EP3SL50F484C2 - 47.5K LE Stratix III L FPGA 484-FBGA | Intel
N.º da peça: EP3SL50F484C2 ⚠ Última compra| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $851.57 | $851,57 |
| 10 | $765.4 | $7.654,00 |
| 100 | $638.5 | $63.850,00 |
| 500 | $540.2 | $270.100,00 |
| 1.000 | $478.8 | $478.800,00 |
EP3SL50F484C2 Visão geral
An FPGA (Field Programmable Gate Array) is a semiconductor device whose logic architecture, interconnect, and I/O behavior are defined by a user-supplied configuration bitstream rather than fixed at the fab. Within the broader programmable-logic taxonomy, FPGAs sit alongside CPLDs and Structured ASICs as reconfigurable computing substrates used for parallel data-path acceleration, high-speed interface bridging, and prototype-to-production ASIC migration. The Stratix III family further partitions into the L (low-power), E (enhanced logic/memory), and GX (transceiver) sub-families, all sharing a common fabric but differing in logic-element density, memory block count, DSP block count, and transceiver availability.
Key features of the EP3SL50F484C2 include 1,900 Logic Array Blocks (LABs), 2,184,192 bits of embedded memory, MultiTrack interconnect for predictable timing closure, TriMatrix embedded memory blocks, and configurable I/O standards including LVDS, LVTTL, LVCMOS, SSTL, and HSTL. The device supports up to 12.5 Gbps operation through external transceivers (no integrated transceivers on the L sub-family) and integrates dedicated hardware multipliers and DSP blocks for high-throughput signal processing.
Typical applications for the EP3SL50F484C2 span wireline telecom backhaul, military radar signal processing, ASIC prototyping, high-speed data acquisition, and video broadcast infrastructure. Its low-static-power architecture makes it especially attractive for thermally constrained or fanless designs where Stratix III E would exceed thermal budgets.
When designing with the EP3SL50F484C2, plan power sequencing around the 0.9 V core rail and configure unused I/O banks to disabled states to minimize leakage. Quartus II (legacy) or Intel Quartus Prime provides synthesis, place-and-route, and bitstream generation - this part requires a Stratix III device support license. Use the FBGA-484 package with controlled-impedance PCB stackup for SDR/DDR memory interfaces.
Alternativas drop-in para EP3SL50F484C2 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP3SL50F484C2 (mesmo formato e footprint) — diferindo em Package, Family, Operating Temperature, Speed Grade, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP3SE50F484C2
✅ Drop-In✓ Em estoque
$895 / unidade
Ver ficha técnica →EP3SE50F484C2N
✅ Drop-In✓ Em estoque
$5934.83 / unidade
Ver ficha técnica →EP3SE50F484C3
✅ Drop-In✓ Em estoque
$820 / unidade
Ver ficha técnica →EP3SE50F484C4
✅ Drop-In✓ Em estoque
$215 / unidade
Ver ficha técnica →EP3SE50F484I3
✅ Drop-In✓ Em estoque
$188 / unidade
Ver ficha técnica →EP3SE50F484I4
✅ Drop-In✓ Em estoque
$730 / unidade
Ver ficha técnica →EP3SL50F484C2 Classificações máximas e características elétricas
| Family | Stratix III L (low-power) |
| Device Type | FPGA |
| Logic Elements | 47,500 |
| Logic Array Blocks (LABs) | 1,900 |
| Embedded Memory Bits | 2,184,192 |
| Maximum Internal Frequency | 800 MHz |
| User I/O Pins | 296 |
| Encapsulamento | 484-BBGA, FCBGA (FineLine BGA) |
| Process Technology | 40 nm CMOS (TSMC) |
| Core Supply Voltage | 0.9 V |
| Temperatura de operação | 0 C to 85 C (commercial) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
| Lead-Free | Yes |
| Configuration Memory | SRAM-based (volatile, requires external flash/EPC) |
| Speed Grade | C2 (slower of Stratix III commercial) |
Guia de Configuração de Pinos do EP3SL50F484C2 484-bbga, fcbga (fineline bga)
Configuração de pinos para EP3SL50F484C2 (pacote 484-bbga, fcbga (fineline bga)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP3SL50F484C2.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP3SL50F484C2 é adequado para 6 aplicaçãos: Wireline Telecom Backhaul Equipment, Military Radar Signal Processing, ASIC Prototyping and Emulation, High-Speed Data Acquisition Systems, Video Broadcast Infrastructure, Industrial Test and Measurement.
Wireline Telecom Backhaul Equipment
The EP3SL50F484C2 fits wireline backhaul designs where 47.5K logic elements drive protocol bridging, packet classification, and traffic shaping between TDM and Ethernet domains. Its 800 MHz fabric and 2.18 Mbits of TriMatrix memory absorb jitter-tolerant FIFOs and lookup tables without external SSRAM. The L sub-family's reduced static power lets line cards run in sealed outdoor enclosures with passive heatsinking, while 296 user I/O pins expose LVDS links to SFP/SFP+ cages without an external transceiver.
Recomendado
Military Radar Signal Processing
The EP3SL50F484C2 suits radar pre-processors where Doppler filtering, pulse compression, and CFAR detection run in parallel across dedicated DSP blocks. Its 47.5K logic elements host four to eight channel pipelines at 200 MSPS each, while the 0.9 V core keeps thermal load within a sealed chassis. Designers pair the device with external ADC banks over LVDS, exploiting 296 I/O for 12-bit parallel data streams and synchronization triggers.
