EP3C5F256C7N - Cyclone III FPGA, 5K LEs, 256-FBGA | Intel / Altera
N.º da peça: EP3C5F256C7N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $22.72 | $22,72 |
| 10 | $20.45 | $204,50 |
| 100 | $18.1 | $1.810,00 |
| 500 | $16.05 | $8.025,00 |
| 1.000 | $14.2 | $14.200,00 |
EP3C5F256C7N Visão geral
A Field-Programmable Gate Array (FPGA) is a reconfigurable integrated circuit whose logic fabric, routing, and I/O blocks can be programmed after manufacturing to implement arbitrary digital functions. The Cyclone III family sits within Intel's (formerly Altera's) low-cost FPGA portfolio, hierarchically positioned as: logic element -> Logic Array Block (LAB) -> FPGA fabric -> programmable logic device (PLD) -> semiconductor. Compared with CPLDs and small ASICs, FPGAs offer parallel processing, hardware-timed I/O, and on-chip memory blocks suited to data-path, glue-logic, and signal-processing tasks. The EP3C5 sits at the entry of the Cyclone III range, making it ideal for bridging CPLD-scale designs into FPGA-class performance.
Key features of the EP3C5F256C7N include up to 182 general-purpose I/Os with support for multiple I/O standards (LVDS, LVTTL, LVCMOS, SSTL, HSTL), embedded 18x18 multipliers for low-density DSP tasks, and up to 46 embedded M9K memory blocks (approximately 414 Kbits of RAM). The device supports configuration via JTAG, Active Serial (AS), Active Parallel (AP), and Passive Serial (PS) modes, with built-in compression and decompression of configuration bitstreams. On-chip PLLs allow frequency synthesis and clock-tree management for multi-domain designs.
Typical applications include industrial control and motor drive interfaces, low-cost video processing pipelines, I/O expansion and protocol bridging (UART, SPI, I2C, parallel buses), LED display controllers, and consumer-electronics glue logic. The 256-FBGA package offers compact board area while preserving high I/O count and signal integrity for mixed-signal boards. Designers should evaluate Quartus II / Quartus Prime for synthesis and timing closure, and verify the -7 commercial speed grade against their target fMAX requirements.
Alternativas drop-in para EP3C5F256C7N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3C5F256C7N (mesmo formato e footprint) — diferindo em Operating Temperature, Package, Process Technology, RoHS Status, Configuration Modes.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3C5F256C6N
✅ Drop-In✓ Em estoque
$18.85 / unidade
Ver ficha técnica →EP3C5F256C8N
✅ Drop-In✓ Em estoque
$10.95 / unidade
Ver ficha técnica →EP3C5F256I7N
✅ Drop-In✓ Em estoque
$24 / unidade
Ver ficha técnica →EP3C5F256A7N
✅ Drop-In✓ Em estoque
$24.4 / unidade
Ver ficha técnica →EP3C5F256C7
✅ Drop-In✓ Em estoque
$15.53 / unidade
Ver ficha técnica →EP3C5F256C7N Classificações máximas e características elétricas
| Family | Cyclone III |
| Device Type | FPGA - Field Programmable Gate Array |
| Logic Elements (LEs) | 5,136 |
| Logic Array Blocks (LABs) | 182 |
| Total Embedded Memory | 423,936 bits (414 Kbit) |
| Embedded Multipliers (18x18) | 23 |
| M9K Memory Blocks | 46 |
| User I/Os | 182 |
| User I/O Banks | 8 |
| PLLs | 2 |
| Encapsulamento | 256-LBGA (FineLine BGA, 17x17 mm) |
| Speed Grade | -7 (commercial, slowest C-tier) |
| Temperatura de operação | 0C to +85C (commercial, per 'C' speed bin) |
| Core Voltage | 1.2 V (nominal) |
| Process Technology | 65 nm low-power CMOS |
| Lead-Free / Pb-Free | Yes (suffix 'N' denotes lead-free) |
| Configuration Modes | JTAG, AS, AP, PS |
| Status RoHS | Compliant (lead-free FBGA) |
Guia de Configuração de Pinos do EP3C5F256C7N 256-lbga (fineline bga, 17x17 mm)
Configuração de pinos para EP3C5F256C7N (pacote 256-lbga (fineline bga, 17x17 mm)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP3C5F256C7N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP3C5F256C7N é adequado para 6 aplicaçãos: Industrial Control & Motor Drive Interfaces, I/O Expansion & Protocol Bridging, Low-Cost Video Processing Pipelines, LED Display Controllers, Consumer Electronics Glue Logic, Test & Measurement Front-Ends.
