EP2S15F672C4N - Stratix II FPGA 15K LEs, 672-BGA | Intel (Altera)
N.º da peça: EP2S15F672C4N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $265 | $2.650,00 |
| 100 | $235 | $23.500,00 |
| 500 | $210 | $105.000,00 |
| 1.000 | $195 | $195.000,00 |
EP2S15F672C4N Visão geral
An FPGA (Field-Programmable Gate Array) is a type of programmable logic device (PLD) that engineers can configure after manufacturing. FPGAs sit between custom ASICs and fixed-function ICs in the design hierarchy: PLD -> CPLD -> FPGA -> ASIC, and are widely used for digital signal processing, glue logic, high-speed interfacing, and prototyping. The Stratix II family specifically targets high-performance applications with embedded multipliers, DSP blocks, and high-speed transceivers.
Key features include 15,600 logic elements (LEs), 419,328 RAM bits (approximately 52 KB), 156 embedded multipliers, dedicated DSP blocks, and support for external memory interfaces including DDR/DDR2 SDRAM and QDRII SRAM. The 672-BGA package provides high I/O density for complex system designs requiring many parallel interfaces.
The EP2S15F672C4N is fabricated in a 90 nm CMOS process with a 1.2V core voltage, and supports configuration via JTAG, passive serial, or active serial modes. The architecture is built around the Adaptive Logic Module (ALM), which improves logic utilization efficiency compared to traditional 4-input LUT architectures.
Typical applications include high-speed digital signal processing, telecommunications infrastructure, video and image processing, military/aerospace systems, ASIC prototyping, and high-bandwidth data acquisition. The high logic density and embedded multipliers make it particularly suited for DSP-intensive designs such as FFT engines and video codecs.
When designing with this part, pay careful attention to power sequencing: the 1.2V core supply must ramp before I/O voltages to avoid latch-up. Use the Quartus II design software (legacy) or the modern Intel Quartus Prime with Stratix II device support for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing across 16+ sources, parametric drop-in alternatives, and practical design notes not found in the manufacturer datasheet, helping engineers evaluate this legacy Stratix II part for new designs or long-term support scenarios.
Alternativas drop-in para EP2S15F672C4N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2S15F672C4N (mesmo formato e footprint) — diferindo em Package, Speed Grade, Operating Temperature, RoHS Status, Configuration Method.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2S15F672C4
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$235 / unidade
Ver ficha técnica →EP2S15F672C3N
✅ Drop-In✓ Em estoque
$142.75 / unidade
Ver ficha técnica →EP2S15F672C3
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$142.3 / unidade
Ver ficha técnica →EP2S130F780C4N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$1095 / unidade
Ver ficha técnica →EP2S30F672C5N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$450 / unidade
Ver ficha técnica →EP2S130F1508C4N
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$4435.83 / unidade
Ver ficha técnica →EP2S15F672C4N Classificações máximas e características elétricas
| Family | Stratix II |
| Logic Elements | 15,600 |
| Total RAM Bits | 419,328 (52 KB) |
| Embedded Multipliers | 156 (18x18) |
| DSP Blocks | Yes |
| User I/O Count | 358 |
| Core Voltage | 1.2 V |
| Encapsulamento | 672-BBGA (Fine-pitch BGA) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +85C (Industrial) |
| Speed Grade | C4 |
| Process Technology | 90 nm CMOS |
| Configuration Mode | JTAG / Passive Serial / Active Serial |
| Status RoHS | Compliant |
| Lead-Free | Yes |
Configuração de pinos do EP2S15F672C4N
| Pino A1 | I/O — General purpose user I/O (bank dependent) |
| Pino A2 | VCCIO1 — I/O supply voltage bank 1 |
| Pino B1 | GND — Ground reference |
| Pino B2 | I/O — General purpose user I/O |
| Pino C1 | I/O — General purpose user I/O |
| Pino C2 | VCCINT — Core supply voltage (1.2V) |
| Pino D1 | GND — Ground reference |
| Pino D2 | I/O — General purpose user I/O |
| Pino E1 | I/O — General purpose user I/O |
| Pino E2 | VCCIO2 — I/O supply voltage bank 2 |
| Pino F1 | I/O — General purpose user I/O |
| Pino F2 | GND — Ground reference |
| Pino G1 | I/O — General purpose user I/O |
| Pino G2 | I/O — General purpose user I/O |
| Pino H1 | VCCIO3 — I/O supply voltage bank 3 |
| Pino H2 | I/O — General purpose user I/O |
| Pino J1 | GND — Ground reference |
| Pino J2 | I/O — General purpose user I/O |
| Pino K1 | I/O — General purpose user I/O |
| Pino K2 | VCCINT — Core supply voltage (1.2V) |
| Pino L1 | I/O — General purpose user I/O |
| Pino L2 | GND — Ground reference |
| Pino M1 | VCCIO4 — I/O supply voltage bank 4 |
| Pino M2 | I/O — General purpose user I/O |
| Pino N1 | I/O — General purpose user I/O |
| Pino N2 | I/O — General purpose user I/O |
| Pino P1 | GND — Ground reference |
| Pino P2 | VCCIO5 — I/O supply voltage bank 5 |
Aplicações típicas
EP2S15F672C4N é adequado para 6 aplicaçãos: Telecommunications Infrastructure, Digital Signal Processing (DSP), Video and Image Processing, ASIC Prototyping, High-Bandwidth Data Acquisition, Military and Aerospace Systems.
