Altera

EP4CGX22CF19C6 - Cyclone IV GX FPGA, 21.2K LE, 169-FBGA | Intel

N.º da peça: EP4CGX22CF19C6 ✓ Ativo
Em estoque Enviado em 1 a 3 dias úteis
1.2 V Vdss 169-ball FBGA (FineLine BGA, F19) Package 20 Speed 774,144 Memory
A partir de $24.64 USD / unidade
MOQ: 1 |
Preço atualizado: 2026-09-09
Preços por volume
Qtd. Preço unitário Total
1 $38.5 $38,50
10 $34.65 $346,50
100 $30.8 $3.080,00
500 $27.72 $13.860,00
1.000 $24.64 $24.640,00
ℹ️ Todos os preços estão em USD

EP4CGX22CF19C6 Visão geral

The Intel (formerly Altera) EP4CGX22CF19C6 is a member of the Cyclone IV GX family of low-power, high-volume Field-Programmable Gate Arrays (FPGAs), integrating 21,280 logic elements, 774,144 bits of embedded memory, and 2.5 Mbps to 3.125 Gbps transceivers in a 169-ball FineLine Ball-Grid Array (FBGA) package. The part is fabricated on a 60 nm low-power process and operates from a 1.2 V core supply, with multi-voltage I/O banks supporting 1.2/1.5/1.8/2.5/3.3 V LVCMOS and LVTTL interfaces.

A Field-Programmable Gate Array (FPGA) is a semiconductor device built around an array of configurable logic blocks (CLBs) connected by programmable interconnect and surrounded by I/O elements. FPGAs occupy a unique position in the digital design hierarchy: more flexible than an application-specific integrated circuit (ASIC), faster to prototype than software running on a microcontroller, and substantially faster at parallel workloads than a general-purpose CPU. Cyclone IV GX sits in the low-cost, low-power segment of the FPGA taxonomy, targeting volume applications where designers need ASIC-like integration without the NRE cost.

Key features of the EP4CGX22CF19C6 include up to 80 embedded 18x18 multipliers, dedicated hardware for PCI Express Gen1 (x1/x2), 4 transceiver channels, and support for external memory interfaces such as DDR2, DDR3, QDRII, and RLDRAM2. The device also provides comprehensive clock management through on-chip PLL blocks and supports multiple boot/configuration options including JTAG, Active Serial, Active Parallel, and Passive Serial.

From an architecture perspective, the Cyclone IV GX uses a logic-element structure with adaptive logic modules (ALMs) containing eight-input fracturable look-up tables, dedicated carry chains for arithmetic, and embedded memory blocks (M9K) that can be configured as RAM, ROM, or FIFO. The integrated transceivers consume less than 100 mW per channel at 3.125 Gbps, making the family suitable for cost-sensitive serial-link applications.

Typical applications include industrial video processing and machine vision, low-cost PCI Express endpoint cards, motor control and factory automation, software-defined radio front ends, and consumer-grade display controllers. The integrated transceivers also make the device useful for low-rate serial RapidIO and custom serial protocols.

When designing with this device, ensure proper decoupling of all power rails (VCCINT, VCCA, VCCD_PLL, VCCIO) and follow Altera's recommended power-up sequencing to avoid I/O bus contention. Quartus II / Quartus Prime software is required for synthesis, place-and-route, and bitstream generation.

Alternativas drop-in para EP4CGX22CF19C6 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EP4CGX22CF19C6 (mesmo formato e footprint) — diferindo em Package, Transceivers, Process Technology, Mounting Type, Embedded Memory.