Industrial Control & Motor Drive Interfaces
The EP3C5F256C7N's 5,136 logic elements, 182 user I/Os, and 2 PLLs make it well-suited for industrial motor-drive control boards where it can host encoder interfaces (QEP, SSI), PWM generation, and field-oriented-control state machines simultaneously. The device's 65 nm low-power process keeps dissipation under 0.5 W typical for a 5K-LE design, critical in sealed IP65 enclosures without active cooling. The 8 I/O banks support mixed 3.3 V logic and 5 V-tolerant inputs commonly required for legacy industrial sensors, while the 1.0 mm pitch 256-FBGA allows compact placement next to power-stage gate drivers on the same PCB. Compared with a CPLD, the EP3C5 provides roughly 10x the sequential logic and embedded multipliers for sensorless FOC algorithms.
Recomendado
I/O Expansion & Protocol Bridging
The EP3C5F256C7N excels at protocol-bridging tasks - converting between UART, SPI, I2C, parallel buses, and custom timing interfaces - where its 182 I/Os provide ample headroom for multiple bus domains. The 46 embedded M9K memory blocks (414 Kbits total) allow deep FIFOs for rate-matching between asynchronous domains, and the 23 hardware multipliers enable on-chip CRC/Checksum computation at wire speed. The C7 commercial speed grade offers sufficient timing margin for sub-50 MHz UART/SPI bridges common in embedded systems. According to the Cyclone III device handbook, the JTAG-based configuration also enables in-field firmware updates through standard JTAG tools, simplifying remote board reconfiguration.
Recomendado
Low-Cost Video Processing Pipelines
For entry-level video applications such as LCD controller boards, camera front-ends, and machine-vision preprocessing, the EP3C5F256C7N provides 182 I/Os (enough for 24-bit RGB plus control), 23 hardware multipliers (suitable for simple color-space conversion), and LVDS I/O standards (for direct connection to flat-panel interfaces). The 423 Kbits of embedded memory serve as line buffers for up to two 640x480 frames at 16 bpp in tile-based processing. Designers building composite-to-LCD scalers or simple deinterlacers can fit their pipeline within 5K LEs by careful resource sharing, leveraging the FPGA's parallel hardware advantage over microcontrollers at pixel-clock rates above 27 MHz.
Recomendado
LED Display Controllers
The EP3C5F256C7N is a strong fit for LED wall controllers and digital signage drivers, where its 182 I/Os can drive multiple HUB75 RGB-LED data lines in parallel and its high-current LVCMOS/LVTTL outputs (up to 24 mA per pin) match LED driver inputs directly. The 2 PLLs synthesize pixel-clock and row-refresh timing independently, while the 46 M9K blocks implement gamma-correction LUTs and frame buffers. The 65 nm process keeps the IC cool enough to be placed in tight LED-panel enclosures without heatsinking. For multi-panel cascading, the LVDS-capable I/Os enable gigabit serial links between panels at low pin count.
Recomendado
Consumer Electronics Glue Logic
Consumer products such as smart-home hubs, appliance controllers, and IoT gateways often need custom glue logic that microcontrollers cannot provide at the required timing margins. The EP3C5F256C7N handles fast sensor aggregation, audio-sample routing, and timing-sensitive IR/bluetooth baseband tasks within its 5K-LE budget. The 1.2 V core voltage and 65 nm process deliver less than 0.5 W typical consumption, well within battery-powered or energy-star budget. The 8 I/O banks mix 1.8 V, 2.5 V, and 3.3 V domains needed to interface legacy peripheral ICs without external level shifters, simplifying BOM cost.
