EP2S15F484I4 - Stratix II FPGA, 15K LE, 484-FBGA, Industrial | Altera
N.º da peça: EP2S15F484I4 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $421.71 | $421,71 |
| 10 | $379.54 | $3.795,40 |
| 100 | $337.37 | $33.737,00 |
| 500 | $295.2 | $147.600,00 |
| 1.000 | $253.03 | $253.030,00 |
EP2S15F484I4 Visão geral
A Field Programmable Gate Array (FPGA) is a type of programmable logic device that lets engineers configure digital logic, memory blocks, and I/O after manufacturing. Within the semiconductor hierarchy, an FPGA sits between an Application-Specific Integrated Circuit (ASIC) and a general-purpose processor: more flexible than an ASIC and far more parallel than a CPU. The Stratix II family specifically targets high-performance applications requiring DSP, high-speed transceivers, and large on-chip memory. The EP2S15F484I4 is the smallest-density member of that family while retaining the full transceiver and DSP feature set.
Key features include 12 transceiver channels supporting multi-gigabit serial links, dedicated DSP blocks delivering up to 1.26 GMACs of signal-processing throughput, and TriMatrix on-chip memory composed of MLAB, M512, and M4K blocks totaling approximately 419 Kbits. Up to 156 multipliers and a four-bit error-correction block in each M-RAM tile support hardware-accelerated DSP. The device also offers high-speed external memory interfaces including DDR, DDR2, QDRII, and RLDRAM controllers.
Architecturally, the Stratix II device uses an adaptive logic module (ALM) with eight inputs, allowing designs to be packed more efficiently than the four-input LUT architectures used in earlier generations. Combined with the 90 nm process, this delivers up to twice the logic capacity per area at lower dynamic power than the prior Stratix family. The I4 industrial temperature grade makes the part suitable for harsh-environment embedded systems that must operate outside commercial temperature ranges.
Typical applications include high-end telecommunications backhaul equipment, broadband aggregation routers, military and aerospace signal processing, video broadcast infrastructure, and ASIC prototyping. The combination of embedded transceivers, large on-chip memory, and DSP blocks makes the EP2S15F484I4 well suited to designs that require parallel processing alongside high-speed serial I/O. Designers migrating from the original Stratix family will find the Quartus II design flow familiar, with the Adaptive Logic Module providing a more efficient mapping target for complex state machines.
When designing with this device, plan power sequencing carefully: the Stratix II family requires well-ordered ramp of VCCINT, VCCIO, and VCCA before configuration. Decoupling follows the Altera reference design, with low-ESR ceramic capacitors distributed across all supply pins. PCB layout for the 484-FBGA package demands microvia or wire-bond stack-up expertise and controlled-impedance routing for the transceiver channels.
This page synthesizes distributor pricing, drop-in alternatives drawn from the same Stratix II family, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para EP2S15F484I4 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2S15F484I4 (mesmo formato e footprint) — diferindo em Package, Speed Grade, Configuration Method, RoHS Status, Family.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2S15F484C5N
✅ Drop-In✓ Em estoque
$144.8 / unidade
Ver ficha técnica →EP2S15F484C5
✅ Drop-In✓ Em estoque
$185 / unidade
Ver ficha técnica →EP2S15F484C4N
✅ Drop-In✓ Em estoque
$185 / unidade
Ver ficha técnica →EP2S15F484C4
✅ Drop-In✓ Em estoque
$205 / unidade
Ver ficha técnica →EP2S15F484C3N
✅ Drop-In✓ Em estoque
$155 / unidade
Ver ficha técnica →EP2S15F484C3
✅ Drop-In✓ Em estoque
$118 / unidade
Ver ficha técnica →EP2S15F484I4 Classificações máximas e características elétricas
| Family | Stratix II |
| Logic Elements | 15,600 |
| Adaptive Logic Modules (ALMs) | 6,240 |
| Embedded Memory (bits) | 419,328 |
| Embedded Memory Blocks | TriMatrix (MLAB, M512, M4K) |
| DSP Blocks | Yes (12 dedicated 18x18 multipliers) |
| Maximum User I/O | 342 |
| Transceiver Channels | Up to 12 (multi-gigabit) |
| Core Voltage (VCCINT) | 1.2 V |
| Process Technology | 90 nm |
| Operating Temperature Grade | Industrial (I4) |
| Encapsulamento | 484-ball FBGA (FineLine BGA) |
| Tipo de montagem | Surface Mount |
| Configuration Scheme | FPGA - SRAM-based |
Guia de Configuração de Pinos do EP2S15F484I4 484-ball fbga (fineline bga)
Configuração de pinos para EP2S15F484I4 (pacote 484-ball fbga (fineline bga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2S15F484I4.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2S15F484I4 é adequado para 6 aplicaçãos: Telecommunications Backhaul, ASIC Prototyping and Emulation, DSP and Signal Processing, Video Broadcast Infrastructure, Industrial Control and Automation, Military and Aerospace Signal Processing.