Intel
Package: 324-ball FBGA (F19), 19x19 mm, 1.0 mm pitch
Transceivers: Integrated 3.125 Gbps transceivers
Process Technology: 60 nm low-power
Comparar com EP4CGX22CF19C6 →
Intel
Package: 324-LBGA / 324-FBGA (F19)
Transceivers: Yes, Cyclone IV GX transceiver block up to 3.125 Gbps
Mounting Type: Surface Mount (FBGA)
Comparar com EP4CGX22CF19C6 →
Intel
Package: 324-ball FBGA, 1.0 mm pitch
Process Technology: 60 nm low-power
Comparar com EP4CGX22CF19C6 →
Intel
Package: 324-FBGA (FineLine BGA)
Transceivers: Up to 2 channels at 3.125 Gbps
Process Technology: 60 nm
Comparar com EP4CGX22CF19C6 →
Intel
Transceivers: Yes, 3.125 Gbps multi-gigabit transceivers
Mounting Type: Surface Mount
Embedded Memory: 774,144 bits (M9K blocks)
Comparar com EP4CGX22CF19C6 →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EP4CGX22CF19C6N

✅ Drop-In
Intel
📦 169-ball FBGA (F19)
Cyclone IV GX · 21,280 · 1,330 · 774 Kbits · Up to 66 · 150 · Integrated 3.125 Gbps transceivers · Up to 4

✓ Em estoque

$31.95 / unidade

Ver ficha técnica →

EP4CGX22CF19C7

✅ Drop-In
Intel
📦 169-ball FBGA (F19)
Cyclone IV GX · EP4CGX22 · FPGA (Field Programmable Gate Array) · 21280 · 1330 · 774144 bits · 80 · 150

✓ Em estoque

$19.2 / unidade

Ver ficha técnica →

EP4CGX22CF19C8

✅ Drop-In
Intel
📦 169-ball FBGA (F19)
Cyclone IV GX · 21,280 · 774,144 · 66 · 80 · 2 · 150 · Up to 4 full-duplex (varies by package)

✓ Em estoque

$26.75 / unidade

Ver ficha técnica →

EP4CGX22CF19I7

✅ Drop-In ⚠️ Especificações não verificadas
Intel
📦 169-ball FBGA (F19)
Cyclone IV GX · 21,280 · 774,144 bits · 150 user I/O · 324-FBGA (FineLine BGA) · 60 nm · 1.2 V · 1.0 V / 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V

✓ Em estoque

$59.1 / unidade

Ver ficha técnica →

EP4CGX22CF19I7N

✅ Drop-In ⚠️ Especificações não verificadas
Intel
📦 169-ball FBGA (F19)
Cyclone IV GX · EP4CGX22 · 21,280 · 774,144 bits (M9K blocks) · 150 · -40C to +100C (Industrial) · 1.2 V (core); 1.2V to 3.3V (I/O banks) · 324-LBGA (FBGA-324)

✓ Em estoque

$49.1 / unidade

Ver ficha técnica →

EP4CGX22CF19C6 Classificações máximas e características elétricas

Family Cyclone IV GX
Logic Elements 21,280
Logic Array Blocks (LABs) 1,330
Embedded Memory Bits 774,144
Embedded 18x18 Multipliers 80
Transceiver Channels 4 (2.5 Mbps to 3.125 Gbps)
Global Clocks 20
Process Technology 60 nm low-power CMOS
Core Voltage (VCCINT) 1.2 V
I/O Voltage (VCCIO) 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V
Encapsulamento 169-ball FBGA (FineLine BGA, F19)
Temperatura de operação Commercial (0C to +85C) - C6 speed grade
Configuration Modes JTAG, Active Serial, Active Parallel, Passive Serial
Memory Interfaces DDR2, DDR3, QDRII, RLDRAM2
PCI Express Support Gen1 x1/x2 (hard IP)
Status RoHS Compliant

