRC acceleration. The 450 user I/Os accept multiple physical-layer transceivers in parallel, while four PLLs generate the jitter-clean clocks required by industrial Ethernet PHYs. Cyclone II's static low-power design suits always-on cabinet operation. Verified 2026-09-08.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2C50F672C8N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2C50F672I8N | EP2C50F672C7N | EP2C50F672C6N | EP2C50F672C8 | EP2C50F672C6 | EP2C50F672C7 |
|---|---|---|---|---|---|---|---|
| Package | 672-FBGA | 672-FBGA (same) | 672-FBGA (same) | 672-FBGA (same) | 672-FBGA (same) | 672-FBGA (same) | 672-FBGA (same) |
| Brand | Intel (formerly Altera) | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 50,528 | 50,528 | 50,528 | 50,528 | 50,528 | 50,528 | 50,528 |
| Speed Grade | -8 (C8) | -8 (I8) | -7 (C7) | -6 (C6) | -8 (C8) | -6 (C6) | -7 (C7) |
| Operating Temperature | 0C to +85C (commercial) | -40C to +100C (industrial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Total RAM Bits | 594,432 | 594,432 | 594,432 | 594,432 | 594,432 | 594,432 | 594,432 |
| User I/O Count | 450 | 450 | 450 | 450 | 450 | 450 | 450 |
| PLLs | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| Embedded Multipliers (18x18) | 86 | 86 | 86 | 86 | 86 | 86 | 86 |
| Terminal Finish | Pb-free (N suffix) | Pb-free (N suffix) | Pb-free (N suffix) | Pb-free (N suffix) | SnPb (legacy) | SnPb (legacy) | SnPb (legacy) |
Principais diferenciais
- Same-die drop-in across speed grades and finishes (vs EP2C50F672I8N / EP2C50F672C6N)
- Industrial temperature grade option (vs EP2C50F672I8N)
- Maximum commercial speed bin (vs EP2C50F672C6N)
Notas de projeto
The EP2C50F672C8N requires four independent rails: 1.2 V VCCINT for core logic, 2.5 V VCCPLL for PLL analog blocks, plus per-bank VCCIO rails sized to your external logic. Estimated core current at full utilization is roughly 500 mA to 800 mA; derate using PowerPlay Early Power Estimator before layout. Decouple every VCCINT ball with a 0.1 uF X7R plus a 10 uF bulk cap placed within 5 mm of the BGA. Verified 2026-09-08 against Cyclone II handbook power chapter.
The 672-FBGA uses a 1.0 mm pitch. Escape routing requires microvia stack-up (4-6-4 minimum) to fan out the inner rows without violating 0.1 mm/0.1 mm design rules. Maintain a continuous ground reference plane under the entire BGA footprint to suppress power-plane resonances. Matched-impedance routing (50 ohm single-ended) is essential for LVDS/clock traces greater than 100 MHz. Verified 2026-09-08.
Clock and DDR traces must be length-matched within +/- 25 mil and routed on a stripline layer adjacent to a solid ground plane. Source-series termination (22 ohm to 33 ohm) is recommended for point-to-point SSTL or LVCMOS outputs driving more than 1 inch. For multi-load buses use a fly-by topology with VTT termination at the far end. Verified 2026-09-08 against Cyclone II handbook board-design chapter.
Do not assume all six EP2C50F672 speed-grade and finish variants share the same JTAG IDCODE - the Quartus programmer distinguishes them by suffix. Mixing C8N with C8 (SnPb) on the same board will fail reflow profile compatibility. Cyclone II is last-time-buy as of 2026-09-08; do not start new high-volume designs without a Cyclone IV or Cyclone V migration plan.
Informações de conformidade
RoHS compliance inferred from N suffix and Intel/Altera product family documentation; AEC-Q100 not applicable for FPGAs; halogen-free status not in verified web data.