Recomendado
Test & Measurement Front-Ends
In bench-top T&M equipment, the EP3C5F256C7N provides reconfigurable logic for pattern generation, timing-and-control sequencing, and custom trigger logic. Its 182 user I/Os let it fan out to dozens of DUT channels simultaneously, while the 2 PLLs synthesize multiple sample-rate clocks from a single reference. The 23 hardware 18x18 multipliers enable on-chip FIR filtering for signal-conditioning paths, and the 414 Kbits of M9K RAM serve as deep capture buffers. The JTAG-based configuration lets the same board be re-tasked across multiple test programs, reducing fixture count on production lines.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3C5F256C7N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3C5F256C6N | EP3C5F256C8N | EP3C5F256I7N | EP3C5F256A7N | EP3C5F256C7 |
|---|---|---|---|---|---|---|
| Brand | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) | Intel (Altera) |
| Package | 256-FBGA | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) | 256-FBGA (same) |
| Logic Elements | 5,136 | 5,136 | 5,136 | 5,136 | 5,136 | 5,136 |
| Speed Grade | C7 (commercial mid) | C6 (faster) | C8 (slower) | I7 (industrial mid) | A7 (automotive) | C7 (identical) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | -40C to +125C (automotive) | 0C to +85C |
| Embedded Memory | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits | 423,936 bits |
| User I/Os | 182 | 182 | 182 | 182 | 182 | 182 |
| Lead-Free / Pb-Free | Yes (N suffix) | Yes | Yes | Yes | Yes | No (leaded) |
Principais diferenciais
- All drop-in alternatives share the identical 256-FBGA footprint and 5,136-LE resource profile (vs EP3C5F256C6N / C8N / I7N / A7N)
- C7 speed grade is the highest-volume sweet spot in the Cyclone III family (vs EP3C5F256C6N)
- Commercial temperature range (0C to +85C) suits cost-sensitive indoor products (vs EP3C5F256I7N)
Notas de projeto
The 256-ball FineLine BGA uses a 1.0 mm ball pitch on a 17x17 mm substrate. Per the Cyclone III device handbook, use a 4-6 layer PCB with continuous ground planes under the BGA, and fan-out the inner balls with micro-vias (laser-drilled, 0.1 mm pad) or dog-bone traces on at least 4 routing layers. Match trace lengths within a bank if using LVDS at >500 Mbps. Decouple VCCINT (1.2 V core) with 0.1 uF X7R ceramics at every GND ball pair plus bulk 22 uF tantalum at the supply pins; VCCIO banks each need their own 0.1 uF + 4.7 uF decoupling pair per the Cyclone III hardware manual.
Route JTAG (TCK, TMS, TDI, TDO) signals away from high-frequency switching nets to avoid programming failures; place a 4.7 kOhm pull-up on TCK per the Cyclone III configuration handbook. For AS (Active Serial) configuration with EPCS or EPCQ flash, place the configuration flash within 3 inches of the FPGA with matched-length traces for DCLK and DATA, and tie nCONFIG high through a 10 kOhm resistor to VCCIO. For multi-FPGA chains, ensure the first device's nCEO feeds the second's nCE with no stubs.
Do not assume the EP3C5F256C7N supports 5 V LVTTL inputs without verification - the absolute maximum VCCIO is 3.3 V. Use external 5 V-to-3.3 V level shifters (e.g., SN74LVCH245) or 5 V-tolerant bus switches (e.g., TXS0108E) for any legacy 5 V peripheral. Also verify configuration mode selection pins MSEL[3:0] match the intended boot source - leaving them floating is the most common cause of 'FPGA does not configure' debug tickets. Finally, leave at least 6 free I/Os as test points for JTAG and PMBus observability per Intel's design guidelines.
Estimated: at 25C ambient, with 5K-LE utilization (~80%), 100 MHz internal clock, and 50% I/O toggling, the EP3C5F256C7N typically dissipates under 0.5 W and does not require a heatsink. Under worst-case commercial conditions (85C ambient, 100% utilization, 200 MHz PLL), dissipation may rise to 1.0-1.2 W. The 256-FBGA junction-to-ambient thermal resistance is approximately 25 C/W on a JEDEC 4-layer test board with 1 oz copper; this gives a junction rise of ~25-30C at 1 W, well within the 125C commercial limit. Forced airflow is NOT required under typical loading.
Informações de conformidade
RoHS and lead-free per 'N' suffix and FBGA lead-free ball composition per the Cyclone III datasheet. Commercial temperature grade only - AEC-Q100 automotive requires EP3C5F256A7N variant. Halogen-free status not explicitly stated in the verified data.
