EP2S90H484C5 - 90K LE Stratix II FPGA, 484-BGA | Intel / Altera
N.º da peça: EP2S90H484C5 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $285 | $285,00 |
| 10 | $256.5 | $2.565,00 |
| 100 | $228 | $22.800,00 |
| 500 | $199.5 | $99.750,00 |
| 1.000 | $171 | $171.000,00 |
EP2S90H484C5 Visão geral
What is an FPGA? A Field-Programmable Gate Array is a semiconductor integrated circuit whose logic functionality is defined by the user after manufacturing rather than at the fab. FPGAs occupy the category hierarchy: programmable logic -> logic IC -> integrated circuit -> semiconductor. The Stratix II family specifically targets high-performance signal processing and ASIC prototyping, combining embedded multipliers, TriMatrix memory blocks, and high-speed transceivers in a single device.
Key features of the EP2S90H484C5 include 4,548 LABs (Logic Array Blocks), 12 embedded DSP blocks for hardware multiplication, dedicated external memory interfaces supporting DDR/DDR2/QDRII SRAM, and up to 12 high-speed transceiver channels. The device supports configuration via passive serial, JTAG, and Altera-enhanced configuration modes, with built-in error detection and correction (EDC) for configuration RAM.
Technically, the EP2S90H484C5 implements an adaptive logic module (ALM) architecture that achieves approximately 2.5x the logic capacity of previous-generation Stratix devices at the same silicon area. The fine-grained ALM combines look-up tables, adders, and registers in 8-bit groupings, optimizing for both register-rich and arithmetic-intensive designs.
Typical applications include high-performance ASIC prototyping, wireless baseband signal processing, high-definition video processing, military radar and sonar systems, and test & measurement equipment. The 484-ball FCBGA package supports high I/O count designs requiring numerous LVDS, DDR memory interfaces, and parallel processing buses.
Designers should pay attention to power distribution network design on the FCBGA - the 1.2V core requires substantial decoupling (typically 100uF bulk plus per-pin 0.1uF/1nF ceramics) and proper power sequencing to prevent inrush damage. Thermal management is critical: at full utilization the device can dissipate 10-15W, requiring thermal vias under the package and forced-air cooling in most deployments.
This page synthesizes distributor pricing, drop-in alternative listings, and practical design notes not found in the manufacturer datasheet alone, enabling faster BOM decisions and design-in for engineers working on Stratix II based systems.
Alternativas drop-in para EP2S90H484C5 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2S90H484C5 (mesmo formato e footprint) — diferindo em DSP Blocks, Operating Temperature, Package, Mounting Type, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2S90H484C4
✅ Drop-In✓ Em estoque
$2476.87 / unidade
Ver ficha técnica →EP2S90H484C4N
✅ Drop-In✓ Em estoque
$215 / unidade
Ver ficha técnica →EP2S90F484C5
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP2S90F484C5N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP2S90F484C4N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP2S90F484C3N
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
EP2S90H484C5 Classificações máximas e características elétricas
| Family | Stratix II |
| Logic Elements | 90,960 |
| Embedded Memory Bits | 4,520,488 |
| User I/Os | 308 |
| LABs (Logic Array Blocks) | 4,548 |
| Encapsulamento | 484-Ball FC-HFBGA (Flip-Chip BGA) |
| Process Technology | 90 nm |
| Core Supply Voltage | 1.2 V |
| Maximum Internal Clock Frequency | 609.76 MHz |
| DSP Blocks | 12 embedded multiplier blocks |
| Configuration Method | Passive Serial, JTAG, Fast Passive Parallel |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | Commercial (0C to +85C) - 'C' speed grade |
| Speed Grade | 5 (Commercial) |
Guia de Configuração de Pinos do EP2S90H484C5 484-ball fc-hfbga (flip-chip bga)
Configuração de pinos para EP2S90H484C5 (pacote 484-ball fc-hfbga (flip-chip bga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2S90H484C5.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2S90H484C5 é adequado para 6 aplicaçãos: ASIC Prototyping, Wireless Baseband Signal Processing, High-Definition Video Processing, Military Radar and Sonar Systems, Test & Measurement Equipment, High-Speed Serial Connectivity Bridge.