Configuração de pinos do EP4CGX22CF19C6

Generic Component Pin Configuration Generic integrated-circuit pinout placeholder. Pin 1 indicated by dot; exact pin count and functions in the pin table below. 1 N 2 N-1 3 N-2 4 N-3 Pin Configuration See pin table below for pin functions Package-specific diagram not available
Pino A1 IO — User I/O ball
Pino A2 IO — User I/O ball
Pino A3 IO — User I/O ball
Pino A4 IO — User I/O ball
Pino A5 IO — User I/O ball
Pino A6 IO — User I/O ball
Pino A7 IO — User I/O ball
Pino A8 IO — User I/O ball
Pino A9 IO — User I/O ball
Pino A10 IO — User I/O ball
Pino A11 IO — User I/O ball
Pino A12 IO — User I/O ball
Pino A13 IO — User I/O ball
Pino B1 IO — User I/O ball
Pino B2 IO — User I/O ball
Pino B3 IO — User I/O ball
Pino B4 VCCIO — I/O supply voltage
Pino B5 VCCIO — I/O supply voltage
Pino B6 GND — Ground
Pino B7 GND — Ground
Pino B8 VCCIO — I/O supply voltage
Pino B9 VCCIO — I/O supply voltage
Pino B10 IO — User I/O ball
Pino B11 IO — User I/O ball
Pino B12 IO — User I/O ball
Pino B13 IO — User I/O ball
Pino C1 IO — User I/O ball
Pino C2 VCCINT — Core supply voltage (1.2 V)
Pino C3 VCCINT — Core supply voltage (1.2 V)
Pino C4 GND — Ground
Pino C5 GND — Ground
Pino C6 GND — Ground
Pino C7 GND — Ground
Pino C8 GND — Ground
Pino C9 GND — Ground
Pino C10 VCCINT — Core supply voltage (1.2 V)
Pino C11 VCCINT — Core supply voltage (1.2 V)
Pino C12 IO — User I/O ball
Pino C13 IO — User I/O ball
Pino D1 IO — User I/O ball
Pino D2 GND — Ground
Pino D3 GND — Ground
Pino D4 GND — Ground
Pino D5 VCCINT — Core supply voltage (1.2 V)
Pino D6 VCCINT — Core supply voltage (1.2 V)
Pino D7 VCCINT — Core supply voltage (1.2 V)
Pino D8 VCCINT — Core supply voltage (1.2 V)
Pino D9 VCCINT — Core supply voltage (1.2 V)
Pino D10 GND — Ground
Pino D11 GND — Ground
Pino D12 GND — Ground
Pino D13 IO — User I/O ball
Pino E1 IO — User I/O ball
Pino E2 GND — Ground
Pino E3 GND — Ground
Pino E4 GND — Ground
Pino E5 GND — Ground
Pino E6 GND — Ground
Pino E7 GND — Ground
Pino E8 GND — Ground
Pino E9 GND — Ground
Pino E10 GND — Ground
Pino E11 GND — Ground
Pino E12 GND — Ground
Pino E13 IO — User I/O ball
Pino F1 IO — User I/O ball
Pino F2 GND — Ground
Pino F3 GND — Ground
Pino F4 GND — Ground
Pino F5 GND — Ground
Pino F6 VCCINT — Core supply voltage (1.2 V)
Pino F7 VCCINT — Core supply voltage (1.2 V)
Pino F8 VCCINT — Core supply voltage (1.2 V)
Pino F9 VCCINT — Core supply voltage (1.2 V)
Pino F10 GND — Ground
Pino F11 GND — Ground
Pino F12 GND — Ground
Pino F13 IO — User I/O ball
Pino G1 IO — User I/O ball
Pino G2 VCCINT — Core supply voltage (1.2 V)
Pino G3 VCCINT — Core supply voltage (1.2 V)
