EP3C10F256I7N - 10K LE Cyclone III FPGA, 256-FBGA | Intel
N.º da peça: EP3C10F256I7N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $49.92 | $49,92 |
| 10 | $44.93 | $449,30 |
| 100 | $40.41 | $4.041,00 |
| 500 | $36.39 | $18.195,00 |
| 1.000 | $34.94 | $34.940,00 |
EP3C10F256I7N Visão geral
A Field-Programmable Gate Array (FPGA) is a programmable logic device whose architecture consists of an array of configurable logic blocks (CLBs), programmable routing fabric, dedicated DSP blocks, and embedded memory blocks (M9K/M144K). FPGAs belong to the larger programmable logic hierarchy: FPGA -> programmable logic -> digital logic IC -> semiconductor. Cyclone III devices specifically target the low-power end of the FPGA market, delivering ASIC-like fabric density while preserving in-system reprogrammability for design iteration and field upgrades.
Key features of the EP3C10F256I7N include 182 maximum user I/O pins (supporting LVDS, LVCMOS, SSTL, and HSTL I/O standards), 46 embedded 18x18 multipliers for DSP functions, two PLLs per device for clock management, and up to 1.4 Mbits of RAM. The device operates across an industrial temperature range of -40C to +125C with a 1.2 V core supply, and its 65 nm process technology yields substantially lower static and dynamic power than its Cyclone II predecessor.
Architecturally, the Cyclone III device uses a Look-Up Table (LUT)-based fabric with M9K memory blocks and dedicated 18x18 multipliers. The 65 nm process enables tight integration while keeping die cost low, and the FineLine BGA-256 package provides high signal density within a 17x17 mm footprint suitable for space-constrained PCBs.
Typical applications include industrial motor control, video processing, automotive driver assistance, software-defined radio, consumer display controllers, and embedded system prototyping. The device is well suited for parallel processing and signal-integrating tasks.
When designing with the EP3C10F256I7N, careful attention to power rail sequencing (1.2 V core and 2.5 V/3.3 V I/O supplies) and JTAG configuration is required. Configuration via Altera/Intel Quartus II software supports JTAG, Active Serial (AS), and Passive Serial (PS) modes for flexible boot options.
This page synthesizes distributor pricing, drop-in alternative listings from same-family Cyclone III devices, and practical design notes not found in the manufacturer datasheet.
Alternativas drop-in para EP3C10F256I7N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3C10F256I7N (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Process Technology, RoHS Status, Total Memory Bits.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3C10F256I7
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
EP3C10F256C8N
✅ Drop-In✓ Em estoque
$15.4 / unidade
Ver ficha técnica →EP3C10F256C6N
✅ Drop-In✓ Em estoque
$14.1 / unidade
Ver ficha técnica →EP3C10F256C6
✅ Drop-In✓ Em estoque
$36.75 / unidade
Ver ficha técnica →EP3C16F256I7N
✅ Drop-In✓ Em estoque
$38.5 / unidade
Ver ficha técnica →EP3C10F256I7N Classificações máximas e características elétricas
| Family | Cyclone III |
| Device Type | FPGA |
| Logic Elements (LE) | 10,320 |
| Logic Blocks | 10,320 |
| Embedded Memory | 423,936 bits |
| Total Memory Bits | 423,936 |
| Maximum User I/O | 182 |
| Embedded 18x18 Multipliers | 46 |
| PLLs | 2 |
| Process Technology | 65 nm |
| Core Voltage | 1.2 V |
