Intel

EP4CGX30CF19C6 - Cyclone IV GX FPGA, 29K LE, 150 I/O | Intel

N.º da peça: EP4CGX30CF19C6 ✓ Ativo

Em estoque Enviado em 1 a 3 dias úteis

1.2 V Vdss 324-LBGA (F19, 19 mm) Package C6 Speed

A partir de $20.75 USD / unidade

MOQ: 1 |

Preço atualizado: 2026-09-10

Preços por volume

Qtd.	Preço unitário	Total
1	$32.5	$32,50
10	$29.85	$298,50
100	$26.4	$2.640,00
500	$23.1	$11.550,00
1.000	$20.75	$20.750,00

ℹ️ Todos os preços estão em USD

Ver datasheet (PDF) Ver alternativas

Quantidade

EP4CGX30CF19C6 Visão geral

The Intel EP4CGX30CF19C6 is a Cyclone IV GX field-programmable gate array (FPGA) built on a 60 nm low-power process, integrating 29,440 logic elements, 1,105,920 bits of embedded RAM, and 150 user I/Os in a 324-ball fine-pitch BGA (F19, 19 mm). It supports up to four integrated 3.125 Gbps transceivers and hardware multipliers for cost-sensitive serial connectivity and DSP applications, while operating from a 1.2 V core supply with commercial 0 to +70 C temperature grade.

A Field-Programmable Gate Array (FPGA) is a reprogrammable semiconductor that engineers configure after manufacture to implement custom digital logic, parallel processing pipelines, and high-speed serial interfaces. FPGAs sit in the programmable-logic tier of the broader semiconductor taxonomy: FPGA -> programmable logic device (PLD) -> logic IC -> integrated circuit (IC). The Cyclone IV GX family specifically targets low-power, transceiver-rich applications such as industrial video bridging, motor control, and wireless backhaul, balancing unit cost against the higher-density Stratix and lower-cost Cyclone IV E variants.

Key features include 1,840 LABs/CLBs, 66 embedded 18x18 multipliers, 4 transceivers at up to 3.125 Gbps, support for PCI Express Gen1 (x1/x2) hard IP blocks, and 4 PLLs. The device family offers flexible configuration via JTAG, Active Serial, or Passive Parallel modes, and supports 1.05 Mbit of dedicated configuration-related internal memory.

Architecture-wise the device combines an LUT-based fabric with distributed M9K memory blocks (108 in total), dedicated DSP blocks, and hard IP for PCIe and transceivers that offload common I/O tasks from the fabric. This mix lets designers hit aggressive power and cost targets without sacrificing serial bandwidth, and the same silicon scales across the EP4CGX30/50/75/110/150 family members by simply changing interconnect density and package.

Typical applications include industrial machine vision, broadcast video processing, low-cost PCIe endpoint cards, motor control drives, and wireless baseband pre-processing. The Cyclone IV GX family is well suited to designs that need a few fast serial lanes without paying for full transceiver-heavy Stratix silicon.

When designing, allocate at least one transceiver reference clock per quad, follow Intel's PCB layout guidelines for the F19 BGA (matched-length differential routing, controlled-impedance vias), and verify Quartus Prime support for the chosen speed grade. Power estimation should start with the PowerPlay Early Power Estimator before PCB commitment.

This page synthesizes distributor stock, drop-in Cyclone IV GX and Cyclone V alternatives, and practical design notes not found in the manufacturer datasheet alone.

Alternativas drop-in para EP4CGX30CF19C6 — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.

Variantes desta série

Modelos da mesma série compatíveis como drop-in com EP4CGX30CF19C6 (mesmo formato e footprint) — diferindo em Package, Operating Temperature, Process Technology, PLLs, Transceivers.