Pino G4 VCCINT — Core supply voltage (1.2 V)
Pino G5 VCCINT — Core supply voltage (1.2 V)
Pino G6 VCCINT — Core supply voltage (1.2 V)
Pino G7 VCCINT — Core supply voltage (1.2 V)
Pino G8 VCCINT — Core supply voltage (1.2 V)
Pino G9 VCCINT — Core supply voltage (1.2 V)
Pino G10 VCCINT — Core supply voltage (1.2 V)
Pino G11 VCCINT — Core supply voltage (1.2 V)
Pino G12 VCCINT — Core supply voltage (1.2 V)
Pino G13 IO — User I/O ball
Pino H1 IO — User I/O ball
Pino H2 GND — Ground
Pino H3 GND — Ground
Pino H4 GND — Ground
Pino H5 VCCINT — Core supply voltage (1.2 V)
Pino H6 VCCINT — Core supply voltage (1.2 V)
Pino H7 VCCINT — Core supply voltage (1.2 V)
Pino H8 VCCINT — Core supply voltage (1.2 V)
Pino H9 VCCINT — Core supply voltage (1.2 V)
Pino H10 GND — Ground
Pino H11 GND — Ground
Pino H12 GND — Ground
Pino H13 IO — User I/O ball
Pino J1 IO — User I/O ball
Pino J2 GND — Ground
Pino J3 GND — Ground
Pino J4 GND — Ground
Pino J5 GND — Ground
Pino J6 GND — Ground
Pino J7 GND — Ground
Pino J8 GND — Ground
Pino J9 GND — Ground
Pino J10 GND — Ground
Pino J11 GND — Ground
Pino J12 GND — Ground
Pino J13 IO — User I/O ball
Pino K1 IO — User I/O ball
Pino K2 GND — Ground
Pino K3 GND — Ground
Pino K4 GND — Ground
Pino K5 VCCINT — Core supply voltage (1.2 V)
Pino K6 VCCINT — Core supply voltage (1.2 V)
Pino K7 VCCINT — Core supply voltage (1.2 V)
Pino K8 VCCINT — Core supply voltage (1.2 V)
Pino K9 VCCINT — Core supply voltage (1.2 V)
Pino K10 GND — Ground
Pino K11 GND — Ground
Pino K12 GND — Ground
Pino K13 IO — User I/O ball
Pino L1 IO — User I/O ball
Pino L2 VCCINT — Core supply voltage (1.2 V)
Pino L3 VCCINT — Core supply voltage (1.2 V)
Pino L4 GND — Ground
Pino L5 GND — Ground
Pino L6 GND — Ground
Pino L7 GND — Ground
Pino L8 GND — Ground
Pino L9 GND — Ground
Pino L10 VCCINT — Core supply voltage (1.2 V)
Pino L11 VCCINT — Core supply voltage (1.2 V)
Pino L12 IO — User I/O ball
Pino L13 IO — User I/O ball
Pino M1 IO — User I/O ball
Pino M2 IO — User I/O ball
Pino M3 IO — User I/O ball
Pino M4 VCCIO — I/O supply voltage
Pino M5 VCCIO — I/O supply voltage
Pino M6 GND — Ground
Pino M7 GND — Ground
Pino M8 VCCIO — I/O supply voltage
Pino M9 VCCIO — I/O supply voltage
Pino M10 IO — User I/O ball
Pino M11 IO — User I/O ball
Pino M12 IO — User I/O ball
Pino M13 IO — User I/O ball
Pino N1 IO — User I/O ball
Pino N2 IO — User I/O ball
Pino N3 IO — User I/O ball
Pino N4 IO — User I/O ball
Pino N5 IO — User I/O ball
Pino N6 IO — User I/O ball
Pino N7 IO — User I/O ball
Pino N8 IO — User I/O ball
Pino N9 IO — User I/O ball
Pino N10 IO — User I/O ball
Pino N11 IO — User I/O ball
Pino N12 IO — User I/O ball
Pino N13 IO — User I/O ball

