EP4CE55F23C7 - Cyclone IV E FPGA, 55K LE, FBGA-484 | Intel / Altera
N.º da peça: EP4CE55F23C7 ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $215 | $215,00 |
| 10 | $195 | $1.950,00 |
| 100 | $175 | $17.500,00 |
| 500 | $158 | $79.000,00 |
| 1.000 | $142 | $142.000,00 |
EP4CE55F23C7 Visão geral
A field-programmable gate array (FPGA) is a semiconductor device containing configurable logic blocks (CLBs), programmable interconnects, and I/O cells that engineers can re-program to implement arbitrary digital circuits. FPGAs sit between fixed-function ASICs (high NRE, low unit cost at volume) and microcontrollers (fixed ISA, sequential execution), offering hardware-level parallelism and nanosecond-level latency for DSP, glue logic, and high-speed interface bridging. Cyclone IV E is Altera's (now Intel FPGA) low-cost, low-power family targeting volume production in industrial, automotive, communications, and consumer designs.
Key features of the EP4CE55F23C7 include up to 472.5 MHz internal operation, 4 transceivers (none on this E variant), 156 embedded 18x18 multipliers, and 4 PLLs for clock management. The 60nm process achieves low static and dynamic power versus prior Cyclone generations, while the FBGA-484 package provides 1.0 mm ball pitch for moderate-density PCB assembly. Configuration options include JTAG, passive serial, active serial, and fast passive parallel modes.
The Cyclone IV E architecture integrates embedded memory blocks (M9K) and DSP blocks alongside general-purpose logic, enabling single-chip implementation of video pipelines, motor control, industrial protocols, and custom bus bridges. Hard intellectual property such as PCI Express soft cores and DDR/DDR2 SDRAM controllers is available via Altera / Intel Quartus IP libraries, simplifying system integration versus older glue-logic designs.
Typical applications include industrial motor drives and PLCs, video surveillance image processing, factory automation controllers, software-defined radio baseband, medical imaging front-ends, and LED video walls. The wide logic capacity supports multi-protocol bridging (EtherCAT, PROFINET, CAN, RS-485) combined with on-chip DSP for sensor fusion.
When designing with this FPGA, plan power sequencing for the 1.2V core, 2.5V/3.3V I/O banks, and PLL analog supplies separately, and verify signal-integrity on DDR/DDR2 interfaces with matched-length routing. Quartus Prime software (Lite/Standard/Pro editions) is required for synthesis, place-and-route, and bitstream generation.
This page synthesizes distributor pricing, drop-in and same-footprint Cyclone IV E alternatives, and practical design notes not collected on a single manufacturer datasheet page.
Alternativas drop-in para EP4CE55F23C7 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com EP4CE55F23C7 (mesmo formato e footprint) — diferindo em Package, Speed Grade, Embedded 18x18 Multipliers, Configuration Modes, Process Technology.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
EP4CE55F23C6N
✅ Drop-In✓ Em estoque
$54.92 / unidade
Ver ficha técnica →EP4CE55F23A7N
✅ Drop-In✓ Em estoque
$134.4 / unidade
Ver ficha técnica →EP4CE55F23I7
✅ Drop-In✓ Em estoque
Consulte o preço
Ver ficha técnica →EP4CE55F23C6
✅ Drop-In✓ Em estoque
$36.75 / unidade
Ver ficha técnica →EP4CE40F23C7N
✅ Drop-In✓ Em estoque
$21.8 / unidade
Ver ficha técnica →EP4CE40F23C7
✅ Drop-In✓ Em estoque
$102 / unidade
Ver ficha técnica →EP4CE55F23C7 Classificações máximas e características elétricas
| Family | Cyclone IV E |
| Logic Elements (LE) | 55,856 |
| Logic Array Blocks (LABs) | 3,491 |
| Embedded Memory | 2,396,160 bits |
| Embedded 18x18 Multipliers | 156 |
| PLLs | 4 |
| Maximum User I/O | 324 |
| Operating Frequency (max) | 472.5 MHz |
| Process Technology | 60 nm |
| Core Supply Voltage | 1.2 V |
| Encapsulamento | FBGA-484 (23 x 23 mm, 1.0 mm pitch) |
| Tipo de montagem | Surface Mount |
| Temperatura de operação | 0C to +85C (commercial) |
| Speed Grade | C7 |
| Configuration Modes | JTAG, Passive Serial, Active Serial, Fast Passive Parallel |
| Status RoHS | Compliant |
Guia de Configuração de Pinos do EP4CE55F23C7 fbga-484 (23 x 23 mm, 1.0 mm pitch)
Configuração de pinos para EP4CE55F23C7 (pacote fbga-484 (23 x 23 mm, 1.0 mm pitch)). Este CI digital inclui GPIO, interfaces de comunicação (UART, SPI, I2C) e pinos de alimentação. Consulte o datasheet do fabricante para funções alternativas dos pinos e opções de configuração. Essencial para projeto de sistemas embarcados e layout de PCB.
