EP2SGX60DF780C7 - Stratix II GX 60K LE FPGA, 364 I/O, 780-BGA | Intel
N.º da peça: EP2SGX60DF780C7 ✗ Fim de vida| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $485 | $485,00 |
| 10 | $445 | $4.450,00 |
| 100 | $405 | $40.500,00 |
| 500 | $372 | $186.000,00 |
| 1.000 | $348 | $348.000,00 |
EP2SGX60DF780C7 Visão geral
An FPGA (Field-Programmable Gate Array) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O can be customized after manufacture. The Stratix II GX family belongs to the taxonomy: FPGA -> programmable logic -> digital ASIC alternative -> semiconductor. These devices sit between generic microcontrollers and fixed-function ASICs in the design hierarchy, providing ASIC-class data-path parallelism and logic density while remaining reprogrammable for design changes, field upgrades, and late-stage bug fixes. The GX suffix denotes integrated multi-gigabit transceivers, making the family especially relevant for serial-protocol-heavy designs such as PCIe, Serial RapidIO, XAUI, and custom high-speed serial links.
Key features of the EP2SGX60DF780C7 include 2,544,192 bits of embedded RAM organized in M512/M4K/M-RAM blocks, embedded DSP blocks for fixed- and floating-point arithmetic, programmable I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL, PCI, PCI-X) on every user pin, and on-chip PLL and clock management. The 780-pin FBGA package supports very high I/O count, enabling wide parallel buses, multiple high-speed serial links, and abundant differential pairs. The 1.15V–1.25V core supply reflects the 90 nm process node, while separate I/O banks allow 1.5V, 1.8V, 2.5V, or 3.3V interfacing on a per-bank basis.
Typical applications for this device include high-speed serial protocol bridging (PCIe endpoint / root complex, XAUI/10 GbE front-end, Serial RapidIO), DSP front-ends for telecom baseband and radar, custom packet processors in networking line cards, and prototype ASIC development. The 780-BGA package combined with 364 user I/Os also suits video broadcast, test and measurement instrumentation, and military/aerospace signal-processing cards where the C7 speed grade and high logic density are advantageous.
When designing with the EP2SGX60DF780C7, note that the C7 speed grade implies a lower Fmax than C5 or C6; reserve C7 for designs where timing margins are not the limiting factor, otherwise upgrade to a faster bin. The 780-BGA requires controlled-impedance PCB design, decoupling capacitor placement within the BGA keep-out, and a thermal solution sized to the application's ambient and airflow. The Intel Quartus II design software (legacy) is the supported toolchain; current Intel Quartus Prime does not support Stratix II, so EOL planning is critical.
This page synthesizes distributor pricing, drop-in speed-grade and variant alternatives, and practical design notes for the EP2SGX60DF780C7 that are not found in the manufacturer datasheet.
Alternativas drop-in para EP2SGX60DF780C7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP2SGX60DF780C7 (mesmo formato e footprint) — diferindo em Package, Speed Grade, RoHS Status, Total RAM Bits, DSP Blocks.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP2SGX60DF780C5N
✅ Drop-In✓ Em estoque
$205 / unidade
Ver ficha técnica →EP2SGX60DF780C4N
✅ Drop-In✓ Em estoque
$365 / unidade
Ver ficha técnica →EP2SGX60DF780C3N
✅ Drop-In✓ Em estoque
$188 / unidade
Ver ficha técnica →EP2SGX60CF780C7
✅ Drop-In✓ Em estoque
$215 / unidade
Ver ficha técnica →EP2SGX60CF780C5N
✅ Drop-In✓ Em estoque
$485 / unidade
Ver ficha técnica →EP2SGX60DF780C7 Classificações máximas e características elétricas
| Family | Stratix II GX |
| Logic Elements | 60,440 |
| Logic Array Blocks (LABs) | 3,022 |
| Total RAM Bits | 2,544,192 |
| User I/O Pins | 364 |
| Encapsulamento | 780-ball FBGA (FineLine BGA) |
| Process Technology | 90 nm |
| Core Supply Voltage | 1.15 V to 1.25 V |
| Operating Junction Temperature (Commercial) | 0 C to 85 C |
| Speed Grade | C7 (slowest commercial) |
| Tipo de montagem | Surface Mount |
| Design Software | Quartus II (legacy, EOL toolchain) |
Guia de Configuração de Pinos do EP2SGX60DF780C7 780-ball fbga (fineline bga)
Configuração de pinos para EP2SGX60DF780C7 (pacote 780-ball fbga (fineline bga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP2SGX60DF780C7.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP2SGX60DF780C7 é adequado para 6 aplicaçãos: PCIe Endpoint / Root Complex Design, 10 Gigabit Ethernet / XAUI Front-End, Telecom Baseband and DSP Front-End, Custom Packet Processor / Network Line Card, Test and Measurement Instrumentation, Legacy ASIC Prototyping.