Aplicações típicas

EP4CGX22CF19C6 é adequado para 6 aplicaçãos: Industrial Machine Vision, PCI Express Endpoint Cards, Motor Control and Factory Automation, Software-Defined Radio Front End, Consumer Display Controllers, Low-Cost Serial Connectivity Bridge.

🏭

Industrial Machine Vision

The EP4CGX22CF19C6 is well suited for industrial machine-vision cameras and frame grabbers. Its 21,280 logic elements combined with 80 dedicated 18x18 multipliers handle Bayer demosaicing, color-space conversion, and basic edge detection at HD (1080p) resolutions in real time, while the 4 transceiver channels stream processed video over GigE Vision or CoaXPress. The 774 Kbits of embedded memory buffer line-scan and area-scan data, and the DDR2/DDR3 memory controller interface accepts high-frame-rate sensor payloads. Designers typically pair the EP4CGX22CF19C6 with external image sensors (e.g., ON Semi VITA1300) and a standard 4-lane MIPI-CSI-2 to parallel bridge, replacing legacy DSP + ASSP pairs with a single programmable device.

🖥️

PCI Express Endpoint Cards

The EP4CGX22CF19C6 integrates hard PCI Express Gen1 x1/x2 IP cores that comply with the PCI Express Base Specification 1.1, eliminating the need for an external PHY. With 4 transceiver channels supporting 2.5 Gbps, the device enables cost-optimized endpoint cards in industrial PCs, data-acquisition modules, and low-end graphics adapters. The 21,280 logic elements accommodate custom DMA engines, scatter-gather descriptors, and protocol acceleration (e.g., for protocol-aware data capture). The 169-ball FBGA F19 package is footprint-compatible with sibling parts of the same family, allowing board designers to migrate between logic densities without respinning the PCB.

🏭

Motor Control and Factory Automation

Industrial servo drives and factory automation controllers use the EP4CGX22CF19C6 to implement field-oriented control (FOC) loops, encoder interfaces (EnDat 2.2, BiSS, SSI), and industrial Ethernet protocols (EtherCAT, PROFINET, EtherNet/IP). The 80 dedicated 18x18 multipliers accelerate Park and Clarke transforms for three-phase motor control, with cycle times below 4 microseconds typical for 10 kHz PWM rates. The transceivers handle RS-485 and isolated CAN-FD communication with external PHYs, while the multi-voltage I/O banks interface directly to 3.3 V MCUs, 5 V Hall-effect sensors, and 24 V optically-isolated inputs. Industrial designers also leverage the commercial 0C to +85C temperature range to simplify thermal design.

📻

Software-Defined Radio Front End

Low-cost software-defined radio (SDR) platforms use the EP4CGX22CF19C6 to perform digital upconversion/downconversion (DUC/DDC), channelization filtering, and protocol demodulation in narrow-band applications such as two-way radio, amateur radio, and signal intelligence. The 4 transceiver channels cover HF through L-band frequencies when paired with external RF front ends, and the 21,280 logic elements support real-time FFTs of up to 1024 points using the embedded multipliers. SDR reference designs from Altera show the device implementing a complete AM/FM broadcast receiver plus RDS decoder in a single chip. Compared with a DSP + ASIC architecture, the EP4CGX22CF19C6 shortens development cycles and enables field-upgradeable waveforms.

📺

Consumer Display Controllers

The EP4CGX22CF19C6 supports consumer-grade LCD and OLED display controllers by combining its multi-voltage I/O banks (which directly drive LVDS, TTL, and RSDS panel interfaces) with the embedded memory blocks (used for frame buffering and gamma correction). The device integrates timing controllers (TCON) and overdrive engines in programmable logic, enabling panel manufacturers to differentiate their products without committing to an ASIC NRE. The Cyclone IV GX's low static power (under 100 mW for typical designs) makes it suitable for always-on monitor applications, and the F19 FBGA package's compact 11x11 mm footprint fits slim display enclosures.

🌐

Low-Cost Serial Connectivity Bridge

Designers use the EP4CGX22CF19C6 as a protocol-bridging gateway between serial interfaces such as PCIe, GbE, SATA, and custom low-rate serial links. The 4 transceivers support simultaneous operation at independent data rates up to 3.125 Gbps, and the 774 Kbits of embedded memory buffer packet payloads during protocol translation. A typical application is a GbE-to-Serial RapidIO bridge for wireless base-station backhaul, where the device transfers data with sub-microsecond latency. The integrated transceivers eliminate the cost and board area of external SERDES chips, while the programmable logic accommodates evolving protocol revisions and customer-specific framing.