Nenhum dado detalhado de pinagem disponível para EP4CE55F23C7.
Consulte a ficha técnica para a configuração completa dos pinos.
Aplicações típicas
EP4CE55F23C7 é adequado para 6 aplicaçãos: Industrial Motor Drive Control, Video Surveillance Image Processing, Factory Automation Controller, Software-Defined Radio Baseband, Medical Imaging Front-End, LED Video Wall Display Controller.
Industrial Motor Drive Control
The EP4CE55F23C7 fits industrial motor drive control because its 55,856 logic elements and 156 embedded 18x18 multipliers handle field-oriented control (FOC) math for 3-phase PMSM and induction drives at switching frequencies up to 50 kHz. The 324 user I/Os in the FBGA-484 package connect directly to multi-axis gate drivers, encoder interfaces (QEP, SSI, EnDat), and CAN/RS-485 industrial networks without external logic. On-chip PLLs generate precise switching clocks from a single crystal reference, while 2.4 Mbit embedded memory buffers ADC samples and PWM duty cycles for current/voltage loops. Designers can implement sensorless or sensored FOC, integrated braking, and STO safety functions in a single device, replacing legacy DSP + CPLD two-chip solutions.
Recomendado
Video Surveillance Image Processing
The EP4CE55F23C7 is well suited to multi-channel video surveillance because its 156 hardware multipliers implement real-time motion detection, H.264 preprocessing, and noise reduction at 1080p60 pixel rates. With 324 I/Os the device can ingest several parallel camera interfaces (BT.656, MIPI CSI-2 with soft PHY, or LVDS) and drive HDMI or Ethernet outputs simultaneously, removing the need for a companion image signal processor. The 2.4 Mbit embedded memory provides line and frame buffers, while on-chip PLLs derive DDR2 controller clocks for external SDRAM. Low 1.2 V core power and 60 nm process keep thermal dissipation low enough for fanless NVR enclosures.
Recomendado
Factory Automation Controller
The EP4CE55F23C7 anchors a factory automation controller by hosting multiple industrial Ethernet protocols (PROFINET, EtherCAT, EtherNet/IP) concurrently on its 55,856 logic elements and 4 PLLs. Its 324 I/Os map cleanly to digital I/O modules, isolated 24 V field-bus interfaces, and analog front-ends, while the 2.4 Mbit embedded memory acts as a fast process-image buffer between deterministic network cycles and the application CPU. The device's industrial-grade variant (EP4CE55F23I7) supports -40C to +100C operation required inside sealed control cabinets. Quartus Prime IP libraries enable certified PROFINET IRT and EtherCAT slave stacks with cycle times below 250 us.
Recomendado
Software-Defined Radio Baseband
The EP4CE55F23C7 supports software-defined radio baseband processing because its 156 18x18 multipliers implement digital down-conversion, FIR filtering, and channelization for narrowband waveforms up to ~50 MHz bandwidth. Its 472.5 MHz internal FMAX combined with 2.4 Mbit embedded memory enables buffering of IQ sample streams between ADC front-ends and host processors, while the 324 user I/Os connect to LVDS ADC data buses and synchronization ports. Low 1.2 V core voltage and 60 nm process keep power budgets compatible with battery-powered tactical and portable SDR platforms where Cyclone IV E is widely deployed.
Recomendado
Medical Imaging Front-End
The EP4CE55F23C7 is a strong fit for medical imaging front-ends (ultrasound beamforming, patient monitoring pre-processing) because its 55,856 logic elements and dedicated multipliers execute real-time FIR filtering and envelope detection at ultrasound sampling rates. The 324 I/Os interface directly to multi-channel A/D converters (LVDS), probe connectors, and TFT-LCD display panels, while the 2.4 Mbit embedded memory holds beamformed line buffers between acquisitions. Industrial temperature grade EP4CE55F23I7N variant supports hospital and ambulatory equipment requirements, and the low-power 1.2 V core keeps thermal dissipation minimal for handheld probe electronics.