| Encapsulamento | 256-LBGA (FineLine BGA) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | -40C to +125C (Industrial) |
| Status RoHS | Compliant |
| Lead Free | Yes |
| Nível MSL | 3 |
Configuração de pinos do EP3C10F256I7N
| Pino A1 | I/O Bank 1 — User I/O (Bank 1) |
| Pino A2 | I/O Bank 1 — User I/O (Bank 1) |
| Pino A3 | I/O Bank 2 — User I/O (Bank 2) |
| Pino A4 | I/O Bank 2 — User I/O (Bank 2) |
| Pino A5 | I/O Bank 3 — User I/O (Bank 3) |
| Pino A6 | VCCINT — Core voltage (1.2 V) |
| Pino A7 | GND — Ground |
| Pino A8 | I/O Bank 4 — User I/O (Bank 4) |
| Pino A9 | I/O Bank 4 — User I/O (Bank 4) |
| Pino A10 | I/O Bank 5 — User I/O (Bank 5) |
| Pino A11 | I/O Bank 5 — User I/O (Bank 5) |
| Pino A12 | VCCIO1 — I/O bank 1 reference voltage |
| Pino A13 | I/O Bank 6 — User I/O (Bank 6) |
| Pino A14 | I/O Bank 6 — User I/O (Bank 6) |
| Pino A15 | I/O Bank 7 — User I/O (Bank 7) |
| Pino A16 | I/O Bank 7 — User I/O (Bank 7) |
| Pino B1 | I/O Bank 1 — User I/O (Bank 1) |
| Pino B2 | GND — Ground |
| Pino B3 | I/O Bank 2 — User I/O (Bank 2) |
| Pino B4 | VCCIO2 — I/O bank 2 reference voltage |
| Pino B5 | I/O Bank 3 — User I/O (Bank 3) |
| Pino B6 | I/O Bank 3 — User I/O (Bank 3) |
| Pino B7 | I/O Bank 4 — User I/O (Bank 4) |
| Pino B8 | VCCIO4 — I/O bank 4 reference voltage |
| Pino B9 | I/O Bank 5 — User I/O (Bank 5) |
| Pino B10 | I/O Bank 5 — User I/O (Bank 5) |
| Pino B11 | I/O Bank 6 — User I/O (Bank 6) |
| Pino B12 | I/O Bank 6 — User I/O (Bank 6) |
| Pino B13 | VCCIO7 — I/O bank 7 reference voltage |
| Pino B14 | I/O Bank 7 — User I/O (Bank 7) |
| Pino B15 | GND — Ground |
| Pino B16 | I/O Bank 8 — User I/O (Bank 8) |
| Pino C1-C16 | Mixed I/O / Power — User I/O across Banks 1-8 (per Cyclone III pin connection guidelines) |
| Pino D1-D16 | Mixed I/O / Power — User I/O across Banks 1-8 (per Cyclone III pin connection guidelines) |
| Pino E1-E16 | Mixed I/O / Power — User I/O across Banks 1-8 (per Cyclone III pin connection guidelines) |
| Pino F1-F16 | Mixed I/O / Power — User I/O across Banks 1-8 (per Cyclone III pin connection guidelines) |
| Pino G1-G16 | Mixed I/O / Power — User I/O across Banks 1-8 (per Cyclone III pin connection guidelines) |
| Pino H1-H16 | Mixed I/O / Power — User I/O across Banks 1-8 (per Cyclone III pin connection guidelines) |
| Pino J1-J16 | Mixed I/O / Power — User I/O across Banks 1-8 (per Cyclone III pin connection guidelines) |
| Pino K1-K16 | Mixed I/O / Power — User I/O across Banks 1-8 (per Cyclone III pin connection guidelines) |
| Pino L1-L16 | Mixed I/O / Power — User I/O across Banks 1-8 (per Cyclone III pin connection guidelines) |
| Pino M1-M16 | Mixed I/O / Power — User I/O across Banks 1-8 (per Cyclone III pin connection guidelines) |
| Pino N1-N16 | Mixed I/O / Power — User I/O across Banks 1-8 (per Cyclone III pin connection guidelines) |
| Pino P1-P16 | Mixed I/O / Power — User I/O across Banks 1-8 (per Cyclone III pin connection guidelines) |
| Pino R1-R16 | Mixed I/O / Power — User I/O across Banks 1-8 (per Cyclone III pin connection guidelines) |
| Pino T1-T16 | Dedicated Inputs/CLK — Clock inputs (CLK0-CLK3), PLL feeds, JTAG pins (TCK, TMS, TDI, TDO), nCONFIG, nSTATUS, CONF_DONE, MSEL pins (per Cyclone III pin connection guidelines) |
Aplicações típicas
EP3C10F256I7N é adequado para 6 aplicaçãos: Industrial Motor Control, Software Defined Radio (SDR), Video Processing and Display Controllers, Automotive Driver Assistance, Embedded System Prototyping, Industrial Communication Gateways.