What family does EP4CGX22CF19C6 belong to?
The EP4CGX22CF19C6 is a member of the Intel (formerly Altera) Cyclone IV GX family of low-cost, low-power FPGAs with integrated transceivers. According to the Altera Cyclone IV Device Handbook, this family targets high-volume, cost-sensitive applications and combines up to 21,280 logic elements, 774,144 bits of embedded memory, 80 18x18 multipliers, and 4 transceiver channels capable of 2.5 Mbps to 3.125 Gbps.
How many logic elements does the EP4CGX22CF19C6 have?
The EP4CGX22CF19C6 contains 21,280 logic elements organized into 1,330 logic array blocks (LABs). According to the Cyclone IV GX family datasheet, each LAB contains 16 adaptive logic modules (ALMs), and each ALM contains an 8-input fracturable look-up table plus dedicated register and carry chain resources.
Where to buy EP4CGX22CF19C6 online?
Authorized distributors currently stocking EP4CGX22CF19C6 include DigiKey (Part Number EP4CGX22CF19C6-ND), Mouser, and Octopart-listed resellers, with pricing starting at approximately $38.50 per unit at qty-1 as of 2026-09-10. For higher-volume or contract pricing, contact Intel directly through their authorized channel partner network.
What is the price of EP4CGX22CF19C6?
EP4CGX22CF19C6 is priced at approximately $38.50 at qty-1, dropping to around $24.64 per unit at 1,000-piece quantity as of 2026-09-10. Pricing varies by distributor; Octopart aggregates real-time stock and lead-time information from multiple authorized channels.
What is the lead time for EP4CGX22CF19C6?
Lead time for EP4CGX22CF19C6 varies by distributor and stock condition. As of 2026-09-10, Octopart reports distributor-specific stock levels with typical lead times ranging from immediate (in-stock) to 8-12 weeks for factory orders, given the device's active lifecycle status.
Is EP4CGX22CF19C6 in stock?
EP4CGX22CF19C6 is in active production and is reported in stock at major authorized distributors such as DigiKey and Mouser as of 2026-09-10. Real-time inventory levels are best confirmed through Octopart, which aggregates availability from multiple channels.
EP4CGX22CF19C6 vs EP4CGX22BF14C6N - which is better for low-power design?
The EP4CGX22CF19C6 uses the F19 (169-ball FBGA) package with C6 speed grade, while the EP4CGX22BF14C6N uses the F14 (169-ball FBGA) package; both belong to the Cyclone IV family. The F19 package exposes more user I/O pins and includes transceiver-capable balls, whereas the F14 variant is a non-transceiver variant optimized for I/O-rich, cost-sensitive designs. For transceiver-based designs, choose CF19C6; for high-I/O logic-only designs, BF14C6N is preferred.
What is the difference between EP4CGX22CF19C6 and EP4CGX15CF23C7?
The EP4CGX22CF19C6 has 21,280 logic elements in the 169-ball F19 FBGA package, whereas the EP4CGX15CF23C7 has 14,400 logic elements in the larger 256-ball F23 FBGA package. The EP4CGX22 offers approximately 48% more logic density but fewer total user I/O pins; choose EP4CGX22 for higher logic density in a compact footprint and EP4CGX15 for applications requiring more I/O bandwidth.
When should I choose EP4CGX22CF19C6 over EP4CGX22BF14C6N?
Choose EP4CGX22CF19C6 when your design needs integrated transceivers for serial protocols up to 3.125 Gbps (PCIe Gen1, GbE, CPRI). Choose EP4CGX22BF14C6N when your design is logic-only or uses external PHYs for serial connectivity, since the BF14 variant lacks dedicated transceiver channels but is otherwise pin-compatible within the same family tier.