ASIC Prototyping
The EP2S90H484C5 is well-suited for ASIC prototyping because its 90,960 logic elements and 4,520,488 bits of embedded memory can map complex ASIC netlists at 1:1. The 90nm Stratix II architecture delivers up to 609.76 MHz internal Fmax, enabling designers to validate timing on representative gate-level designs before committing to silicon. The 484-ball FC-HFBGA provides 308 user I/Os, sufficient for ASIC-class peripheral buses and boundary-scan chains. Using the device with Quartus II and the SOPC Builder allows RTL design iteration cycles measured in hours rather than weeks, dramatically reducing time-to-prototype for gate-rich ASICs.
Recomendado
Wireless Baseband Signal Processing
The EP2S90H484C5's 12 dedicated DSP blocks enable parallel multiply-accumulate operations ideal for wireless baseband algorithms including FFT, channel coding, and digital up/down conversion. Combined with 4.5 Mbits of embedded memory, the device can buffer symbol data on-chip to eliminate external memory accesses in real-time baseband paths. The 484-ball FC-HFBGA's 308 I/Os support multiple antenna interfaces and CPRI/OBSAI backhaul links. Designers targeting 3G/4G baseband processing benefit from the ALM architecture's efficient mapping of arithmetic-heavy DSP functions.
Recomendado
High-Definition Video Processing
High-definition video pipelines require massive parallel datapaths for pixel processing, color-space conversion, and motion estimation - exactly the workload profile that fits the EP2S90H484C5's 90,960-LE fabric. The 4,520,488-bit TriMatrix memory provides line buffers and frame-storage capability without external SRAM, and the 308 user I/Os accommodate multiple BT.656 / BT.1120 / DVI / HDMI input channels simultaneously. At 609.76 MHz internal Fmax, the device can process 1080p60 video streams at full pixel clock rates with margin. Designers building broadcast-grade processing equipment use Stratix II for its deterministic latency and DSP-rich fabric.
Recomendado
Military Radar and Sonar Systems
The EP2S90H484C5 suits military radar and sonar processing due to its deterministic latency, high DSP throughput, and ability to run multiple matched-filter and FFT operations in parallel. The 12 DSP blocks deliver parallel 18x18 multiplies required for pulse-Doppler radar processing, while 4.5 Mbits of embedded memory supports range-bin buffering. The 484-ball FC-HFBGA package's commercial temperature rating makes it appropriate for ruggedized indoor electronics bays; ruggedized deployments would use the industrial-grade EP2S90F484I4 variant family instead. Long-term support concerns for military programs make Intel's NRND status a key risk factor for new programs.
Recomendado
Test & Measurement Equipment
Automated test equipment, logic analyzers, and protocol exercisers benefit from the EP2S90H484C5's high I/O count (308 pins) and protocol-flexible I/O banks supporting LVDS, LVCMOS, and HSTL simultaneously. Designers can implement protocol-specific stimulus generators, bit-error-rate testers, and pattern-matching receivers entirely in the FPGA fabric. The 90nm process and 1.2V core keep power consumption manageable despite 90K logic elements, and Quartus II's SignalTap embedded logic analyzer provides on-chip debug visibility for T&M applications. Replacement of obsolete custom ASICs in legacy test platforms is a common Stratix II deployment scenario.