EP4CGX30CF19C7

Intel

Package: 324-ball FBGA (F19), 19 x 19 mm, 1.0 mm pitch

Operating Temperature: 0 C to +85 C (Commercial)

Process Technology: 60 nm low-k CMOS

Comparar com EP4CGX30CF19C6 →

EP4CGX30CF19C7N

Intel

Package: 324-ball FBGA (F19)

Operating Temperature: 0 C to +85 C (commercial)

Process Technology: 60 nm low-power

Comparar com EP4CGX30CF19C6 →

EP4CGX30CF19C8

Intel

Package: 324-FBGA (FineLine BGA), 19 mm body

Operating Temperature: -40C to +100C (TJ)

PLLs: 4 (general-purpose)

Comparar com EP4CGX30CF19C6 →

EP4CGX30CF19C8N

Altera

Package: 324-ball FBGA, 19x19 mm, 1.0 mm pitch

Process Technology: 60 nm low-power

Transceivers: 4 channels, up to 3.125 Gbps

Comparar com EP4CGX30CF19C6 →

EP4CGX30CF19I6N

Intel

Package: FBGA-324 (Plastic, 19 mm x 19 mm)

Operating Temperature: -40C to +100C (industrial)

Transceivers: Up to 8 channels, 3.125 Gbps

Comparar com EP4CGX30CF19C6 →

Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:

EP4CGX30CF19C7N

✅ Drop-In

Intel

📦 324-LBGA (F19, 19 mm)

Cyclone IV GX · 29,440 · 1,105,920 · 66 · 66 · 150 · 4 channels, up to 3.125 Gbps · 8

✓ Em estoque

$68.95 / unidade

Ver ficha técnica →

EP4CGX30CF19C7

✅ Drop-In

Intel

📦 324-LBGA (F19, 19 mm)

Cyclone IV GX · EP4CGX30 · EP4CGX30CF19C7 · 29,440 · 1,840 · 1,105,920 bits · 66 · 150

✓ Em estoque

$82 / unidade

Ver ficha técnica →

EP4CGX30CF19C8

✅ Drop-In

Intel

📦 324-LBGA (F19, 19 mm)

Cyclone IV GX · Cyclone IV GX · 29,440 · 1,105,920 bits · 66 · 150 · Up to 8 channels @ 3.125 Gbps

✓ Em estoque

$52.4 / unidade

Ver ficha técnica →

EP4CGX30CF19I6

✅ Drop-In ⚠️ Especificações não verificadas

📦 324-LBGA (F19, 19 mm)

same F19 324-ball footprint, industrial temperature grade 40 C to +100 C, C6 speed; pin-compatible drop-in

📋 Alternativa de referência (fora do catálogo)

EP4CGX30CF19C8N

✅ Drop-In ⚠️ Especificações não verificadas

Altera

📦 324-LBGA (F19, 19 mm)

Cyclone IV GX · 29,440 · 1,105,920 · 66 · 66 · 150 · 4 channels, up to 3.125 Gbps · 2 (x1/x2, Gen1)

✓ Em estoque

$24.6 / unidade

Ver ficha técnica →

EP4CGX30CF19C6 Classificações máximas e características elétricas

Family	Cyclone IV GX
Logic Elements	29,440 LE
LABs/CLBs	1,840
Total RAM Bits	1,105,920 bits
Number of I/Os	150
Embedded Multipliers (18x18)	66
PLLs	4
Operating Supply Voltage (Core)	1.2 V
Process Technology	60 nm
Encapsulamento / Caixa	324-LBGA (F19, 19 mm)
Estilo de montagem	SMD/SMT
Temperatura de operação	0 C to +70 C (Commercial)
Speed Grade	C6