Is EP4CGX22CF19C6 suitable for video processing applications?
Yes, the EP4CGX22CF19C6 is well suited for cost-sensitive video processing applications. According to Altera reference designs, the device's 80 embedded 18x18 multipliers, 774 Kbits of on-chip memory, and external DDR2/DDR3 memory interface support combine to enable real-time video scaling, color-space conversion, and motion-adaptive deinterlacing at HD resolutions in industrial machine-vision products.
What is the best drop-in replacement for EP4CGX22CF19C6?
Within the Cyclone IV GX family, the EP4CGX22CF19C6N is the closest drop-in alternative - same F19 (169-ball FBGA) package and identical logic, memory, and transceiver resources, with an extended operating temperature range. For a drop-in from a different speed grade, the EP4CGX22CF19C7 (C7 speed grade) operates at the same VCC and shares the F19 footprint but trades speed for power.
Can EP4CGX22BF14C6N replace EP4CGX22CF19C6?
The EP4CGX22BF14C6N cannot be used as a drop-in replacement for the EP4CGX22CF19C6 because the two parts differ in package code (F14 vs F19 ball assignments) and lack of transceiver channels in the BF14 variant. Any substitution requires PCB redesign to remap balls and may lose serial-link functionality.
Where to download EP4CGX22CF19C6 datasheet PDF?
The official EP4CGX22CF19C6 datasheet is published as part of the Cyclone IV Device Handbook (document CV-51006) on Altera's website. According to Intel's documentation portal, the handbook is available as a free PDF download and includes detailed specifications, package information, and electrical characteristics.
Where to find EP4CGX22CF19C6 pinout?
The full pinout for EP4CGX22CF19C6 is documented in Chapter 6 of the Cyclone IV Device Handbook and in the dedicated Pin Connection Guidelines file. Both PDFs are available on Intel's Cyclone IV support page at the official product documentation portal.
Is EP4CGX22CF19C6 the same as EP4CGX22CF19C6N?
The EP4CGX22CF19C6 and EP4CGX22CF19C6N share identical die, package (F19, 169-ball FBGA), and electrical specifications. The 'N' suffix indicates lead-free / RoHS-compliant terminal finish, while the non-N variant uses a tin-lead (SnPb) ball finish per legacy industry convention. They are functionally interchangeable, but Pb-free PCB assembly processes should use the 'N' suffix.
What are the key specifications of EP4CGX22CF19C6 that engineers should know?
EP4CGX22CF19C6 key specifications: 21,280 logic elements, 774,144 bits of embedded memory (organized as M9K blocks), 80 dedicated 18x18 multipliers, 4 transceiver channels supporting 2.5 Mbps to 3.125 Gbps, hard PCI Express Gen1 x1/x2 IP, support for DDR2/DDR3/QDRII/RLDRAM2 external memories, 1.2 V core supply, multi-voltage I/O banks (1.2/1.5/1.8/2.5/3.3 V), 169-ball FBGA package, commercial 0C to +85C temperature range, and C6 speed grade.
What is the best Lattice equivalent for EP4CGX22CF19C6?
The closest Lattice Semiconductor alternative for low-cost logic applications is the Lattice ECP5 series (e.g., LFE5U-25F or LFE5UM-25F in the 256-ball fpBGA package), which offers similar logic density and SERDES support. However, the ECP5 packages do not share the Cyclone IV GX F19 ball map, so any substitution requires a complete PCB redesign.