PCIe Endpoint / Root Complex Design
The EP2SGX60DF780C7 is well-suited for PCI Express endpoint and root-complex designs in legacy server, storage, and add-in-card platforms. With 60,440 logic elements and 3,022 LABs, the device can host a PCIe Gen1 hard IP core plus DMA engines, MSI-X interrupt controllers, and the application-layer protocol state machine on a single fabric. The integrated multi-gigabit transceivers support PCIe Gen1 at 2.5 Gbps per lane with the C7 speed grade, sufficient for typical endpoint designs where timing margin is not critical. The 780-ball FBGA package exposes enough I/O for x4 or x8 PCIe plus auxiliary interfaces, and 2,544,192 bits of RAM back the completion headers and DMA descriptor rings. Designers should note the C7 speed grade is the slowest in the family, so x8 Gen1 designs with tight receiver-eye margins may need to step up to the C5N variant.
Recomendado
10 Gigabit Ethernet / XAUI Front-End
The integrated transceivers in the EP2SGX60DF780C7 support XAUI (4 x 3.125 Gbps) and 10 Gigabit Ethernet front-end designs, making the device a candidate for legacy switch, router, and line-card prototyping. The 60,440-LE fabric provides enough logic for a 10G MAC, optional 802.1Q VLAN tagging, and XGMII-to-XAUI bridge, while 2,544,192 RAM bits back the receive and transmit FIFO buffers required to absorb inter-packet gaps. The C7 commercial speed grade supports XAUI at 3.125 Gbps with adequate margin, though designs targeting 6.25 Gbps or 10 Gbps serial backplanes typically step up to the C5N variant. The 780-BGA package's 364 user I/Os allow multiple XAUI ports plus GMII/SGMII management interfaces and 32-bit or 64-bit processor buses. This combination of transceivers, RAM, and I/O density was a defining feature of the Stratix II GX family for telecom and datacom line cards.
Recomendado
Telecom Baseband and DSP Front-End
The EP2SGX60DF780C7's 60,440 logic elements and embedded DSP blocks make it suitable for telecom baseband processing, software-defined radio (SDR) front-ends, and radar signal-processing applications. The fabric can host multiple parallel FIR filters, FFT/iFFT engines, and channel-correction blocks while leaving headroom for a control-plane soft processor (NIOS II). The 2,544,192 bits of embedded RAM back sample buffers and twiddle-factor tables needed for 1024- or 2048-point FFTs, and the 364 user I/Os allow multi-channel ADC/DAC interfacing with LVDS or DDR-style data capture. The C7 commercial speed grade and 0 C to 85 C junction range suit indoor telco equipment. For outdoor base-station deployments or military radar, the I-grade EP2SGX60DF780I variant supports the wider -40 C to +100 C industrial temperature range, while the same-die migration path applies.
Recomendado
Custom Packet Processor / Network Line Card
With 60,440 logic elements, 364 user I/Os, and 2,544,192 bits of RAM, the EP2SGX60DF780C7 is well-matched to custom packet processor designs in enterprise routers, security appliances, and Layer 2-3 switch line cards. The fabric can host deep packet inspection engines, QoS schedulers, and classification lookups while the multi-gigabit transceivers drive SGMII, XAUI, or Interlaken links to the backplane. The 780-BGA package supports 64-bit or 128-bit external memory buses (DDR/DDR2 SDRAM) for routing-table and buffer-pool storage, critical for line-rate processing at multi-gigabit speeds. The C7 commercial speed grade is appropriate for designs where the critical path is memory access rather than fabric Fmax, allowing a cost-optimized bill of materials. For new designs, consider Stratix V GX or Arria 10 for active toolchain and longer lifecycle support.
Recomendado
Test and Measurement Instrumentation
The high I/O count, abundant RAM, and integrated transceivers of the EP2SGX60DF780C7 make it well-suited for test and measurement equipment such as protocol analyzers, logic-analyzer back-ends, and bit-error-rate testers (BERT). The 364 user I/Os and flexible per-bank I/O standards (LVDS, LVTTL, LVCMOS, SSTL) allow direct probing of high-speed digital buses including DDR memory interfaces, parallel ADC/DAC data streams, and multi-lane serializer/deserializer (SerDes) outputs. The 2,544,192 RAM bits provide deep capture buffers for storing pre-trigger and post-trigger samples, while 60,440 logic elements implement state machines, pattern generators, and analysis engines. The C7 commercial speed grade suits lab-bench environments at 0 C to 85 C junction, and the 780-BGA's signal integrity supports multi-GHz signal capture when paired with proper PCB stackup and decoupling.
