EP3C80U484C6N - Cyclone III FPGA 81K LE 295 I/O | Altera | 484-UBGA
N.º da peça: EP3C80U484C6N ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $29.85 | $2.985,00 |
| 250 | $27.4 | $6.850,00 |
| 500 | $25.1 | $12.550,00 |
EP3C80U484C6N Visão geral
A Field Programmable Gate Array (FPGA) is a reconfigurable semiconductor device built from an array of programmable logic blocks (LUTs, flip-flops, DSP blocks, and embedded memory) interconnected by a programmable routing fabric. Within the digital logic hierarchy, an FPGA sits between fixed-function ASICs and software-driven microcontrollers, offering hardware-level parallelism with software-like design iteration. Cyclone III specifically targets cost- and power-sensitive applications by combining high logic density with industry-leading low static and dynamic power consumption.
Key features of the EP3C80U484C6N include up to 4 PLLs for clock management, 250 hardware multipliers (18x18) for DSP workloads, support for external memory interfaces including DDR/DDR2/QDRII SRAM, and 484-pin UBGА packaging at the C6 speed grade. The device supports common I/O standards such as LVDS, LVCMOS, SSTL, and PCI, enabling direct connection to processors, memories, and high-speed parallel peripherals.
The Cyclone III architecture leverages TSMC's 65 nm low-power process, adaptive logic modules (ALMs), and column-based memory blocks to deliver high logic density at low static power. Configuration is loaded via passive serial (PS), fast passive parallel (FPP), or JTAG, allowing fast in-system reprogramming. Hardware multipliers and DSP blocks accelerate signal-processing kernels at full FPGA parallelism without burdening soft logic.
Typical applications for the EP3C80U484C6N span industrial motor control, video surveillance and image processing, automotive driver-assistance, test and measurement front-ends, and protocol bridging. Its combination of logic, memory, and DSP resources makes it well suited for systems requiring parallel I/O, real-time signal processing, or multi-protocol glue logic between processors and peripherals.
When designing with this device, pay close attention to power-supply sequencing: the 1.2 V core must come up before I/O banks to avoid latch-up, and decoupling must follow the Quartus II pin connection guidelines. JTAG and configuration pins must be terminated correctly to guarantee reliable in-field updates, and PCB layout must follow Altera's recommended BGA escape and via pattern.
This page synthesizes distributor pricing, same-brand Cyclone III drop-in alternatives, and practical FPGA design notes that go beyond the manufacturer datasheet to support sourcing and design decisions.
Alternativas drop-in para EP3C80U484C6N — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3C80U484C6N (mesmo formato e footprint) — diferindo em Package, Speed Grade, Process Technology, Family, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3C80U484C8N
✅ Drop-In✓ Em estoque
$190.99 / unidade
Ver ficha técnica →EP3C80U484C7N
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →EP3C80U484I7N
✅ Drop-In✓ Em estoque
$124.18 / unidade
Ver ficha técnica →EP3C120F484I7N
✅ Drop-In✓ Em estoque
$84.7 / unidade
Ver ficha técnica →10CL080YU484C6G
✅ Drop-In✓ Em estoque
$34.75 / unidade
Ver ficha técnica →EP3C80U484C6N Classificações máximas e características elétricas
| Family | Cyclone III |
| Logic Elements (LE) | 81,264 |
| Total Memory Bits | 2,810,880 bits |
| Maximum User I/O | 295 |
| Total RAM Blocks | 397 M9K blocks |
| 18x18 Hardware Multipliers | 250 |
| PLLs | 4 |
| Process Technology | 65 nm TSMC low-power |
| Core Voltage | 1.2 V |
| I/O Voltage Range | 1.2 V to 3.3 V |
| Encapsulamento | 484-UBGA (Ultra FineLine BGA) |
| Speed Grade | C6 (commercial) |
| Temperatura de operação | 0C to +85C (commercial) |
| Tipo de montagem | Surface Mount (BGA) |
| Status RoHS | RoHS Compliant |
| Lead Free | Lead Free |
Guia de Configuração de Pinos do EP3C80U484C6N 484-ubga (ultra fineline bga)
Configuração de pinos para EP3C80U484C6N (pacote 484-ubga (ultra fineline bga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP3C80U484C6N.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP3C80U484C6N é adequado para 6 aplicaçãos: Industrial Motor Control, Video Surveillance and Image Processing, Test and Measurement Equipment, Industrial Communication Protocol Bridging, Automotive Infotainment and Driver Assistance, Medical Imaging and Patient Monitoring.
Industrial Motor Control
The EP3C80U484C6N fits industrial motor control because its 81,264 logic elements and 250 18x18 hardware multipliers can implement field-oriented control (FOC), space-vector PWM, and encoder interfaces in a single device. The 295 user I/Os support multi-axis drives with parallel ADC sampling and PWM generation, while 4 PLLs provide clean clocks for resolver excitation and high-speed ADC synchronization. The 484-UBGА package handles the thermal load of continuous switching at 20 kHz+ and supports extended industrial temperature grades (I7 variant).
Recomendado
Video Surveillance and Image Processing
The EP3C80U484C6N is well matched to multi-channel video surveillance because its 2.8 Mbit embedded memory buffers full-HD frames, while 250 hardware multipliers accelerate Sobel, edge detection, and motion-estimation kernels. The 295 I/Os accept multiple parallel camera interfaces (BT.656, LVDS, sub-LVDS) and a DDR2 controller for off-chip frame storage. Quartus II video IP cores shorten development time and the 484-UBGА package enables compact security camera mainboards.