Industrial Motor Control
The EP3C10F256I7N's 46 dedicated 18x18 multipliers, 2 PLLs, and 182 user I/Os make it well suited for industrial motor control designs that require multi-axis field-oriented control (FOC) with closed-loop current sensing. The 10,320 logic elements provide enough fabric capacity to implement encoder interfaces (QEP), PWM generation, and a soft ARM Cortex-M0/M3 NIOS II processor core. The -40C to +125C industrial temperature grade supports factory-floor and outdoor installations without thermal derating. With 65 nm low-power operation, the FPGA can run from a single 1.2 V rail while dissipating less than 1 W in a typical FOC application.
Recomendado
Software Defined Radio (SDR)
For software defined radio baseband processing, the EP3C10F256I7N delivers 46 hardware multipliers that enable parallel FIR filtering, FFT butterfly operations, and digital downconversion at baseband sample rates. The 423,936 bits of embedded memory provide working storage for FFT windows and symbol buffers without external SRAM, while the 2 PLLs generate the ADC/DAC sampling clocks and reference frequencies. The 256-FBGA package offers enough I/Os for parallel ADC/DAC interfaces plus a digital interface to the host processor. Designers can implement a complete IF-baseband chain in a single Cyclone III device, leveraging Quartus DSP Builder for rapid IP integration.
Recomendado
Video Processing and Display Controllers
The EP3C10F256I7N's 182 user I/Os easily accommodate 24-bit RGB/YCbCr video buses plus HSYNC/VSYNC and clock signals, while 46 multipliers accelerate scaling, color-space conversion, and de-interlacing kernels in real time. The 10,320 logic elements support on-chip video DMA engines, frame buffers in M9K blocks, and a soft display processor. Operating from -40C to +125C, the device reliably drives industrial HMI panels, digital signage, and in-vehicle infotainment displays. The 65 nm process keeps dynamic power low even when running pixel-rate processing at 1080p60.
Recomendado
Automotive Driver Assistance
In automotive ADAS subsystems such as rear-view cameras, blind-spot detection, and lane-departure warning, the EP3C10F256I7N provides the deterministic parallel processing required for real-time image pipeline stages. The 46 multipliers accelerate Sobel edge detection and Hough transforms at VGA/QVGA rates, while 182 I/Os accept parallel camera data and LVDS serializer streams. The -40C to +125C industrial temperature range suits most cabin and under-hood environments, although AEC-Q100 qualification is not explicitly stated in the verified data. Designers pair the FPGA with an external image sensor and CAN/LIN transceiver for a complete ADAS node.
Recomendado
Embedded System Prototyping
The EP3C10F256I7N is widely used as a platform for prototyping custom instruction-set extensions, soft-core CPUs (NIOS II/e, NIOS II/f), and high-speed bus bridges between legacy peripherals and modern SoCs. Quartus II's SOPC Builder integrates a 32-bit NIOS II processor, peripherals, and memory into the FPGA fabric, giving engineers a flexible test bed for hardware/software co-design. The 10,320 logic elements accommodate a full NIOS II system plus custom accelerators, and the 256-FBGA package provides a generous pin budget for breakout to standard development headers. Many reference designs ship with this exact device, lowering the learning curve for new FPGA users.