Configuração de pinos do EP4CGX30CF19C6

Pino A1	I/O — Bank 8 general purpose I/O
Pino A2	I/O — Bank 8 general purpose I/O
Pino A3	I/O — Bank 8 general purpose I/O
Pino A4	I/O — Bank 8 general purpose I/O
Pino A5	I/O — Bank 8 general purpose I/O
Pino A6	I/O — Bank 8 general purpose I/O
Pino A7	I/O — Bank 8 general purpose I/O
Pino A8	I/O — Bank 8 general purpose I/O
Pino A9	I/O — Bank 8 general purpose I/O
Pino A10	I/O — Bank 8 general purpose I/O
Pino A11	I/O — Bank 8 general purpose I/O
Pino A12	VCCIO8 — Bank 8 I/O supply
Pino B1	I/O — Bank 8 general purpose I/O
Pino B2	I/O — Bank 8 general purpose I/O
Pino B3	I/O — Bank 8 general purpose I/O
Pino B4	I/O — Bank 8 general purpose I/O
Pino B5	I/O — Bank 8 general purpose I/O
Pino B6	I/O — Bank 8 general purpose I/O
Pino B7	I/O — Bank 8 general purpose I/O
Pino B8	I/O — Bank 8 general purpose I/O
Pino B9	I/O — Bank 8 general purpose I/O
Pino B10	I/O — Bank 8 general purpose I/O
Pino B11	VCCINT — Core supply 1.2 V
Pino B12	GND — Ground

Aplicações típicas

EP4CGX30CF19C6 é adequado para 6 aplicaçãos: Industrial Machine Vision, PCIe Endpoint Card, Motor Control and Industrial Drive, Broadcast Video Processing, Wireless Baseband Pre-Processing, Test & Measurement Instrumentation.

🏭

Industrial Machine Vision

The EP4CGX30CF19C6 fits industrial machine vision because its 29,440 logic elements can host Camera Link, CoaXPress, or GigE Vision image processing pipelines while the 4 transceivers feed raw data into the fabric at line rate. Designers place external SDRAM next to the FPGA for frame buffering, then implement Bayer demosaicing, defect detection, and compression in the DSP blocks. The 1.2 V core plus dedicated PLL support lets the part run the image sensor at fixed pixel clocks while a second PLL drives an Ethernet PHY. Compared with discrete ASSP vision processors, the FPGA offers deterministic latency critical for inline quality inspection. Ensure the PCB keeps 100 ohm differential pairs matched for the transceiver channels.

Recomendado

🖥️

PCIe Endpoint Card

The EP4CGX30CF19C6 includes a hard PCIe Gen1 x1/x2 endpoint block, so designers can build a low-cost PCIe add-in card without consuming soft logic for the PHY. With 29,440 logic elements available, the FPGA can implement a custom DMA engine plus driver-side protocol logic on the fabric, while 4 transceivers reserve lanes for PCIe plus an upstream high-speed link. Commercial temperature grade suits desktop and server PCIe slots. A typical layout places the PCIe edge connector traces within 250 mil of the FPGA transceiver pins per Intel's PCIe design guide. The 1105920-bit embedded RAM supports packet buffers without external SSRAM.

Recomendado

EP4CGX30BF14I7N · Intel EP4CGX22CF19C8 · Intel

🏭

Motor Control and Industrial Drive

Motor control drives benefit from the EP4CGX30CF19C6 because the FPGA fabric handles high-rate field-oriented control (FOC) loops while the dedicated PLLs generate synchronized PWM clocks. With 66 embedded 18x18 multipliers, the design can implement space-vector modulation, SVPWM, and observer algorithms in hardware for sub-microsecond loop times. The 4 transceivers feed encoder protocols like EnDat 2.2 or BiSS C over LVDS, and 150 I/Os drive gate-driver signals and over-current protection. Industrial-grade variants (EP4CGX30CF19I6) extend temperature to +100 C for cabinet-side mounting.

Recomendado

EP4CGX30CF19I6 (Industrial-temp variant for cabinet environments) EP4CGX50CF23C7 · Intel

📺

Broadcast Video Processing

Broadcast video routers and SDI gateways run on the EP4CGX30CF19C6 because the integrated transceivers support SDI rates up to 3 Gbps (SMPTE 424M) without external serializers. The 29K LEs are enough for cross-point switching, frame sync, and audio embedding for up to four SDI streams, with 108 M9K memory blocks buffering line-rate data. Designers pair the FPGA with external DDR2 SDRAM for full-frame store-and-forward. Quartus Prime supports SDI reference designs from Intel that drop into the F19 footprint. The commercial temperature grade is adequate for studio and headend installations.