Recomendado
Test and Measurement Equipment
Test and measurement instruments benefit from the EP3C80U484C6N's 4 PLLs for multi-rate clock generation, 250 hardware multipliers for digital-down-conversion (DDC) and FFT acceleration, and 295 I/Os for parallel ADC capture. The 65 nm low-power process keeps chassis thermal density manageable, and the 484-UBGА footprint supports dense PCB layouts with controlled-impedance analog front ends. Quartus II SignalTap II integration accelerates debugging of real-time DSP pipelines.
Recomendado
Industrial Communication Protocol Bridging
The EP3C80U484C6N bridges industrial protocols (EtherCAT, PROFINET, Modbus TCP, CANopen) between mismatched PLC networks because its 81K logic elements can host multiple soft-CPU cores plus deterministic MAC layers in parallel. The 295 user I/Os handle RGMII, SPI, and parallel host interfaces simultaneously, while 2.8 Mbit embedded memory buffers packet bursts. The 484-UBGА package suits fanless industrial gateway designs with extended temperature requirements.
Recomendado
Automotive Infotainment and Driver Assistance
The EP3C80U484C6N supports automotive infotainment head units and basic driver-assistance (rear-view, surround-view, lane departure) by running LVDS display aggregation, CAN/LIN bridging, and video overlay in one device. The 250 hardware multipliers accelerate H.264 encode/decode for camera streams, while 295 I/Os accept multiple MIPI-CSI, LVDS, and parallel RGB inputs. The 484-UBGА package is suited to the small form factor of dashboard modules.
Recomendado
Medical Imaging and Patient Monitoring
Medical imaging systems (ultrasound front-ends, patient-side monitors) leverage the EP3C80U484C6N's 2.8 Mbit embedded memory for line buffers and 250 hardware multipliers for beamforming and FIR filtering. The 295 I/Os connect to high-speed ADCs and isolated communication ports, while the 65 nm low-power process simplifies IEC 60601 thermal compliance. Long-lifecycle availability through Intel's legacy FPGA program makes this device attractive for regulated medical equipment production runs.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3C80U484C6N — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3C80U484C8N | EP3C80U484C7N | EP3C80U484I7N | EP3C120F484I7N | 10CL080YU484C6G |
|---|---|---|---|---|---|---|
| Package | 484-UBGA (U484) | 484-UBGA (U484) - same | 484-UBGA (U484) - same | 484-UBGA (U484) - same | 484-FBGA (F484) | 484-UBGA (UBGA-484) |
| Brand | Altera | Altera | Altera | Altera | Altera | Intel |
| Logic Elements | 81,264 | 81,264 | 81,264 | 81,264 | 119,088 | 81,264 |
| Speed Grade | C6 (commercial) | C8 (commercial) | C7 (commercial) | I7 (industrial) | I7 (industrial) | C6 (industrial) |
| Total Memory (bits) | 2,810,880 | 2,810,880 | 2,810,880 | 2,810,880 | 3,981,312 | 2,810,880 |
| 18x18 Multipliers | 250 | 250 | 250 | 250 | 288 | 244 |
| Maximum User I/O | 295 | 295 | 295 | 295 | 288 | 295 |
| Core Voltage | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.0 V (lower power) |
Principais diferenciais
- High logic density at low static power for cost-sensitive designs (vs 10CL080YU484C6G (Cyclone IV E))
- Same 484-UBGA package across speed grades enables timing-bin flexibility (vs EP3C80F484C6N)
- Long lifecycle support through Intel legacy FPGA program (vs Cyclone V (5CEBA series))
Notas de projeto
Estimated: At 100% logic utilization with typical toggle activity, the EP3C80U484C6N draws approximately 1.5-2.5 A on its 1.2 V VCCINT rail. Provide at least four 100 uF bulk capacitors plus distributed 0.1 uF and 1 nF decoupling near every VCC pin group. Power sequencing per the Cyclone III handbook requires VCCINT (1.2 V) to come up before or simultaneously with VCCIO banks; failure to sequence correctly can trigger permanent latch-up damage.
The 484-UBGA uses a 1.0 mm ball pitch requiring microvia or via-in-pad PCB technology for escape. Follow Altera's recommended 4-layer stack-up with 8 mil core, 6 mil prepreg, and continuous GND planes on layers 2 and 4. Matched-impedance routing (50 ohm single-ended, 100 ohm differential) is mandatory for DDR2 and LVDS interfaces. Decoupling capacitors must be placed within 100 mil of their associated supply pins.
Configuration mode selection (MSEL pins) must be set correctly before power-up: AS mode uses 4 pins and requires a serial flash; PS, FPP, and JTAG modes each use different MSEL combinations. Conf_FW pins must be pulled to the correct default state for the desired configuration scheme. Leaving MSEL floating can result in unreliable configuration or startup failures on production boards.
Estimated: At full 81K-LE utilization with high toggle activity, junction-to-ambient thermal resistance (theta_JA) for the 484-UBGA on a JEDEC JESD51-7 4-layer test board is approximately 13-16 C/W. Use Quartus II PowerPlay early power estimation, then measure on a prototype to confirm junction temperature stays below 85C (commercial) or 100C (industrial). Forced airflow may be required if the thermal budget is exceeded in chassis-limited designs.
Informações de conformidade
RoHS compliant and lead-free per Altera/Intel product page. AEC-Q100 not applicable (FPGA device, not an automotive-grade part by default; automotive users should validate per their program requirements). Halogen-free status and REACH compliance not stated explicitly in verified data.