Recomendado
High-Speed Serial Connectivity Bridge
Stratix II devices with embedded transceivers - the 'GX' variants - support multi-gigabit serial links, but the EP2S90H484C5 (non-GX) still serves as a parallel bridge/aggregator between high-speed serial ports and legacy parallel buses. The 308 user I/Os accommodate wide parallel data paths, while the 90,960 logic elements can implement protocol conversion, data framing, and rate-matching FIFOs. Telecom equipment manufacturers have long used Stratix II for protocol-bridging applications between legacy TDM buses and newer packet-based fabrics. The 484-FCBGA's signal integrity supports multi-hundred-MHz parallel interfaces with proper PCB stackup.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2S90H484C5 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2S90H484C4 | EP2S90H484C4N | EP2S90F484C5 | EP2S90F484C5N | EP2S90F484C4N | EP2S90F484C3N |
|---|---|---|---|---|---|---|---|
| Brand | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera | Intel / Altera |
| Package | 484-Ball FC-HFBGA | 484-Ball FC-HFBGA - same | 484-Ball FC-HFBGA - same | 484-Ball FineLine BGA - same ball count | 484-Ball FineLine BGA - same ball count | 484-Ball FineLine BGA - same ball count | 484-Ball FineLine BGA - same ball count |
| Logic Elements | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 | 90,960 |
| Embedded Memory Bits | 4,520,488 | 4,520,488 | 4,520,488 | 4,520,488 | 4,520,488 | 4,520,488 | 4,520,488 |
| User I/Os | 308 | 308 | 308 | 308 | 308 | 308 | 308 |
| Core Supply Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
| Speed Grade | C5 (fastest) | C4 (slower) | C4 (slower) | C5 (same as target) | C5 (same as target) | C4 (slower) | C3 (slowest) |
| Operating Temperature | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) | Commercial (0C to +85C) |
| Lifecycle Status | NRND | NRND | NRND | NRND | NRND | NRND | NRND |
Principais diferenciais
- Same 90K-LE Stratix II die with only speed-grade downgrade (vs EP2S90H484C4 / EP2S90H484C4N)
- F484 FineLine BGA package variant with same LE count (vs EP2S90F484C5 / EP2S90F484C5N / EP2S90F484C4N)
- Slowest C3 grade option for budget/availability (vs EP2S90F484C3N)
Notas de projeto
Estimated: At 90% utilization the EP2S90H484C5 can draw 10-15W on the 1.2V core rail; budget a switching regulator with at least 20W capacity. Use a minimum of 100uF bulk polymer-tantalum decoupling on VCCINT plus per-pin 0.1uF X7R ceramic and 1nF NP0 ceramic to handle 90nm core transient spikes. Power-on sequence per Altera datasheet: VCCINT first, then VCCPD, then VCCIO banks - violating this sequence can damage the device.
The 484-ball FC-HFBGA has a JEDEC-standard thermal resistance theta-JA around 11-14 C/W with proper thermal vias under the BGA. Estimated: at 12W dissipation and 11 C/W theta-JA the junction-to-ambient temperature rise is 132C, exceeding the 85C commercial rating - a heatsink with thermal interface material or forced-air cooling (>=200 LFM) is required for full utilization. Place thermal vias in a 4x4 array directly under the package center per Altera Stratix II Hardware Reference Design guidelines.
Use a minimum 8-layer PCB stackup for the 484-ball FC-HFBGA with dedicated ground and power planes. Differential pair routing (LVDS) should maintain 100 ohm differential impedance with matched trace lengths within 50 mils. DDR/DDR2 memory interfaces on Stratix II require strict length matching (data within +/-25 mils of strobe) and proper termination - reference Altera's External Memory Interface Handbook for the specific controller used.
Three common Stratix II mistakes to avoid: (1) Do not use older Quartus II versions (<7.2) with EP2S90H484C5 - some configuration bugs affect large Stratix II devices; (2) Do not omit the configuration flash memory EPCS16/EPCS64 - volatile SRAM requires configuration at every power-on; (3) Do not ignore MSL (Moisture Sensitivity Level) on the FC-HFBGA package - the device is MSL3 or MSL4 and requires dry-pack storage and pre-bake if exposure exceeds floor life.
Place the JTAG header (Altera USB-Blaster pinout) on a board-edge accessible location for programming and debug. Keep high-speed transceiver routes (if used) on the top layer only, with GND stitching vias every 1/4 wavelength. The CLK inputs are pin-limited on the 484-FCBGA; place the primary clock oscillator within 1 inch of the assigned clock pin and use microstrip routing with controlled impedance.
Informações de conformidade
RoHS / lead-free / halogen-free status was not explicitly confirmed in the retrieved web data for EP2S90H484C5 as of 2026-09-09. The N-suffixed variants (EP2S90H484C4N, EP2S90F484C5N, EP2S90F484C4N, EP2S90F484C3N) are typically lead-free per Altera's lead-free part numbering convention, but the non-N variants (including EP2S90H484C5) require manufacturer lot-level confirmation. AEC-Q100 not applicable - this is an FPGA not an automotive IC. Reach and conflict-minerals status require manufacturer material declaration request.