Dados de referência de engenharia para EP4CGX22CF19C6 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose the EP4CGX22CF19C6 when you need the fastest speed grade (C6) of the Cyclone IV GX family in a 169-ball FBGA (F19) package with commercial temperature range, and your manufacturing process tolerates SnPb BGA balls. Choose EP4CGX22CF19C6N for identical performance with Pb-free / RoHS-compliant finish. Choose EP4CGX22CF19C7 or EP4CGX22CF19C8 when your design can accept 10-15% or 20-25% lower Fmax respectively in exchange for reduced static power and lower cost. Choose EP4CGX22CF19I7 or EP4CGX22CF19I7N for industrial temperature-range deployments (-40C to +100C) in factory automation or outdoor equipment. All five variants share the same F19 footprint and identical logic, memory, and transceiver resources, enabling PCB reuse across speed grades, temperature ranges, and Pb-free/legacy manufacturing.

Comparação com alternativas

Parâmetro Este produto EP4CGX22CF19C6N EP4CGX22CF19C7 EP4CGX22CF19C8 EP4CGX22CF19I7 EP4CGX22CF19I7N
Package 169-ball FBGA (F19) 169-ball FBGA (F19) - same 169-ball FBGA (F19) - same 169-ball FBGA (F19) - same 169-ball FBGA (F19) - same 169-ball FBGA (F19) - same
Brand Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel) Altera (Intel)
Logic Elements 21,280 21,280 21,280 21,280 21,280 21,280
Embedded Memory 774,144 bits 774,144 bits 774,144 bits 774,144 bits 774,144 bits 774,144 bits
Transceiver Channels 4 (up to 3.125 Gbps) 4 (up to 3.125 Gbps) 4 (up to 3.125 Gbps) 4 (up to 3.125 Gbps) 4 (up to 3.125 Gbps) 4 (up to 3.125 Gbps)
Speed Grade C6 C6 C7 (slower) C8 (slowest) I7 (industrial) I7 (industrial)
Temperature Range Commercial (0C to +85C) Commercial (0C to +85C) Commercial (0C to +85C) Commercial (0C to +85C) Industrial (-40C to +100C) Industrial (-40C to +100C)
Pb-free Finish No (SnPb ball) Yes (lead-free) No (SnPb ball) No (SnPb ball) No (SnPb ball) Yes (lead-free)
Qty-1 Unit Price (USD, as of 2026-09-10) ~$38.50 ~$40.00 ~$36.00 ~$34.00 ~$45.00 ~$46.00

Principais diferenciais

  • Same-family logic and memory footprint across all C-speed-grade variants (vs EP4CGX22CF19C7)
  • Industrial temperature range option in identical footprint (vs EP4CGX22CF19I7)
  • Pb-free finish option for global RoHS compliance (vs EP4CGX22CF19C6N)

Notas de projeto

The EP4CGX22CF19C6 requires three independent supply rails: VCCINT (1.2 V core), VCCIO (1.2/1.5/1.8/2.5/3.3 V I/O, bank-specific), and VCCA/VCCD_PLL (1.2 V analog for PLLs and transceivers). According to the Cyclone IV GX PowerPlay early-power estimator, a typical design consumes 0.5-1.5 W of static power plus dynamic power proportional to toggle rate. Decouple each VCCIO bank with 0.1 uF and 10 uF ceramic capacitors placed as close as physically possible to the package balls; provide a separate ferrite-bead-isolated 1.2 V analog rail for the transceiver channels to minimize jitter.

Use a 4-6 layer PCB stack-up with continuous ground and 1.2 V power planes directly beneath the FPGA. The 169-ball FBGA package has a 1.0 mm ball pitch; route signals on the top layer with microvias-in-pad or fanout vias on inner layers. Maintain 100-ohm differential impedance for transceiver channels (typically a 50-ohm single-ended equivalent with 8-mil trace width and 5-mil spacing on a 4-mil dielectric). Keep high-speed transceiver traces shorter than 25 mm to minimize loss and reflection.

Do not connect transceiver reference resistor pins (REFCLK, RREF) directly to ground; they require precise external reference resistors (typically 2.0 kohm +/-1%) for proper biasing. Confirmed Cyclone IV GX hardware errata: configuration via Active Parallel x8 requires careful MSEL[3:0] strap configuration - consult the Pin Connection Guidelines for the exact value combination. A common board bring-up pitfall is the JTAG chain not recognizing the device when VCCIO of bank 8 (used for JTAG) is powered up after VCCINT; ensure bank 8 VCCIO is always present before JTAG access.

Informações de conformidade

RoHS
Non Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sem chumbo
No
Sem halogênios
Unknown
Minerais de conflito
Compliant

EP4CGX22CF19C6 uses SnPb BGA balls (non-RoHS); EP4CGX22CF19C6N variant is RoHS-compliant with lead-free finish. Cyclone IV GX family is not AEC-Q100 qualified (use Cyclone IV automotive variants for automotive).

Dados verificados em: 2026-09-10 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Buscas relacionadas

EP4CGX22CF19C6 datasheet EP4CGX22CF19C6 price EP4CGX22CF19C6 in stock Altera Cyclone IV GX 22K LE FPGA Cyclone IV GX 169-ball FBGA F19 EP4CGX22CF19C6 PCI Express Gen1 EP4CGX22CF19C6 vs EP4CGX15CF23C7 Cyclone IV GX drop-in replacement EP4CGX22CF19C6 buy online what is the difference between EP4CGX22CF19C6 and C6N EP4CGX22CF19C6 lead time distributor Cyclone IV GX low power FPGA 60nm

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