Recomendado

EP4CGX30BF14C7N · Intel EP4CGX50CF23C8 · Intel

📡

Wireless Baseband Pre-Processing

In wireless backhaul and small-cell designs, the EP4CGX30CF19C6 acts as a baseband front-end with the 4 transceivers handling CPRI or OBSAI links to the radio unit. The 66 multipliers implement channel estimation, FFT/iFFT, and digital up/down conversion in the DSP blocks, while 1.1 Mbit of embedded RAM buffers symbol streams. With low static power from the 60 nm process, the FPGA fits thermally constrained PoE-powered enclosures. Designers should budget 4 watts typical for full-speed operation and provide at least 4 layers of 1 oz copper for heat spreading.

Recomendado

EP4CGX22CF19I7 · Intel EP4CGX30BF14I7N · Intel

🔧

Test & Measurement Instrumentation

Test equipment vendors use the EP4CGX30CF19C6 for protocol analyzers, logic analyzers, and protocol-aware BERT systems. The high I/O count (150) connects to physical-layer probes, and the transceivers feed the analyzer with up to 3.125 Gbps signals from serial protocols. The 1105920 bits of embedded RAM allow deep capture windows at full speed, while the 66 multipliers accelerate protocol decoding in real time. Commercial 0 to +70 C temperature works for lab equipment, and the F19 package simplifies integration into PXIe or USB-based instruments.

Recomendado

EP4CGX50CF23C7 · Intel EP4CGX30CF19I6 (Industrial-temp variant for portable instruments)

Resumo dos produtos recomendados

EP4CGX30BF14C6 Altera Usado em: Industrial Machine Vision EP4CGX50CF23C7 Intel Usado em: Industrial Machine Vision, Motor Control and Industrial Drive, Test & Measurement Instrumentation EP4CGX30BF14I7N Intel Usado em: PCIe Endpoint Card, Wireless Baseband Pre-Processing EP4CGX22CF19C8 Intel Usado em: PCIe Endpoint Card EP4CGX30CF19I6 Industrial-temp variant for cabinet environments Usado em: Motor Control and Industrial Drive, Test & Measurement Instrumentation EP4CGX30BF14C7N Intel Usado em: Broadcast Video Processing EP4CGX50CF23C8 Intel Usado em: Broadcast Video Processing EP4CGX22CF19I7 Intel Usado em: Wireless Baseband Pre-Processing

What is the operating voltage of EP4CGX30CF19C6?

The EP4CGX30CF19C6 operates from a 1.2 V core supply, with separate rails for I/O banks and analog transceiver blocks. According to the Cyclone IV GX device handbook, the device supports 1.0 V/1.2 V core operation and bank-specific VCCIO for mixed-voltage I/O. Designers must power all rails within the datasheet tolerance and respect power-on sequencing between VCCINT and VCCA, otherwise internal configuration logic may latch up.

How many logic elements does EP4CGX30CF19C6 have?

The EP4CGX30CF19C6 contains 29,440 logic elements (LEs) and 1,840 LABs/CLBs as confirmed by the manufacturer product page and the verified distributor data. This positions it as a mid-density member of the Cyclone IV GX family, suited to designs that need transceivers plus moderate logic capacity. For larger designs, the EP4CGX50/75/110/150 variants scale to 50K, 75K, 110K, and 150K LEs respectively in the same family.

What package does EP4CGX30CF19C6 use?

The EP4CGX30CF19C6 is supplied in a 324-ball FineLine BGA package, package code F19, with body size 19 mm. The F19 package exposes 150 user I/Os across the BGA footprint and supports the full transceiver count specified for this device. This is one of two package options for the EP4CGX30 family; the other is the 169-ball F14 BGA used by the BF14 variants.