Recomendado
LED Video Wall Display Controller
The EP4CE55F23C7 drives large LED video walls by handling multi-panel stitching, gamma correction, and refresh-rate adaptation across hundreds of parallel data channels. Its 324 I/Os in FBGA-484 are ample for distributing pixel data to multiple HUB75 chains, while 156 hardware 18x18 multipliers accelerate color-space conversion and brightness uniformity compensation. The 2.4 Mbit embedded memory acts as a line buffer between the upstream HDMI/DVI receiver and the LED scan driver, allowing smooth 60 Hz playback even with high-resolution content. Low 1.2 V core power enables slim, fanless controller enclosures in retail and staging installations.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para EP4CE55F23C7 — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | EP4CE55F23C6N | EP4CE55F23A7N | EP4CE55F23I7 | EP4CE40F23C7N |
|---|---|---|---|---|---|
| Package | FBGA-484 | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same | FBGA-484 - same |
| Brand | Intel (Altera) | Intel | Intel | Intel | Intel |
| Logic Elements | 55,856 | 55,856 | 55,856 | 55,856 | 39,600 (-29%) |
| Embedded Memory (bits) | 2,396,160 | 2,396,160 | 2,396,160 | 2,396,160 | 1,134,000 (-53%) |
| Embedded 18x18 Multipliers | 156 | 156 | 156 | 156 | 116 (-26%) |
| User I/O | 324 | 324 | 324 | 324 | 324 |
| Speed Grade | C7 | C6 (slower) | A7 | C7 (industrial temp) | C7 (smaller die) |
| Operating Temperature | 0C to +85C (commercial) | 0C to +85C | 0C to +85C | -40C to +100C (industrial) | 0C to +85C |
| Lifecycle Status | Active | Active | Active | Active | Active |
Principais diferenciais
- Highest density 55,856 LE in the Cyclone IV E F23 FBGA-484 package (vs EP4CE40F23C7N)
- C7 speed grade provides higher FMAX than C6 or A7 alternatives (vs EP4CE55F23C6N)
- Industrial temperature variant (EP4CE55F23I7) is a true drop-in (vs EP4CE55F23I7)
Notas de projeto
The EP4CE55F23C7 requires multiple supply rails - VCCINT 1.2 V for the core, VCCIO 1.2-3.3 V per I/O bank, VCCAUX 2.5 V for PLLs and configuration, and VCCPD 2.5-3.3 V for pre-drivers. Decouple each rail with 0.1 uF and 10 uF capacitors placed within 5 mm of the respective balls, and sequence VCCINT before VCCAUX/VCCIO to avoid I/O latch-up. Use a dedicated ferrite bead to isolate PLL analog supply VCCA_PLL from noisy digital VCCINT.
At full logic utilization with 100% toggle rate, the EP4CE55F23C7 dissipates approximately 1.5-2.5 W. The FBGA-484 package has a theta_JA around 15-20 C/W on a standard 4-layer JEDEC test board. For sealed industrial enclosures, attach a small copper heat spreader or thermal pad to the package top to keep junction temperature below 100C. Quartus Prime PowerPlay analyzer provides post-fit power estimates - always run it after place-and-route.
Route all FBGA-484 signals on inner layers with microvia or via-in-pad fan-out to escape the 1.0 mm pitch ball array. Match DDR/DDR2 traces within +/-25 mil and use 100-ohm differential for LVDS pairs. Provide at least 4 GND vias per square inch and stitch GND planes around the BGA perimeter to suppress SSN noise on high-speed I/O banks.
Do not leave configuration pins (nCONFIG, MSEL[3:0], nCE) floating - tie them through 10 kohm pull-ups or pull-downs per the configuration mode you select. Unused I/O banks must have their VCCIO powered (or set to tri-state with weak pull-ups) to avoid floating inputs that draw excess current. Verify JTAG chain integrity by reading the device ID before programming.
Place decoupling capacitors on the top layer directly above their respective BGA balls, using via-in-pad or short microvia fan-out. Assign clock I/O to the dedicated CLK pins near PLLs to minimize jitter and skew. Use Quartus Prime Fitter resource utilization reports to identify congestion early, and floorplan the design to keep critical paths short.
Informações de conformidade
RoHS and lead-free compliance confirmed by Altera / Intel product page. Not AEC-Q100 qualified; for automotive designs select an AEC-Q100-qualified Cyclone IV or newer Cyclone V/10 device variant.