Recomendado
Legacy ASIC Prototyping
The EP2SGX60DF780C7 is a well-known ASIC prototyping vehicle, with 60,440 logic elements and 364 user I/Os providing enough density to map mid-complexity ASIC RTL for pre-silicon validation. Designers can use the device to verify functional correctness, software bring-up, and firmware development months before tape-out, with the option to step into volume production on a Stratix IV/V/10 or Arria variant. The 780-BGA package exposes the full I/O and transceiver count for ASIC-accurate peripheral modeling, and Quartus II synthesis yields timing results that closely correlate with downstream ASIC libraries. The C7 commercial speed grade is typically acceptable for functional validation, with C5N reserved for timing-accurate runs. As of 2026-09-09, design teams still using Stratix II GX for ASIC prototyping should plan migration to Stratix V GX or Stratix 10 for active Quartus Prime support.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP2SGX60DF780C7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP2SGX60DF780C5N | EP2SGX60DF780C4N | EP2SGX60DF780C3N | EP2SGX60CF780C7 | EP2SGX60CF780C5N |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 780-ball FBGA (DF780) | 780-ball FBGA (DF780) - same | 780-ball FBGA (DF780) - same | 780-ball FBGA (DF780) - same | 780-ball FBGA (CF780) - same | 780-ball FBGA (CF780) - same |
| Logic Elements | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 | 60,440 |
| User I/O Pins | 364 | 364 | 364 | 364 | 364 | 364 |
| Speed Grade | C7 (slowest commercial) | C5N (faster) | C4N (faster) | C3N (fastest commercial) | C7 (same) | C5N (faster) |
| Total RAM Bits | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 | 2,544,192 |
| Core Voltage | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V | 1.15 V to 1.25 V |
| Lead-Free Finish (N suffix) | Not specified (no N suffix) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) | Not specified | Yes (N suffix) |
| Lifecycle Status (2026-09-09) | Obsolete (C7) - secondary market only | Obsolete (Stratix II GX family EOL) | Obsolete (Stratix II GX family EOL) | Obsolete (Stratix II GX family EOL) | Obsolete (Stratix II GX family EOL) | Obsolete (Stratix II GX family EOL) |
Principais diferenciais
- Slowest commercial speed grade in the Stratix II GX family (vs EP2SGX60DF780C5N)
- Pin-compatible across the entire EP2SGX60 Speed-grade family (vs EP2SGX60DF780C3N)
- Integrated multi-gigabit transceivers vs non-GX Stratix II (vs EP2S60F484C5)
Notas de projeto
Estimated: the EP2SGX60DF780C7 in the 780-ball FBGA at full utilization (e.g., 60% LE usage plus active transceivers at 3.125 Gbps) dissipates approximately 8-12 W. The DF780 package thermal resistance theta_JA on a JEDEC JESD51-7 4-layer test board is typically 10-14 C/W with adequate airflow, giving a junction-to-ambient rise of 80-170 C above 25 C ambient. Always validate the thermal solution against the actual design utilization and board stack-up. For high-utilization or sealed-enclosure designs, use a heatsink with thermal interface material, ground-copper thermal vias under the BGA, and active airflow. Confirm operating junction temperature stays within the 0 C to 85 C commercial range using the on-chip temperature-sensing diode.
The 780-ball FBGA package requires a controlled-impedance PCB stack-up with reference planes for every signal layer and matched trace lengths for high-speed signals. Place decoupling capacitors directly within the BGA field (under or as close as possible to the balls), using a mix of bulk, mid-frequency, and high-frequency capacitors per the Stratix II GX Hardware Reference Manual power-distribution-network (PDN) guidelines. Power islands for VCCINT (1.15-1.25 V core), VCCIO (per-bank I/O supply), VCCAUX, and VCCPD (pre-driver) must be properly decoupled, and PLL analog supplies must be filtered with ferrite beads. Always run a signal-integrity and PDN simulation on the final layout to validate impedance, crosstalk, and target-bit-error-rate at the chosen transceiver rate.
A common pitfall when using the EP2SGX60DF780C7 is treating the C7 speed grade as sufficient for all timing paths; in reality C7 is the slowest commercial grade, so designs targeting Fmax above ~200 MHz on critical paths or running transceivers near their maximum rate (3.125 Gbps for XAUI) may not close timing. Step up to a C5N or C4N speed grade for tight timing. Another pitfall is using the legacy Quartus II toolchain with outdated device libraries, which can produce bitstreams that fail post-configuration CRC check; always regenerate the SOF/POF against the latest Quartus II 13.0sp1 patch for the exact device variant. Finally, watch for counterfeit risk in secondary-market purchases - request a factory-sealed tray and verify date code and lot traceability.
Stratix II GX transceivers are highly sensitive to power-supply noise and reference-clock jitter. The MGT reference clock must be sourced from a low-jitter oscillator (typically less than 1 ps RMS) and routed as a 100-ohm differential pair with proper length matching. The transceiver analog supply (VCCH_GXB) must be heavily filtered with ferrite beads and bulk capacitance per the Stratix II GX Hardware Reference Manual. Keep all high-speed serial lanes length-matched to within the budget specified by the target protocol (e.g., PCIe Gen1 requires 150 mil of inter-lane skew tolerance). Use a continuous reference ground plane under all transceiver channels to minimize return-path discontinuities.
Informações de conformidade
The C7 variant does not have an N suffix, suggesting it may be a non-lead-free finish; the N-suffixed C5N, C4N, and C3N variants are lead-free. RoHS and REACH status could not be confirmed from the provided data. AEC-Q100 is not applicable for this commercial-grade FPGA.