Telecommunications Backhaul
The EP2S15F484I4's 12 multi-gigabit transceiver channels (up to 6.375 Gbps each) make it a strong fit for telecom backhaul line cards. With 15,600 logic elements and 419 Kbits of TriMatrix on-chip memory, it can simultaneously handle packet classification, framing, and QoS scheduling. Placed on the line card between the PHY and the network processor, it absorbs serializer/deserializer overhead and protocol bridging. The industrial temperature grade allows deployment in outdoor cabinets without additional thermal management.
Recomendado
ASIC Prototyping and Emulation
With 15,600 logic elements and 342 user I/Os, the EP2S15F484I4 can emulate ASIC designs up to roughly 1.5 million gates. Designers map ASIC RTL into Quartus II and benefit from the same Adaptive Logic Module used in Stratix II production silicon, ensuring timing-accurate prototyping. The 484-FBGA package exposes sufficient I/O for breaking out complex SoC peripherals. Industrial temperature support enables pre-silicon hardware-software integration for automotive ASICs.
Recomendado
DSP and Signal Processing
Twelve dedicated 18x18 multipliers deliver up to 1.26 GMACs of DSP throughput, allowing the EP2S15F484I4 to handle FIR filters, FFT engines, and channelizers in software-defined radio. TriMatrix memory provides the high-bandwidth on-chip data buffers required for streaming signal processing without external memory stalls. The high PSRR of the 1.2 V core supply keeps noise out of sensitive RF chains. Quartus II DSP Builder accelerates model-based DSP design.
Recomendado
Video Broadcast Infrastructure
The 419 Kbits of TriMatrix memory acts as line buffers and chroma interpolation storage for HD-SDI and 3G-SDI video processing pipelines. Twelve multi-gigabit transceivers directly drive SDI physical layers and HDMI/DVI serial links without external bridge chips. 342 user I/Os support parallel video buses and DDR2 frame buffers. Industrial temperature ensures reliable operation in broadcast rack and outdoor transmitter environments.
Recomendado
Industrial Control and Automation
Industrial automation systems benefit from the EP2S15F484I4's industrial temperature range, fast DSP blocks for closed-loop control algorithms, and abundant I/O for parallel encoder/counter interfaces. The 484-FBGA package provides sufficient user I/O to consolidate multiple PLC functions onto a single device. On-chip TriMatrix memory supports deterministic real-time control loops. Conformal coating compatibility of the FBGA package enables use in harsh factory environments.