How many transceivers does EP4CGX30CF19C6 have?

The EP4CGX30CF19C6 in the F19 package supports up to four 3.125 Gbps transceiver channels, suitable for PCIe Gen1 x1 or x2 endpoints and high-speed serial bridging. The transceiver blocks include hard PCIe Gen1 IP and dedicated reference-clock inputs. Designers must follow Intel's PCB layout guidelines for matched-length differential pairs and 100 ohm differential impedance.

What is the difference between EP4CGX30CF19C6 and EP4CGX30CF19C7?

The C6 and C7 suffixes denote different speed grades within the same Cyclone IV GX silicon. According to the Cyclone IV GX ordering information, C6 is a slower speed grade than C7, which means the C7 version achieves higher Fmax on internal logic at the cost of typically slightly higher unit price. The package, pinout, logic capacity, and transceiver count are identical, so the parts are pin-compatible drop-in replacements when migrating from C6 to C7 for timing closure.

What is the difference between EP4CGX30CF19C6 and EP4CGX30CF19C6N?

The trailing N in the ordering part number indicates a lead-free, RoHS-compliant variant, while the part without N may be offered in a non-RoHS finish or in legacy packaging. According to Intel product ordering information, both versions are pin-compatible and functionally identical on the silicon level. Choose the N suffix for new designs requiring RoHS compliance under EU Directive 2011/65/EU.

Where can I buy EP4CGX30CF19C6 and what is the lead time?

The EP4CGX30CF19C6 is stocked at major authorized distributors including DigiKey and Mouser, with stock shown as of 2026-09-10. According to distributor listings, the part typically ships same-day for small quantities from authorized inventory, while larger bulk orders (500+ units) follow factory or distributor warehouse lead times of 2 to 6 weeks. Contact your distributor for a real-time quote on production volumes.

What is the price of EP4CGX30CF19C6?

The EP4CGX30CF19C6 is priced at approximately 32.50 USD per unit at quantity 1 as of 2026-09-10, with volume pricing dropping to around 20.75 USD at 1,000 pieces. Pricing varies by distributor and current market demand, so we recommend requesting fresh quotes from DigiKey, Mouser, or your preferred distributor for production quantities. Octopart is also useful for cross-distributor comparison.

How does EP4CGX30CF19C6 compare to EP4CGX50CF23C7?

The EP4CGX50CF23C7 is the next step up in the Cyclone IV GX family, offering about 50,000 logic elements versus 29,440 in the EP4CGX30CF19C6, but in a larger F23 484-ball BGA package. They are not drop-in compatible due to the different package, so board layout cannot be reused. Choose EP4CGX30CF19C6 for F19-based designs that need lower logic density at lower cost, and EP4CGX50CF23C7 when you need the extra LEs and can rework the PCB.

Can EP4CGX30CF19C6 be replaced by EP4CGX30BF14C7?

The EP4CGX30BF14C7 is the BF14-package variant of the same 30K-LE Cyclone IV GX silicon, while EP4CGX30CF19C6 is the F19-package variant. Because BF14 and F19 are different BGA footprints with different pin counts (169 vs 324 balls), they are not pin-compatible drop-in replacements. Within the same F19 package, the closest drop-in alternatives are EP4CGX30CF19C7 (faster speed grade) and EP4CGX30CF19C8 (fastest speed grade).

Is EP4CGX30CF19C6 suitable for industrial control?

Yes, the EP4CGX30CF19C6 is well suited to industrial control applications such as motor control drives, factory automation controllers, and industrial sensor aggregation. The integrated transceivers support industrial protocols like Profibus, RS-485 over LVDS, and proprietary fast serial links, while the deterministic fabric handles real-time control loops. For harsher industrial temperature ranges, choose the EP4CGX30CF19I6 (industrial 40 C to +100 C) variant.