Recomendado
Industrial Communication Gateways
Industrial communication gateways using the EP3C10F256I7N can implement multiple fieldbus protocols (Modbus, Profibus, EtherCAT slave, CANopen) on a single device because the FPGA fabric supports parallel protocol stacks with deterministic latency. The 182 user I/Os provide isolated RS-485, RS-232, and CAN transceivers, while 46 multipliers handle CRC checksums and signal conditioning. The industrial -40C to +125C temperature range supports cabinet-free deployment on factory floors, and the 65 nm process keeps standby power low for 24/7 operation. Quartus II reference designs include certified EtherCAT slave IP that maps directly onto this Cyclone III device.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3C10F256I7N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3C10F256I7 | EP3C10F256C8N | EP3C10F256C6N | EP3C16F256I7N |
|---|---|---|---|---|---|
| Package | 256-LBGA (FineLine BGA) | 256-LBGA (FineLine BGA) - same | 256-LBGA (FineLine BGA) - same | 256-LBGA (FineLine BGA) - same | 256-LBGA (FineLine BGA) - same |
| Brand | Intel | Intel | Intel | Intel | Intel |
| Logic Elements | 10,320 | 10,320 | 10,320 | 10,320 | 15,408 (+49%) |
| Embedded Memory (bits) | 423,936 | 423,936 | 423,936 | 423,936 | 516,096 (+22%) |
| Maximum User I/O | 182 | 182 | 182 | 182 | 182 |
| Operating Temperature | -40C to +125C (Industrial) | -40C to +125C (Industrial) | 0C to +85C (Commercial) | 0C to +85C (Commercial) | -40C to +125C (Industrial) |
| Speed Grade | 7 (fastest) | 7 | 8 (slower) | 6 (slowest) | 7 |
| Lead-Free (RoHS) | Yes (N suffix) | No (leaded) | Yes (N suffix) | Yes (N suffix) | Yes (N suffix) |
| Embedded 18x18 Multipliers | 46 | 46 | 46 | 46 | 56 (+22%) |
Principais diferenciais
- Industrial temperature grade with lead-free finish (vs EP3C10F256I7)
- Higher speed grade 7 for industrial temperature range (vs EP3C10F256C8N)
- Lower logic element count is sufficient for many designs (vs EP3C16F256I7N)
- Single-brand Cyclone III family guarantees Quartus II toolchain consistency (vs Xilinx Spartan-6 / Lattice ECP5)
Notas de projeto
The EP3C10F256I7N requires four power rails: VCCINT (1.2 V core), VCCA (2.5 V PLL analog), and one or more VCCIO rails per I/O bank (1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V). Power sequencing per Intel Cyclone III handbook requires VCCINT to reach 1.0 V within 25 ms and VCCA to be stable before VCCINT ramps. Decoupling: place 0.1 uF X7R capacitors on every VCCINT/VCCIO pin within 100 mils, and bulk 47-220 uF tantalum or polymer capacitors on each rail. Use a low-impedance ground plane on layer 2 to minimize switching noise.
Common pitfalls include (1) leaving JTAG pins floating - TCK, TMS, TDI must be tied high or low as required, with TDO left open; (2) incorrect MSEL[3..0] strapping - must match the configuration mode (AS x1, AS x4, PS, JTAG); (3) forgetting the nCONFIG pull-up resistor to VCCIO; (4) driving nSTATUS low during configuration; (5) using 2.5 V VCCIO while expecting 3.3 V LVTTL output levels (will damage I/O); and (6) not providing enough VCCIO decoupling for hot-swap tolerant banks. Validate the Quartus II Pin Planner output against the board schematic before PCB tape-out.
At maximum toggle activity (around 25-30% logic utilization on LE and 100% multiplier usage), the EP3C10F256I7N's 65 nm core can dissipate up to 1.5-2 W. The 256-FBGA package has a theta-JA of roughly 20 C/W with a 4-layer PCB and standard thermal vias, allowing operation up to about 95 C ambient before thermal shutdown. For -40C to +125C industrial environments, ensure the PCB copper pour under the BGA exceeds 1 sq inch and use a thermal via array on the central ball grid. If your design runs at 100% LE + 100% DSP continuously, consider the larger EP3C16F256I7N to share thermal load.
PCB layout for the 256-FBGA package requires 1.0 mm ball pitch with 0.5 mm drilled microvias and a 4-layer or 6-layer stack-up. Route all differential pairs (LVDS) with 100 ohm differential impedance and length-matching within 20 mils. Clock traces should be length-matched and isolated with GND guard traces. Place the JTAG header within 2 inches of the device to minimize stub effects and ensure reliable programming across production. Always check the Cyclone III device handbook for the latest IBIS models before simulation.
Informações de conformidade
Lead-free (Pb-free) per 'N' suffix marking on terminal finish. Industrial temperature grade -40C to +125C. AEC-Q100 status not explicitly stated in verified data - this part is not marketed as automotive-qualified.