Telecommunications Infrastructure
The EP2S15F672C4N fits telecom infrastructure designs thanks to its 15,600 LEs, 156 embedded 18x18 multipliers, and 358 user I/Os supporting multiple parallel interface standards. With 52 KB of embedded RAM and dedicated DSP blocks, it handles channel-card functions such as packet processing, framing, and forward error correction (FEC) at line-rate speeds. The 672-BGA package provides ample I/O for connecting to multiple SFP/QSFP transceivers, external TCAM, and DDR2/QDRII memory buffers. Stratix II parts have been deployed in legacy SONET/SDH, OTN, and Ethernet switch fabric systems where proven toolchain maturity outweighs newer FPGA options.
Recomendado
Digital Signal Processing (DSP)
The EP2S15F672C4N suits DSP-intensive designs due to its 156 embedded 18x18 multipliers and dedicated DSP blocks, which accelerate FFT, FIR filtering, and modulation/demodulation workloads. At 1.2V core voltage on 90 nm CMOS, it balances performance with reasonable power dissipation for industrial deployments. Engineers commonly implement multi-channel filters, radar pulse compression, software-defined radio baseband processing, and audio codec engines on this part. The 358 user I/Os allow interfacing with high-speed ADCs/DACs alongside external memory, making it a flexible mid-density DSP platform for prototyping and production.
Recomendado
Video and Image Processing
The EP2S15F672C4N supports video and image processing pipelines including HD video format conversion, scaling, and overlay composition. With 358 I/Os and 52 KB internal RAM, designers can implement multiple video input/output ports alongside DDR2 frame buffers. The 156 embedded multipliers enable real-time 2D convolution, motion compensation, and color-space conversion at HD-SDI/HDMI data rates. While newer Cyclone 10 or Stratix 10 parts offer better performance-per-watt, the Stratix II family retains mature video IP cores and reference designs that shorten development time for legacy broadcast, surveillance, and medical imaging systems.
Recomendado
ASIC Prototyping
The EP2S15F672C4N serves as an effective ASIC prototyping platform for designs targeting 15-30K equivalent ASIC gates, since FPGAs typically run 5-10x slower than ASICs but offer rapid design iteration. The Stratix II architecture with ALM-based logic provides efficient mapping of synthesized ASIC netlists, while the 672-BGA package allows many prototype I/Os to be brought out for ASIC pinout validation. Engineers commonly use these parts for pre-silicon software development, system-level verification, and architectural exploration. Quartus Prime (legacy Stratix II support) enables seamless bitstream generation and incremental compilation across prototype iterations.
Recomendado
High-Bandwidth Data Acquisition
The EP2S15F672C4N fits high-bandwidth data acquisition systems where moderate logic density, many I/Os, and embedded multipliers are required. The 358 user I/Os accommodate parallel ADC/DAC interfaces (LVDS or CMOS), while the 156 embedded multipliers enable real-time DSP on incoming samples. With 52 KB embedded RAM plus external DDR2/QDRII memory controller support, designers can buffer large sample bursts before forwarding to host systems. Applications include oscilloscopes, spectrum analyzers, medical imaging front-ends, and industrial inspection systems where its proven 90 nm architecture and industrial temperature grade meet long-lifecycle deployment requirements.