When should I choose EP4CGX30CF19C6 over a Cyclone V device?

Choose the EP4CGX30CF19C6 when your design needs PCIe Gen1 hard IP, a few 3.125 Gbps transceivers, and you prefer the mature Quartus II / Quartus Prime 13.0 toolchain. Migrate to Cyclone V (such as 5CGXFC5C6F23C6N) when you need 5 Gbps transceivers, lower power at the same logic density, or built-in hard memory controllers. Cyclone V is not pin-compatible with Cyclone IV GX, so this is a PCB redesign.

What is the best cross-brand equivalent for EP4CGX30CF19C6?

There is no true drop-in cross-brand equivalent for the EP4CGX30CF19C6 because the Cyclone IV GX family is Intel/Altera proprietary silicon with hard PCIe Gen1 and 3.125 Gbps transceivers that no competitor matches in the same F19 BGA footprint. Lattice ECP5 series (LFE5U-25F-7BG256C) and Xilinx Artix-7 (XC7A35T-1FTG256C) come closest in logic capacity, but require different packages, different transceivers, and a toolchain swap, so they are NOT drop-in compatible. Re-validate PCB layout, pinout, and IP libraries if migrating.

Where can I download the EP4CGX30CF19C6 datasheet PDF?

The official EP4CGX30CF19C6 datasheet PDF is available from the Intel Altera product page at the URL https://www.altera.com/products/fpga/cyclone/iv/gx/ep4cgx30-f19/EP4CGX30CF19C6, which links to the Cyclone IV GX device handbook covering all C6/C7/C8 speed grades and F19 package variants. The device handbook contains pinout tables, electrical characteristics, and configuration information. For register transfer level details consult the separate Cyclone IV GX device datasheet addendum.

Dados de referência de engenharia para EP4CGX30CF19C6 — comparação, orientação de projeto e informações de conformidade.

Guia de seleção

Choose EP4CGX30CF19C6 when your design fits the C6 speed grade, runs in commercial temperature (0 to +70 C), and targets the Cyclone IV GX family on a 324-ball F19 BGA. Migrate to EP4CGX30CF19C7 if timing closure fails on C6, to EP4CGX30CF19I6 for industrial temperature environments, or to EP4CGX30CF19C8N for the fastest speed grade plus lead-free compliance. Stay on the F19 package family for PCB layout reuse; stepping to BF14 (169-ball) or F23 (484-ball) requires a new PCB layout because the BGA footprint, ball count, and pin assignments differ. For new designs requiring 5 Gbps transceivers or lower static power, evaluate Cyclone V GX instead, accepting a full PCB redesign and toolchain transition.

Comparação com alternativas

Parâmetro	Este produto	EP4CGX30CF19C7N	EP4CGX30CF19C7	EP4CGX30CF19C8	EP4CGX30CF19I6	EP4CGX30CF19C8N
Brand	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)	Intel (Altera)
Package	324-LBGA (F19, 19 mm)	324-LBGA (F19, 19 mm) - same	324-LBGA (F19, 19 mm) - same	324-LBGA (F19, 19 mm) - same	324-LBGA (F19, 19 mm) - same	324-LBGA (F19, 19 mm) - same
Logic Elements	29,440	29,440	29,440	29,440	29,440	29,440
Speed Grade	C6	C7 (faster Fmax)	C7	C8 (fastest)	C6 industrial	C8 lead-free
Total RAM Bits	1,105,920	1,105,920	1,105,920	1,105,920	1,105,920	1,105,920
Embedded 18x18 Multipliers	66	66	66	66	66	66
Operating Temperature	0 C to +70 C (Commercial)	0 C to +70 C	0 C to +70 C	0 C to +70 C	-40 C to +100 C (Industrial)	0 C to +70 C

Principais diferenciais

Faster speed grade available in identical F19 package (vs EP4CGX30CF19C7)
Industrial temperature option in identical F19 package (vs EP4CGX30CF19I6)
Lead-free RoHS option available (vs EP4CGX30CF19C6N)

Notas de projeto

The 324-ball F19 FineLine BGA demands controlled-impedance 100 ohm differential routing for all four transceiver channels. Match intra-pair length to within 5 mils and pair-to-pair within 50 mils per Intel's Cyclone IV GX PCB layout guidelines. Use 4 or more PCB layers with a continuous ground plane under the device for return path integrity. BGA vias should be 12 mil drill with 24 mil pad for 1 oz copper process.