Recomendado
ASIC Prototyping and Emulation
The EP3SL50F484C2 is widely used as an ASIC prototype target because Quartus Prime supports gate-level synthesis flows that mirror ASIC timing. Its 2.18 Mbit embedded memory maps to register arrays and scratchpad RAM, while the 484-FBGA package exposes sufficient I/O for chip-level signal visibility. Engineers partition multi-million-gate ASICs across multiple Stratix III L devices using the same package to simplify PCB stacking.
Recomendado
High-Speed Data Acquisition Systems
The EP3SL50F484C2 fits multi-channel data acquisition backplanes where the FPGA performs parallel decimation, triggering, and timestamp insertion across 16 to 32 ADC lanes. Its 800 MHz fabric sustains 200 MHz FIR filters and CORDIC-based frequency translation in real time, while 296 I/O pins expose LVDS pairs to support 14/16-bit ADCs at full sample rate. The commercial temperature range suits lab and factory-floor installations.
Recomendado
Video Broadcast Infrastructure
The EP3SL50F484C2 powers SD/HD/3G-SDI router crosspoints, frame synchronizers, and broadcast graphics overlays where deterministic latency and parallel video processing are mandatory. Its MultiTrack interconnect supports timing closure at 148.5 MHz and 297 MHz pixel clocks for 1080p and 4K up-conversion. The 296 I/O pins accommodate eight to twelve SDI streams plus genlock reference distribution.
Recomendado
Industrial Test and Measurement
The EP3SL50F484C2 fits ATE pin-electronics controllers, protocol analyzers, and BERT (bit-error-rate tester) backplanes where the FPGA must generate and check high-speed patterns in real time. Its 47.5K logic elements implement deep PRBS generators, 8B/10B encoders, and trigger sequencers, while 296 I/O pins fan out to multi-channel comparators. The commercial 0 to 85 C range suits benchtop and rack-mount equipment with airflow cooling.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP3SL50F484C2 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP3SE50F484C2 | EP3SE50F484C2N | EP3SE50F484C3 | EP3SE50F484C4 | EP3SE50F484I3 | EP3SE50F484I4 |
|---|---|---|---|---|---|---|---|
| Package | 484-BBGA, FCBGA | 484-BBGA, FCBGA (same) | 484-BBGA, FCBGA (same) | 484-BBGA, FCBGA (same) | 484-BBGA, FCBGA (same) | 484-BBGA, FCBGA (same) | 484-BBGA, FCBGA (same) |
| Brand | Intel | Intel | Intel | Intel | Intel | Intel | Intel |
| Sub-Family | Stratix III L (low-power) | Stratix III E (enhanced) | Stratix III E (enhanced) | Stratix III E (enhanced) | Stratix III E (enhanced) | Stratix III E (enhanced) | Stratix III E (enhanced) |
| Logic Elements | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 | 47,500 |
| Speed Grade | C2 | C2 | C2 | C3 | C4 | I3 | I4 |
| Operating Temperature | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | 0 C to 85 C (commercial) | -40 C to +100 C (industrial) | -40 C to +100 C (industrial) |
| Static Power Profile | Reduced (L sub-family) | Higher (E sub-family) | Higher (E sub-family) | Higher (E sub-family) | Higher (E sub-family) | Higher (E sub-family) | Higher (E sub-family) |
| Lifecycle Status | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy | Last-time-buy |
Principais diferenciais
- Lower static power than Stratix III E variants (vs EP3SE50F484C2)
- Pin-compatible migration path within Stratix III family (vs EP3SE50F484I3)
- Speed grade upgrade available in same package (vs EP3SE50F484C3)
Notas de projeto
Estimated: at 50% toggle rate and 800 MHz operating frequency, the EP3SL50F484C2 draws approximately 1.5 to 2.5 W dynamic plus 0.4 to 0.6 W static. Use a multi-rail regulator topology with 0.9 V VCC, 1.2 V/1.5 V VCCPT, and 2.5 V/3.3 V VCCIO supplies. Decoupling per Stratix III handbook: 100 nF X7R at each VCC pin, 22 uF bulk per bank, and four 10 uF bulk capacitors near the FPGA. Power-rail sequencing must follow the datasheet order to avoid latch-up.
Use a 12- or 14-layer PCB stackup with dedicated ground and power planes for the 484-FBGA. BGA breakout requires 0.4 mm or 0.5 mm ball pitch via-in-pad with 0.2 mm laser-drilled microvias. Maintain 50 ohm single-ended and 100 ohm differential controlled impedance for LVDS/SDR/DDR interfaces. Route all eight transceiver-free high-speed LVDS pairs on the top layers with matched length within 150 mil.
Estimated: under typical load, the FBGA-484 package dissipates 2 to 4 W, producing a junction-to-ambient thermal resistance near 15 C/W on a standard 4-layer JEDEC test board. For sealed enclosures, mount a 15 x 15 mm copper heat spreader directly to the package top with thermal interface material, or integrate a small fan for 200 LFM airflow. Junction temperature should stay below 100 C for reliability margin.
Do not confuse the EP3SL50 (Stratix III L) with the EP3SE50 (Stratix III E) when sourcing - both share the same 484-FBGA package but differ in static power and DSP count. Ensure Quartus Prime has the Stratix III device support installed; legacy Quartus II 13.0 is the last release with full Stratix III support. Always generate a configuration bitstream with the correct C2 speed grade selected; mismatched timing constraints may cause hold-time violations.
Informações de conformidade
RoHS and lead-free status verified from Altera/Intel product page. AEC-Q100 is not applicable because this is a commercial-grade FPGA, not an automotive IC. Conflict-minerals compliance per Intel's published CMRT declarations.