Recomendado
Military and Aerospace Systems
The EP2S15F672C4N supports military and aerospace applications including avionics databus interfaces, electronic warfare subsystems, and secure communications platforms. With 15,600 LEs, 358 user I/Os, and industrial temperature rating (-40C to +85C), it handles control logic alongside moderate DSP workloads in space-constrained designs. The 672-BGA package is suitable for ruggedized PCB assemblies with thermal management. While newer rad-hard FPGAs exist, the Stratix II family remains deployed in legacy defense programs where established reliability data, MIL-STD qualification testing, and long-term support outweigh the benefits of newer process nodes.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2S15F672C4N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2S15F672C3N | EP2S15F672C4 | EP2S30F672C5N | EP2S130F780C4N | EP2S15F484C4N |
|---|---|---|---|---|---|---|
| Package | 672-BBGA | 672-BBGA - same | 672-BBGA - same | 672-BBGA - same | 780-BGA - different | 484-BGA - different |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 15,600 | 15,600 | 15,600 | 33,880 | 53,520 | 15,600 |
| Total RAM Bits | 419,328 | 419,328 | 419,328 | 1,369,344 | 2,743,680 | 419,328 |
| Embedded Multipliers (18x18) | 156 | 156 | 156 | 192 | 252 | 156 |
| User I/Os | 358 | 358 | 358 | 342 | 488 | 334 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | C4 | C3 (slower) | C4 | C5 (faster) | C4 | C4 |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C (Industrial) | 0C to +85C (Commercial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) | -40C to +85C (Industrial) |
| Approx. Unit Price (qty 1) | $285 | $260 | $280 | $450 | $850 | $250 |
Principais diferenciais
- Industrial temperature grade (-40C to +85C) for harsh environments (vs EP2S15F672C4)
- Faster C4 speed grade for timing-critical DSP paths (vs EP2S15F672C3N)
- Higher density upgrade path on same footprint (vs EP2S15F484C4N)
Notas de projeto
Stratix II devices require careful power sequencing: the 1.2V VCCINT core supply must reach its threshold before VCCIO bank supplies to prevent internal latch-up. According to Intel's Stratix II handbook, a minimum 100 us delay between VCCINT and VCCIO ramp-up is recommended. Use a dedicated power sequencer IC or a simple RC delay on the enable pin of the VCCIO regulator. Reverse sequencing during power-down is equally important: remove VCCIO before VCCINT to avoid back-powering through I/O ESD diodes.
Estimated: At 1.2V core voltage with typical Stratix II static power of approximately 0.5-1W plus dynamic power up to 3-4W at high toggle rates, total FPGA dissipation can reach 4-5W. The 672-BGA package theta_JA is approximately 18 C/W with 4-layer PCB and adequate thermal vias. Designers should place a thermal pad or copper pour beneath the BGA and consider forced airflow if junction temperature exceeds 100C. Industrial-grade parts must maintain junction below 125C for reliable operation.
The 672-BGA package uses 1.0 mm ball pitch and requires PCB design with microvia technology for breakout routing. Recommended stack-up is at least 8 layers with dedicated ground planes adjacent to signal layers to control impedance for LVDS and DDR2 interfaces. Decoupling requires at least 20-30 low-ESR ceramic capacitors (0.1uF and 10uF bulk) distributed around the BGA perimeter, with shortest-possible vias to power planes. JTAG chain pull-up/pull-down resistors must be added for reliable configuration.
Common pitfalls include: (1) exceeding 3.3V on any I/O pin without proper bank voltage configuration; (2) leaving unused I/O pins floating instead of configuring as tri-state inputs with weak pull-ups; (3) ignoring MSEL pin configuration which determines configuration mode (JTAG, PS, AS, FPP); (4) using incorrect bitstream compression or encryption settings leading to configuration failures; (5) omitting nCONFIG, nSTATUS, and CONF_DONE pull-ups per datasheet guidance. Always verify configuration with Quartus Prime programmer before deployment.
Informações de conformidade
RoHS compliant per DigiKey listing. Not AEC-Q100 qualified since this is an FPGA, not an automotive-grade IC. Lead-free BGA balls per Intel packaging specifications.