Estimated: core current for the EP4CGX30CF19C6 at 100% logic utilization with all 4 transceivers running at 3.125 Gbps draws approximately 1.3 A from the 1.2 V VCCINT rail, so designers should budget a 4 A capable switching regulator with at least 1.5x headroom. Add 100 uF bulk decoupling plus 0.1 uF and 0.01 uF ceramic decoupling per VCCINT ball group. Use the PowerPlay Early Power Estimator (EPE) spreadsheet for accurate design-specific numbers.

Reference clocks for the transceiver blocks (REFCLK0n/p, REFCLK1n/p) must be driven by a low-jitter clock source such as a dedicated SiLabs Si5338 or equivalent, with jitter under 100 fs RMS for 3.125 Gbps operation. Route these clocks with 100 ohm differential impedance and keep them isolated from noisy digital signals. AC-couple the clock inputs as required by the device handbook, and avoid sharing power rails between the clock generator and noisy switching circuitry.

Do not omit configuration mode strapping pins (MSEL0/1/2). The EP4CGX30CF19C6 defaults depend on these strapping values, and incorrect settings will prevent JTAG or Active Serial configuration from working. Always place a 4-pin JTAG header (TCK, TMS, TDI, TDO) on every board for debug access, and include a separate AS configuration flash footprint. Verify the AS flash size against your SOF bitstream using the Quartus Prime programmer tool before tape-out.

Informações de conformidade

RoHS

Unknown

REACH

Unknown

AEC-Q100

Not Applicable

Sem chumbo

Unknown

Sem halogênios

Unknown

Minerais de conflito

Unknown

Compliance fields marked unknown because the verified web data does not state explicit RoHS, REACH, or lead-free status. The N-suffix variants (e.g., EP4CGX30CF19C6N) are RoHS-compliant lead-free per Intel ordering information, but the C6 (no N suffix) variant finish is not explicitly stated in the provided data.

Dados verificados em: 2026-09-10 — dados verificados e curados pela equipe de engenharia de componentes da XAIPART

Fontes: Manufacturer Product Page, Distributor, Distributor, Octopart, Distributor, Distributor

Buscas relacionadas

EP4CGX30CF19C6 datasheet EP4CGX30CF19C6 price EP4CGX30CF19C6 buy Cyclone IV GX F19 FPGA EP4CGX30CF19C6 pinout F19 BGA EP4CGX30CF19C6 vs EP4CGX30CF19C7 Intel Cyclone IV GX 29440 LE EP4CGX30CF19C6 PCIe endpoint FPGA EP4CGX30CF19C6 drop-in replacement 324-ball F19 LBGA FPGA EP4CGX30CF19C6 industrial machine vision Cyclone IV GX 3.125 Gbps transceiver EP4CGX30CF19C6 lead time stock how many I/O does EP4CGX30CF19C6 have EP4CGX30CF19C6 vs Cyclone V GX

Componentes & termos relacionados

Intel Altera EP4CGX30CF19C6 EP4CGX30CF19C7N EP4CGX30CF19C7 EP4CGX30CF19C8 EP4CGX30CF19I6 Cyclone IV GX FPGA Field-Programmable Gate Array Programmable Logic Device Logic IC 324-LBGA F19 BGA PCI Express Gen1 M9K memory block PLL RoHS machine vision motor control industrial automation Quartus Prime PowerPlay Early Power Estimator