Recomendado
Military and Aerospace Signal Processing
Industrial temperature grade, combined with the Stratix II family's high logic density and multi-gigabit transceivers, makes the EP2S15F484I4 suitable for ruggedized electronic warfare, radar preprocessing, and secure communications payloads. Adaptive Logic Modules implement custom cryptographic primitives efficiently while 12 transceivers drive high-speed sensor links. FBGA package supports conformal coating and hermetic packaging for defense and aerospace programs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2S15F484I4 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2S15F484C5N | EP2S15F484C5 | EP2S15F484C4N | EP2S15F484C4 | EP2S15F484C3N | EP2S15F484C3 |
|---|---|---|---|---|---|---|---|
| Package | 484-FBGA | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same | 484-FBGA - same |
| Brand | Altera | Altera | Altera | Altera | Altera | Altera | Altera |
| Logic Elements | 15,600 | 15,600 | 15,600 | 15,600 | 15,600 | 15,600 | 15,600 |
| Temperature Grade | Industrial (I4) | Commercial | Commercial | Commercial | Commercial | Commercial | Commercial |
| Speed Grade | I4 (industrial, fastest) | -5 (fastest) | -5 (fastest) | -4 | -4 | -3 (slowest) | -3 (slowest) |
| Embedded Memory (bits) | 419,328 | 419,328 | 419,328 | 419,328 | 419,328 | 419,328 | 419,328 |
| User I/O | 342 | 342 | 342 | 342 | 342 | 342 | 342 |
| Pb-free (N suffix) | No (industrial variant) | Yes | No | Yes | No | Yes | No |
Principais diferenciais
- Industrial temperature grade (-40C to +100C) for ruggedized applications (vs EP2S15F484C5N)
- Fastest Stratix II speed grade in the industrial variant (vs EP2S15F484C4N)
- 12 multi-gigabit transceiver channels integrated on-chip (vs Cyclone II EP2C20F484I8N)
Notas de projeto
The Stratix II EP2S15F484I4 requires a specific power-up sequence: VCCINT (1.2 V) must ramp before VCCIO, and VCCA (analog supply for PLLs and transceivers) must be present before configuration. According to the Altera Stratix II handbook, an out-of-order ramp can cause high inrush currents and may trigger latch-up. Use a dedicated power supervisor such as the LTC3589 or Altera-recommended sequencer. Decoupling follows the Altera reference design: 0.1 uF and 0.01 uF ceramics adjacent to every VCCINT ball, plus bulk 22 uF tantalum per quadrant.
Estimated: at 100% resource utilization and 1.2 V core, the EP2S15F484I4 typically dissipates 3 to 5 W. The 484-FBGA package has a theta_JA in the 8 to 12 C/W range when mounted on a JEDEC JESD51 test board with adequate copper. Designers targeting the full industrial temperature range must keep junction temperature below +100C, leaving 15 to 20 C margin for derating. Use of thermal vias under the central die region and forced airflow is recommended when the device is operated at sustained high toggle rates.
The 484-FBGA package uses a 1.0 mm ball pitch, which requires microvia or via-in-pad PCB technology for breakout. A wire-bond stack-up with sequential lamination is the standard approach; laser-drilled microvias at each pad are required for clean escape routing. Reference the Altera 484-FBGA layout application note for escape pattern guidance. Differential transceiver channels must be routed with 100 ohm differential impedance and matched within 150 mil length, per the Stratix II device handbook.
Do not confuse EP2S15F484I4 with EP2S15F484C5N: the I4 suffix denotes industrial temperature grade, while the C5 denotes commercial with a different speed grade. Mismatched grades cause timing analysis errors and may render the design non-functional outside commercial temperature range. Always lock the pinout in Quartus II before PCB layout to avoid costly respins. Confirm transceiver channel availability for the 484-FBGA package, since some transceiver balls are multiplexed with regular I/O.
Multi-gigabit transceiver channels on the EP2S15F484I4 require careful attention to AC coupling, reference plane continuity, and crosstalk isolation. Per Stratix II device handbook recommendations, AC-coupling capacitors must be placed within 250 mil of the transmitter ball, and the reference plane must remain unbroken beneath the entire differential pair. A failed signal-integrity check on one transceiver can corrupt multiple channels through coupled noise; budgeting 10 to 15 dB insertion-loss margin is essential for reliable multi-gigabit operation.
Informações de conformidade
RoHS and REACH compliance status not confirmed by verified web data - listed as [DATA_NEEDED] in specs. AEC-Q100 is not applicable for FPGAs of this class. Designers should request the latest material declaration from Intel Altera directly.